JPH0691348B2 - Electronic component automatic mounting device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electronic component automatic mounting apparatus for automatically mounting electronic components on a printed circuit board, and particularly to a bare chip in which a semiconductor chip is not molded in a synthetic resin mold body. The present invention relates to a device for automatically mounting a plurality of printed circuit boards on a printed circuit board with good work efficiency and high accuracy.

(Prior Art) In recent years, various devices for automatically mounting an electronic component (generally called a bare chip) in which a semiconductor chip is not molded in a molded body have been proposed, but this type of electronic component automatic mounting device is There is an increasing demand for shortening the mounting time in order to mount electronic parts on a predetermined position of a substrate accurately and surely and to improve work efficiency.

FIG. 4 is a plan view of the conventional automatic electronic component mounting apparatus, in which the printed circuit board 5 is conveyed on the circuit board rail 67 and positioned at a position (m) below the adhesive application head 68. An adhesive supply device (hereinafter referred to as an epoxy unit) 27 is provided in front of the coating head 68.
Are held in XY table 1. In this case, the XY table 1 is driven and the coating head 68 moves in the XY directions (directions of the arrow O), so that the adhesive agent of the epoxy unit 27 is applied to a predetermined position of the printed circuit board 5. In the figure, B1 ~
B4 is an adhesive applied to the substrate 5.

Next, the printed circuit board 5 is conveyed in the M direction, and the transfer head 69
Is positioned at the lower position (n) of the. Reference numeral 7 is a substrate holder. This transfer head 69 is also held on the XY table 1 and can move in the XY directions.

A displacement correction device (hereinafter referred to as a pre-center) 71 that corrects the displacement of the electronic component 11 is provided on the side of the substrate holder 7.
Is provided, and an electronic component supply device 9 is provided beside the pre-center 71. This electronic component supply device 9 is equipped with a jig 21 equipped with a wafer to which an electronic component 11 which is a bare chip is adhered.
Direction (arrow A direction) and index device 12
To rotate horizontally.

A rotating arm 72 is provided on the side of the pre-center 71 and the electronic component supplying device 9, and the rotating arm 72 is indicated by an arrow P.
By rotating in the direction, the electronic component 11 on the jig 21 is picked up by the sub transfer head 70 at the tip of the rotating arm 72 and transferred to the pre-center 71. This pre-center
At 71, the positional deviation of the electronic component 11 is corrected by pressing the position regulating nail 73 against the electronic component 11 from four directions. Next, the transfer head 69 moves in the direction of arrow N to pick up the electronic component 11 on the pre-center 71,
It is transferred onto the adhesives B1 to B4 previously applied to the substrate 5. The substrate 5 on which the electronic component 11 is mounted in this way is carried out by the conveyor 17 in the L direction (arrow).

(Problems to be Solved by the Invention) In the above conventional means, the substrate 5 is positioned at the coating position (m), the adhesive is applied to a plurality of points on the substrate 5 by the coating head 68, and then the substrate 5 is conveyed by the conveyor 67. Is transferred to the mounting position (n) of the electronic component 11 by the front transfer head 69, and the substrate 5 is repositioned at this mounting position (n).

That is, this conventional means has a problem that the mechanism is complicated because the positioning of the substrate 5 has to be performed twice. Moreover, if the substrate 5 is positioned twice at the position (m) and the position (n), then at both positions (m) and (n),
There is a problem in that relative displacement occurs in the substrate 5, which makes it difficult to mount the electronic component 11 on the adhesives B1 to B4 with high positional accuracy.

The sub transfer head 70 includes a coating head 68 and a transfer head.
60 and the conveyor 67 and the substrate holder 7 are provided on the opposite side of the substrate holder 7, and the electronic component 11 on the jig 21 is transferred to and mounted on the pre-center 71 by the rotational movement of the rotational arm 72. Therefore, there is a problem that a large installation space is required.

Further, this device mounts a plurality of types of electronic components 11 at a plurality of locations on the substrate 5, but since the substrate 5 cannot be moved in the XY directions, the sub-transfer head 68 and the transfer head 69 are mounted on the XY table 1. The adhesive B1 to B4 is applied to a plurality of points on the substrate 5 or the electronic components 11 are mounted on the adhesives B1 to B4 by being driven by. That is, this is one in which, while moving the coating head 68 in the XY directions, the adhesives B1 to B4 are applied in advance to a plurality of points on the substrate 5, the substrate 5 is conveyed in the M direction and repositioned, and then the transfer head. While moving 69 in the XY direction, adhesive B1
A plurality of electronic components 11 are mounted one after another on B4. In this way, after applying the adhesive to the substrate 5 at the position (m), the substrate 5 is moved to the position (n). When,
There is a problem that the adhesives B1 to B4 applied to the substrate 5 easily flow out before the electronic component 11 is mounted.

Therefore, an object of the present invention is to provide an electronic component automatic mounting apparatus that can solve the problems of the above-mentioned conventional means.

(Means for Solving the Problems) To this end, the present invention provides three electronic component supply devices, an electronic component positional deviation correction device, and an XY direction moving device that positions a printed circuit board to move in the XY directions. The devices are arranged side by side, and reciprocally move between the electronic component supply device and the positional deviation correction device to adsorb electronic components provided in the electronic component supply device to the nozzles and transfer them to the positional deviation correction device. Sub transfer head, position deviation compensator and XY
And a transfer head that reciprocates between the directional movement devices and adsorbs electronic components whose positions have been corrected by the positional deviation correction device onto nozzles and transfers them to the printed circuit board positioned by the XY direction movement device. Adhesive applying means for applying the agent to the position where the electronic components of the printed circuit board positioned in the XY direction moving device are mounted, and in the electronic component supplying device, the positional deviation correcting device and the XY direction moving device, A vertical movement means for vertically moving the nozzles of the sub transfer head and the transfer head is provided.

(Operation) In the above configuration, the sub transfer head moves between the electronic component supply device and the positional deviation correction device, and transfers the electronic component of the electronic component supply device to the positional deviation correction device. Further, the transfer head picks up the electronic component whose positional deviation has been corrected by the positional deviation correcting device and transfers it to the printed circuit board on the XY direction moving device.

In this case, the board only needs to be positioned once on the XY direction moving device, and the printed circuit board moves in the XY direction when driven by the XY direction moving device,
Application of the adhesive by the adhesive application means and mounting of electronic components on the adhesive are performed. Moreover, in this case, when the adhesive is applied to one point of the printed board by the adhesive applying means, the electronic head is immediately adhered onto the adhesive by the transfer head immediately after each application.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

In FIG. 2, reference numeral 1 is a transfer device, a substrate stocker 4 for stocking a printed circuit board 5 on the back side thereof, a lifter device (loader) 3, an extrusion device 2 for extruding and supplying the printed circuit board 5, and a carry-in conveyor. 6 is provided. In front of the carry-in conveyor 6, an XY that moves in the XY direction
A direction moving device 7 is provided (see also FIG. 1). 8
Is a carrier.

The substrate 5 of the stocker 4 is conveyed on the conveyor 6 to move the XY
Positioned on the direction moving device 7. The board 5 on which the electronic component 11 is mounted on the XY direction moving device 7 is collected by the carry-out conveyor 17 and the carrying device 15 into the board stocker 4 held by the lifter device (unloader) 14.

In FIGS. 1 to 3, an XY table 10 is provided in front of the center. An electronic component supply device 9 and an index device 12 are provided on the XY table 10. As shown in FIG. 1, a jig 21 is attached and fixed to the index device 12 with screws 22.
Is installed. When the XY table 10 is driven, the jig 21
Moves in the XY directions, and when the index device 12 is driven, the jig 21 rotates horizontally.

In FIGS. 1 and 2, a push-up device 23 (hereinafter referred to as an ejector) having a push-up pin 24 that pushes up the electronic component 11 in the C direction (arrow) is provided below the jig 21. In addition, a position deviation correction device 13 (hereinafter referred to as a pre-center) that corrects the position deviation of the electronic component 11 is provided on the side thereof. Reference numeral 39 is a position adjusting claw provided in the pre-center 13. Further, the XY direction moving device 7 having a motor 26 for driving the X axis and a motor 25 for driving the Y axis is provided on the side of the substrate 5 in the B direction (XY direction).
To move.

Further, an adhesive supply device (hereinafter referred to as an epoxy unit) 27 is provided on the side of the adhesive supply device. This epoxy unit
27 includes a ring 29 having a ring-shaped groove, and an adhesive is stored in the ring 29. Reference numeral 28 is a motor that horizontally rotates the ring 29.

The four devices of the electronic component supply device 9, the pre-center 13 XY direction moving device 7, and the exposure unit 27 are arranged side by side, and the transfer device 1 is located above them. Further, the carry-in conveyor 6 and the carry-out conveyor 17 are arranged in a direction orthogonal to the side-by-side direction. By laying out the entire device in this manner, the entire device can be made compact. Next, a detailed structure of the transfer device 1 will be described.

In FIG. 1, a block 31 is provided on the back surface of each of the devices 9, 13, 7, 27 arranged side by side. This block 31 is provided with a guide rail 76, and guide rail nut 38
The plates 44a and 44b are provided via the. The plate 44b is provided with the sub transfer head 40a. The sub transfer head 40a moves laterally along the guide rail 76 to reciprocate between the electronic component supply device 9 and the pre-center 13, and the electronic component 11 pushed up by the pin 24 of the ejector 23. The nozzle 73 moves up and down in the H direction to pick up and transfer it to the precenter 13. The sub transfer head 40a is provided with a motor 41 for correcting the angle of the electronic component 11 sucked by the nozzle 73.

The plate 44a includes a transfer head 40b and an adhesive applying means 40.
c is installed. The transfer head 40b has a guide rail 76.
By moving laterally along the pre-center 13
And reciprocating between the XY direction moving device 7 and the pre-center 13
The electronic component 11 whose positional deviation has been corrected in (1) is transferred and mounted on the substrate 5 positioned on the XY direction moving device 7. Further, the adhesive applying means 40c is similar to the epoxy unit 2
The adhesive of epoxy unit 27 is applied to substrate 5 by reciprocating between 7 and XY direction moving device 7.

The transfer head 40b has a nozzle 74 for adsorbing the electronic component 11.
A plurality of nozzles, and by driving and rotating the motor 42, a nozzle that matches the size and shape of the electronic component 11
Select 74. Also, similarly to this, the adhesive applying means 40c
Also has a plurality of nozzles 75, and by driving and rotating the motor 43, the nozzle 75 that matches the size and shape of the electronic component 11 is selected. And the selected nozzle
Only 74 and 75 move up and down in the H direction by the up-and-down moving means (described later).

In FIG. 1, a bearing 66 mounted on the side surface of the block 31.
Is provided with a shaft 33 that rotates about its axis through a bearing. The sub transfer head 40a, the transfer head 40b, and the adhesive application means 40c are attached to the shaft 33.
At the position where the nozzles stop, that is, above the pre-center 13, the XY direction moving device 7, and the epoxy unit 27.
Lever 36,37 is provided as a vertical movement means for vertically moving 3,74,75. Reference numeral 35 is a plate attached to the lever 36, and 34 is a solenoid which operates independently in response to a trouble or the like. When the shaft 33 rotates about its axis, the levers 36 and 37 simultaneously swing to move the nozzles 73, 74 and 75 selected as described above up and down.

In FIGS. 3A and 3B, 54 is a motor, 55 is a cam drive device, 56 is a rod driven by the cam drive device 55 to move up and down in the I direction, and 57 is in the J direction around the pin 58. A swinging lever 59 is a rod that is driven by the lever 57 to reciprocate in the E direction. The plates 44a and 44b are connected to the rod 59, and thus when the motor 54 is driven, the sub transfer head 40a, the transfer head 40b, and the adhesive applying means 4
0c reciprocates laterally along the guide rail 76 as described above.

Further, the shaft 33 includes a rod 60 and a ball joint 6
4, which is connected to the cam drive device 55 via the arm 65, and when the motor 54 is driven, the rod 60 moves up and down in the G direction, and the shaft 33 rotates about its axis, and the lever 36 , 37 swing, and the nozzles 73, 74, 75 move up and down.

Further, the ejector 23 is connected to the cam drive device 55 via a lever 63 pivotally supported by a rod 61 and a pin 62. When the motor 54 is driven, the rod 61 reciprocates in the K direction, the lever 63 swings around the pin 62, the pin 24 moves up and down, and the electronic component 11 on the jig 21 is pushed up. The sub transfer head 40a has the electronic component 1 pushed up by the pin 24.
1 is adsorbed to the nozzle 73 and picked up.

As described above, the present apparatus uses the single motor 54 to reciprocate the sub transfer head 40a, the transfer head 40b, and the adhesive application means 40c in the lateral direction, and vertically move the nozzles 73, 74, and 75. The pins 24 of the ejector 23 are moved up and down to simplify the drive system and facilitate the timing of each operation. Particularly, by driving the push-up pin 24 and the nozzle 73 of the sub transfer head 40a by the same motor 54, the push-up timing of the pin 24 and the pick-up timing of the nozzle 73 can be surely matched, and the electronic component 11 due to the deviation of both timings. It has eliminated the pickup mistake.

The present apparatus has the above-mentioned configuration, and the operation will be described next.

The substrate 5 pushed out of the stocker 4 by the pushing device 2 is sent to the XY direction moving device 7 by the carry-in conveyor 6 and positioned on the XY direction moving device 7. Next, when the motor 54 is driven, the sub transfer head 40a, the transfer head 40b, and the adhesive application means 40c respectively move the ejector 23 and the pre-center 1 as shown in FIG.
3 Stop right above the XY direction moving device base 7. In this state,
When the shaft 33 rotates, the levers 36, 37 swing, and the nozzles 73, 74, 75 move up and down. At the same time, the pin 24 of the ejector 23 pushes up the electronic component 11 of the jig 21 from below, and the nozzle 73 sucks and picks up the electronic component 11 while moving up and down. Also transfer head 40b
The nozzle 74 of the above picks up the electronic component 11 whose position shift is corrected by the pre-center 13 while moving up and down, and the nozzle 75 of the adhesive applying means 40c moves up and down to remove the adhesive attached to its lower end. Apply to the substrate 5.

Then, as the motor 54 is further driven, as shown in FIG. 3B, the sub transfer head 40a and the transfer head 4
0b, the adhesive applying means 40c moves to the right along the guide rail 76 and stops right above the pre-center 13, the XY direction moving device 7, and the epoxy unit 27, respectively. Next, when the levers 36 and 37 swing, the nozzle 73 moves up and down to transfer the electronic component 11 to the pre-center 13, and
74 also moves up and down, the electronic component 11 adsorbed at the lower end thereof is mounted on the adhesive previously applied to the substrate 5 as described above, and the nozzle 75 also moves up and down and is stored in the ring 29. Adhesive is attached to its lower end. That is, in this product, the electronic component 11 is adhered onto the adhesive by the transfer head 40b immediately after each time while applying the adhesive to the substrate 5 one by one by the adhesive applying means 40c.

Then, when the motor 54 is further driven, the sub transfer head 40a, the transfer head 40b, and the adhesive applying means 40c move to the left, and the ejector 23, the pre-center 13, and the pre-center 13, respectively.
The movement is stopped by the XY-direction moving device 7, and the state shown in FIG. Next, the nozzle 73 moves up and down to pick up the electronic component 11 on the jig 21, the nozzle 74 picks up the electronic component 11 on the pre-center 13, and the nozzle 75 attaches the adhesive attached to the lower end to the substrate. Apply to 5.

The motor 54 is driven as described above, and the sub transfer head 40
a, the transfer head 40b, and the adhesive application means 40c simultaneously reciprocate laterally to transfer the electronic component 11 on the jig 21 to the pre-center 13 and to the substrate 5 on the pre-center 13. The transfer and the application of the adhesive to the electronic component mounting position of the substrate 5 are repeatedly performed simultaneously as a series of operations, and the substrate 5 on which the electronic components 11 have been mounted is conveyed to the carry-out conveyor 17 and moved to the stocker. Recovered in 4.

This device mounts a plurality of types of electronic components 11 on a substrate 5. Therefore, as shown in FIG. 1 and FIG.
A plurality of jigs 21 are arranged, and each jig 21 is equipped with various kinds of electronic components 11. The index device 12 is installed on the XY table 10 so that it can be moved in the XY directions. Therefore, by driving the index device 12 and horizontally rotating each jig 21, the jig 21 equipped with the desired electronic component 11 is ejected.
Position directly above 23. Also in that state, XY table 10
By moving the jig 21 in the XY direction,
The predetermined electronic component 11 is stopped immediately above the pin 24 and picked up by the nozzle 73 of the sub transfer head 40a.

Further, the substrate 5 is also moved in the XY direction by being driven by the XY direction moving device 7, the adhesive is applied to the predetermined coordinate position by the nozzle 75, and the transfer head 40 is applied on the adhesive.
The electronic component 11 attracted to the nozzle 74 of b is mounted.

(Effects of the Invention) According to the present invention as described above, it is sufficient to position the substrate once, and while applying the adhesive one point at a time in that state, each time immediately after that, the electronic components are immediately and successively. Since they are mounted, a plurality of electronic components can be surely mounted on the substrate with good workability and high positional accuracy.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic component automatic mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view thereof, FIGS. 3 (a) and 3 (b) are front views of the apparatus, and FIG. It is a top view of an electronic component automatic mounting device. 5 ... Substrate 7 ... XY-direction moving device 9 ... Electronic component supply device 11 ... Electronic component 13 ... Pre-center (positional deviation compensator) 21 ... Push-up pin 36,37 ... Vertical moving means 40a ... Sub transfer head 40b …… Transfer head 40c …… Adhesive applying means 54 …… Motor 73,74,75 …… Nozzle

Claims (1)

[Claims] 1. An electronic component supply device, an electronic component position shift correction device, and an XY direction moving device for positioning a printed circuit board and moving the printed circuit board in the XY directions are arranged side by side. A sub-transfer head that reciprocates between a component supply device and the positional deviation correction device to adsorb an electronic component provided in the electronic component supply device to a nozzle and transfer the electronic component to the positional deviation correction device; Correction device and above XY
And a transfer head that reciprocates between the directional movement devices and adsorbs electronic components whose positions have been corrected by the positional deviation correction device onto nozzles and transfers them to the printed circuit board positioned by the XY direction movement device. Adhesive applying means for applying the agent to the position where the electronic components of the printed circuit board positioned in the XY direction moving device are mounted, and in the electronic component supplying device, the positional deviation correcting device and the XY direction moving device, An automatic electronic component mounting apparatus comprising a vertical movement means for vertically moving the nozzles of the sub transfer head and the transfer head.