JPH0738300A - Correcting method of nozzle eccentricity in packaging machine - Google Patents

Abstract

PURPOSE:To improve packaging performance of chip components to a substrate by detecting the amount of an average position change of the center of a suction nozzle tip in advance adding the amount of position change, and setting a traveling target position when a suction nozzle is lowered from a compensation position to the fitting of chip components on the substrate when fitting the chip components. CONSTITUTION:The amount of an average center position charge of the center of a suction nozzle tip is detected before starting packaging operation or each time before sucking chip components and then the amount of position change is secured as data. Then, when setting a traveling target position, amount of suction position deviation of chip components is added or corrected for setting the traveling target position for the substrate and further the amount of position change is added to determine the traveling target position finally. Therefore, even if the travelling target position is set at the compensation position, chip components can be fitted to a specific fitting position of the substrate accurately and positively since it is the setting value where the amount of position change of the center of the suction nozzle tip is added, thus enhancing the fitting performance of the chip components.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an IC using a suction nozzle.
The present invention relates to a nozzle eccentricity correction method in a mounting machine for adsorbing chip components such as electronic components such as the above and accurately mounting them on a predetermined position on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, a mounting machine has an X-axis and a Y-axis which are orthogonal to each other, and an X-axis is mounted on the Y-axis composed of a rail or the like.
A shaft component is movably mounted along the Y-axis, and a head provided with a nozzle member is provided on the X-axis component movably along the X-axis so that the head can be moved in the XY plane. Those that are known are known. In such an apparatus, the nozzle member has a suction nozzle for sucking chip components, the entire nozzle member is rotatable with respect to the head, and the suction nozzle moves up and down along the rotation axis of the nozzle member. Being free.

When mounting a chip component such as an electronic component such as an IC at a predetermined position on a substrate by the above mounting machine,
First, the head is moved onto the component supply unit, where the suction nozzle is lowered to suck a desired chip component. afterwards,
The suction nozzle is raised while the chip component is sucked, and the chip component is arranged above the component recognition camera by moving the head, and the chip component is recognized by the component recognition camera. Here, the suction displacement amount of the chip component with respect to the rotation axis of the nozzle member is obtained from the image captured by the component recognition camera, and this displacement amount is taken into consideration.
The target position at the time of mounting, that is, the moving position of the nozzle member is set, and the correction amount for each driving means is obtained from this target position.

When the correction amount is obtained as described above, the head and nozzle member are moved and rotated in consideration of the correction amount, and when the nozzle member reaches the target position, the suction nozzle is lowered. , Chip components are mounted on the substrate. Instead of the correction based on the above-mentioned component recognition, there is also a device in which a chuck member that can be opened and closed at the suction nozzle rising position is used to correct the suction displacement of the chip component.

[0005]

In the mounting machine as described above, the central axis of the suction nozzle and the rotational axis of the nozzle member should normally be aligned or parallel to each other. Due to the accuracy of parts or the accuracy of assembly, as shown in FIG. 8A, the central axis S of the suction nozzle 51 is slightly inclined with respect to the vertical rotation axis P of the nozzle member 50. Sometimes. In this case, at the tip portion 51a of the suction nozzle 51, since the central axis S of the suction nozzle 51 is eccentric with respect to the rotation axis P of the nozzle member 50, when the nozzle member 50 is rotated,
The tip portion 51a of the suction nozzle 51 swings around the rotation axis P as shown by the trajectory Sa1 in FIG. 8A. Moreover, the distance between the central axis S at the tip 51a of the suction nozzle 51 and the rotation axis P of the nozzle member 50, the so-called eccentric amount, increases as the suction nozzle 51 is lowered, and therefore the nozzle member 50 is rotated. At this time, the swing of the suction nozzle 51 is also enlarged as shown by the trajectory Sa2 in FIG. 8B.

Further, the eccentricity of the suction nozzle 51 as described above may include a twisting element. That is, the central axis S of the suction nozzle 51 may be inclined with a twisted positional relationship with respect to the rotation axis P of the nozzle member 50. In such a case, as shown in FIG. ,
As the suction nozzle 51 descends, not only the eccentric amount at the tip 51a of the suction nozzle 51 increases, but also the tip of the suction nozzle 51 in the lowered position with respect to the tip 51a of the suction nozzle 51 in the raised position. The portion 51a is displaced in the circumferential direction by the angle θ.

Therefore, it is assumed that the central axis of the suction nozzle and the rotation axis of the nozzle member are coaxial or parallel to each other, and the amount of misalignment of the chip component is determined in a state where the suction nozzle is raised. In the conventional mounting method for performing the correction process and the correction of the displacement, when the tip center of the suction nozzle is eccentric with respect to the rotation axis of the nozzle member, when the chip component is actually mounted on the substrate, the suction nozzle is With the descent of
The deviation due to the eccentricity of the suction nozzle causes a disadvantage that the chip component is not mounted at a predetermined mounting position on the substrate.

Therefore, in the mounting machine, assuming that the central axis of the suction nozzle is eccentric with respect to the rotation axis of the nozzle member, the planar displacement of the tip of the suction nozzle when the suction nozzle is moved up and down is also taken into consideration. It is necessary to set the target position during mounting.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a nozzle eccentricity correction method for a mounting machine which can further improve the mounting performance of a chip component on a substrate.

[0010]

According to the present invention, a head movable in a horizontal direction is equipped with a suction nozzle capable of rotating and moving up and down, and a chip component is sucked by the suction nozzle, and the suction nozzle is elevated. In a mounting machine designed to set the target movement position when mounting a chip component by adding or correcting the suction displacement of the chip component at the position, mount the chip component on the board from the above correction position when mounting the chip component. When the suction nozzle is lowered to the position, a planar position change amount of the suction nozzle tip center is detected in advance, and the movement target position is set in consideration of the position change amount.

[0011]

According to the present invention, before the mounting operation is started or before each chip component is picked up, the planar center position change amount of the suction nozzle tip center when the suction nozzle is moved up and down is detected. Is secured as data. When setting the movement target position, the amount of displacement of the suction position of the chip component is added or corrected to set the movement target position with respect to the substrate, and the position change amount is set to the set movement target position. The final determination of the movement target position is made in consideration. Therefore, even if the movement target position is set at the position where the suction nozzle is raised, that is, at the correction position, since the set value takes into account the positional change amount of the suction nozzle tip center as described above, the suction nozzle is eccentric and tilted. Even in such a case, the chip component can be accurately and surely mounted at the predetermined mounting position on the substrate, and the mounting performance of the chip component can be improved.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A chip component mounting machine to which a nozzle eccentricity correction method for a mounting machine according to the present invention is applied will be described with reference to the drawings. 1 and 2 show the structure of the entire chip component mounter. As shown in the figure, a conveyor 2 for conveying a printed circuit board is arranged on a base 1 of a chip component mounting machine (hereinafter referred to as a mounting machine), and the printed circuit board 3 is conveyed on the conveyor 2 and predetermined. It is designed to be stopped at the mounting work position.

On the side of the conveyor 2, a parts supply section 4 is provided.
Are arranged. The component supply unit 4 includes a large number of rows of tape feeders 4a. Each tape feeder 4a is a reel in which small pieces of chip components such as ICs, transistors and capacitors are stored and held at predetermined intervals. In addition, the tape feeding end is provided with a ratchet type feeding mechanism so that the tape is intermittently fed as chip components are picked up by a head unit 5 described later.

A head unit 5 for mounting components is installed above the base 1. The head unit 5 is movable in the X-axis direction (direction of the conveyor 2) and Y-axis direction (direction on the horizontal plane orthogonal to the X-axis).

That is, a pair of fixed rails 7 extending in the Y-axis direction and a ball screw shaft 8 rotatably driven by a Y-axis servomotor 9 are arranged on the base 1, and the fixed rails 7 are mounted on the fixed rail 7. A head unit support member 11 is arranged in the head unit, and a nut portion 12 provided on the support member 11 is screwed onto the ball screw shaft 8. A guide member 13 extending in the X-axis direction and a ball screw shaft 14 driven by an X-axis servomotor 15 are arranged on the support member 11, and the head unit 5 can be moved on the guide member 13. A nut portion (not shown) that is held and provided on the head unit 5 is screwed onto the ball screw shaft 14. Then, the ball screw shaft 8 is rotated by the operation of the Y-axis servomotor 9 to move the support member 11 in the Y-axis direction, and the ball screw shaft 14 is rotated by the operation of the X-axis servomotor 15, so that the head unit is rotated. 5 moves in the X-axis direction with respect to the support member 11.

Further, the Y-axis servomotor 9 and the X-axis servomotor 15 are provided with position detecting devices 10 and 16 each composed of an encoder so that the moving position of the head unit 5 can be detected. It has become.

The head unit 5 is equipped with three nozzle members 20. Each of these nozzle members 20
Has a suction nozzle 21 located on its central axis and a nozzle holding portion 20a around it, and the entire nozzle member is rotatable about the central axis (R axis) with respect to the frame of the head unit 5. In addition, the suction nozzle 21 can be moved up and down (moved in the Z-axis direction) with respect to the nozzle holder 20a. At this time, the nozzle member 20 and the suction nozzle 21 are adapted to be operated by the Z-axis servo motor 17 and the R-axis servo motor 18, respectively, and the position detection device 22 provided in each servo motor 17, 18 is moved. ，
The movement position of the suction nozzle 21 is detected by 23.

Further, a negative pressure from a negative pressure generating source (not shown) is supplied to each suction nozzle 21 through a valve member or the like, and when mounted, the supplied negative pressure is supplied to each nozzle. The tip parts are each acted on to adsorb the chip component.

On the other hand, on the base 1, on the side of the conveyor 2 (on the upper side in FIG. 1), a component recognition camera 25 for chip component recognition is arranged between the component supply section 4 and the conveyor. This component recognition camera 25 images the chip component and recognizes the chip component. Specifically, after sucking the chip component, the suction nozzle 21 is moved up and the head unit 5 is moved so that the sucked chip component is located at a predetermined component recognition position (correction position) above the component recognition camera 25. The chip component image is picked up by the component recognition camera 25 by holding it at.

Although not shown, the mounting machine configured as described above includes a control device having a microcomputer as a component, and includes the Y-axis and X-axis servomotors 9 and 15 and the head unit 5. The driving means such as the R-axis servo motor 18 for each nozzle member 20, the Z-axis servo motor 17 for each suction nozzle 21 and the component recognition camera 25 are all electrically connected to the above-mentioned control device and are integrally controlled by this control device. It has become so. Further, the control device is provided with an image processing unit. In this image processing unit, the suction displacement amount of the chip component with respect to the rotation axis of the nozzle member 20 is obtained by performing predetermined image processing on the image signal of the suction chip component captured by the component recognition camera 25. On the basis of this suction displacement amount, in the control device, the moving position of the nozzle member 20 at the time of mounting, that is, the nozzle member 20.
To determine the temporary target position.

By the way, the control unit is provided with a storage unit for storing the amount of change in position of the center of the suction nozzle 21, and the amount of change in position of each suction nozzle 21 is stored as data. . That is, in the configuration of the mounting machine described above, when the suction nozzle 21 is at the raised position and the nozzle member 20 is at the reference angle (for example, a rotation angle of 0 °), as shown by the chain line in FIG. The center S of the tip and the center P of rotation of the nozzle member 20 should originally coincide with each other, but as shown by the solid line in FIG.
The center S of the tip may be eccentric to the rotation center P of the nozzle member 20 by a distance Na. This occurs when the central axis of the suction nozzle 21 is inclined with respect to the rotation axis of the nozzle member 20 due to a component manufacturing error or an assembly error. In this case, when the suction nozzle 21 is lowered from the above-mentioned raised position, the suction nozzle 2 is accompanied by this.
The center S of the tip of 1 is the center of rotation P of the nozzle member 20.
Away from each other, that is, the amount of eccentricity increases, and as shown in FIG.

Therefore, in this embodiment, before the chip component is picked up by the component recognition camera 25, the suction nozzle 21 is raised by a recognition camera (not shown) or the like, that is, at the position when the chip component is recognized. The tip end of the suction nozzle 21 and the lower position of the suction nozzle 21, that is, the tip portion of the suction nozzle 21 at the time of mounting the chip component on the board are image-recognized, and based on this, the suction position in the raised position and the lower position is determined. As shown in FIG. 3, the displacement of the nozzle tip center S is two-dimensionally grasped, and the change amount of the tip center S is converted into a position change amount N (X axis direction change amount Nx, Y axis direction change amount N, as shown in FIG.
As y), it is stored in the storage unit of the control device.

When the provisional target position of the nozzle member 20 at the time of mounting is determined from the amount of displacement of the suction position of the chip component with respect to the rotation center P of the nozzle member 20 as described above, the above-mentioned control device further The position change amount N data for the suction nozzle 21 is read from the storage unit, and the final target position of the nozzle member 20 is determined by adding the position change amount N to the temporary target position of the nozzle member 20 by a calculation method described later. decide. Further, the control device further calculates a correction amount for the drive means such as each servo motor based on the determined final target position, and drives and controls each drive means in consideration of the correction amount. ing.

Next, a chip component suction and mounting operation and a nozzle eccentricity correction method at the time of mounting the chip component in the mounting machine will be described with reference to FIGS. 5 and 6 based on the flowchart of FIG.

First, when the mounting operation is started, preset data such as the type and mounting position of the mounted chip component is selected and read out by the control device in accordance with the substrate, and is read on the substrate. Each drive unit is controlled to perform the mounting operation according to the operation (step S1).

When the mounting operation is started, the controller resets the chip component counter, which is incremented each time a chip component is mounted, and starts driving the conveyor 2 to convey the board. Then, the substrate to be mounted is carried in and positioned at a predetermined work position (steps S1 to S3).

When the board is positioned at the predetermined working position as described above, the head unit 5 is moved in the XY directions and the suction nozzle 21 is moved to the desired chip component supply position of the component supply unit 4. After the positioning, and then the suction nozzle 21 is lowered, the component supply unit 4
The chip parts are picked up from (step S4 to step S5).

As described above, when a chip component is sucked by the suction nozzle 21, the suction nozzle 21 is lifted while sucking the chip component, and the head unit 5 is moved to move the chip component to the component. Recognition camera 2
The chip component image is picked up by the component recognition camera 25 at a predetermined recognition position above 5.

The component recognition camera 25 outputs the imaged chip component image to the control device as a signal corresponding to the image. Then, the image signal input to the control device is subjected to predetermined image processing in the image processing section, whereby the chip component image is recognized.

By the way, in the above control device, the mounting position Ea of the chip component on the substrate is the nozzle member 2.
The rotation center P of 0 is set as a reference. That is,
Nozzle member at the time of mounting, assuming that the nozzle member 20 is held at the reference angle and the rotation center P of the nozzle member 20 and the center of the chip component are aligned at the time of chip component adsorption. The mounting position Ea is set by the rotation center position coordinates and the rotation angle of 20.

Therefore, when the chip component is sucked, the rotation center P of the nozzle member 20 and the center Q of the chip component 30 coincide with each other as shown by the chain line in FIG. If it is adsorbed, the mounting position Ea and the moving position of the nozzle member 20 during mounting (the nozzle member 2
It means that the position is the same as the moving position (including the rotation angle of 0). However, for example, as shown by the solid line in FIG. 5A, in the case where the rotation center P of the nozzle member 20 and the center Q of the chip component 30 do not coincide with each other and the suction is performed in a state of being inclined in the rotation direction. In order to mount the chip component 30 on the predetermined mounting position Ea on the substrate, it is necessary to correct the moving position of the nozzle member 20. Therefore, in the control device, the chip component recognition result is compared with preset proper data, and the suction position displacement amount of the chip component 30 with respect to the rotation center P of the nozzle member 20 is calculated from the comparison result. The provisional target position is set by correcting the moving position of the suction nozzle 21 based on this deviation amount.

At this time, the mounting position Ea of the chip component (that is, the initial movement position of the nozzle member 20) is Ea = (Mx, My, Mr) Mx: X-axis coordinate My: Y-axis coordinate Mr: rotation angle, Let the temporary target position Eb be Eb = (Ox, Oy, Or) Ox: X-axis coordinate Oy: Y-axis coordinate Or: rotation angle, and shift the chip component 30 in the X-axis direction with respect to the rotation center P of the nozzle member 20. If the amount is Δx, the deviation amount in the Y-axis direction is ΔY, and the rotation deviation amount is Δr, the temporary target position E
b can be obtained based on the conventionally well-known calculation method shown below.

Ox = Δx · cosOr−Δy · sinOr + Mx (1) Oy = Δx · sinOr + Δy · cosOr + My (2) Or = −Δr + Mr (3) Then, from the above formulas (1) to (3), provisional Target position E
When b is obtained (step S6), then, in the control device, the position change amount N in the suction nozzle 21 is read from the storage unit, and this position is set to the temporary target position Eb obtained as described above. The final target position Ec is obtained by adding the change amount N.

That is, as shown in FIG. 5B, the provisional target position Eb of the rotation center P of the nozzle member 20 is set so that the chip component 30 is mounted at the predetermined mounting position Ea indicated by the solid line. However, if the tip center S of the suction nozzle 21 is eccentric with respect to the rotation center P of the nozzle member 20 as described above, as the suction nozzle 21 descends during mounting, Since the suction nozzle 21 is displaced in the plane by the position change amount N, and the chip component 30 sucked by the suction nozzle 21 is also displaced in the same manner, the position change amount N is further added to the provisional target position Eb. By doing so, the final target position Ec is obtained.

Specifically, the position change amount N (X-axis direction change amount Nx, Y-axis direction change amount Ny) previously detected and stored in the storage unit as described above is used as the temporary target position Eb. The X-axis coordinate and the Y-axis coordinate of the final target position are obtained by adding them to the X-axis direction coordinate Mx and the Y-axis direction coordinate My, respectively. At this time, at the temporary target position Eb, the nozzle member 20 rotates Since the nozzle member 20 is rotated by Or, the nozzle member 20 is rotated by the rotation angle Or from the position change amount N detected at the reference angle of the nozzle member 20.
It is necessary to calculate the amount of change in position when rotated by only. This will be described with reference to FIG. 6. When the nozzle member 20 is rotated by the rotation angle Or, the tip of the suction nozzle 21 is accordingly moved from the position shown by the broken line to the position shown by the solid line. Then, when the suction nozzle 21 is lowered from the raised position in order to mount the chip component on the substrate at this solid line position, the eccentricity of the tip of the suction nozzle 21 is increased and the tip of the suction nozzle 21 is shown at the position shown by the alternate long and short dash line Be moved to. Therefore, the position change amount N ′ (X-axis direction change amount Nx ′, Y-axis direction change amount Ny ′) of the center position S of the suction nozzle 21 at this time is calculated as the position change amount N (X-axis direction change amount Nx, From the Y-axis direction change amount Ny), it is possible to obtain Nx ′ = Nx · cosOr−Ny · sinOr Ny ′ = Nx · sinOr + Ny · cosOr, as shown in FIG. Therefore, assuming that the final target position Ec is Ec = (Ex, Ey, Er) Ex: X-axis coordinate Ey: Y-axis coordinate Er: rotation angle, the final target position Ec is the position change amount N and the temporary target position Eb. Therefore, Ex = Nx ′ + Ox = Nx · cosEr−Ny · sinEr + Ox (4) Ey = Ny ′ + Oy = Nx · sinEr + Ny · cosEr + Oy (5) Er = Or ... (6).

As a result, even when the suction nozzle 21 is lowered, the chip component 30 is mounted at a predetermined mounting position Ea (position indicated by a chain double-dashed line) as shown in FIG. 5C. , The final target position Ec of the suction nozzle 21
(Position indicated by solid line) is set (step S7).

When the final target position Ec of the rotation center P of the nozzle member 20 is determined in step S7 as described above, each drive means is driven by the control device,
The head unit 5 is moved in the XY directions, and the nozzle member 20 is rotated and moved to the final target position Ec. When the final target position Ec is reached, the suction nozzle 21 is lowered at that position to mount the chip component on the substrate, and after mounting the chip component, the chip component counter of the control device counts up at a predetermined timing. (Step S8 to Step S
9).

When the mounting of a predetermined number of chip components on the substrate is completed (YES in step S10) by sequentially repeating the operations in steps S4 to S9 (NO in step S10), the conveyor 2 is driven again. Then, the substrate positioned at the predetermined work position is carried out by the conveyor 2 to, for example, the next process (step S11), and the present flowchart ends.

As described above, in the mounting machine, first, the nozzle 2 is picked up based on the image picked up by the component recognition camera 25.
The suction displacement amount of the chip component with respect to the rotation center P of 0 is obtained, and based on this suction displacement amount, the moving position of the nozzle member 20 at the time of mounting the chip component, that is, the temporary target position E.
After setting b, the final target position Ec is further set by adding the positional change amount N with respect to the suction nozzle 21 to the temporary target position Eb, and the nozzle member 20 is moved to this final target position Ec. Since the component mounting is performed, it is possible to preferably correct the positional deviation of the tip of the suction nozzle 21 when the suction nozzle 21 moves up and down, which occurs when the suction nozzle 21 is eccentric with respect to the nozzle member 20. This makes it possible to mount the chip component on the substrate more accurately and reliably. Therefore, as in the conventional example, in which the movement position of the suction nozzle is determined by considering only the suction position shift of the chip component with respect to the nozzle member, the mounting of the chip component is accurately performed due to the position shift of the suction nozzle tip accompanying the elevation. It may not be possible to do this, but the above device does not have such inconvenience,
It is possible to further improve the chip component mounting performance in the mounting machine.

Further, in the mounting machine to which the nozzle eccentricity correction method as described above is applied, when some force acts on the suction nozzle 21 at the time of mounting, which causes deformation of the nozzle member 20 or the suction nozzle 21. Even if there is, there is also an advantage that the mounting work can be favorably dealt with simply by appropriately changing the value of the position change amount N. That is,
In the case of the conventional apparatus, when the suction nozzle 21 or the nozzle member 20 is deformed, accurate chip component mounting cannot be expected unless replacement of the deformed component is performed. However, in the mounting machine to which the nozzle eccentricity correction method as described above is applied, it is possible to perform accurate mounting work with the soft correspondence as described above. However, it becomes possible to continue the mounting work.

In the above embodiment, the nozzle eccentricity correction method of the present invention obtains the suction displacement amount of the chip component with respect to the rotation center P of the nozzle member 20 based on the image picked up by the component recognition camera 25, and takes this suction displacement amount into consideration. The case where the provisional target position Eb is set and the mounting deviation of the chip component is corrected is explained.
For example, as shown in FIG.
It is also applicable to a mounting machine configured to mechanically correct the suction deviation of (1) by a plurality of openable / closable chuck members 31 provided in the nozzle holding portion 20a of the nozzle member 20. In this case, instead of step S6 of the flowchart of the above embodiment (FIG. 4), the chuck member 31 mechanically corrects the suction deviation of the chip component picked up by the suction nozzle 21 from the component supply unit 4. Then, the final target position Ec may be set in step S7 as in the above embodiment.

At this time, the mounting position Ea of the chip component (that is, the initial movement position of the nozzle member 20) and the final target position Ec are respectively Ea = (Mx, My, Mr) Mx: X-axis coordinate My: Y-axis Coordinate Mr: Rotation angle Ec = (Ex, Ey, Er) Ex: X-axis coordinate Ey: Y-axis coordinate Er: Rotation angle, suction nozzle position change amount N (X-axis direction change amount N
x, Y-axis direction change amount Ny), since the suction displacement of the chip component with respect to the suction nozzle 21 has already been corrected, it is not necessary to obtain the temporary target position Eb as in the above embodiment, and therefore Ex = Nx -CosMr-Ny * sinMr + Mx ... (7) Ey = Nx * sinMr + Ny * cosMr + My ... (8) Er = Mr ... (9).

When the final target position Ec is set as described above, the nozzle member 2 should be mounted to mount the chip component.
0 is moved to the final target position Ec.

As described above, the eccentricity correction method of the present invention can be applied to a mounting machine configured to mechanically correct the suction displacement of chip components. In addition to the above, it is also applicable to a mounting machine configured to detect the suction displacement of the chip component with respect to the suction nozzle by an optical means such as a laser.

In the above embodiment, the suction nozzle 21 is in the raised position, that is, the tip of the suction nozzle 21 at the time of chip component recognition, and the suction nozzle 21 is in the lowered position.
That is, the suction nozzle 21 at the position when the chip component is mounted
The final target position Ec of the suction nozzle 21 is set based on the position change amount N of the tip center S of the suction nozzle 21 between the tip and the tip. The change amount N may be proportionally distributed. According to this, for example, it is possible to set an effective final target position Ec even when mounting chip components having different thicknesses, and it is possible to further improve the mounting performance.

[0046]

As described above, according to the present invention,
Before starting the mounting operation or before picking up each chip component,
A flat center position change amount of the suction nozzle tip center when the suction nozzle is moved up and down is detected, and this position change amount is secured as data. When setting the movement target position, the amount of displacement of the suction position of the chip component is added or corrected to set the movement target position with respect to the substrate, and the position change amount is set to the set movement target position. The final determination of the movement target position is made in consideration. Therefore, even if the movement target position is set at the position where the suction nozzle is raised, that is, at the correction position, since the set value takes into account the positional change amount of the suction nozzle tip center as described above, the suction nozzle is eccentric and tilted. Even in such a case, the chip component can be accurately and surely mounted at the predetermined mounting position on the substrate, and the mounting performance of the chip component can be improved.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of a mounting machine to which a nozzle eccentricity correction method of the present invention is applied.

FIG. 2 is a front view of the same.

FIG. 3 is a plan view of a suction nozzle tip at a suction nozzle rising position with respect to a rotation center of a nozzle member and a suction nozzle tip when the suction nozzle is lowered.

FIG. 4 is a flowchart showing a mounting operation in a mounting machine to which the nozzle eccentricity correction method of the present invention is applied.

FIG. 5 (a) is a schematic view showing when a chip component is picked up,
(B) is an assumed view when the chip part is moved to the temporary target position, and (c) is a schematic view showing a state where the chip part is moved to the final target position.

FIG. 6 is a logic diagram for obtaining a position change amount when a nozzle member is rotated.

FIG. 7 is a front view showing a nozzle portion of another mounting machine to which the nozzle eccentricity correction method of the present invention is applied.

FIG. 8A is a schematic perspective view showing an example when the suction nozzle with eccentricity is raised, and FIG. 8B is a schematic perspective view showing the suction nozzle shown in FIG. 8A when it is lowered.

FIG. 9 is a plan view of a suction nozzle tip at a suction nozzle rising position with respect to a rotation center of a nozzle member and a suction nozzle tip when the suction nozzle is lowered.

[Explanation of symbols]

 20 Nozzle member 21 Adsorption nozzle S Center of tip P Center of rotation

Claims (1)

[Claims] 1. A head movable in a horizontal direction is equipped with a suction nozzle capable of rotating and ascending and descending. The suction nozzle sucks a chip component, and the suction displacement of the chip component at a correction position where the suction nozzle is raised. In a mounter configured to set a movement target position at the time of mounting a chip component by adding or correcting the amount, the suction nozzle is lowered from the correction position to the chip component mounting position on the substrate when the chip component is mounted. A method for correcting eccentricity of nozzles in a mounting machine, characterized in that a planar position change amount of a suction nozzle tip center at this time is previously detected, and the movement target position is set in consideration of the position change amount.