JPH0661693A - Component mounting machine - Google Patents

Abstract

PURPOSE:To enhance efficiency in processing by eliminating the need for preliminary rotation when a correction amount of component mounting position is determined based on a detection signal of projection width obtained by rotating a suction nozzle, while sucking a chip component, in predetermined direction and then irradiating the chip component with a parallel light beam during rotation. CONSTITUTION:The component mounting machine comprises a laser unit 27 for irradiating a chip component sucked to a suction nozzle 21 in a head unit 5 with a parallel light beam and detecting the projection width thereof, and means for operating a correction amount of component mounting position based on a detection signal from the laser unit 27 during rotation of the suction nozzle 21 in predetermined direction, wherein the component arranging direction at a component feeding section 3 is inclined by a predetermined angle relatively to the laser beam irradiating direction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for accurately mounting a small chip component such as an electronic component such as an IC at a predetermined position on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, a component mounting head unit having a suction nozzle sucks a chip component from a component supply unit such as a tape feeder and transfers it onto a positioned printed circuit board to a predetermined position on the printed circuit board. A component mounting apparatus adapted to be mounted on a device is generally known. In this device, normally, the head unit is movable in the X-axis direction and the Y-axis direction, and the suction nozzle is movable and rotatable in the Z-axis direction to move and rotate in each direction. Drive mechanism is provided.
Further, in order to mount it accurately on a predetermined position on the printed circuit board, the position and the rotation angle of the chip component sucked by the suction nozzle are examined to obtain a correction amount corresponding to these errors, and the printed circuit board is accordingly It is also known in this type of device to adjust the position and the angle of rotation when mounting the.

As one of the methods for the above adjustment, a chip component is sucked by a suction nozzle of a head unit and is rotated around a suction point, while an optical detecting means is used to move the chip component from a certain direction to a laser or the like. There has been proposed a method in which parallel rays are emitted to detect the projection width thereof, and the correction amount is obtained based on the detected value.

[0004]

However, in the case of the method of obtaining the correction amount based on the detection of the projection width by the optical detecting means as described above, the following problems remain.

That is, as a method of this kind, for example, as shown in FIG. 12, a nozzle 21 sucking the chip component 20 is rotated by a predetermined angle in a predetermined positive direction (counterclockwise direction in FIG. 12), and in the meantime. A parallel light beam in the X-axis direction is applied to the chip component 20 to detect the projection width on the Y-axis. Then, as will be described later in the examples, in a state where the projection width is the minimum (a state where the long side or the short side of the component is in the X-axis direction), the rotation angle at that time, the center position of the projection width, etc. are checked, The correction amount is calculated based on this.

In this case, conventionally, the direction of the component at the time of suction by the nozzle has a variation within a predetermined rotation angle error range with the X-axis direction as the center, and it is unknown whether the component is tilted in the positive or negative direction. In some cases, a state in which the projection width is minimum may not be obtained simply by rotating the positive direction by a certain angle. For this reason, after picking up parts, the nozzle is set to some angle θ.
Preliminary rotation by rotating s in the negative direction (arrow R in FIG. 12
According to a), it is possible to ensure that the component has a minimum projection width by rotating the component in the negative direction with respect to the X-axis and then rotating it in the positive direction (arrow Rb). It is considered.

However, in this case, since the preliminary rotation is required, the time until the correction amount is obtained increases, which may hinder the efficiency improvement.

In view of the above circumstances, it is an object of the present invention to provide a component mounting apparatus capable of improving the processing efficiency by eliminating the preliminary rotation in the process of obtaining the component mounting position correction amount.

[0009]

In order to achieve the above object, the present invention comprises a component supply unit for supplying a chip component, a portion for holding a printed circuit board, and a head unit having a suction nozzle. In a component mounting apparatus that suctions a chip component from the component supply unit by a suction nozzle and mounts it on a printed circuit board, an optical detection unit that irradiates a parallel light beam to the chip component suctioned by the suction nozzle and detects the projection width thereof. And a calculation means for rotating the suction nozzle in the chip component suction state in a predetermined direction and obtaining a correction amount of the component mounting position based on a detection signal obtained from the optical detection means during the rotation. These arrangements are set such that the component arrangement direction of the component supply unit and the light beam irradiation direction of the optical detection means are inclined relative to each other by a predetermined angle.

In this structure, a plurality of rows of component supply members are provided in the component supply unit, while a plurality of suction nozzles are provided in parallel in the head unit, and the arrangement direction of these suction nozzles and the light irradiation of the optical detection means. It is preferable that the directions are relatively inclined and the arrangement of the component supply members and the arrangement of the suction nozzles are set to correspond to each other.

[0011]

According to the above construction, the chip component is always tilted in the same direction with respect to the parallel light irradiation direction at the time of mounting the component, and the preliminary rotation is unnecessary.

[0012]

Embodiments of the present invention will be described with reference to the drawings.
1 and 2 show the overall structure of a component mounting apparatus according to a first embodiment of the present invention. In these figures, a conveyor 2 which constitutes a portion for holding and carrying the printed circuit board 3 is arranged on the base 1, and the printed circuit board 3 is provided.
Are conveyed on the conveyor 2 and stopped at a fixed position of the mounting work station.

On the side of the conveyor 2, a component supply section 4 composed of a multi-row component supply member, which will be described in detail later, is arranged. A head unit 5 for mounting components is installed above the base 1. The head unit 5 is mounted in the X-axis direction (direction of the conveyor 2) and in the Y-axis direction (direction orthogonal to the X-axis on a horizontal plane). ) Can be moved to.

That is, the conveyor 2 is mounted on the base 1.
Two fixed rails 7 extending in the Y-axis direction across the same are arranged in parallel with each other at a predetermined interval, and as a Y-axis feed mechanism, one fixed rail 7 is provided near the one fixed rail 7.
Ball screw shaft 8 which is driven to rotate by a shaft servo motor 9
Are arranged. A support member 11 for supporting the head unit 5 is movably supported on the fixed rails 7, and a nut portion 12 at an end of the support member 11 is screwed onto the ball screw shaft 8. Ball screw shaft 8
The rotation of the support member 11 causes the support member 11 to move in the Y-axis direction. The Y-axis servomotor 9 is provided with Y-axis position detecting means 10 including an encoder.

A guide rail 13 extending in the X-axis direction is provided on the support member 11, and a ball screw shaft 14 as an X-axis feed mechanism and an X-axis servomotor for rotationally driving the ball screw shaft 14 are provided. 15 and is equipped. The head unit 5 is movably supported on the guide rail 13, and the nut portion 17 provided on the head unit 5 is attached to the ball screw shaft 14
The head unit 5 is moved in the X-axis direction by the rotation of the ball screw shaft 14. X above
The axis servo motor 15 is provided with X-axis position detecting means 16.

The head unit 5 includes a chip component 2
A suction nozzle 21 for sucking 0 is provided, and three suction nozzles 21 are provided in the illustrated example. As shown in detail in FIG. 3, each suction nozzle 21 can be moved in the Z-axis direction (vertical direction) and rotated about the R-axis (nozzle center axis), and the Z-axis servo motor 22 for each suction nozzle 21 can be moved. An R-axis servomotor 24 is provided in the head unit 5. Each of the servo motors 22 and 2 above
4 are provided with position detecting means 23 and 25, respectively. Further, the interference position detecting means 26 for detecting the interference position between the suction nozzle 21 and the component supply unit 4 is provided by the head unit 5.
Installed on.

A laser unit 27, which constitutes an optical detecting means, is attached to the lower end of the head unit 5. This laser unit 27 has a suction nozzle 2
Chip component 2 in the chip component adsorption state by 1
It irradiates a laser which is a parallel light beam to 0 and detects the projected width thereof, and has a laser generating portion 27a and a detector (CCD) 27b which face each other across the suction nozzle 21.

As shown in FIG. 4, each of the servo motors 9, 15, 22, 24 and the position detecting means 10, 16, 2 is described above.
3, 25 are electrically connected to an axis controller (driver) 31 of the main controller 30. The laser unit 27 is electrically connected to the laser unit computing section 28, and the R-axis position detecting means 25 is also connected to the laser unit computing section 28. The laser unit calculator 28 is connected to the main calculator 33 via the input / output means 32 of the main controller 30. The main arithmetic unit 33 constitutes an arithmetic means for obtaining the correction amount of the component mounting position.
Further, the interference position detecting means 26 is connected to the input / output means 32.

Further, as shown in FIG. 1, the component supply unit 4 is provided with a plurality of rows of supply tapes (component supply members) 4a for enabling supply of a large number of types of chip components.
Each supply tape 4a has an IC, a transistor,
The small tape-shaped chip parts 20 such as capacitors are housed and held at equal intervals and wound around a reel.
A ratchet-type feed mechanism is incorporated in the feeding end 4b of the feeding tape 4a, and as the chip component 20 is picked up from the feeding end 4b by the suction nozzle 20 of the head unit 5, the feeding tape 4a is intermittently fed and the pickup work is performed. Can be repeated.

Further, as a feature of the present invention, these arrangements are set so that the component arrangement direction of the component supply section 4 and the laser beam irradiation direction of the laser unit 27 are relatively inclined at a predetermined angle. , In this example,
The component arranging direction of the component supply unit 4 is inclined.

The relationship between the component arrangement direction and the laser beam irradiation direction will be described with reference to FIGS. 1 and 6.
The laser unit 27 is arranged so that the laser beam irradiation direction is the X-axis direction. On the other hand, in the component supply section 4, the direction of the supply tape 4a is tilted by a predetermined angle α with respect to the Y-axis in a plan view, so that the direction perpendicular to the supply tape direction is a predetermined angle with respect to the laser beam irradiation direction. The supply tapes 4a are arranged so as to be inclined by α, and the chip parts 20 are housed in the supply tapes 4a in such an arrangement that the long sides are substantially perpendicular to the supply tape direction. The predetermined angle α is set so as to be commensurate with the rotation angle error range of the chip component 20 housed and arranged in the supply tape 4a.

As shown in FIG. 1, the suction nozzles 21 of the head unit 5 are arranged in a direction inclined with respect to the X and Y axes in order to avoid overlapping in the laser beam irradiation direction. There is. In addition, the component supply unit 4
The feeding ends 4b of the supply tapes 4a are arranged in a direction corresponding to the arrangement direction of the suction nozzles 21.

The chip component mounting operation by the apparatus of this embodiment as described above will be described below with reference to FIG.

According to a predetermined program, first, negative pressure is applied to the suction nozzle 21 by negative pressure generating means (not shown), and the head unit 5 is moved to the X position.
When moved to a position corresponding to the component supply unit 4 by being actuated in the axial and Y-axis directions and reaching the suction target position, the suction nozzle descends (Fig. 5 (a)), and the feeding end 4b of the supply tape 4a.
The chip component 20 located at is adsorbed. Then, when the suction nozzle 21 rises and rises to a position where the suction nozzle 21 moves out of the interference area with the component supply unit 4 (FIG. 5B), the movement of the head unit 5 to the printed circuit board 3 side is started. .
When the chip component 20 further rises to a position corresponding to the recognition height of the laser unit 27 (FIG. 5C), a process for correcting a component mounting position described later is performed in parallel with the movement of the head unit 5. When the head unit 5 reaches the target mounting position with the above correction taken into consideration, the nozzle descends (FIG. 5 (d)). When the chip component 20 descends to a predetermined height close to the printed circuit board 3 (FIG. 5 (e)), the negative pressure of the suction nozzle 21 is cut off, so that the chip component 20 is cut.
Are mounted on the printed circuit board 3. After that, suction nozzle 2
1 rises, and a series of sucking and mounting operations are completed.

Although only one suction nozzle 21 is shown in FIG. 5 for simplification of the operation description, a plurality of suction nozzles 21 are shown.
In the case where the chip component 20 is provided, each suction nozzle 21 performs operations such as suction and mounting of the chip component 20. In this case, when the arrangement of the suction nozzles 21 and the arrangement of the feeding ends 4b of the supply tapes 4a correspond to each other as shown in FIG. 1, the suction nozzles 21 can simultaneously suck a plurality of chip components 20. .

The process for correcting the component mounting position, which is performed during the suction and mounting operation, will be described with reference to FIGS. 6 and 7.

In the state where the chip component 20 is sucked from the supply tape 4a by the suction nozzle 21 and lifted as it is, the long side direction of the chip component 20 is centered on the direction orthogonal to the supply tape direction and has a constant rotation angle error range. However, since the chip component arrangement direction (direction orthogonal to the direction of the supply tape 4a) is inclined by a predetermined angle α with respect to the laser beam direction (X-axis direction), even if there is the above rotation angle error. The chip component 20 is always tilted in the negative direction (clockwise in the figure) with respect to the laser beam direction (FIG. 6). Therefore, even if the preliminary rotation in the negative direction is not performed,
The following correction process is achieved.

From the initial state shown in FIG. 6, the suction nozzle is rotated in the forward direction (counterclockwise direction) by a constant angle θe (for example, 45 °) (FIG. 7). While this rotation operation is being performed, the laser generator 2 of the laser unit 27 is
The laser beam emitted from 7a is the detector 27.
The light is received by b and the projection width of the chip component 20 is detected.
The change of the projection width W according to the rotation angle θ in this case is as shown in FIG.
The long side of 0 corresponds to the laser beam direction, and the projection width becomes the minimum.

The projection width W _S and its center position C _S in the initial state as shown in FIG. 9, the projection width W min when the projection width is in the minimum state, the center position C _{m of the} projection width and the initial position The suction nozzle rotation angle θ _m from the state is read by the main calculation unit 33 via the laser unit calculation unit 28 and the input / output unit 32. Then, based on these values, the main operation unit 33 causes the component mounting position correction amount X _C ,
Y _C and θ _C are calculated.

That is, assuming that the chip component 20 is mounted on the printed circuit board 3 with the long side in the X-axis direction, Y out of the component mounting position correction amounts X _C , Y _C and θ _C.
The correction amount in the θ direction is Y _C , θ _C is

[0031]

## EQU1 ## Y _C = C _m −C _N θ _C = θ _m . C _N is the center position (suction point) of the suction nozzle 21 and is a known value.

Further, in this embodiment, the X-direction correction amount X _C is calculated by using the data obtained by the detection, and the calculation will be described below with reference to FIG. In FIG. 9, O is the suction nozzle center point, b and B are the chip component center points in the initial state and the minimum projected width state, and Δa
Ob≡ΔAOB.

L _AB : length of line segment AB _ab : length of line segment ab L _AO : length of line segment AO L _aO : length of line segment aO Y _ab : on Y axis of line segment ab Projection length of Y _aO : If the projection length of the line segment aO on the Y axis is

[0034]

## EQU2 ## C _N -C _S = Y _aO + Y _ab

[0035]

[ _Formula 3] Y _aO = L _aO · sin θ _m

[0036]

## EQU4 ## Y _ab = L _ab .cos θ _m . Then, L _aO = L _AO = X _C , L _ab = L _AB = C _N
Since −C _m , X _C is derived from the above equations as in the following equation.

[0037]

X _C = {(C _N −C _S ) − (C _N −C _m ) · cos θ _m } / sin θ _m FIG. 10 shows a second embodiment of the present invention. In this embodiment, the component arrangement direction of the component supply unit 4 and the laser unit 2 are
The laser beam irradiation direction is inclined so that the laser beam irradiation direction of No. 7 is inclined relative to the laser beam irradiation direction by a predetermined angle. That is, the supply tape 4a of the component supply unit 4
Are arranged in the Y-axis direction, the feeding ends 4b of the supply tapes 4a are aligned in the X-axis direction, and the suction nozzles 21 of the head unit 5 are also aligned in the X-axis direction. On the other hand, the laser unit 27 is attached to the head unit 5 in an arrangement such that the laser beam direction thereof is inclined by a predetermined angle α with respect to the X axis.

Also in this embodiment, since the state in which the chip component 20 is always tilted in the same direction with respect to the laser beam direction is ensured when the chip component is picked up, preliminary rotation is not required in the process for correcting the component mounting position. become. In addition, the chip components 20 can be simultaneously sucked by a plurality of suction nozzles 21 as in the first embodiment.

FIG. 11 shows a third embodiment of the present invention. In this embodiment, in addition to the laser unit 27 being attached to the head unit 5 as in the second embodiment (or the first embodiment), a relatively large laser unit 40 is mounted on the base 1. It is fixedly installed.

According to this embodiment, if the chip component is relatively small, the attached laser unit 27 is used for the head unit 5 to perform the correction process during the movement operation of the head unit 27, but the chip component is large. If the detection by the laser unit 27 attached to the head unit is difficult, it can be carried to the fixed laser unit 40 and the correction processing can be performed based on the detection here.

In each of the above embodiments, the head unit is provided with a plurality of suction nozzles, but the number is not limited and may be one. Besides this, the specific structure of each part may be changed without departing from the gist of the present invention.

[0042]

As described above, the component mounting apparatus of the present invention is
Optical detection means for radiating parallel light rays to the chip component sucked by the suction nozzle to detect its projection width, and component mounting based on the detection signal of the optical detection means while rotating the suction nozzle in a predetermined direction. With the means for determining the position correction amount, and because the component placement direction of the component supply section and the light beam irradiation direction of the optical detection means are inclined relative to each other by a predetermined angle, the chip component is always attracted. The state in which the chip component is tilted in a certain direction with respect to the irradiation direction of the parallel rays is ensured, and the correction amount can be obtained without requiring preliminary rotation. Therefore, the time required for correction can be shortened and the efficiency can be improved.

Further, the head unit is provided with a plurality of suction nozzles in parallel, the arrangement direction of these suction nozzles and the light irradiation direction of the optical detection means are relatively inclined, and the above-mentioned component supply member If the array and the array of the suction nozzles are set to correspond to each other, in addition to the above effects,
A plurality of parts can be adsorbed at the same time, and the efficiency can be further improved.

[Brief description of drawings]

FIG. 1 is a plan view of a component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a front view of the same device.

FIG. 3 is an enlarged view of a mounting head unit.

FIG. 4 is a block diagram showing a control system.

5A to 5E are operation explanatory views sequentially showing a series of suction and attachment operations.

FIG. 6 is an explanatory diagram showing a state when a suction nozzle picks up a component.

FIG. 7 is an explanatory diagram showing a state in which a chip component is rotated as a process for obtaining a mounting position correction amount.

FIG. 8 is a diagram showing a change in projection width with rotation of a chip component.

FIG. 9 is a diagram for explaining how to obtain a mounting position correction amount.

FIG. 10 is a plan view showing a second embodiment.

FIG. 11 is a plan view showing a third embodiment.

FIG. 12 is an explanatory diagram showing a problem in the case of the conventional example.

[Explanation of symbols]

 3 Printed Circuit Board 4 Component Supply Section 5 Head Unit 20 Chip Component 21 Adsorption Nozzle 9, 15, 22, 24 Servo Motor 10, 16, 23, 25 Position Detection Means 27 Laser Unit (Optical Detection Means) 30, Main Controller

Claims (2)

[Claims] 1. A printed circuit board comprising: a component supply unit for supplying a chip component; a portion for holding a printed circuit board; and a head unit having a suction nozzle, wherein the suction nozzle sucks the chip component from the component supply unit. In the component mounting device to be mounted on, the optical detection means for irradiating the chip component sucked by the suction nozzle with a parallel light beam to detect the projection width, and the suction nozzle in the chip component suction state are rotated in a predetermined direction. During the rotation, there is provided a calculation means for obtaining a correction amount of the component mounting position based on a detection signal obtained from the optical detection means, and the component arrangement direction of the component supply section and the light irradiation of the optical detection means. The component mounting apparatus is characterized in that these arrangements are set so as to be inclined at a predetermined angle relative to the direction. 2. A plurality of rows of component supply members are provided in the component supply unit, while a plurality of suction nozzles are provided in parallel in the head unit, and the arrangement direction of these suction nozzles and the light irradiation direction of the optical detection means are set. Is relatively inclined, and the arrangement of the component supply members and the arrangement of the suction nozzles are set to correspond to each other, the component mounting apparatus.