JP3948348B2 - Electronic component mounting equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus including a multiple suction head unit.
[0002]
[Prior art]
As an electronic component mounting apparatus, an apparatus having a multiple head unit in which a plurality of suction heads are arranged in parallel is known (for example, Japanese Patent Laid-Open No. 9-186492). This type of electronic component mounting apparatus is designed to suck and pick up electronic components on the nozzles of each suction head in the electronic component supply unit, and to mount the electronic components sucked on each nozzle one after another on the substrate. It has the advantage that the mounting efficiency is much higher than that of the electronic component mounting apparatus having a single head section having a single suction head.
[0003]
FIG. 5 is a simplified front view of a multiple head portion of a conventional electronic component mounting apparatus. The head unit 51 is a multiple head unit in which a plurality of (three in this example) suction heads 52 are arranged in parallel. Each suction head 52 has a nozzle 54 for sucking the electronic component 10 projecting downward from the main body 53.
[0004]
A vertical feed screw 55 is provided on the back surface of each suction head 52, and the feed screw 55 is screwed into a nut 56 provided on the back surface of the suction head 52. Behind the suction head 52, two vertical linear guides 57 are provided with a feed screw 55 interposed therebetween. Each linear guide 57 has a slider 58 provided on the back of the main body 53. It is slidably fitted. Therefore, when the feed screw 55 is rotated by a Z-axis motor (not shown), the suction head 52 is moved up and down by being guided by the linear guide 57, and the electronic component 10 provided in the electronic component supply unit is vacuum suctioned to the lower end portion of the nozzle 54. Then, the head unit 51 moves above the substrate, and the electronic components 10 vacuum-adsorbed by the nozzles 54 are successively transferred and mounted at predetermined coordinate positions on the substrate.
[0005]
[Problems to be solved by the invention]
However, the conventional head portion 51 has a configuration in which two linear guides 57 are arranged on the left and right of the feed screw 55 that moves the suction head 52 up and down, so that the lateral dimension D1 of the suction head 52 increases, and as a result. The arrangement pitch P1 of the suction heads 52 is also increased, and the head portion 51 is enlarged accordingly. For this reason, the overall weight of the head portion 51 is increased, and there is a problem that the head portion 51 is difficult to move horizontally in the X direction and the Y direction.
[0006]
In addition, since the electronic component supply unit is generally formed by arranging narrow parts feeders such as a tape feeder and a tube feeder at a narrow pitch, the nozzles 54 of the suction heads 52 vacuum the electronic components 10 of the parts feeders. When picking up by suction, the moving stroke of the head portion 51 in the lateral direction (the direction in which the suction heads 52 are arranged) becomes long, and it takes a long time to pick up the electronic component 10 by vacuum suction to each nozzle 54 accordingly. As a result, there is a problem in that the mounting efficiency for mounting the electronic component 10 on the substrate also decreases.
[0007]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus having a small and compact head portion in which suction heads can be arranged at a narrow pitch.
[0008]
[Means for Solving the Problems]
According to the present invention , an electronic component provided in an electronic component supply unit by the nozzle is moved in a horizontal direction by moving a multiple head unit in which a plurality of suction heads each having a nozzle for sucking electronic components are arranged in front of the frame. An electronic component mounting apparatus that picks up and picks up a component and mounts it at a predetermined position on a substrate, wherein the suction head projects downward from the main body provided on the front surface of the holding frame. and the nozzle, and θ-rotation means for rotating the nozzle provided on the holding frame to θ direction around the axis thereof, a nut provided on the top rear of the holding frame, behind the holding frame And a vertical feed screw that is screwed into the nut, and the suction head is moved up and down by rotating the feed screw provided on an upper portion of the frame . A Z-axis motor, a vertical linear guide provided on the front surface of the frame and below the feed screw , and a slider provided on the lower back surface of the holding frame and slidably fitted to the linear guide The feed screw and the linear guide were provided on the same vertical line.
[0009]
In the present invention having the above configuration, since the linear guide is provided below the feed screw, the horizontal dimension of the suction head can be reduced and the arrangement pitch thereof can be considerably smaller than that of the conventional one, and thus the head portion can be made compact and compact. Can be configured. Therefore, the mobility of the head portion is excellent, and the electronic components provided in the electronic component supply device can be quickly vacuum-sucked one after another by each nozzle and picked up and transported and mounted on the substrate.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1 is an overall perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a head portion of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 is a simplified front view of the head portion of the electronic component mounting apparatus according to the embodiment of the present invention.
[0011]
First, the overall configuration of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport unit 3 that transports a substrate 2 and positions it at a predetermined position is provided on a base 1. A plurality of narrow part feeders 4 are arranged in parallel at a narrow pitch on both sides of the transport unit 3, and these part feeders 4 constitute an electronic component supply unit.
[0012]
A first recognition unit 5, a second recognition unit 6, and a third recognition unit 7 are provided on the side of the transport unit 3. The 1st recognition part 5 consists of a line sensor, and recognizes the electronic component vacuum-sucked by the nozzle (after-mentioned) of a suction head. The 2nd recognition part 6 consists of an area camera, and recognizes an electronic component precisely. The 3rd recognition part 7 consists of a laser apparatus, irradiates a laser beam to the lead | read | reed of an electronic component, and acquires the height information of a lead | read | reed by receiving the reflected light.
[0013]
Two Y table parts 11 are provided in front and back so as to straddle the transport part 3, and an X table part 12 is installed on the Y table part 11. The X table unit 12 is provided with a multiple head unit 20 (described later). When the X table unit 12 and the Y table unit 11 are driven, the head unit 20 moves horizontally in the X direction (the conveyance direction of the substrate 2 by the conveyance unit 3) or in the Y direction orthogonal thereto.
[0014]
Next, the detailed structure of the multiple head unit 20 will be described with reference to FIGS. Reference numeral 21 denotes a frame of the head unit 20, and a plurality (three in this example) of suction heads 22 are arranged in parallel in the X direction on the front surface thereof. The suction head 22 includes a main body portion 23 and a nozzle 24 that protrudes downward from the main body portion 23, and the electronic component 10 vacuum-sucked at the lower end portion of the nozzle 24 includes the first recognition portion 5 and the second recognition portion. A back plate 25 for recognition at 6 is attached.
[0015]
The main body 23 is provided on the front surface of the inverted L-shaped holding frame 26. A motor 27 is provided as a θ direction rotating means on the holding frame 26, and the motor 27 rotates the nozzle 24 around the axis thereof by θ, and the electronic component 10 vacuum-adsorbed by this rotates in the θ direction (horizontal). (Rotation direction) position is corrected. Each main body 23 is provided with load control means (not shown) for controlling the load applied to the electronic component 10 during mounting by adjusting the air pressure.
[0016]
A nut 30 is provided at the upper back of the holding frame 26, and a slider 31 is provided at the lower back. A Z-axis motor 32 is provided on the upper portion of the frame 21. The Z-axis motor 32 rotates a vertical feed screw 33 below it. The feed screw 33 is behind the holding frame 26 and is screwed into the nut 30. A vertical linear guide 34 is provided on the front surface of the frame 21 behind the suction head 22, and the slider 31 is fitted to the linear guide 34 so as to be slidable in the vertical direction.
[0017]
As shown in FIG. 4, the linear guide 34 is provided below the feed screw 33. In the present embodiment, the feed screw 33 and the linear guide 34 are provided on the same vertical line. That is, when the feed screw 33 is virtually extended in the vertical direction, the positional relationship is such that it interferes with the linear guide 34 or the slider 31 (see also FIG. 3). Since the feed screw 33 and the linear guide 34 are arranged in this way, the lateral dimension D2 of the suction head 22 is reduced, and its arrangement pitch P2 is also considerably smaller than the arrangement pitch P1 of the suction head 2 of the conventional example shown in FIG. Accordingly, the head portion 20 is reduced in size and size. FIG. 4 shows only elements necessary for explanation in a simplified manner.
[0018]
This electronic component mounting apparatus has the above-described configuration, and the operation will be described next. In FIG. 1, the head unit 20 reaches above the parts feeder 4 and picks up the electronic components 10 by vacuum suction one after another to each nozzle 24 of each suction head 22. Next, the head unit 20 arrives above the first recognition unit 5, the second recognition unit 6, and the third recognition unit 7 and recognizes each electronic component 10. The type of recognition performed by each recognition unit differs depending on the type of electronic component 10 and required mounting accuracy.
[0019]
Next, the head unit 20 arrives above the substrate 2, corrects the positional deviation of the electronic components 10, and then mounts the electronic components 10 one after another at predetermined coordinate positions on the substrate 2.
[0020]
【The invention's effect】
According to the present invention, the horizontal dimension of the suction head can be reduced and the arrangement pitch thereof can be made considerably smaller than that of the conventional one, so that the head portion can be made compact and compact. Therefore, the movement of the head portion in the horizontal direction is excellent, and the electronic components provided in the electronic component supply device can be quickly vacuum-sucked and picked up by each nozzle, and can be transported and mounted on the substrate.
[Brief description of the drawings]
FIG. 1 is an overall perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view of a head portion of the electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is a side view of the head portion of the electronic component mounting apparatus according to the embodiment. FIG. 4 is a simplified front view of the head portion of the electronic component mounting apparatus according to the embodiment of the present invention. Simplified front view of the head type [Explanation of symbols]
2 Substrate 10 Electronic component 20 Head portion 22 Suction head 24 Nozzle 30 Nut 31 Slider 32 Z-axis motor 33 Feed screw 34 Linear guide

Claims (1)

By moving a multiple-type head portion, in which a plurality of suction heads each having a nozzle for sucking electronic components on the front surface of the frame, are moved in the horizontal direction, the electronic components provided in the electronic component supply portion are sucked by the nozzles. An electronic component mounting apparatus that is picked up and mounted at a predetermined position on the board, wherein the suction head includes a main body provided on the front surface of the holding frame, and the nozzle protruding downward from the main body, and θ direction rotating means for rotating the θ direction the nozzles provided on the holding frame about its axis, a nut provided on the top rear of the holding frame, is provided behind the retaining frame A vertical feed screw that is screwed into the nut, and a Z-axis motor that is provided at the top of the frame and moves the suction head up and down by rotating the feed screw And a vertical linear guide provided on the front surface of the frame and below the feed screw , and a slider provided on the lower back surface of the holding frame and slidably fitted to the linear guide. An electronic component mounting apparatus, wherein the feed screw and the linear guide are provided on the same vertical line.

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