JPH0432560B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an electronic component mounting apparatus that efficiently automatically assembles electronic components into various electronic circuits.

Configuration of conventional example and its problems As shown in FIG. 1, as an example of a method for mounting electronic components on a printed circuit board constituting an electronic circuit, a first First, adhesive or solder paste 1-b is printed as shown in Figure b, and then electronic component 2 is printed as shown in Figure 1c.
are mounted and connected by curing adhesive or solder paste with heat.

As shown in FIG. 2, the conventional electronic component mounting apparatus used in this construction method has a printed circuit board 1 on which an electronic component 2 is mounted, which is positioned on an XY table 3 that is movable in a horizontal plane. The mounting rod 6 attached to the tip of the mounting head section 5 fixed to the base 4 takes out the electronic component 2' that has come to the pick-up position determined by the supply section 7, which is movable on the horizontal axis, and transfers it to the XY table 3. It was configured to be mounted at any position on the upper printed circuit board 1.

However, with the above configuration, it is difficult to automatically supply or take out a film-like soft printed circuit board to or from the positioning section 8 on the XY table 3. Furthermore, when a heavy component 9 or the like is mounted on the printed circuit board 1, when the printed circuit board 1 is moved, the electronic component 9 also moves, causing positional shift.

Another conventional electronic component mounting apparatus, as shown in FIG.
3 etc., the electronic components supplied by the electronic components were taken out by the transfer head 14 which is movable in a horizontal plane and mounted on the printed circuit board 11 after being moved. It has the disadvantages of long travel distance, extremely long mounting time, and poor production efficiency.

Purpose of the Invention In order to eliminate the above-mentioned drawbacks, the present invention provides a substrate that is difficult to automatically feed and take out, such as a film substrate or a ceramic substrate, and that has a heavy weight mounted on the substrate. High-speed, high-performance electronic component mounting that makes it possible to mount electronic components on a fixed board at high speed by moving the component supply section and mounting head, which is difficult to move the board at high speed. It provides equipment.

In addition, the mounting head and the adhesive application head are moved simultaneously, the adhesive is applied to one printed circuit board, and the electronic components are placed on the other printed circuit board, on which the adhesive has already been applied. By mounting this, we provide an inexpensive and efficient electronic component mounting device.

Composition of the Invention The present invention provides an apparatus for mounting taped electronic components one by one on arbitrary positions on a printed circuit board, which includes an XY table movable in a horizontal plane;
An electronic component mounting head fixed on an XY table and capable of reciprocating between a position for taking out electronic components and a position for mounting the electronic components on a printed circuit board; In order to ensure that the part removal position is a fixed position,
Multiple types of tapes with multiple electronic components are arranged side by side on an XY table, and these tapes are arranged in the longitudinal direction so that the tape with the desired electronic component is always placed at a fixed position. It consists of an electronic component supply section that is movable in a substantially vertical direction, and allows components to be mounted on a fixed board at high speed.

In addition to the above configuration, by configuring an adhesive or solder paste application head on the XY table, it is possible to implement an excellent system in which electronic components can be mounted on the next head while applying adhesive. Moreover, it provides an inexpensive mounting device.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 4 is a side view of an apparatus for mounting electronic components 16 on printed circuit board 15, and FIG. 5 is a plan view thereof. An X-slide shaft 18 fixed horizontally on the base 17, an X-table 19 movable guided by the slide shaft 18, an X-axis drive section 20, and a right angle to the X-slide shaft 18 fixed on the X-table 19. Y slide shaft 21 fixed in the direction
, a Y-table 22 that is movable while being guided by the Y-slide 21, and a Y-axis drive unit 23.
There is an XY table section 24, which can be moved to any position within a horizontal plane. The XY table section 24 has a Z slide shaft 2 fixed in the horizontal axis direction.
5 and a component supply section 26 movable on the Z slide shaft 25 and its driving section 27 are loaded, and the component supply section 26 feeds taped components 28 one by one as shown in FIG. As shown in FIG. 6a, the component feeding section 29 is driven by a camshaft 30 and moves up and down to pick up the electronic components 28. The suction part 31 has a positioning claw 32 for positioning the suctioned parts as shown in FIG. 6b.
Then, the component 28', which has been suctioned and positioned as shown in FIG. 6c, is mounted on the printed circuit board 15.
The suction part 31 can be rotated through a certain angle by a rotary lever 34 that rotates the suction part 31 around a rotating shaft 33, and the positioning can be performed by vertical movement of a vertical lever 35 that is synchronously moved by a camshaft 30. By opening and closing the claws 32, the electronic components are brought onto the printed circuit board 15, and by the vertical movement of the lever 36, which is synchronously moved by the camshaft 30, the feed rod 37 is moved up and down and attached to the component feeding section 29. , tap the lever 38 for sequentially feeding the electronic components, and sequentially feeding the electronic components one by one. Further, the rod 39 rotates the rotary lever 34.

With the above configuration, the mounting head 40 can be reciprocated by the suction object 31 and the positioning claw 32 between the position S for taking out electronic components and the position M for mounting electronic components on the printed circuit board 15. is completed, and multiple parts feeding parts 2 on the parts feeding part 26 are created.
Reference numeral 9 makes it possible to bring any component feeding section 29 to the position S for taking out electronic components by horizontally moving the component supplying section 26, and moving the mounting head section 40 and the component supplying section 26 to the XY table 24.
By stacking the electronic components on top, it becomes possible to mount electronic components at any position on the fixedly positioned printed circuit board 15.

Further, as another embodiment, the coating head section 41 is mounted on the XY table 24 and the mounting head section 40 is mounted on the XY table 24.
As an example of loading the same, the plan view is shown in Figure 7.
A side view of the coating head 41 is shown in FIG.

By fixing the coating head 41 at a certain distance L from the mounting head 40 in this way, the adhesive or solder paste 1-b is applied onto the pattern 1-a shown in FIG. The two steps of mounting the electronic component onto the adhesive or solder paste can be performed simultaneously.

Effects of the Invention As described above, the present invention mounts heavy electronic components on a substrate that is difficult to automatically supply and take out, such as a film substrate or a ceramic substrate.
For printed circuit boards that are difficult to move at high speed
By moving the component supply section on the XY table, it is possible to quickly mount electronic components onto the printed circuit board fixed by the mounting head.

In addition, the mounting head and the adhesive application head are moved at the same time, and adhesive is applied to one printed circuit board, and electronic components are applied to the other printed circuit board on top of which the adhesive has already been applied. By implementing
It enables the mounting of electronic components at low cost and with high efficiency.

[Brief explanation of drawings]

Figures 1a, b, and c are process diagrams of electronic component mounting, Figure 2 is a side view of a conventional electronic component mounting apparatus, Figure 3 is a perspective view of another conventional mounting apparatus, and Figure 4 is a diagram of the present invention. A side view of one embodiment, FIG. 5 is a plan view of the same embodiment,
Figures 6a, b, and c are mounting process diagrams according to the same embodiment.
FIG. 7 is a plan view of another embodiment of the present invention, and FIG. 8 is a side view of the same. 15...Printed circuit board, 16...Electronic component, 2
4...XY table section, 26...Parts supply section, 4
0...Mounting head section, 41...Painting head section.

Claims (1)

[Scope of Claims] 1. In an apparatus that picks out electronic components one by one from a tape having a plurality of electronic components, and mounts them at arbitrary positions on a printed circuit board that is transported and positioned at a predetermined position, the electronic components are moved in a horizontal plane. Possible XY
a table; an electronic component mounting head fixed on the XY table and provided so as to be able to reciprocate between a position for taking out electronic components and a position for mounting the electronic components on a printed circuit board; A plurality of types of tapes are arranged side by side on the XY table so that the ejecting position of the electronic component from the head part is at a constant position, and a tape having a desired electronic component among these tapes is always arranged at a constant position. and an electronic component supply unit that is provided so that these tapes can be moved in the conveyance direction of the printed circuit board. 2. The electronic component mounting apparatus according to claim 1, comprising an adhesive or solder paste application head on an XY table.