JPH07154086A - Automatic electronic parts mounter - Google Patents

Abstract

PURPOSE:To reduce impact when a parts feeding unit touches a contact member for detecting abnormality. CONSTITUTION:When a start key 28 is depressed, a CPU 24 rotates a feeder table drive motor 9 at low speed to move a feeder table at low speed. If a parts feeder is not fixed accurately but raised, for example, it touches a template with low impact and rocks the template. Consequently, a proximity sensor 41 is turned OFF and the CPU 24 makes a decision that an abnormality has occurred.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention supplies a desired electronic component by moving a supply table, in which a plurality of component supply units for supplying electronic components are arranged in parallel, by a driving device in the arrangement direction of the unit. The present invention relates to an electronic component automatic mounting apparatus that stops a unit at a component extraction position, takes out an electronic component by an ejection nozzle, and mounts the electronic component on a printed circuit board.

[0002]

2. Description of the Related Art An electronic component automatic mounting apparatus of this type is disclosed in Japanese Patent Laid-Open No.
Japanese Patent Laid-Open No. 94355/1994 discloses that a plurality of tape feeding devices corresponding to component supply units are arranged on a supply table, the supply tables move in the arrangement direction, and a component is taken out from a desired unit to a take-out nozzle. It is mounted on the printed circuit board.

In this type of electronic component automatic mounting apparatus, the component supply unit is not sufficiently mounted, and the unit is lifted and mounted, or the tape holder is lifted for tape replacement and then left down. It may remain in a raised state due to movement, and in such a case it may collide with the ejection nozzle etc. due to movement of the supply base, so it protrudes from the component supply unit in a normally attached and normal state. An abutting member that abuts and displaces when the above-mentioned portion moves of the supply table is provided in the middle of the movement path of the supply table.

[0004]

However, in the above-mentioned prior art, the supply table is moved at a speed for normal component supply, that is, at a high speed for moving the component supply unit to the component extraction position of the ejection nozzle. Therefore, there is a drawback that the impact on the abutting member is strong, and the abutting member and the component supply unit are easily damaged.

Therefore, an object of the present invention is to reduce the impact applied when the component supply unit hits the contact member for detecting abnormality.

[0006]

SUMMARY OF THE INVENTION Therefore, according to the present invention, a plurality of component supply units for supplying electronic components are installed side by side and a supply table is moved by a drive device in the arrangement direction of the units to obtain desired electronic components. In the electronic component automatic mounting device that stops the unit that supplies the component to the component extraction position and removes the electronic component by the extraction nozzle and mounts it on the printed circuit board, contact the obstacle portion that collides with the extraction nozzle on the movement path of the supply base. A contact member that displaces, a detection unit that detects an obstacle portion by the displacement of the contact member, a command unit that instructs the timing at which the detection unit should detect the obstacle portion, and the command unit that responds to the command from the instruction unit. The control means is provided to move the drive device at a lower speed than in the normal component supply operation.

Further, according to the present invention, a plurality of component supply units for supplying electronic components are arranged in parallel and are attached to the supply table by a driving device to move in the arrangement direction of the units to supply the desired electronic components. In an electronic component automatic mounting device that stops at an extraction position, takes out an electronic component by an ejection nozzle, and mounts it on a printed circuit board, a contact member that abuts on a component supply unit that is lifted on a movement path of a supply table and displaced. A detecting means for detecting a mounting abnormality of the unit by displacement of the contact member,
A means for instructing a timing at which the detecting means should detect an attachment abnormality, and a control means for moving the drive device at a lower speed in response to the instruction of the instructing means as compared with a normal component supply operation Is.

According to the present invention, a plurality of component supply units for supplying electronic components are arranged side by side, and a drive unit moves a supply table in the arrangement direction of the units to supply desired electronic components. In an electronic component automatic mounting device that stops at an extraction position and takes out an electronic component by an extraction nozzle and mounts it on a printed circuit board, a contact member that abuts and displaces on an obstacle portion that collides with the extraction nozzle on a movement path of a supply base, Detecting means for detecting an obstacle part by displacement of the abutting member, command means for instructing start of automatic operation of component mounting, and the drive device for normal component before the component mounting operation according to the command of the commanding means. The control means is provided to move all of the units on the supply table at a lower speed than during the supply operation within the range detected by the detection means.

[0009]

The control means detects the obstacle portion so that the detecting means for detecting the obstacle portion by the displacement of the contact member that comes into contact with and displaces the obstacle portion that collides with the ejection nozzle on the movement path of the supply base. The drive unit is controlled in accordance with the command from the commanding unit that commands the power timing, and the supply base is moved at a lower speed than in the normal component supply operation.

Further, even when the component supply unit is lifted and attached, the supply base is moved at a lower speed in response to the instruction of the instruction means than in the normal component supply operation. Also. Before the automatic operation of the component mounting operation, the supply base is moved at a low speed so that all the component supply units can be detected by the detection means.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings. In FIG. 2 and FIG. 3, reference numeral 1 denotes a Y table which moves in the Y direction by rotation of the Y axis motor 2, and 3 indicates movement in the X direction on the Y table 1 by rotation of the X axis motor 4. As a result, an XY table that moves in the XY directions, and a printed circuit board 6 on which a chip-shaped electronic component 5 (hereinafter, referred to as a chip component or a component) is mounted is fixedly mounted on a fixing unit (not shown).

Reference numeral 7 denotes a supply table, on which a large number of component supply devices 8 serving as component supply units for supplying the chip components 5 are arranged. Reference numeral 9 denotes a supply base drive motor, and by rotating the ball screw 10, the supply base 7 is guided by the linear guide 12 via a nut 11 fitted to the ball screw 10 and fixed to the supply base 7. Move in the direction.
Reference numeral 13 denotes a rotary table that rotates intermittently. On the outer edge of the table 13, mounting heads 15 having six suction nozzles 14 as take-out nozzles are arranged at equal intervals according to the intermittent pitch.

Reference numeral I denotes a suction station at which the suction nozzle 14 stops the mounting head 15 for picking up and picking up the component 5 from the supply device 8 by intermittent rotation of the rotary table 13. Adsorb 5 16 is a component 5 that the suction nozzle 14 sucks
This is a component recognition device for recognizing the positional shift of the component 5 by imaging the lower surface of the component 5 with a camera in a predetermined visual field range and recognizing the imaged screen, and is provided in the recognition station II.

Next mounting head 1 of recognition station II
The position where 5 is stopped is the angle correction station III, and the angle amount for correcting the angular position deviation of the chip component 5 due to the recognition result of the recognition device 16 is added to the predetermined angle amount shown in the mounting data (not shown). The head rotating device 17 rotates the mounting head 15 in the θ direction by an amount.

The next stop position after the angle correction station III is the mounting station IV, and the component 5 to be sucked by the suction nozzle 14 of the station is mounted on the substrate 6. Reference numeral 20 is an up-and-down rod that moves up and down, and is engaged with a rocking lever 21 of the component supply device 8 to rock the chip component 5.
The component storage tape (not shown), which is sealed at a predetermined interval, is intermittently fed according to the interval to supply the chip component 5 to the component suction position of the suction nozzle 14. 22 is a tape reel around which the component storage tape (not shown) is wound.

Next, the component supply device 8 and the mechanism for detecting the lifting of the device 8 will be described with reference to FIGS. 4 and 5. The component storage tape (not shown) delivered from the tape reel 22 is rotatable around a support shaft 32 as a fulcrum, and is pressed by a suppressor 33 which is rotated clockwise in FIG. The suppressor 33 can be lifted with the support shaft 32 as a fulcrum when replacing the component storage tape.

The component supply device 8 is attached to the supply base 7 by the positioning pin 34 being inserted into a positioning hole (not shown) of the supply base 7 to be positioned and the lock lever 35 engaging the bar 36. If there is a mounting error, the component supply device 8 is lifted up and comes off during the movement of the supply base 7, hits the suction nozzle 14 or is attached in a horizontal direction so that the suction nozzle 14 is displaced. May not be able to adsorb the chip component 5.

Reference numeral 37 is a template as an abutting member, and is supported by a supporting frame 39 extending from a supporting member 38 supporting the rotary table 13 so as to be swingable left and right in FIG. The template 37 is made of metal such as aluminum, and when it is suspended as it is, it is close to a proximity sensor 41 as a detection means provided on the support frame 39, and the sensor 41 is in an ON state.

As described above, when the component supply device 8 is lifted due to a mounting error, the component supply device 8 is attached with the suppressor 33 lifted, or when there is another obstacle, the supply base When 7 moves, the template 37 hits and swings, and the sensor 41
The template 37 is further separated to bring it into the OFF state. The template 37 and the proximity sensor 41 are provided one on each side of the movement path of the supply base 7.

Next, the control block will be described with reference to FIG. 24 is a CPU as a control means,
Based on the data stored in the RAM 26 according to the program stored in the M25, various operations relating to component mounting are controlled. The recognition device 16 and the proximity sensor 41 are connected to the CPU 24 via an interface 27. Further, the interface 27 is connected to a supply base drive motor 9 and the like via a start key 28 as a command means and a drive circuit 30, and is controlled by the CPU 24.

Mounting data as shown in FIG. 6 is stored in the RAM 26. The mounting data varies depending on the type of the printed circuit board 6 on which the component is to be mounted, and is stored in the RAM 26 for each type of the printed circuit board 6. The reel number, X, and X for each step number indicating the mounting order.
Data (column labeled "X"), Y data ("Y")
And the .theta. Data (the field labeled ".theta.") Are stored. The reel number is a number indicating the arrangement position of the component supply device 8 on the supply base 7, and is numbered according to the arrangement position of the supply device 8 such as "1", "2" ... From the right side of FIG. There is. The X data and the Y data represent XY position coordinates on the printed circuit board 6 where the chip component 5 should be mounted, and the θ data indicates the θ direction in which the chip component 5 should be mounted, that is, the sucked chip component 5 should rotate. Indicates the amount of angle. "E" in the column "C" indicates that component mounting for each printed circuit board 6 is completed at this step number.

The operation of the above configuration will be described below. First, when the power of the electronic component mounting apparatus is turned on and the start key 28 is pressed, as shown in the flowchart of FIG.
U24, for example, moves the supply base 7 stopped at the left end of FIG. 2 toward the right at a speed lower than the speed at which the normal component supply device 8 is moved for component supply, so that the supply base drive motor 9 rotates at a low speed. Let Then, if any one of the component supply devices 8 is not securely attached and is in a state of being lifted with respect to the supply base 7, the component supply device 8
Hits the template 37 with almost no impact,
The template 37 swings, the proximity sensor 41 is turned off, the CPU 24 determines that an obstacle or an abnormality due to lifting has occurred, stops the movement of the supply base, and displays this on a CRT (not shown). And I can't go into automatic driving.

Next, when the operator notices that there is an abnormality, the component supply device 8 is reattached and the abnormal state is released. After this, the supply table 7 automatically returns to the initial position. next,
When the start key 28 is pressed again, the supply base 7 moves at a low speed in the same manner as described above. Next, when the component supply device 8 is normally attached and the suppressor 33 is not lifted up and there is no other obstacle, there is nothing that comes into contact with the template 37, so the proximity sensor 41 remains in the ON state and the supply base 7
Is moved to the opposite side through the template 37 on one side, the CPU 24 stops the supply base drive motor 9, determines that there is no abnormality, and then starts the automatic operation as follows.

The fact that the supply table 7 has passed the template 37 is judged by moving the distance set as a destination in advance. That is, first, in accordance with the intermittent rotation of the rotary table 13, the ball screw 10 caused by the rotation of the motor 9 is rotated.
Rotation causes the supply table 7 to move along the linear guide 12 at a higher speed than the moving speed for detecting the above-mentioned obstacle, and the reel number "1" of the step number "1" of the mounting data of FIG. The component supply device 8 disposed in “” moves to the suction station I and stops.

Next, the chip component 5 supplied by the component supply device 8 by the suction nozzle 14 of the mounting head 15 stopped at the suction station I by the rotation of the rotary table 13.
Are adsorbed. Next, when the mounting head 15 reaches the recognition station II by the rotation of the rotary table 13,
The displacement of the chip component 5 that the suction nozzle 14 is sucking is recognized.

Next, when the rotary table 13 rotates and the head 15 reaches the angle correction station III,
The suction nozzle 14 is rotated by the head rotating device 17 by an angle amount obtained by adding the angle amount for correcting the angle deviation recognized in the recognition station to “θ1” of the θ data of the mounting data. The CPU 24 controls. Next, the head 15 reaches the mounting station IV, and the XY table 3
Moves in the XY directions, and the chip component 5 is placed on the printed circuit board 6.
Is installed.

The mounting operation is performed as described above,
When the component mounting is completed for a predetermined number of printed circuit boards, the automatic operation is stopped, the substrate type is changed, the component supply device 8 is replaced, and the start key 28 is pressed next, the supply base 7 is templated as described above. When the component supply device 8 hits the component 37, the component supply device 8 moves at a low speed without impact. For example, when the suppressor 33 is detached and lifted, the suppressor 33 hits the template 37 and the proximity sensor 41. Is turned off, so the CPU 24
Judges an abnormality and stops the supply base drive motor 9 to stop the supply base 7 to notify the abnormality.

In the present embodiment, the supply base 7 is moved at a low speed before the start of the automatic operation to detect the obstacle, but the same operation may be performed after the power is turned on, or the component supply device may be used. When a part is out of 8 and it is necessary to perform the above detection operation such as replacement, the CPU issues a command by pressing the detection start key and moves the supply base 7 at low speed over the entire area. You may allow it.

Further, since the template 37 is provided on both sides of the suction station I, the movement for detecting the obstacle portion may be started from either side.

[0030]

As described above, according to the present invention, even when the component supply unit is lifted up or has an obstacle, the supply base is moved at a low speed to detect it, so that the component is supplied to the contact member. Even if the units collide with each other, the impact is small, and damage to the contact member and the component supply unit can be reduced.

[Brief description of drawings]

FIG. 1 is a control block diagram of an electronic component automatic mounting apparatus to which the present invention is applied.

FIG. 2 is a plan view of the electronic component automatic mounting device.

FIG. 3 is a side view of the electronic component automatic mounting device.

FIG. 4 is a side view showing a component supply device and a template.

FIG. 5 is a front view showing a template and a proximity sensor.

FIG. 6 is a diagram showing mounting data.

FIG. 7 is a diagram showing a flowchart.

[Explanation of symbols]

 5 Chip-shaped Electronic Components (Electronic Components) 6 Printed Circuit Board 7 Supply Platform 8 Component Supply Device (Component Supply Unit) 9 Supply Platform Drive Motor (Drive Device) 14 Adsorption Nozzle (Extraction Nozzle) 24 CPU (Control Means) 28 Start Key ( Commanding means) 33 Suppressor 37 Template (contact member) 41 Proximity sensor (detecting means)

Claims (3)

[Claims] 1. A supply base, to which a plurality of component supply units for supplying electronic components are arranged side by side, is moved in the arrangement direction of the units by a driving device so that the units for supplying desired electronic components are at a component extraction position. In an electronic component automatic mounting device that stops and picks up an electronic component by a pick-up nozzle and mounts it on a printed circuit board, a contact member that abuts and displaces on an obstacle portion that collides with the pick-up nozzle on a movement path of a supply base, and a corresponding contact member. Detecting means for detecting a faulty part by displacement of the drive means, command means for instructing the timing at which the detecting means should detect the faulty part, and comparing the drive device in the normal component supply operation according to the command of the commanding means. An automatic electronic component mounting apparatus is provided with control means for moving at low speed. 2. A plurality of component supply units for supplying electronic components arranged in parallel are attached to a supply table by a driving device to move the units in the arrangement direction of the units so that the units for supplying desired electronic components are at a component extraction position. In an automatic electronic component mounting device that stops and takes out an electronic component from a pick-up nozzle and mounts it on a printed circuit board, a contact member that comes into contact with a component supply unit that is lifted on the moving path of the supply base and displaced, and a corresponding contact member. Detecting means for detecting the mounting abnormality of the unit by displacement of the member, command means for instructing the timing at which the detecting means should detect the mounting abnormality, and the drive device for normal parts according to the command of the command means. An electronic component automatic mounting apparatus comprising a control means for moving at a lower speed than during a supply operation. 3. A plurality of component supply units for supplying electronic components arranged in parallel and attached to a supply table by a driving device to move the units in the arrangement direction of the units so that the units for supplying desired electronic components are at a component extraction position. In an electronic component automatic mounting device that stops and picks up an electronic component by a pick-up nozzle and mounts it on a printed circuit board, a contact member that abuts and displaces on an obstacle portion that collides with the pick-up nozzle on a movement path of a supply base, and a corresponding contact member. Detecting means for detecting an obstacle part by displacement of the driving means, command means for instructing start of automatic operation of component mounting, and in response to a command of the commanding means, the drive device is operated during normal component supply operation before component mounting operation. In comparison, an automatic electronic component mounting apparatus is provided, which is provided with control means for moving all of the units on the supply table at a low speed within a range detected by the detection means.