JP7171931B2 - Work machine for board - Google Patents

Description

TECHNICAL FIELD The present disclosure relates to a board-to-board work machine that performs predetermined work on a board.

Conventionally, various techniques have been proposed for the above-described board-to-board work machine.

For example, the technology described in Patent Literature 1 below includes substrate supply means for supplying a substrate having a predetermined wiring pattern made of a conductive metal, and solder layer forming means for forming a solder layer on a predetermined region of the wiring pattern. and mounting means for mounting a predetermined electrical component on the substrate by soldering using the solder layer, and a mounting line for mounting the electrical component on the substrate. The component mounting apparatus comprising the component mounting apparatus, characterized in that a plasma irradiation apparatus is incorporated for irradiating plasma under atmospheric pressure to at least a region of the wiring pattern where the solder layer is to be formed.

According to this configuration, in a component mounting apparatus constituting a component mounting line for at least forming a solder layer on a substrate and mounting and soldering an electrical component on the substrate, a plasma irradiation device for irradiating plasma under atmospheric pressure is provided. Since it is incorporated, it is possible to perform surface modification by irradiating plasma to the area where the solder layer of the wiring pattern is to be formed in one step of performing a series of treatments on the substrate. Such plasma irradiation cleans the surface to be soldered and improves wettability, so that soldering can be performed without using flux.

JP 2007-299822 A

However, it has been desired to more preferably irradiate the substrate with plasma.

The present disclosure has been made in view of the above points, and an object thereof is to provide a substrate-to-substrate working machine suitable for irradiating a substrate with plasma.

The present specification relates to a substrate-to-substrate working machine that performs a predetermined operation on a substrate, comprising a plasma unit that generates plasma, a storage device that stores condition data, and a transfer pin that transfers a transfer agent onto the substrate. and a control device for adjusting the irradiation amount of the plasma irradiated to the substrate by the plasma unit based on condition data , wherein the condition data is such that the irradiation condition of the transfer pin and the irradiation condition of the substrate correspond to the surface free energy. a data table associated with the transfer agent, wherein the control device performs a search process of searching the data table for the irradiation condition of the transfer pin and the irradiation condition of the substrate via the surface free energy of the transfer agent; a transfer pin irradiation process for irradiating the transfer pin with plasma from the plasma unit under the irradiation conditions of the transfer pin searched for in step 1 to approximate the surface free energy of the transfer pin to the surface free energy of the transfer agent; and a substrate irradiation process for irradiating the substrate with plasma from the plasma unit under the irradiation conditions of the substrate retrieved in the retrieval process to approximate the surface free energy of the substrate to the surface free energy of the transfer agent. Disclosed is a board- to-board work machine that performs :

According to the present disclosure, the substrate-to-substrate working machine is suitable for irradiating the substrate with plasma.

It is a perspective view of a mounting machine. It is a top view of a mounting machine. 1 is a perspective view of a mounting head; FIG. It is a top view of an electronic component mounting apparatus. 3 is a block diagram of a control device in the electronic component mounting apparatus; FIG. FIG. 4 is an explanatory diagram of a transfer operation in a storage tray; FIG. 4 is an explanatory diagram of a transfer operation in a storage tray; FIG. 4 is an explanatory diagram of a transfer operation in a storage tray; It is explanatory drawing of the transcription|transfer operation|work in a circuit board. It is explanatory drawing of the transcription|transfer operation|work in a circuit board. It is explanatory drawing of the transcription|transfer operation|work in a circuit board. It is a conceptual diagram of a data table. It is a flowchart which shows the flow of irradiation work. It is a top view of an electronic component mounting apparatus. 3 is a block diagram of a control device in the electronic component mounting apparatus; FIG.

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which an electronic component mounting apparatus 10 is embodied in a working apparatus for board according to the present disclosure will be described below with reference to the drawings.

As shown in FIGS. 1 and 2, an electronic component mounting apparatus 10 according to this embodiment is an apparatus for mounting electronic components on a circuit board. The electronic component mounting apparatus 10 has one system base 14 and two mounting machines 16 arranged side by side on the system base 14 . In the following description, the direction in which the mounters 16 are arranged is called the X-axis direction, and the horizontal direction perpendicular to that direction is called the Y-axis direction.

Each mounting machine 16 mainly includes a mounting machine main body 20, a first conveying device 22, a mounting head moving device 24 (hereinafter sometimes abbreviated as moving device 24), a mounting head 26, a supply device 28, a flux unit 30, An operating device 200 , a first plasma unit 202 and a transfer pin tray 204 are provided. The mounting machine main body 20 is composed of a frame portion 32 and a beam portion 34 mounted on the frame portion 32 .

The first conveying device 22 includes two conveyor devices (conveyor device 40 and conveyor device 42). The conveyor device 40 and the conveyor device 42 are arranged on the frame portion 32 so as to be parallel to each other and extend in the X-axis direction. Conveyor devices 40 and 42 convey the circuit boards respectively supported in the X-axis direction by electromagnetic motors 46 (see FIG. 5). Also, the circuit board is fixedly held by a board holding device 48 (see FIG. 5) at a predetermined working position.

The moving device 24 is an XY robot type moving device, and includes an electromagnetic motor 52 (see FIG. 5) that slides the slider 50 in the X-axis direction and an electromagnetic motor 54 (see FIG. 5) that slides the slider 50 in the Y-axis direction. ing. A mounting head 26 is attached to the slider 50 , and the mounting head 26 is moved to an arbitrary position on the frame portion 32 by the operation of the electromagnetic motors 52 and 54 .

The mounting head 26 mounts electronic components on the circuit board. As shown in FIG. 3 , the mounting head 26 is provided on a slider 50 and includes a plurality of rod-shaped mounting units 60 , each of which has a suction nozzle 62 attached to its tip. there is The suction nozzle 62 communicates with a positive/negative pressure supply device 66 (see FIG. 5) via a negative pressure air passage and a positive pressure air passage. The suction nozzle 62 sucks and holds an electronic component with negative pressure, and releases the held electronic component with positive pressure. A plurality of rod-shaped mounting units 60 are arranged at equal angular pitches on the outer peripheral portion of the unit holder 68, and are held in a state in which the axial direction is vertical. The suction nozzle 62 extends downward from the lower surface of the unit holder 68 . Attachment/exchange of the suction nozzle 62 with respect to each attachment unit 60 is automatically performed with one touch, but since this is a known technique, detailed description thereof will be omitted.

Further, in the mounting head 26, the unit holder 68 is intermittently rotated for each mounting angle of the mounting unit 60 by the electromagnetic motor 72 (see FIG. 5) of the holder rotating device . As a result, the mounting units 60 are sequentially stopped at the lifting station, which is one of the stop positions of the plurality of mounting units 60 . The mounting unit 60 located at the lifting station is lifted and lowered by the electromagnetic motor 76 (see FIG. 5) of the unit lifting device 74 . As a result, the vertical position of the electronic component sucked and held by the suction nozzle 62 is changed. In the mounting head 26, a rotation station is provided as a stop position separate from the lifting station. do. As a result, the holding posture of the electronic component sucked and held by the suction nozzle 62 is changed.

The supply device 28 is a feeder-type supply device, and is arranged at one end of the frame portion 32 in the Y-axis direction. The supply device 28 has a tape feeder 81 . The tape feeder 81 accommodates taped components, which are formed by taping electronic components, in a wound state. Then, the tape feeder 81 feeds out taped components by a feeder 82 (see FIG. 5). Thereby, the feeder-type supply device 28 supplies the electronic components at the supply position by feeding the taped components. The tape feeder 81 is detachable with respect to the frame portion 32, and can correspond to replacement of electronic components.

The flux unit 30 is arranged next to the supply device 28 so as to be slidable in the Y-axis direction, and has a storage tray 93 and the like for storing the flux to be applied to the electronic components. The storage tray 93 is a shallow tray having a circular outer shape when viewed from above, stores flux, and is rotated in a predetermined direction by a tray rotating device 90 (see FIG. 5). As a result, the flux is spread uniformly on the storage tray 93 by a squeegee (not shown) to form a flux film.

The operation device 200 is composed of a touch panel or the like, and is arranged above the front side of the mounting machine 16, displays operation information of the mounting machine 16, and receives instructions from an operator or the like.

The first plasma unit 202 is disposed between the supply device 28 and the conveyor device 40, has a cubic shape, and has an internal space irradiated with plasma. The upper surface of the first plasma unit 202 is provided with a hole H that communicates with the internal space. Thereby, the first plasma unit 202 can irradiate the object inserted into the internal space from the hole H with plasma of a predetermined intensity. The amount of plasma irradiation is adjusted by the time during which the hole H of the first plasma unit 202 is inserted.

The transfer pin tray 204 is arranged between the flux unit 30 and the conveyor device 40, and accommodates three transfer pins P therein. Each transfer pin P is rod-shaped and made of different materials, and is accommodated in the transfer pin tray 204 with its axial direction vertical. Each transfer pin P is used when transferring the flux of the flux unit 30 to the circuit board. At that time, each transfer pin P is mounted on the mounting unit 60 of the mounting head 26 instead of the suction nozzle 62 . Attachment/detachment of the transfer pin P to/from the attachment unit 60 is automatically performed with one touch in the same manner as the suction nozzle 62. However, since this is a known technique, a detailed description thereof will be omitted.

As shown in FIG. 4 , the electronic component mounting apparatus 10 has a second conveying device 210 and a second plasma unit 220 . The second transport device 210 includes two conveyor devices (conveyor device 214 and conveyor device 216). The conveyor device 214 and the conveyor device 216 are parallel to each other, extend in the X-axis direction, and are arranged so as to be connected to the conveyor device 40 and the conveyor device 42 of the first transfer device 22 of each mounter 16. . The conveyor device 214 and the conveyor device 216 convey the circuit board C supported respectively in the advancing direction X1 parallel to the X-axis direction by the electromagnetic motor 212 (see FIG. 5). Thereby, the circuit board C is transferred from the second transfer device 210 to the first transfer device 22 .

The second plasma unit 220 is a device that irradiates plasma downward. The second plasma unit 220 is provided along the Y-axis and crosses over the second transfer device 210 so that it is perpendicular to the conveyor device 214 and the conveyor device 216 of the second transfer device 210. there is Thereby, the second plasma unit 220 can irradiate the circuit board C passing under it by the second transfer device 210 with plasma of a predetermined intensity. The amount of plasma irradiation is adjusted by the speed of passing below the second plasma unit 220, that is, the transport speed in the traveling direction X1 in the second transport device 210. FIG.

The electronic component mounting apparatus 10 further includes a control device 100 as shown in FIG. The control device 100 has a controller 102. The controller 102 comprises a CPU, a ROM, a RAM, etc., and is mainly composed of a computer. The controller 102 is connected to a plurality of drive circuits 106 that drive the electromagnetic motor 46, the electromagnetic motor 52, the electromagnetic motor 54, the electromagnetic motor 72, the electromagnetic motor 76, the electromagnetic motor 80 and the substrate holder. 48 , a positive and negative pressure supply device 66 , a delivery device 82 and a tray rotation device 90 . Accordingly, the controller 102 controls the operations of the first conveying device 22, the moving device 24, the mounting head 26, the tape feeder 81, the flux unit 30, and the like.

Controller 102 is connected to control circuitry 107 and includes memory 230 . The control circuit 107 causes the touch panel of the operation device 200 to display an image according to a command from the CPU of the controller 102, and outputs information received by the touch panel or the like of the operation device 200 to the CPU of the controller 102 as a signal. Memory 230 is a flash memory. The memory 230 is provided with a database 232, which will be described later.

Further, a plurality of drive circuits 106 are connected to the first plasma unit 202 , the second plasma unit 220 and the electromagnetic motor 212 . Accordingly, the controller 102 controls the operations of the first plasma unit 202 , the second plasma unit 220 , the second transfer device 210 , and the like.

In the electronic component mounting apparatus 10, the mounting operation is performed by the mounting head 26 on the circuit board C held by the first conveying apparatus 22 by the above configuration. Specifically, according to a command from the controller 102, the circuit board C is transported to the work position by the first transport device 22, and is held by the substrate holding device 48 at that position. In addition, the tape feeder 81 feeds taped components with a feeder 82 in accordance with a command from the controller 102, and supplies electronic components at the feed position. Then, the mounting head 26 is moved above the supply position of the electronic component by the moving device 24 or the like, and the suction nozzle 62 sucks and holds the electronic component. Subsequently, the mounting head 26 moves above the circuit board C and mounts the held electronic component on the circuit board C. As shown in FIG.

In the electronic component mounting apparatus 10, the transfer work is performed before the mounting work is performed for the purpose of optimally performing the mounting work. In the transfer operation, the flux F is transferred to the circuit board C by the mounting head 26 and transfer pins P. As shown in FIG. Specifically, as shown in FIG. 6, the upper end of the transfer pin P is attached to the mounting head 26 . As a result, the transfer pin P is mounted on the mounting head 26 with its axial direction vertical. Further, the mounting head 26 is moved above the storage tray 93 by the moving device 24 or the like. Thereby, the transfer pin P is positioned above the flux film 300 in the storage tray 93 in which the flux F is stored. Next, as shown in FIGS. 7 and 8, the mounting head 26 is lowered and raised by the moving device 24 and the like. As a result, the lower ends of the transfer pins P are dipped into the flux film 300, so that the flux F is transferred to the lower ends of the transfer pins P. As shown in FIG.

Then, as shown in FIG. 9, the mounting head 26 is moved above the circuit board C by the moving device 24 or the like. As a result, the transfer pin P moves above the circuit board C with the flux F being transferred to its lower end. Next, as shown in FIGS. 10 and 11, the mounting head 26 is lowered and raised by the moving device 24 and the like. As a result, the lower ends of the transfer pins P are brought close to the circuit board C, so that the flux F is transferred onto the circuit board C. As shown in FIG.

Furthermore, in the electronic component mounting apparatus 10, in order to stabilize the amount of the flux F transferred to the transfer pin P and the amount of the flux F transferred to the circuit board C, irradiation is performed before the above transfer operation is performed. work is done. In the irradiation work, the transfer pins P are irradiated with plasma by the first plasma unit 202 , and the circuit board C is irradiated with plasma by the second plasma unit 220 . When the plasma is irradiated, the amount of plasma irradiation is adjusted based on the information stored in the database 232 . As a result, the surface free energies of the transfer pins P and the circuit board C are approximated to the surface free energies of the flux F. FIG.

Information stored in the database 232 includes, for example, the data table 234 shown in FIG. The data table 234 has a first data table 236 and a second data table 238 . The first data table 236 is composed of a circuit board table 240 and a transfer pin table 242 .

The circuit board table 240 stores surface free energy values in association with the types of circuit boards C and plasma irradiation conditions. The number attached to the reference numeral of the circuit board C indicates the type of the circuit board C. As shown in FIG. Therefore, in the circuit board table 240, the types of the circuit board C are the circuit boards C1, C2, and C3. The plasma irradiation conditions on the circuit board table 240 are for the plasma irradiation by the second plasma unit 220, and the transport speed in the traveling direction X1 in the second transport device 210 (that is, the circuit board C is the second velocity passing below the plasma unit 220). According to this, when the circuit board C passes under the second plasma unit 220 under certain plasma irradiation conditions, the surface free energy of the circuit board C becomes a value associated with the plasma irradiation conditions.

For example, when each circuit board C1, C2, C3 passes under the second plasma unit 220 at 100 mm/s (plasma irradiation condition), the surface free energy of each circuit board C1, C2, C3 is approximately 80,85,90. When the plasma irradiation condition (the transport speed in the traveling direction X1 in the second transport device 210) becomes faster, the time for the circuit board C to pass under the second plasma unit 220 becomes shorter, and the plasma irradiation by the second plasma unit 220 becomes shorter. The smaller the amount, the smaller the value of the surface free energy.

The transfer pin table 242 stores surface free energy values in association with types of transfer pins P and plasma irradiation conditions. The numbers attached to the symbols of the transfer pins P represent the types of the transfer pins P. As shown in FIG. Accordingly, in the transfer pin table 242, transfer pins P1, P2, and P3 exist as the types of transfer pins P. As shown in FIG. The plasma irradiation conditions on the transfer pin table 242 are for the plasma irradiation by the first plasma unit 202, and are expressed in terms of the time (seconds) during which the transfer pins P are inserted into the holes H of the first plasma unit 202. It is According to this, when the transfer pin P is inserted into the hole H of the first plasma unit 202 under certain plasma irradiation conditions, the surface free energy of the transfer pin P becomes a value associated with the plasma irradiation conditions.

For example, when the transfer pins P1, P2, and P3 are inserted into the holes H of the first plasma unit 202 and maintained for 50 seconds (plasma irradiation conditions), the surfaces of the transfer pins P1, P2, and P3 The free energies are roughly 80,85,90. When the plasma irradiation condition (the time during which the transfer pin P is inserted into the hole H of the first plasma unit 202) is shortened, the time during which the transfer pin P is present in the internal space of the first plasma unit 202 irradiated with plasma is shortened. Therefore, the value of surface free energy becomes small.

In the second data table 238, values of surface free energy possessed by the flux F are stored in association with types of the flux F. FIG. The number attached to the symbol of the flux F indicates the type of flux F. Therefore, in the second data table 238, fluxes F1, F2, and F3 exist as types of flux F. FIG.

Next, the irradiation work performed by the electronic component mounting apparatus 10 will be described in addition to the data table 234 with reference to the flowchart shown in FIG. The control program shown in the flowchart of FIG. 13 is composed of the processes of S10 to S16, is stored in the ROM of the controller 102, and is executed by the CPU of the controller 102 when irradiation work is performed. Also, various data used in the control program shown in the flowchart of FIG. there is

In the determination process S10, the types of the transfer pins P, the circuit board C, and the flux F are set. The setting is performed by the operating device 200 receiving an instruction from an operator or the like, for example. The operator or the like indicates the types of the transfer pins P, the circuit board C, and the flux F that are used in the transfer work after the irradiation work.

In the following, when a specific example is used for explanation, the transfer pin P2, the circuit board C3, and the flux F1 are determined as the types of the transfer pin P, the circuit board C, and the flux F by the determination process S10. is set.

Furthermore, in the determination process S10, the surface free energy used in the search process S12, which will be described later, is determined based on the set type of flux F and the data table 234. FIG. In the specific example, in second data table 238 of data tables 234, the value of 80 associated with flux F1 is determined as the surface free energy.

In the search process S12, the irradiation conditions of the transfer pins P are determined through the types of the transfer pins P and the circuit board C set in the determination process S10 and the surface free energy determined in the determination process S10. and the irradiation conditions for the circuit board C are retrieved from the first data table 236 of the data table 234 .

In a specific example, in the transfer pin table 242 of the first data table 236, the transfer pin P2 set in the determination process S10 and the surface free energy value of 80 determined in the determination process S10 are The associated 40s is found as the irradiation condition of the transfer pin P. In the circuit board table 240 of the first data table 236, the circuit board C3 set in the determination process S10 is associated with the surface free energy value 80 determined in the determination process S10. 300 mm/s is found as the irradiation condition for the circuit board C.

In the transfer pin irradiation process S14, the transfer pin P is irradiated with plasma from the first plasma unit 202 under the irradiation conditions of the transfer pin P searched in the search process S12, thereby increasing the surface free energy of the transfer pin P. is approximated to the surface free energy of the flux F.

In a specific example, the mounting head 26 mounts the transfer pin P2 from the transfer pin tray 204, inserts the transfer pin P2 into the hole H of the first plasma unit 202, and maintains the inserted state for 40 seconds. As a result, the surface free energy value of the transfer pin P2 mounted on the mounting head 26 approximates 80, which is the surface free energy value of the flux F1.

In the substrate irradiation process S16, the surface free energy of the circuit board C is increased by irradiating the circuit board C with plasma from the second plasma unit 220 under the irradiation conditions for the circuit board C searched in the search process S12. , is approximated to the surface free energy of the flux F.

In a specific example, circuit board C3 is supported by conveyor device 214 or conveyor device 216 of second transfer device 210 so as to pass below second plasma unit 220 . Furthermore, the transport speed in the traveling direction X1 in the second transport device 210, that is, the speed at which the circuit board C3 passes below the second plasma unit 220 is set to 300 mm/s. As a result, the surface free energy value of the circuit board C3 transported by the second transport device 210 approximates 80, which is the surface free energy value of the flux F1.

The substrate irradiation process S16 may be performed simultaneously with the transfer pin irradiation process S14, or may be performed prior to the transfer pin irradiation process S14.

After that, the transfer operation described above is performed. In a specific example, the above transfer operation is performed using the circuit board C3 transferred from the second transfer device 210 to the first transfer device 22 and the transfer pins P2 mounted on the mounting head 26. , the flux F1 is stored in the storage tray 93 .

As described in detail above, the electronic component mounting apparatus 10 of this embodiment is suitable for irradiating the circuit board C with plasma.

Incidentally, in this embodiment, the electronic component mounting apparatus 10 is an example of a work machine for board. The first plasma unit 202 and the second plasma unit 220 are examples of plasma units. The second transport device 210 is an example of a transport device. Memory 230 is an example of a storage device. Information stored in the database 232 is an example of condition data. The circuit board C is an example of a board. Flux F is an example of a transfer agent.

It should be noted that the present disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present disclosure.

For example, as shown in FIG. 14, the second plasma unit 220 may be provided in a plasma unit moving device 400. FIG. The plasma unit moving device 400 will be described below with reference to FIG. However, portions that are substantially the same as those in the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

The plasma unit moving device 400 is an XY robot type moving device and includes an X-axis slide mechanism 410 and a Y-axis slide mechanism 420 . The X-axis slide mechanism 410 has an X-axis slide rail 412 and an X-axis slider 414 . The X-axis slide rail 412 is provided along the conveyor device 214 and the conveyor device 216 of the second transfer device 210 so as to extend in the X-axis direction. The X-axis slider 414 is held by an X-axis slide rail 412 so as to be slidable in the X-axis direction. Furthermore, the X-axis slide mechanism 410 has an electromagnetic motor (not shown), and the X-axis slider 414 is moved to any position in the X-axis direction by driving the electromagnetic motor.

The Y-axis slide mechanism 420 also has a Y-axis slide rail 422 . The Y-axis slide rail 422 is provided along the Y-axis, and crosses over the second transport device 210 so that it is perpendicular to the conveyor device 214 and the conveyor device 216 of the second transport device 210. there is One end of the Y-axis slide rail 422 is connected to the X-axis slider 414 . Therefore, the Y-axis slide rail 422 is movable in the X-axis direction. The second plasma unit 220 is held below the Y-axis slide rail 422 so as to be slidable in the Y-axis direction. Furthermore, the Y-axis slide mechanism 420 has an electromagnetic motor (not shown), and by driving the electromagnetic motor, the second plasma unit 220 moves to any position in the Y-axis direction. Therefore, the second plasma unit 220 can be moved to any position on the second transport device 210 by driving the X-axis slide mechanism 410 and the Y-axis slide mechanism 420, and can move to any position on the second transport device 210. can be passed through.

Thereby, the second plasma unit 220 can irradiate the circuit board C on the second transfer device 210 with plasma. The amount of plasma irradiation is adjusted by the moving speed of the second plasma unit 220 .

For example, when the second transport device 210 is stopped, the speed at which the X-axis slider 414 slides on the X-axis slide rail 412 and the speed at which the second plasma unit 220 slides on the Y-axis slide rail 422 allow the second transport The plasma dose to the circuit board C on the device 210 is adjusted. Further, when the position of the X-axis slider 414 is fixed so that the Y-axis slide rail 422 is positioned above the circuit board C while the second transport device 210 is stopped, the second plasma unit 220 is moved to the Y position. The amount of plasma applied to the circuit board C is adjusted by the speed at which the shaft slide rail 422 is slid.

On the other hand, when the second transport device 210 is driven, the speed at which the X-axis slider 414 slides on the X-axis slide rail 412 and the speed at which the second plasma unit 220 slides on the Y-axis slide rail 422 are , and the transport speed in the traveling direction X1 in the second transport device 210, the irradiation amount of the plasma to the circuit board C on the second transport device 210 is adjusted. Further, when the position of the X-axis slider 414 is fixed while the second transport device 210 is being driven, the speed at which the second plasma unit 220 slides on the Y-axis slide rail 422 and the second transport device The amount of plasma irradiation to the circuit board C on the second transport device 210 is adjusted by the transport speed in the traveling direction X1 in 210 .

Incidentally, in the modification above, the plasma unit moving device 400 is an example of a moving device.

Also, as shown in FIG. 15, the database 232 (that is, the data table 234) may be provided on the server 244. FIG. The server 244 will be described below with reference to FIG. 15 and the like. However, portions that are substantially the same as those in the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

Server 244 is connected to controller 102 via communication circuitry 108 . This allows the CPU of the controller 102 to communicate with the server 244 . Further, the CPU of the controller 102 transforms the determination process S10 and the search process S12 as follows.

In the determination process S10, the CPU of the controller 102 transmits to the server 244 first information including the types of the flux F, the transfer pin P, and the circuit board C set in the final determination process S10. Server 244 determines the surface free energy based on the type of flux F included in the first information and second data table 238 of data table 234 .

In the search process S12, the server 244 uses the surface free energy determined by the server 244 itself and the types of the transfer pins P and the circuit board C included in the first information to obtain the irradiation conditions of the transfer pins P, The irradiation conditions for the circuit board C are retrieved from the first data table 236 of the data table 234 . Further, the server 244 transmits to the controller 102 second information including the irradiation conditions for the transfer pins P and the circuit board C searched by the server 244 itself.

Thereafter, the CPU of the controller 102 executes transfer pin irradiation processing S14 under the irradiation conditions for the transfer pins P included in the second information, and executes substrate irradiation processing S16 under the irradiation conditions for the circuit board C included in the second information. .

Incidentally, in the modification above, the server 244 is an example of an external device.

The server 244 may be a host computer that controls the electronic component mounting apparatus 10, or may be provided by cloud computing.

Also, instead of the server 244, the memory 230 may be provided as an external device by a local area network, cloud computing, or the like. In such a case, the CPU of the controller 102 accesses the database 232 of the memory 230 via the communication circuit 108 in the decision process S10 and the search process S12.

Further, unlike the above embodiment, when the transfer pin P is transported to each mounter 16 by the second transport device 210, the second plasma unit 220 may irradiate the transfer pin P with plasma during the transport.

Further, the circuit board C may be plasma-irradiated on the first transfer device 22, unlike the above embodiment. However, in such a case, the circuit board C on the first transfer device 22 is irradiated with plasma by the plasma unit detachably mounted on the mounting head 26 . The plasma unit may also irradiate each transfer pin P accommodated in the transfer pin tray 204 with plasma.

Further, in the above embodiment, the flux F is used as the transfer agent, but instead of the flux F, silver paste, molten solder, or the like may be used.

10: Electronic component mounting device, 100: Control device, 108: Communication circuit, 202: First plasma unit, 210: Second transfer device, 220: Second plasma unit, 230: Memory, 232: Database, 234: Data table , 236: first data table, 238: second data table, 244: server, 400: plasma unit moving device, C: circuit board, F: flux, P: transfer pin, S10: decision processing, S12: search processing, S14: transfer pin irradiation process, S16: substrate irradiation process

Claims (6)

A board-to-board work machine for performing a predetermined work on a board,
a plasma unit for generating plasma;
a storage device in which condition data is stored;
a transfer pin for transferring a transfer agent to the substrate;
a control device that adjusts the amount of plasma irradiated to the substrate by the plasma unit based on the condition data ;
The condition data is a data table in which the irradiation condition of the transfer pin and the irradiation condition of the substrate are associated with surface free energy,
The control device is
a search process of searching the data table for the irradiation conditions of the transfer pin and the irradiation conditions of the substrate via the surface free energy of the transfer agent;
A transfer pin that irradiates the transfer pin with plasma from the plasma unit under the irradiation conditions of the transfer pin searched in the search process, thereby approximating the surface free energy of the transfer pin to the surface free energy of the transfer agent. irradiation treatment;
a substrate irradiation process of irradiating the substrate with plasma from the plasma unit under the irradiation conditions of the substrate searched in the search process to approximate the surface free energy of the substrate to the surface free energy of the transfer agent; A working machine for the board that performs A board-to-board work machine for performing a predetermined work on a board,
a plasma unit for generating plasma;
a communication circuit that enables communication with an external device in which condition data is stored;
a transfer pin for transferring a transfer agent to the substrate;
a control device that adjusts the amount of plasma irradiated to the substrate by the plasma unit based on the condition data ;
The condition data is a data table in which the irradiation condition of the transfer pin and the irradiation condition of the substrate are associated with surface free energy,
The control device is
a search process of searching the data table for the irradiation conditions of the transfer pins and the irradiation conditions of the substrate via the surface free energy of the transfer agent;
A transfer pin that irradiates the transfer pin with plasma from the plasma unit under the irradiation conditions of the transfer pin searched in the search process, thereby approximating the surface free energy of the transfer pin to the surface free energy of the transfer agent. irradiation treatment;
a substrate irradiation process of irradiating the substrate with plasma from the plasma unit under the irradiation conditions of the substrate searched in the search process to approximate the surface free energy of the substrate to the surface free energy of the transfer agent; A working machine for the board that performs 3. The working machine for a substrate according to claim 1, wherein the control device adjusts the irradiation amount according to a plasma irradiation time for the substrate. A transport device for transporting the substrate,
4. The working machine for substrates according to claim 3, wherein said control device changes said irradiation time according to the speed at which said substrate is transported by said transport device. A moving device for moving the plasma unit,
4. The working machine for substrate according to claim 3, wherein the control device changes the irradiation time according to the speed at which the plasma unit is moved by the moving device. The data table is
a first data table in which the irradiation condition of the transfer pin and the irradiation condition of the substrate are associated with surface free energy for each type of the transfer pin and the substrate;
a second data table in which the type of the transfer agent and the surface free energy are associated;
The control device is
6. The determining process for determining the surface free energy used in the searching process is executed by setting the respective types of the transfer pin, the substrate, and the transfer agent . 2. The board-to-board working machine according to item 1 .

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