JPH0897595A - Electronic part mounting device - Google Patents

Abstract

PURPOSE: To provide an electronic part mounting device which transfers and mounts electronic parts to and on a substrate from a parts supplying section by using two heads and can improve the mounting efficiency by reducing the number of forward and backward moving times of the heads against the substrate. CONSTITUTION: A first head 31 and second head 32 are respectively provided with pluralities of nozzles 52, γ-correcting motors 39 which corrects the γ of electronic parts 24 attracted to the lower end sections of the nozzles 52 by suction, and cylinders 41-44 which respectively lower and raise the nozzles 52. When the first head 31 mounts a plurality of electronic parts 24 while moving in X- and Y-directions above a substrate, the second head retreats to a position above a second parts supplying section at which the head does not interfere with the first head 31 and picks up a plurality of electronic parts 24. In other words, the first head 31 and second head perform electronic parts mounting and picking-up operations without interfering with each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for transferring and mounting electronic components on a substrate by two heads.

[0002]

2. Description of the Related Art As an electronic component mounting apparatus, there is known a two-head system in which two heads are used to transfer and mount electronic components on a substrate (for example, Japanese Patent Laid-Open No. 3-203294). Hereinafter, a conventional two-head type electronic component mounting apparatus will be described.

FIG. 6 is a plan view of a conventional electronic component mounting apparatus,
FIG. 7 is a side view of the first head of the electronic component mounting apparatus. In FIG. 6, reference numeral 1 denotes a board, which is positioned on a guide rail 2 as a positioning portion of the board 1. Board 1
A first component supply unit 3 is provided on one side portion, and a second component supply unit 4 is provided on the other side portion. The first component supply unit 3 is configured by arranging a large number of component feeders 31 to 3n equipped with electronic components such as a tape feeder and a tube feeder in parallel.
The component supply section 4 is also configured by arranging a large number of similar part feeders 41 to 4n in parallel.

Reference numeral 5 is a first head. A nut 6 is integrally connected to the first head 5. Nut 6
Is screwed to the X-direction feed screw 7. The feed screw 7 is driven by the first X-direction motor 8 to rotate. The feed screw 7 and the first X-direction motor 8 are provided on an elongated table 9. Both sides of the table 9 are slidably provided on a guide rail 9a in the Y direction. A nut 10 is connected to the end of the table 9. The nut 10 is screwed onto a Y-direction feed screw 11. The feed screw 11 is driven by the first Y-direction motor 12 to rotate. Therefore, when the first X-direction motor 8 is driven and the feed screw 7 rotates, the first head 5 moves in the X-direction,
Further, when the first Y-direction motor 12 is driven and the feed screw 11 rotates, the first head 5 moves in the Y direction. That is, the nut 6, the feed screw 7, the first X-direction motor 8,
The table 9, the nut 10, the feed screw 11, and the first Y-direction motor 12 constitute a first XY-direction moving device for moving the first head 5 in the X and Y directions.

Reference numeral 13 is a second head. Like the first head 5, the second head 13 also includes the nut 14, the feed screw 15, the second X-direction motor 16, the table 17, and the like.
It is moved in the X and Y directions by a second XY direction moving device including a nut 18, a feed screw 19, and a second Y direction motor 20. Reference numeral 21 is a first camera provided below the moving path of the first head 5, and 22 is a second camera provided below the moving path of the second head 13.

In FIG. 7, the first head 5 is a nozzle 2
3 is provided, and the electronic component 24 provided in the first component supply unit 3 is vacuum-sucked and picked up by the nozzle 23. 25 is a Z-direction motor, 26 is a Z-direction motor 2
A feed screw that is driven by 5 to rotate, 27 is a feed screw 26
The nut 28, which is screwed into, is an elevating block integrated with the nut 27. The nozzle 23 is vertically installed on the elevating block 28, and when the Z-direction motor 25 is driven and the feed screw 26 rotates in the forward and reverse directions, the nozzle 23 moves up and down. The nozzle 23 is connected to a θ-direction motor 30 by a transmission system such as a belt 29. When the θ-direction motor 30 is driven, the nozzle 2
3 rotates about its axis. The second head 13 also has the same structure as the first head 5 and includes one nozzle.

The conventional electronic component mounting apparatus is constructed as described above, and its operation will be described below. First, the first head 5 moves in the X direction or the Y direction to pick up an electronic component of any one of the parts feeders (eg, the parts feeder 32) of the first component supply unit 3 and set it at a predetermined coordinate position on the substrate 1. It is transferred and mounted (see the trajectory indicated by arrow N1). Second
Head 13 moves in the X direction or the Y direction, picks up an electronic component of one of the parts feeders (for example, parts feeder 42) of second component supply unit 4, and transfers it to a predetermined coordinate position of substrate 1 for mounting. (See arrow N2). Hereinafter, similarly, the first head 5 and the second head 13 alternately move in the X direction and the Y direction, and the electronic components of the first component supply unit 3 and the second component supply unit 4, respectively. Are sequentially transferred and mounted on the substrate 1.

[0008]

As described above, the conventional 2
In the head-type electronic component mounting apparatus, the first head 5 and the second head 13 alternately move in the X direction and the Y direction, and
The electronic components of the component supply unit 3 and the second component supply unit 4 are alternately transferred and mounted on the substrate 1. Therefore, the first head 5 transfers and mounts the electronic components on the substrate 1 so that During the upward movement, the second head 13 retreats laterally so as not to hinder the movement of the first head 5 in the X and Y directions, and during that time, the second head 13 Head 13 picks up electronic components to be mounted on the substrate from the second component supply unit 4.

Similarly, when the second head 13 is advancing above the substrate 1 to transfer and mount electronic components on the substrate 1, the first head 5 moves in the X direction of the second head 13. And the first head 5 is then retracted to the side so that it does not hinder the movement operation in the Y direction.
The electronic component to be mounted on is picked up from the first component supply unit 3. In this way, the first head 5 and the second head 1
3 moves into the upper side of the substrate 1 or retracts from the upper side of the substrate 1 every time one electronic component is mounted on the substrate 1, so that the total movement distance of each head becomes long, and the time required for this movement is long. There is a problem in that the mounting efficiency of transferring and mounting electronic components on the substrate 1 does not increase because of consumption.

Therefore, the present invention provides a first head and a second head.
It is an object of the present invention to provide an electronic component mounting apparatus capable of increasing the mounting efficiency of transferring and mounting electronic components on a substrate by reducing the number of times the head moves forward and backward with respect to the substrate.

[0011]

To this end, the present invention provides a plurality of nozzles for the first head and the second head to vacuum-adsorb electronic components, and these nozzles are rotated to rotate the nozzles. The nozzle is provided with a rotating unit that corrects the positional deviation of the electronic components vacuum-sucked by the nozzle in the rotating direction, and an elevating unit that causes each nozzle to perform an elevating operation.

[0012]

According to the above construction, when the first head transfers and mounts a plurality of electronic components vacuum-adsorbed by the plurality of nozzles on the substrate one after another, the second head moves to the second component. Above the supply unit, electronic components are vacuum-sucked and picked up by a plurality of nozzles. Then, the first head configures all electronic components as a substrate and returns to the upper side of the first component supply unit, while the second head moves to the upper side of the substrate and the electronic components vacuum sucked by the plurality of nozzles. Are sequentially transferred and mounted on the substrate.

[0013]

Embodiments of the present invention will now be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a first head of the electronic component mounting apparatus, and FIG. 3 is a cross section of a first head of the electronic component mounting apparatus. FIG. 4 is a block diagram of a control system of the electronic component mounting apparatus, and FIG. 5 is a time chart of the operation of the electronic component mounting apparatus.

In FIG. 1, the same components as those of the conventional electronic component mounting apparatus shown in FIG. The electronic component mounting apparatus of FIG. 1 and the conventional electronic component mounting apparatus of FIG. 6 have the same basic structure, but the structure of the first head 31 and the second head 32 is the same as that of the above-described conventional first component.
The head 5 and the second head 13 of FIG. The first head 31 and the second head 32 have the same structure.
The structure of the first head 31 will be described with reference to FIGS.

In FIG. 2, reference numeral 33 is a block having an L-shaped cross section, which is provided on the front surface of the support plate 34. A Z-direction motor 35 is arranged on the support plate 34. The Z-direction motor 35 rotates a vertical feed screw 36 that penetrates the support plate 34. A nut 37 is connected to the back surface of the block 33, and the nut 37 is screwed into the feed screw 36. Therefore, the Z-direction motor 3
When the feed screw 36 rotates in the forward and reverse directions and the feed screw 36 rotates in the forward and reverse directions, the block 33 moves up and down.

A plate 38 is provided on the block 33. A θ correction motor 39 is arranged in the center of the upper surface of the plate 38, and four cylinders 41, 42, 43, 44 are arranged around the θ correction motor 39. In FIG. 3, the rotation shaft 4 of the θ correction motor 39
A gear 46 is attached to the lower end of the gear 5. An engagement element 47 is connected to the lower ends of the rods 41a and 43a of the cylinders 41 and 43. The engagement element 47 is engaged with the engaged element 48. The engaged member 48 is the vertical shaft 4.
It is attached to the upper end portion of 9. The engaged element 48 is resiliently urged downward by a spring 50, and the engaging element 47 is engaged with the engaged element 48, thereby preventing the engaged element 48 from being lowered by the spring force of the spring 50. .

A gear 51 is vertically slidably coupled to the lower end of the shaft 49. The gear 51 is engaged with the gear 46. A vertical nozzle 52 is connected to the lower portion of the gear 51. The nozzle 52 is connected to a vacuum device (not shown) through a suction path 53, and the vacuum device drives the vacuum device to vacuum-suck the electronic component 24 to the lower end portion of the nozzle 52.

When the θ correction motor 39 is driven to rotate the rotary shaft 45, the gear 46 rotates and the other gears 5 rotate.
1 also rotates. Then, the nozzle 52 rotates about its axis, and corrects the angle in the θ direction (horizontal rotation direction) of the electronic component 24 vacuum-adsorbed at the lower end. Also cylinder 4
When the rods 41a and 43a of 1, 43 project downward,
The engaged member 48 descends due to the spring force of the spring 50,
The nozzle 52 also descends. When the rods 41a and 43a are pulled upward, the nozzle 52 moves up. Although the other cylinders 42 and 44 are not shown in FIG. 3,
The other cylinders 42 and 44 have the same structure as the cylinders 41 and 43.

When picking up the electronic component 24 with the nozzle 52, first, one of the cylinders 41, 42, 43, 44 is projected to lower the nozzle 52 by one. Next, the Z-direction motor 35 (see FIG. 1) is driven to lower the nozzle 52 together with the block 33 so that only one nozzle projecting downward is landed on the upper surface of the electronic component 24 and the electronic component 24 is vacuum-sucked. To do. Then, the block 33 is raised by the Z-direction motor 35, and the rod of the cylinder that is further protruding is pulled in, so that the nozzle 5
2 is raised to pick up the electronic component 24.

Also, when the electronic component 24 vacuum-sucked by the nozzle 52 is mounted on the substrate 1, the electronic component 24 is lowered by lowering the nozzle 52 as in the case of the pickup described above.
Is mounted on the substrate 1, and the vacuum suction is released. Then, the nozzle 52 is raised as in the case of pickup.

In the present embodiment, the Z-direction motor 35 and the cylinders 41, 42, 43, 44 correspond to the elevating means for causing the respective nozzles 52 to ascend and descend. In addition, the electronic component 24 in which the θ correction motor 39 is vacuum sucked by the nozzle 52
Corresponds to a correction unit that corrects the positional deviation in the rotation direction.

In FIG. 4, the first head 31 side first
The X-direction motor 8, the first Y-direction motor 12, the Z-direction motor 35, and the θ correction motor 39 of FIG.
It is controlled by the control unit 65 via 1, 62, 63 and 64. Reference numeral 66 denotes a bus, which includes a storage unit 67 for storing necessary data, a first recognition unit 68 of the first camera 21, a second recognition unit 69 of the second camera 22, an operation unit 70 such as a keyboard. It is connected. The cylinders 41 to 44 are also connected to the bus 66 via the drive circuit 71. Since the control system of the second head 32 is also the same as the control system of the first head 31 shown in FIG. 4, illustration and description thereof will be omitted.

This electronic component mounting apparatus has the above-mentioned structure. Next, referring to the time chart of FIG.
The overall operation will be described. In FIG. 5, X movement, Y
The movement means the movement of the heads (31, 32) in the horizontal direction by the respective XY movement devices, and the θ rotation means the rotation of the nozzle 52 by the θ correction motor 39.
The movement refers to the Z-direction motor 35 and the cylinder 4
The operation of raising and lowering the nozzle 52 by 1, 42, 43 and 44 is shown. 1 and 5, the first head 31
Moves above the first component supply unit 3 in the X direction and the Y direction, and lowers and raises the nozzles 52 at the pick-up position, so that the four nozzles 52 successively receive the electronic components of the parts feeders 31 to 3n. 24 is vacuum-sucked and picked up (see timings T2 to T5 in FIG. 5). The X movement and the Y movement at the timings T1 and T2 are the first
The second electronic component 24 is moved to the pickup position, and the θ rotation at the timing T1 is performed by the nozzle 52.
Is returned to the initial position in the θ direction.

Next, the first head 31 is connected to the first camera 21.
Of the electronic components 24 vacuum-sucked by the four nozzles 52 are observed by the first camera 21 to recognize their positions (see timings T6 and T7). Subsequently, the first head 31 moves above the substrate 1, moves in the X direction and the Y direction there, and lowers and raises the nozzles 52 at predetermined coordinate positions, thereby vacuum suctioning the four nozzles 52. The electronic components 24 thus mounted are mounted one after another at predetermined coordinate positions on the substrate 1 (see timings T8 to T12 above). If the electronic component 24 is mounted on the substrate 1 as described above, the first
The head 31 returns to above the first component supply unit 3, and the operations at the timings T1 to T12 described above are repeated.

On the other hand, the second head 32 has a timing T
While the first head 31 is performing recognition and mounting at 7 to T11, it moves above the second component supply unit 4 in the X direction and the Y direction, and the nozzle 52 descends and rises on the pickup position. By doing so, the electronic components 24 of the part feeders 41 to 4n are sequentially vacuum-sucked and picked up by the four nozzles 52. Next, at timings T12 to T2, the second camera 22 is moved to a position above the second camera 22, and the electronic components 24 vacuum-sucked by the four nozzles 52 are observed by the second camera 22 to recognize their positions. Subsequently, the second head 32 moves above the substrate 1, moves in the X direction and the Y direction there, and lowers and raises the nozzle 52 at a predetermined coordinate position,
The electronic components 24 vacuum-sucked by the four nozzles 52 are sequentially mounted at predetermined coordinate positions on the substrate 1 (timing T3).
~ T6). Hereinafter, the same operation is repeated.

As is clear from the time chart of FIG.
The first head 31 and the second head 32 always operate almost full time without stopping the operation. In particular,
When one head (for example, the first head 31) moves above the substrate 1 in the X direction or the Y direction to mount the electronic component 24 on the substrate 1, the other second head 32 moves to the first head. The electronic component 2 is retracted onto the second camera 22 and the second component supply unit 4 so as not to hinder the movement operation of the head 31 of
4 is recognized and picked up. Similarly, when the second head 32 mounts the electronic component 24 above the substrate 1, the first head 31 is similar to the first camera 21.
Recognized and picked up on the top and the first component supply unit 3. Further, since the number of times the heads 31 and 32 move back and forth with respect to the substrate 1 is reduced, the heads 31 and 3 are correspondingly reduced.
Since the total moving distance of 2 is short and the moving time is correspondingly short, the work efficiency of mounting the electronic component 24 on the substrate 1 is significantly higher than that of the conventional electronic component mounting apparatus shown in FIG.

[0027]

As described above, according to the present invention, a plurality of nozzles for the first head and the second head to vacuum-adsorb electronic components, and these nozzles by rotating these nozzles are provided. Since the rotating means for correcting the positional deviation of the vacuum-adsorbed electronic component in the rotating direction and the elevating means for causing each nozzle to perform the elevating operation are configured, the first head and the second head Since the number of forward / backward movements with respect to the substrate can be reduced, the mounting efficiency of electronic components can be significantly improved.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a first head of an electronic component mounting apparatus according to an exemplary embodiment of the present invention.

FIG. 3 is a sectional view of a first head of an electronic component mounting apparatus according to an exemplary embodiment of the present invention.

FIG. 4 is a block diagram of a control system of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 5 is a time chart of the operation of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 6 is a plan view of a conventional electronic component mounting apparatus.

FIG. 7 is a side view of a first head of a conventional electronic component mounting apparatus.

[Explanation of reference numerals] 1 board 2 guide rail (positioning part of board) 3 first component supply section 4 second component supply section 8 first X-direction motor 12 first Y-direction motor 16 second X-direction Motor 20 Second Y-direction motor 31 First head 32 Second head 35 Z-direction motor 39 θ correction motor 41-44 Cylinder

Claims (1)

[Claims] 1. A positioning unit for a board, first and second component feeding units and second component feeding units provided on both sides of the positioning unit, and a first XY direction moving device for driving in the XY directions. A first head for moving and mounting the electronic component of the first component supply unit on the substrate by moving, and a second XY
An electronic component mounting apparatus comprising: a second head that is driven by a direction moving device to move in the XY directions to transfer and mount the component of the second component supply unit onto the substrate. The head and the second head rotate a plurality of nozzles for vacuum-suctioning electronic components, and correct the positional deviation of the electronic components vacuum-sucked by these nozzles in the rotation direction. An electronic component mounting apparatus comprising: rotating means and elevating means for causing each nozzle to perform an elevating operation.