JP3696413B2 - Electronic component mounting method and electronic component mounting apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method and an electronic component mounting apparatus for mounting an electronic component on a printed board after position recognition using each of a plurality of mounting heads that can be moved independently.
[0002]
[Prior art]
As this kind of electronic component mounting apparatus, an apparatus described in JP-A-9-270595 is known. According to this prior art, two mounting heads that can be independently moved by two XY stages take out electronic components and mount them on a printed circuit board.
[0003]
[Problems to be solved by the invention]
However, in the above-described prior art, particularly when an electronic component that requires mounting accuracy is to be mounted on a printed circuit board, vibration occurs due to movement of another mounting head, and the component has the required positional accuracy. There was a problem that it could not be installed.
[0004]
This is because the position of the electronic component held by the mounting head cannot be recognized due to vibrations caused by the movement of other heads, and when the component comes into contact with the board. It is thought that the position is shifted due to the vibration of the head.
[0005]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to prevent the accuracy when mounting an electronic component from being deteriorated due to the movement of another mounting head that can move independently.
[0006]
[Means for Solving the Problems]
For this reason, the present invention provides a plurality of beams that move in a direction orthogonal to the longitudinal direction and movement of the mounting head that is provided on each of the beams and is movable in the longitudinal direction. In an electronic component mounting method for picking up a component and mounting it on a printed circuit board after position recognition by a component recognition device, an electronic device that specifies the type of electronic component to be mounted at each mounting step and requires mounting accuracy at each mounting step Mounting data that can be designated as a component is stored in the storage means, and an electronic component that requires the mounting accuracy stored in the storage means is held by a mounting head mounted on one beam, and position recognition and / or or parts thereof beam and control means so as to decelerate or stop the movement of the other beam when stopping the horizontal movement of the mounting head for mounting It is intended to control.
[0007]
The present invention also provides a plurality of beams that move in a direction perpendicular to the longitudinal direction of the beam and a mounting head that is provided on each of the beams and is movably mounted in the longitudinal direction. In the mounting method of the electronic component that is taken out and mounted on the printed circuit board after position recognition by the component recognition device, the electronic device that requires mounting accuracy is stored in the storage unit for each type of electronic component, and the storage unit The mounting head mounted on one beam holds the electronic components that require mounting accuracy stored in the beam and stops the horizontal movement of the beam and mounting head for position recognition and / or component mounting. The control means controls so as to decelerate or stop the movement of the other beam when it is in operation.
[0010]
The present invention further includes a plurality of beams that move in a direction orthogonal to the longitudinal direction thereof, and a mounting head that is mounted on each of the beams so as to be movable in the longitudinal direction. Specifies the type of electronic component to be mounted at each mounting step and mounting accuracy at each mounting step in the electronic component mounting device that takes out the electronic component from the component supply unit and mounts it on the printed circuit board after position recognition by the component recognition device The mounting head mounted on one beam holds storage means for storing mounting data capable of designating that the electronic component is required, and an electronic component requiring mounting accuracy stored in the storage means. When the horizontal movement of the beam and the mounting head is stopped for position recognition and / or component mounting, the movement of other beams is decelerated or stopped. As is provided with a control means for controlling.
[0011]
The present invention further includes a plurality of beams that move in a direction orthogonal to the longitudinal direction thereof, and a mounting head that is mounted on each of the beams so as to be movable in the longitudinal direction. In the electronic component mounting apparatus that takes out the electronic component from the component supply unit and mounts it on the printed circuit board after the position recognition by the component recognition device, the storage stores for each type of electronic component that the mounting accuracy is required. And a mounting head mounted on one beam holding an electronic component stored in the storage means that requires mounting accuracy, and the beam and the mounting head in the horizontal direction for position recognition and / or component mounting. Control means for controlling to decelerate or stop the movement of other beams when the movement of the beam is stopped is provided.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
[0013]
In FIG. 2, a pair of rails 5 for guiding the movement of the A beam 3 and the B beam 4 in the Y direction are disposed on the base 2 of the electronic component mounting apparatus 1. The A beam 3 and the B beam 4 are long in the X direction, and the mounting heads 7 and 8 are arranged to be movable along the longitudinal direction. Accordingly, the mounting heads 7 and 8 are movable in the XY directions. A ball screw shaft 11 rotated by the A side Y-axis motor 10 is screwed into a nut (not shown) fixed to the A beam 3, and the A beam 3 moves along the rail 5 by the rotation of the ball screw shaft 11. Is possible. Further, the B beam 4 moves along the rail 5 when the ball screw shaft 12 having the same structure is rotated by the B side Y axis motor 14. A component supply unit is formed at each of the upper and lower positions in FIG. 2 of the base 2, and the component supply unit 16 for supplying various chip-shaped electronic components (not shown) is arranged in parallel in the X direction in the component supply unit. ing. The mounting head 7 transports and mounts an electronic component taken out from the component supply device 16 by vacuum suction to a desired position on the printed circuit board 18.
[0014]
The printed circuit board 18 is transported by a transport conveyor 20 installed on the base 2 and positioned and fixed by a fixing mechanism (not shown) at a predetermined position.
[0015]
The electronic component taken out from the component supply device 16 is recognized by the component recognition camera 21 for its positional deviation with respect to the mounting head 8.
[0016]
Next, the control block of the electronic component mounting apparatus 1 will be described with reference to FIG.
[0017]
Reference numeral 23 denotes a CPU that performs overall control of operations related to component mounting of the electronic component mounting apparatus in accordance with a program stored in the ROM 25 based on data stored in the RAM 24. An interface 26 is connected to the CPU 23, an A-side X-axis motor 29 via an A-side X-axis driver 28, an A-side Y-axis motor 10 via an A-side Y-axis driver 30, and a B-side X-axis driver 31. The B-side X-axis motor 32 is connected via the B-side Y-axis driver 33, and the B-side Y-axis motor 14 is connected via the B-side Y-axis driver 33. The component recognition camera 21 and the like are connected to the interface 26. The program stored in the ROM 25 includes a program relating to a flowchart for controlling the XY movement of the symmetric beam shown in FIG.
[0018]
The RAM 24 stores part library data for each component type as shown in FIG. 5 and mounting data for each board type as shown in FIG. The part library data stores the data related to each part ID indicating the part type. When “Symmetric beam speed designation” is Y, this part needs to be precisely positioned. The part library data includes the symmetric beam, that is, the moving speed of the beam 4 or 3 opposite to the mounting head 7 or 8 holding the part and the moving speed of the mounting head 8 or 7 along the beam 4 or 3. The displayed symmetric beam speed is controlled. The mounting data indicates the component type, the XY coordinate position on the printed circuit board 18 and the rotation angle position around the vertical axis for each mounting step, which is the order of mounting the electronic components on the printed circuit board.
[0019]
The operation will be described below.
[0020]
The automatic operation of the electronic component mounting apparatus 1 will be described. A part of this operation is performed according to the flowchart of FIG.
[0021]
First, according to the mounting data of FIG. 6, the mounting head 7 is moved to the picking position of the component supply device 16 component of the upper component supply unit of FIG. 2 by the rotation of the A side Y axis motor 10 and the A side X axis motor 29. When the head 7 is lowered by a lifting mechanism (not shown), the electronic component is sucked and taken out.
[0022]
Next, the mounting head 7 conveys the electronic component and stops so that the suction position is at the center of the screen of the component recognition camera 21, and the displacement of the electronic component is recognized based on the captured image of the recognition camera 21.
[0023]
Next, the mounting head 7 is moved to a position where this positional deviation is corrected so that the center of the electronic component is positioned at the position indicated by the mounting data in FIG. The angle of the head 7 is changed by an angle changing mechanism (not shown) according to the θ angle of the electronic component.
[0024]
Next, the electronic component is mounted on the printed circuit board 18 by lowering the mounting head 7.
[0025]
Next, the other mounting head 8 picks up the component 5 from the component supply device 16 of the lower component supply unit in FIG. 2 and is indicated by the data on the printed circuit board 18 as in the case of the mounting head 7 described above. Install in position.
[0026]
At this time, according to the flowchart shown in FIG. 1, the part library data of the suction-symmetric part is read out by the CPU 23. In this case, since the symmetric beam speed designation is “N”, the mounting head 8 recognizes the part. Even when the mounting is stopped for mounting, the moving speed of the beam 3 that is a symmetrical beam and the mounting head 7 that moves on the beam 3 are not decelerated or stopped.
[0027]
Note that the mounting data shown in FIG. 6 indicates that the mounting head 7 and the mounting head 8 alternately take out the components from the upper component supply unit and the lower component supply unit in FIG. The mounting steps of the component supply device 16 of the component supply unit and the component supply device 16 of the lower component supply unit are designated and created. The mounting head 7 can take out components only from the upper component supply unit, and the mounting head 8 can take out components only from the lower component supply unit.
[0028]
Next, the mounting head 7 moves to the corresponding component supply device 16 in the component supply unit in the upper part of FIG. For this reason, the CPU 23 reads the mounting data mounting step 3 from the RAM 24 at a predetermined timing. At this time, according to the flowchart of FIG. N ”is checked. As a result, since it is “Y”, the CPU 23 moves the symmetric beam B beam 4 and the mounting head 8 at the specified symmetric beam speed when the mounting head 7 stops for recognition and mounting. It is decided to set a certain 0, that is, stop.
[0029]
Next, the mounting head 7 performs the component suction operation of mounting step 3. At this time, the mounting head 8 of the beam 4, which is a symmetrical beam, shows the operation of mounting the electronic component of step 2 on the substrate 18 as shown in FIG. The timing is as follows.
[0030]
Next, the mounting head 7 moves above the component recognition camera 21 by the movement of the A beam 3 and the mounting head 7 on the A beam 3, and stops according to the symmetric beam velocity of FIG. At this time, the mounting head 8 is moving at a normal speed toward the component supply unit for component adsorption in the next mounting step 4, while the mounting head 7 is stopped as shown in FIG. 4. Is started and stopped at a predetermined timing so as to stop, and the movement starts after the component recognition is completed and the mounting head 7 starts moving. Therefore, the vibration of the mounting head 7 itself is attenuated without vibration due to the movement of the B beam 4 and the mounting head 8, and accurate imaging is performed without causing the component recognition image to be blurred. Recognition is made.
[0031]
Next, when the mounting head 7 stops at a designated position on the printed circuit board 18 for component mounting, the mounting head 8 also stops as shown in FIG.
[0032]
Naturally, the mounting head 7 that adsorbs the components recognizes or mounts the time zone in which the speed (including the stop) shown in FIG. 5 of the mounting head 8 that is the symmetrical beam in this case is maintained. The movement efficiency is better when the time is exactly the same as the time when the vehicle is stopped.
[0033]
Further, as shown in FIG. 7 as the second embodiment, stop or deceleration of the symmetric beam may be designated. That is, in the above-described embodiment, the symmetric beam speed designation is specified as shown in FIG. 5 in the library data for each component type, but as shown in FIG. A designation is input so that it can be stored in the RAM 24. When the symmetric beam velocity designation column is blank, it indicates that there is no designation, and the same control as N is performed when the symmetric beam velocity designation of the part library data in FIG. In this case, control of deceleration or stop of the symmetric beam is not performed unless the parts of the same type are designated for each mounting step.
[0034]
Further, in this embodiment, when the symmetric beam velocity designation is “Y”, the beam 3 or 4 on the side that is not the component to be accurately mounted is only decelerated or stopped when the component is recognized or mounted. In addition, the mounting head 7 or 8 moving along the beam was also stopped or decelerated, but the beam 3 or 4 has a greater influence on the other mounting head due to vibration, so the beam 3 or 4 is stopped. Alternatively, the mounting head 7 or 8 moving on the head may be stopped or not decelerated.
[0035]
【The invention's effect】
As described above, according to the present invention, the movement of other beams is stopped, the movement of other mounting heads is stopped, and the position of the electronic component can be recognized or mounted. Can keep .
[Brief description of the drawings]
FIG. 1 is a flowchart related to control of XY movement of a symmetric beam of an electronic component mounting apparatus.
FIG. 2 is a plan view of the electronic component mounting apparatus.
FIG. 3 is a control block diagram of the electronic component mounting apparatus.
FIG. 4 is a diagram comparing changes in the movement speed of the B beam with respect to changes in the movement speed of the A beam holding a part that requires positional accuracy.
FIG. 5 is a diagram showing part library data.
FIG. 6 is a diagram showing mounting data.
FIG. 7 is a diagram showing mounting data in the second embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 A beam 3 B beam 7 Mounting head 8 Mounting head 18 Printed circuit board 21 Component recognition camera 23 CPU (control means)
24 RAM (storage means)

Claims (4)

A plurality of beams moving in a direction perpendicular to the longitudinal direction, and a mounting head provided on each of the beams so as to be movable in the longitudinal direction, the mounting head takes out the electronic component from the component supply unit and recognizes the component. In the mounting method of electronic components to be mounted on the printed circuit board after position recognition by the device ,
The type of electronic component to be mounted for each mounting step is specified, and mounting data that can specify that the electronic component is required to be mounted for each mounting step is stored in the storage unit, and stored in the storage unit When the mounting head mounted on one beam holds an electronic component that requires mounting accuracy and the horizontal movement of the beam and mounting head is stopped for position recognition and / or component mounting , A method for mounting an electronic component, wherein the control means controls so as to decelerate or stop the movement of the beam . A plurality of beams moving in a direction perpendicular to the longitudinal direction, and a mounting head provided on each of the beams so as to be movable in the longitudinal direction, the mounting head takes out the electronic component from the component supply unit and recognizes the component. In the mounting method of electronic components to be mounted on the printed circuit board after position recognition by the device ,
A mounting head that stores electronic components that require mounting accuracy stored in the storage unit for each type of electronic component and that requires the mounting accuracy is mounted on one beam. When the movement of the beam and the mounting head in the horizontal direction is stopped for holding and recognizing position and / or component mounting, the control means controls to decelerate or stop the movement of other beams. How to install electronic components. A plurality of beams that move in a direction perpendicular to the longitudinal direction, and a mounting head that is mounted on each of the beams so as to be movable in the longitudinal direction. In an electronic component mounting device that takes out an electronic component and mounts it on a printed circuit board after position recognition by the component recognition device ,
A storage means for specifying the type of electronic component to be mounted at each mounting step and storing mounting data capable of specifying that the electronic component is required to be mounted at each mounting step , and stored in the storage means When the mounting head mounted on one beam holds an electronic component that requires mounting accuracy and the horizontal movement of the beam and mounting head is stopped for position recognition and / or component mounting , An electronic component mounting apparatus comprising control means for controlling to decelerate or stop the movement of a beam . A plurality of beams that move in a direction perpendicular to the longitudinal direction, and a mounting head that is mounted on each of the beams so as to be movable in the longitudinal direction. In an electronic component mounting device that takes out an electronic component and mounts it on a printed circuit board after position recognition by the component recognition device ,
There is a storage means for storing for each type of electronic component that it is an electronic component that requires mounting accuracy, and a mounting head on which the electronic component that requires mounting accuracy stored in the storage means is mounted on one beam. Control means is provided for controlling to decelerate or stop the movement of other beams when holding and stopping the horizontal movement of the beam and the mounting head for position recognition and / or component mounting. Electronic component mounting device.

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