JP3720209B2 - Electronic component automatic placement equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component automatic mounting apparatus that takes out an electronic component from a component supply unit provided side by side on a supply table and mounts the electronic component on a printed circuit board.
[0002]
[Prior art]
Conventionally, in this type of electronic component automatic mounting apparatus, a mounting head for sucking an electronic component is moved in the XY directions, the component is taken out from a component supply unit at a predetermined position, and mounted on a printed circuit board fixed at a predetermined position. It has been known. Such a method is often used in a so-called multi-function mounter that mounts various types of electronic components on a substrate.
[0003]
[Problems to be solved by the invention]
However, since the mounting head reciprocates between the suction position and the mounting position of the component, the mounting speed of the component cannot be increased much.
[0004]
For this reason, in order to increase the speed of component mounting, for example, a method of providing a plurality of mounting heads for XY movement has been proposed, but it is not easy to control the movement so that the mounting heads do not interfere with each other.
[0005]
Accordingly, an object of the present invention is to reduce the waste of movement of the mounting head as much as possible.
[0006]
[Means for Solving the Problems]
Therefore, the present invention provides an electronic component automatic mounting apparatus that takes out an electronic component from a component supply unit arranged in parallel on a supply table and mounts the electronic component on a printed circuit board, and extends in the parallel arrangement direction of the component supply unit. A beam movable in a direction perpendicular to the beam, a plurality of mounting heads movable along the beam, and a substrate placement table that is movable in the same direction as the beam movement direction and places the printed circuit board The substrate mounting table moves separately from the beam with respect to the moving direction of the beam on a base table that moves together with the beam .
[0007]
In this way, even if there is not a plurality of beams, even if one mounting head is attracting a component, the other mounting head can mount the component on the substrate, and the mounting efficiency can be increased.
Further, the movement distance of the substrate mounting table can be shortened and the movement control can be simplified.
[0008]
In the present invention, the movement path of each mounting head on the beam is preferably different.
[0009]
By doing so, interference between the mounting heads can be eliminated, and restrictions on movement of the mounting heads can be eliminated.
[0010]
In the present invention, it is preferable that the supply bases on which the component supply units are arranged in parallel are provided on both sides of the printed circuit board in the beam moving direction.
[0011]
In this way, after one head picks up a component from one supply base, it can pass through the entire printed circuit board while the other head moves to pick up the component from the other supply base. In addition, it is possible to avoid waste in component mounting of one head and component suction operation of the other head.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of an electronic component automatic mounting apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
[0015]
1 and 2, a supply base 3 and a supply base 4 are provided on both sides of the base 2 of the electronic component automatic mounting apparatus 1. Each of the supply bases 3 and 4 has a large number of component supply units 6 arranged in parallel. Each of the component supply units 6 stores and supplies a large number of electronic components of the same type, and different units 6 can supply various types of electronic components by supplying different types of components. An arrangement direction of the component supply unit 6 is an X direction, and a direction orthogonal to the X direction is a Y direction in a horizontal plane.
[0016]
A substrate mounting table 8 on which the printed circuit board 7 is mounted is installed between the supply bases 3 and 4, and the printed circuit board 7 is fixed on a pair of chutes 10 on the table 8. The printed circuit board 7 discharged from the upstream apparatus is transferred to the chute 10 by the supply conveyor 11 and transferred, and the board 7 on the chute 10 is transferred to the discharge conveyor 12 and discharged to the downstream apparatus. The printed circuit board 7 is conveyed in the X direction on the conveyors 11 and 12 and the chute 10.
[0017]
The mounting heads 14 and 15 for taking out and holding electronic components from the component supply unit 6 and mounting them on the printed circuit board 7 are provided so as to be movable in the X direction on a beam 16 extending in the X direction.
[0018]
The mounting heads 14 and 15 are provided on opposite sides of the beam 16 and can be individually moved by a driving source such as a ball screw (not shown). Further, since the movement paths of the mounting heads 14 and 15 are at positions where the beam 16 is opposed, they do not interfere with each other.
[0019]
The beam 16 is guided by guide rails 17 provided in a pair of Y directions on both sides of the base 2 so as to be movable, and is moved by driving a ball screw shaft 18 rotated by a motor (not shown).
[0020]
Each of the mounting heads 14 and 15 includes a plurality of suction nozzles 20, and each suction nozzle 20 can move up and down relative to the mounting heads to vacuum-suck electronic components. Individual electronic components can be sucked and held. The mounting heads 14 and 15 each have a substrate recognition camera 22. The substrate recognition camera 22 recognizes the position of a positioning mark (not shown) attached on the substrate 7 and recognizes the position where the substrate 7 is fixed.
[0021]
The substrate mounting table 8 is movable in the Y direction. A structure for driving this movement will be described.
[0022]
As shown in FIG. 3, a pair of guide rails 24 extending in the Y direction are provided on the base 2 to guide the movement of the base table 25. A pair of guide rails 27 extending in the Y direction are provided on the base table 25 and guide the movement of the substrate mounting table 8 in the Y direction.
A Y-axis motor 30 and a screw shaft 31 rotated by the motor 30 are further provided on the base table 25, and the screw shaft 31 is screwed into a nut portion (not shown) fixed to the substrate mounting table 8. The table 8 moves on the base table 25 in the Y direction by the rotation of the motor 30.
[0023]
Further, the base table 25 moves in synchronization with the beam 16. That is, as shown in FIG. 3, the belt is between a pulley 33 that is fixed to a screw shaft 18 that drives the movement of the beam 16 and rotates together with the screw shaft 18 and a pulley 34 that is rotatably fixed on the base 2. 35, and a belt 38 is stretched between a pulley 37 and a pulley (not shown) that are coaxial with the pulley 34 and have the same diameter as the pulley 34. Rotate by the amount of rotation angle. A ball screw shaft (not shown) is fixed to the pulley 37, and a nut portion (not shown) fixed to the base table 25 is screwed to the screw shaft. Therefore, the base table 25 moves together with the beam 16 without changing the position in the Y direction. Further, the substrate mounting table 8 can freely move in the Y direction with respect to the beam 16.
[0024]
A motor for rotating the ball screw shaft to which the pulley 37 is attached is provided without using the above-described interlocking drive mechanism using the pulley and belt, and the motor and the motor for driving the movement of the beam 16 are synchronized to rotate. The beam 16 and the base table 25 may be moved without changing the relative positional relationship.
Below the supply bases 3 and 4, a space is formed so that the base table 25, the substrate mounting table 8, and the printed circuit board 7 fixed on the table 8 can enter. Even when the component 14 is attracting components, the mounting head 15 can mount components at any position on the printed circuit board 7.
[0025]
Further, a component recognition camera 39 for recognizing the positional deviation of the electronic component held by the mounting heads 14 and 15 with respect to the suction nozzle 20 with respect to the nozzle 20 is provided on the supply bases 3 and 4, respectively. The camera 39 is lower than the height of the component supply unit 6 so that the mounting heads 14 and 15 can move smoothly.
[0026]
The thickness of the parts supply unit 3 and the thickness of the parts supply unit and the thickness of the recognition camera 39 are as small as possible so that the suction nozzle 20 can be moved down to the substrate 7 to reduce the stroke. It is desirable to make it thinner.
The positions at which the components of each component supply unit 6 are taken out by each of the supply bases 3 and 4 are on one straight line with respect to the X direction, and the center of the imaging screen of the camera 39 is also on this straight line. Since the plurality of suction nozzles 20 are also arranged on a straight line facing the X direction in the mounting heads 14 and 15, the suction position of the parts may be finely adjusted. The electronic components are picked up by the movement of 14 and 15, and the camera 39 can recognize the components as they are.
[0027]
Further, a component recognition camera 40 for recognizing a positional shift of the electronic component held by the suction nozzle 20 of the mounting heads 14 and 15 with respect to the nozzle 20 is installed on the base 2. Further, on the base 2, a nozzle stocker 41 in which a plurality of types of suction nozzles 20 for replacing the suction nozzles detachably attached to the mounting heads 14 and 15 is installed.
[0028]
The operation will be described below with the above configuration.
[0029]
First, the substrate 7 discharged from the upstream apparatus by the supply conveyor 11 is transported, transferred onto the chute 10, and fixed by a fixing mechanism (not shown).
[0030]
Next, the electronic component is mounted on a desired position on the board 7 according to the mounting data specifying the mounting position on the board 7 and the type of component to be mounted for each mounting order stored in a storage device (not shown). .
[0031]
That is, the mounting heads 14 and 15 move on the beam 16 and the beam 16 to take out the components from the component supply unit 6 that supplies the electronic components specified in the order of the data, and the suction nozzle 20 sucks the components. .
[0032]
Preferably, for example, the mounting head 14 takes out components from the component supply unit 6 installed on the supply table 3 in the order of mounting by each of the plurality of suction nozzles 20 having the components. For this purpose, the arrangement of the units 6 may be determined according to the mounting data.
[0033]
Next, the mounting head 14 on which the suction nozzle 20 has picked up the component moves while the beam 16 is substantially stopped to face each component on the recognition camera 39, and recognizes a positional shift with respect to each suction nozzle. At this time, the mounting head 14 may move without stopping on the camera 39 to image the electronic component.
[0034]
Alternatively, the mounting head 14 on which the suction nozzle 20 has picked up the component faces each component on the recognition camera 40 by the movement of the beam 16 and its own movement, and the positional deviation with respect to each suction nozzle is recognized.
[0035]
Next, each component held by the mounting head 14 is mounted at a position specified by the printed circuit board 7 mounting data on the substrate mounting table 8. That is, the mounting head 14 moves in the X direction, and the table 8 moves by driving the motor 30 in the Y direction, and corrects the positional deviation detected by the recognition of the recognition cameras 39 and 40 to the position to be mounted. It will be installed. During this mounting operation, the beam 16 moves toward the supply table 4, and therefore the base table 25 also moves in the same direction in synchronization with the beam 16.
[0036]
Next, the mounting head 15 sucks components according to the mounting data from the component supply unit 6 on the supply base 4. The mounting head 14 can mount components on the printed circuit board 7 even during this suction operation. Is possible.
[0037]
Next, the mounting head 15 moves above the nearby recognition camera 39 or the recognition camera 40 in order to recognize the positional deviation of the components held by the mounting head 15. During this time, if the mounting head 14 has not yet finished mounting the component, it can continue to mount the component on the substrate 7.
[0038]
Next, while the component held by the mounting head 15 is mounted at the position indicated by the data on the substrate 7, the beam 14 and the base table 25 move toward the supply base 3 for the next component suction. To do.
[0039]
Next, when such operations are repeated and component mounting on the board 7 is completed, the board 7 is transferred to the discharge conveyor 12 and discharged and conveyed toward the downstream apparatus.
[0040]
It should be noted that the movement range of the beam 16 is widened so that the mounting head 15 can be moved to a position where parts can be taken out from the unit 6 of the supply table 3, and the mounting head 14 is moved from the unit 6 of the supply table 4. Alternatively, the components may be taken out and the components may be taken out by both the mounting heads 14 and 15 on the supply table on one side as appropriate. However, in consideration of the mounting data and the arrangement of the units 6, after all (or as many as possible) suction nozzles 20 of the mounting head 14 have suctioned parts on the supply base 3 side, all of the mounting heads 15 It is preferable that the nozzle 20 (or as many as possible) can suck the parts on the supply base 4 side, and this makes it possible to reduce the waste of operation and the loss time of the mounting heads 14 and 15. it can.
[0041]
Further, unlike the present embodiment, the base table 25 is not provided, and the motor 30, the screw shaft 31, and the guide rail 27 are directly installed on the base 2, and the Y-direction of the substrate 7 in the Y direction in consideration of the moving position of the beam 16. The motor 30 may be controlled so as to be positioned. However, control of the motor 30 becomes difficult.
[0042]
【The invention's effect】
As described above, according to the present invention, even if there are not a plurality of beams, one mounting head can mount a component on a substrate while the other mounting head is adsorbing the component, and the mounting efficiency can be increased. Furthermore, if only one beam is used, it is not necessary to consider interference between beams.
In addition, by moving the substrate mounting table separately from the beam on the base table that moves together with the beam, the moving distance of the substrate mounting table can be shortened and the movement control can be performed. Can be simple.
[0043]
Further, by making the movement paths of the heads on the beam different, interference between the mounting heads can be eliminated, and restrictions on the movement of the mounting heads can be eliminated.
[0044]
In addition, the supply bases with the component supply units arranged side by side are provided on both sides of the printed circuit board in the beam moving direction, so that after one head picks up the components from one supply base, the other head supplies the other. While moving to pick up the components from the table, the entire area of the printed circuit board can be passed, and the component mounting operation of one head and the component suction operation of the other head can be made useless.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component automatic mounting apparatus to which the present invention is applied.
FIG. 2 is a plan view of the electronic component automatic mounting apparatus to which the present invention is applied as viewed from below the beam portion.
FIG. 3 is a side view of the electronic component automatic mounting apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component automatic mounting apparatus 3 Supply stand 4 Supply stand 6 Component supply unit 7 Printed circuit board 8 Substrate mounting table 14 Mounting head 15 Mounting head 16 Beam 25 Base table

Claims (3)

In an electronic component automatic mounting apparatus that takes out an electronic component from a component supply unit arranged side by side on a supply stand and mounts it on a printed circuit board,
A beam extending in the direction in which the component supply units are juxtaposed and movable in a direction perpendicular to the juxtaposition direction, a plurality of mounting heads movable along the beam, and moving in the same direction as the beam movement direction And a substrate mounting table on which the printed circuit board is mounted, and the substrate mounting table moves separately from the beam with respect to the moving direction of the beam on a base table that moves with the beam. automatic electronic part mounting apparatus, characterized in that it.   The electronic component automatic mounting apparatus according to claim 1, wherein a movement path of each mounting head on the beam is different.   3. The electronic component automatic mounting apparatus according to claim 1, wherein the supply bases on which the component supply units are arranged are provided on both sides of the printed circuit board in the beam moving direction.

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