JP2007260706A - Soldering method, equipment, and work treatment apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering method using a flux free solder by which an increase in the size and cost of soldering equipment and complication thereof are suppressed. <P>SOLUTION: When a solder member is fusion-adhered to a surface Wa to be soldered of a workpiece W, the improvement of the surface Wa to be soldered is first performed by irradiating a region including the surface Wa with plume P which is the gas made into a plasma from a plasma generation nozzle 20. Then, the flux free wire solder member H in a solid phase state is supplied to the surface Wa which is subjected to surface improvement. And by the heat retained by the plume P, the wire solder member H is fused to fusion-adhere the solder member H to the surface Wa. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a soldering method, apparatus, and work processing apparatus for melting and bonding flux-free solder to a work such as a circuit board.

  In a solder alloy (Pu—Sn alloy) that is widely used for joining metal parts and the like, a flux that is an organic resin is used to release oxide on the adherend surface and improve wettability. In soldering, the solder alloy is heated and melted by contact of a soldering iron, hot air irradiation, laser irradiation, or the like, and is melt-bonded to the adherend surface. However, if flux is used, it may be necessary to clean the substrate using chlorofluorocarbon or the like after soldering, which not only increases the number of processes but also is not preferable from the viewpoint of environmental destruction. Although there is a non-cleaning flux that does not require cleaning, it is generally expensive and has a problem that it lacks versatility. In the first place, the organic resin itself used as a flux is also in a tendency to restrict its use, and it is desired to use a flux-free solder that does not use the flux as much as possible.

By the way, a technique is known in which plasma is applied to an adherend surface to be soldered, and the adherend surface is cleaned or surface-modified. For example, Patent Document 1 discloses that impurities on the substrate surface are removed by plasma before soldering. Patent Document 2 discloses a technique in which the surface of an object to be processed is activated by high-frequency plasma before soldering, and soldering is performed using flux-free solder. Further, Patent Document 3 discloses a technique for cleaning the surface by irradiating two members to be soldered by flux-free solder with atmospheric-pressure low-temperature plasma and supplying molten solder to solder them together. Yes.
JP-A-3-174972 JP-A-8-281423 JP-A-9-235686

  However, in the conventional soldering method or apparatus, plasma is only used for cleaning and surface modification of the solder deposition surface, and the plasma treatment process and the soldering process are handled as separate stages. It is. Patent Document 2 discloses that after plasma processing is performed in a vacuum apparatus, soldering is performed by a jet-type soldering apparatus disposed in a subsequent stage. Patent Document 3 discloses that after the plasma treatment, molten solder is supplied to the cleaned portion, or non-molten solder is supplied and melted. For this reason, a plasma generator that cleans or improves the surface to be deposited and a device that melts the solder to join the members are required separately, increasing the size, complexity, and cost of the device. The result was inviting.

  The present invention has been made in view of the above-described problems, and provides a soldering method, an apparatus, and a work processing apparatus using flux-free solder that can suppress an increase in size, complexity, and cost of the apparatus. For the purpose.

  A soldering method according to claim 1 of the present invention is a soldering method in which a solder member is melt-bonded to a predetermined adherend surface, and plasmaized gas is applied to a region including the adherend surface. A first step of irradiating to modify the surface of the adherend surface, and supplying a solid-state flux-free solder member to the portion surface-modified by the first step; And a second step of irradiating the solder member with a plasma gas having a temperature higher than the melting point to melt and bond the solder member to the adherend surface.

  According to this method, the surface modification including the cleaning of the adherend surface is performed by the irradiation of the plasmad gas in the first step. Subsequently, the flux-free solder member is melted by the irradiation of the plasma gas in the second step, and the solder member is melt-bonded to the adherend surface. That is, not only cleaning or surface modification of the adherend surface but also melt bonding of the solder member is performed by irradiation with the gasified plasma.

  According to a second aspect of the present invention, there is provided a soldering apparatus comprising: energy generating means for generating power energy; a plasma generating nozzle for generating and releasing a plasma gas based on the power energy; and a predetermined processing gas as the plasma. A gas supply means for supplying to the generating nozzle, a position adjusting means for adjusting the position of the plasma generating nozzle so that the plasmaized gas can be irradiated to a predetermined target position, and a target position. And a solder supply means for supplying a flux-free solder member.

  According to this configuration, the plasma-ized gas can be irradiated to a predetermined target position, and a flux-free solder member is supplied to the target position. Accordingly, if the adherend surface of the solder member is positioned at the target position, the surface of the adherend surface can be modified by the irradiation of the plasma gas, and the melt adhesion of the solder member can be performed. Become.

  In the soldering apparatus, the energy generating means may be constituted by microwave generating means for generating microwaves (claim 3). According to this configuration, the plasma gas is generated based on the microwave energy.

  In the above-described configuration, it is desirable that the position adjusting means is a robot hand that mounts the plasma generating nozzle and can move the plasma generating nozzle in a two-dimensional direction or a three-dimensional direction. ). According to this configuration, since the plasma generating nozzle can be moved in the two-dimensional direction or the three-dimensional direction by the robot hand, it becomes possible to freely radiate plasma-formed gas to various parts of the workpiece such as the substrate.

  In this case, it can be set as the structure provided with the electric power feeding cable which supplies electric power energy generated from the said energy generation means to the said plasma generation nozzle mounted in the said robot hand (Claim 5). Alternatively, the energy generating means may be mounted on the robot hand, and power energy may be directly supplied from the energy generating means to the plasma generating nozzle.

  A workpiece processing apparatus according to a seventh aspect of the present invention continuously supplies a predetermined workpiece having a solder member attachment surface to the soldering apparatus according to any one of the second to sixth aspects and the target position. And a workpiece supply means. According to this configuration, the workpiece supply means transports the predetermined workpiece having the adherend surface of the solder member to the target position, and surface modification of the adherend surface by irradiation with plasma gas at the position, The solder bonding of the solder member is performed.

  According to the soldering method according to claim 1, not only cleaning or surface modification of the adherend surface but also melting and bonding of the solder member is performed by irradiation of the plasma gas, so that the solder member is melted. The process for making it adhere | attach can be continuously performed to the process for surface modification. Therefore, the soldering method using flux-free solder can be simplified and speeded up.

  According to the soldering apparatus according to claim 2 and the work processing apparatus according to claim 7, by irradiating the plasma generation gas from the plasma generation nozzle by locating the adherend surface of the solder member at the target position, It is possible to modify the surface of the adherend and to melt and bond the solder member. Therefore, the soldering method using flux-free solder can be simplified and speeded up.

  According to the soldering apparatus of the third aspect, since the plasmaized gas is generated based on the microwave energy, the apparatus can be configured using a general-purpose product such as a magnetron as an energy source.

  According to the soldering apparatus of the fourth aspect, since the plasma generating nozzle can be positioned freely in two dimensions or three dimensions by the robot hand, the functionality of the soldering apparatus can be further improved.

  According to the soldering apparatus of the fifth aspect, since the power energy is supplied to the plasma generation nozzle mounted on the robot hand through the power feeding cable, the weight of the robot hand can be reduced and the mobility can be improved.

  According to the soldering apparatus of the sixth aspect, since the energy generating means is mounted on the robot hand and the power energy is directly supplied to the plasma generating nozzle, the use of a waveguide member such as a waveguide or a feeding cable can be omitted. , Energy transmission loss can be minimized.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a block diagram showing an example of a soldering apparatus S1 for carrying out the soldering method according to the present invention, and FIG. This soldering apparatus S1 includes a robot hand 10 (position adjusting means) placed on a base 100, a plasma generation nozzle 20 that is mounted on the robot hand 10 and generates and releases plasma gas, and plasma generation A solder supply mechanism 30 (solder supply means) for supplying a flux-free linear solder member H to the tip portion of the nozzle 20, and a microwave generator 40 (energy generation means) for generating microwave energy (a type of electric power energy) ), A processing gas supply device 50 (gas supply means) for supplying a predetermined processing gas to the plasma generation nozzle 20, a control unit 60 for controlling the operation of the soldering device S1, and a solder member deposition surface. A work carry 101 for conveying a work W such as a circuit board is provided.

  The robot hand 10 includes a robot base unit 11 that is placed and fixed on a base 100 and an articulated arm having five degrees of freedom attached to the robot base unit 11. The articulated arm is configured by connecting a rotating arm 12, a first tilting arm 13, a second tilting arm 14 and a rotating tilting arm 15 in this order from the robot base 11.

  The rotary arm 12 is attached to the robot base 11 so as to be able to turn around the a axis shown in the drawing. The base end of the first tilting arm 13 is attached to the tip of the rotating arm 12 so as to rotate in the direction indicated by the arrow c in the figure. The base end of the second tilt arm 14 is attached to the tip of the first tilt arm 13 so as to rotate in the direction indicated by the arrow d in the figure. The rotary tilt arm 15 is attached so that the base end of the rotary tilt arm 15 rotates at the tip of the first tilt arm 13 in the direction indicated by the arrow e in the figure, and turns itself about the b axis shown in the figure. It has a possible mechanism. A plasma generation nozzle 20 is attached to the tip (lower end surface side) of the rotary tilt arm 15. Such an articulated arm is driven to bend and turn under the control of the robot controller 61, and enables three-dimensional positioning of the plasma generating nozzle 20, that is, positioning to a predetermined target position.

  The plasma generation nozzle 20 is for generating and discharging a gas that has been converted into plasma based on the microwave energy generated by the microwave generator 40. The plasmaized gas was supplied to the surface of the workpiece W on which the solder member adheres (target position) is modified (first step) and to the portion that has been surface-modified by the first step. Radiation is performed in order to melt and adhere the flux-free solder member to the adherend surface (second step). That is, the plasma generation nozzle 20 has a function of irradiating plasma for surface modification of the adherend surface and a function of a soldering iron for melting and bonding the solder member.

  As shown in FIG. 2, the plasma generating nozzle 20 includes a central conductor 21, a nozzle holder 22, a nozzle body 23, a protective tube 24, and an insulating holding member 25. The central conductor 21 and the nozzle body 23 are concentrically arranged and insulated from each other.

  The central conductor 21 is made of a rod-shaped member made of a highly conductive metal, and its upper end 211 protrudes to the internal space 221 of the nozzle holder 22, while the lower end 212 is the lower end edge of the nozzle body 23. It is arranged in the vertical direction so as to be substantially flush with 23B. Microwave energy (microwave power; may be high-frequency energy (high-frequency power)) is applied to the upper end portion 211 of the central conductor 21 from the microwave generator 40 via the coaxial cable 41 (feeding cable). It is supposed to be. The central conductor 21 is held by the insulating holding member 25 in the vicinity of the upper end portion 211.

  The nozzle holder 22 holds the nozzle body 23 and is made of a highly conductive metal. The nozzle holder 22 includes a cylindrical body 220 whose base end is insulated and supported by the robot hand 10 (rotating and tilting arm 15), and a nozzle body 23 and an insulating holding member 25 formed inside the cylindrical body 220. A cylindrical inner space 221 to be held and a connector portion 222 that is formed through the cylindrical body portion 220 and to which the terminal end portion of the coaxial cable 41 is connected.

  The nozzle body 23 is similarly a cylindrical body made of a highly conductive metal and having a cylindrical space 231 in which the central conductor 21 is accommodated. The central conductor 21 is disposed on the central axis of the cylindrical space 231 in a state where a predetermined annular space (insulation interval) is secured around the central conductor 21. The nozzle body 23 includes a gas supply hole 232 drilled in the vicinity of the approximate center in the vertical direction, and a flange portion 233 that protrudes slightly above the center. The gas supply hole 232 is attached with a pipe joint or the like for connecting a terminal portion of the gas supply pipe 51 extending from the processing gas supply apparatus 50 that supplies a predetermined processing gas.

  The nozzle body 23 is fitted to the nozzle holder 22 such that the upper end side enters the internal space 221 of the nozzle holder 22 and the upper end surface of the flange portion 233 comes into contact with the lower end edge of the nozzle holder 22. The nozzle body 23 is attached to the nozzle holder 22 in a detachable fixing structure using, for example, a plunger or a set screw (not shown). Further, a groove 234 is formed on the outer periphery near the upper end side of the nozzle body 23, and a gas seal ring 235 for suppressing gas leakage is interposed in the groove 234.

  The protective tube 24 is made of a quartz glass pipe or the like having a predetermined length, and has an outer diameter substantially equal to the inner diameter of the cylindrical space 231 of the nozzle body 23. The protective tube 24 has a function of preventing abnormal discharge (arcing) at the lower end edge 23 </ b> B of the nozzle body 23 and normally radiating a plume P to be described later, a part of which is a lower end edge of the nozzle body 23. It is inserted in the said cylindrical space 231 so that it may protrude from 23B. The protective tube 24 may be entirely accommodated in the cylindrical space 231 so that the tip end thereof coincides with the lower end edge 23B or enters the inner side of the lower end edge 23B.

  The insulating holding member 25 is made of a heat-resistant resin material such as Teflon (registered trademark), ceramic, or the like, and is made of a disk-like insulating member that penetrates the central conductor 21 and holds it fixedly. The insulating holding member 25 is supported in the internal space 221 of the nozzle holder 22 in such a manner that its lower end edge is supported in contact with the upper end edge of the nozzle body 23.

  The coaxial cable 41 is formed by sequentially forming a foamed insulating layer 412, an outer conductor 413, and an outer insulating jacket 414 on the inner conductor 411. One end of the coaxial cable 41 is connected to the connector portion 222, the inner conductor 411 is electrically connected to the upper end portion 211 of the central conductor 21, and the outer conductor 413 is electrically connected to the nozzle holder 22. The In FIG. 2, the detailed connection mechanism is not shown. On the other hand, the other end of the coaxial cable 41 is connected to the microwave generator 40. Thereby, the central conductor 21 is supplied with microwave energy generated by the microwave generator 40 via the coaxial cable 41. The nozzle body 23 and the nozzle holder 22 are set to ground potential.

  As a result of the plasma generation nozzle 20 being configured as described above, when the microwave power is supplied to the central conductor 21 via the coaxial cable 41, the central conductor 21 supported by the insulating holding member 25; A potential difference is generated between the nozzle body 23 and the ground potential. Then, an electric field concentration portion is formed in the vicinity of the lower end portion 212 of the central conductor 21 and the lower end edge 23B of the nozzle body 23.

  In this state, when an oxygen-based processing gas such as oxygen gas or air is supplied from the gas supply hole 232 to the cylindrical space 231 of the nozzle body 23, the processing gas is excited by the microwave power, and the central conduction is performed. Plasma (ionized gas) is generated near the lower end 212 of the body 21. Although this plasma has an electron temperature of several tens of thousands of degrees, the gas temperature is an ambient temperature to several hundred degrees C. Reactive plasma (the electron temperature indicated by electrons is extremely high compared to the gas temperature indicated by neutral molecules) Plasma generated under normal pressure.

  The processing gas thus converted into plasma is radiated from the lower end edge 23B of the nozzle body 23 (lower end edge of the protective tube 24) as a plume P by the gas flow provided from the gas supply hole 232. This plume P contains radicals. For example, when oxygen-based gas is used as a processing gas, oxygen radicals are generated, and plumes having surface modification performance such as organic substance decomposition / removal action and surface roughening action. P can be used. As shown in FIG. 2, the plume P is irradiated onto the adherend surface Wa of the workpiece W.

  The solder supply mechanism 30 supplies a flux-free linear solder member H to the irradiation position (target position) of the plume P. The solder supply mechanism 30 includes a guide member 31 that sends the linear solder member H toward the adherend surface Wa of the workpiece W to be soldered, a support member 32 that supports the guide member 31, and one end on the support member 32. The support arm 33 for fixing the side and the other end side to the outer periphery of the nozzle holder 22 to support the guide member 31 by using the outer peripheral wall of the nozzle holder 22 and a linear solder member H wound around a bobbin or the like And a solder supply device 34 that feeds out a necessary amount toward the guide member 31.

  As shown in FIG. 2, the flux-free linear solder member H is supplied to the irradiation area of the plume P (the area indicated by the dotted line in FIG. 2) by such a solder supply mechanism 30, and is held by the plume P. It is melted by heat. In general, the melting point of a Pu—Sn solder alloy is about 220 ° C. to 230 ° C., and even a lead-free solder alloy is about 300 ° C. On the other hand, the plume P can be heated to a temperature exceeding the above-described temperature range (for example, about 500 ° C.) by controlling the amount of generated plasma, the temperature of the processing gas, and the like. The solder member H can be melted. In addition, it is desirable to provide a heater in the guide member 31 and to preheat the linear solder member H with this heater.

  The microwave generator 40 generates microwave energy for generating plasma. For example, a microwave generator such as a magnetron that generates a microwave of 2.45 GHz and the microwave generator generate the microwave energy. Further, it is possible to use one having an amplifier that adjusts the intensity of the microwave to a predetermined output intensity. As described above, the microwave energy generated by the microwave generator 40 is supplied to the plasma generation nozzle 20 by the coaxial cable 41. Instead of such a microwave generator 40, for example, a high frequency power source that generates high frequency power of 13.65 MHz can be used.

  The processing gas supply device 50 includes, for example, a gas cylinder that stores an appropriate processing gas supplied to the plasma generation nozzle 20 such as oxygen gas, nitrogen gas, and argon gas, and a flow rate control valve that controls the gas supply amount. Become. The processing gas provided in the processing gas supply device 50 is supplied toward the gas supply hole 232 of the nozzle body 23 through the gas supply pipe 51.

  The work carry 101 (work supply means) sequentially transports the work W to be soldered on a predetermined transport route passing through the work area of the plasma generation nozzle 20. Instead of the work carry 101, a work stage may be arranged, and the work W may be sequentially supplied to the work stage by another robot hand.

  The control unit 60 controls the operation of the soldering apparatus S1, and includes a robot control unit 61, an overall control unit 62, and an operation unit 63.

  The robot control unit 61 includes a general-purpose robot controller or the like, and adjusts the position of the plasma generating nozzle 20 by controlling the turning and bending operations of the robot hand 10 under the control of the overall control unit 62. That is, the robot control unit 61 drives the robot hand 10 so that the plume P emitted from the plasma generation nozzle 20 attached to the tip of the robot hand 10 is spaced from the adherend surface Wa of the workpiece W at a predetermined interval. So that the position of the plasma generating nozzle 20 is adjusted. Further, the robot control unit 61 controls the driving of the solder supply device 34 so as to feed the linear solder member H toward the guide member 31 by a necessary amount.

  The overall control unit 62 includes a CPU (Central Processing Unit), a ROM (Read Only Memory) that stores a control program, a RAM (Random Access Memory) that is used as a work area of the CPU, and the like. By executing this, overall operation control of the soldering apparatus S1 is performed. That is, the overall control unit 62 controls the robot control unit 61, the microwave generation device 40, the processing gas supply device 50, and the work carry 101 in accordance with a user instruction signal given from the operation unit 63, thereby generating a plasma generation nozzle. The plume P is discharged from 20 to perform surface modification and soldering on the adherend surface Wa of the workpiece W.

  An example of a soldering method for the circuit board (work W) executed by the soldering device S1 (work processing device) configured as described above will be described with reference to FIG. First, the overall control unit 62 moves the work carry 101 on which the work W is mounted, and positions the work W on the processing stage of the robot hand 10 (FIG. 3A).

  Next, the overall control unit 62 operates the robot hand 10 via the robot control unit 61 to position the plasma generating nozzle 20 at a predetermined position facing the solder deposition surface of the workpiece W (FIG. 3B). Subsequently, the overall control unit 62 operates the microwave generator 40 and the processing gas supply device 50 to release the plume P from the plasma generation nozzle 20 as shown in FIG. 3C (first step).

  FIG. 4A is a schematic diagram for explaining the surface modification state of the workpiece W by the plume P. FIG. A workpiece W such as a circuit board generally has a copper pattern layer 72 constituting a circuit pattern on an insulating base 71 and a gold plating layer 73 covering the surface of the copper pattern layer 72. The solder member is welded to the surface of the gold plating layer 73 (deposition surface Wa), but there may be a case where the oxide film layer 74 is present on the surface of the gold plating layer 73 or a foreign substance made of organic matter is attached. is there. The solder weld layer Ho formed in this case becomes spherical as shown by the alternate long and short dash line in FIG. 4B, and the solder wettability and spread coefficient are deteriorated, so that a strong weld cannot be expected.

  However, when the plume P is irradiated to such a deposition surface Wa, the oxide film layer 74 and the organic matter are decomposed. Furthermore, in combination with the fact that the surface of the gold plating layer 73 is finely roughened, sufficient wettability and spread angle can be obtained even if the solder member is flux-free. That is, as shown by a solid line in FIG. 4B, as a result of the surface modification of the gold plating layer 73 by the plume P being irradiated, the solder weld layer Hc in this case has a small wetting angle and a good spreading coefficient. Therefore, it has good adhesiveness to the adherend surface Wa.

  Thereafter, the overall control unit 62 operates the solder supply device 34 to feed out the linear solder member H by a necessary amount. Thereby, the flux-free linear solder member H in a solid phase is supplied toward the adherend surface Wa that has been surface-modified by the previous process and irradiated with the plume P (FIG. 3D). )). The heat of the plume P is applied to the linear solder member H, and the linear solder member H is melted by this heat. As a result, a solder weld layer Hc is formed on the surface of the workpiece W (FIG. 3E; second step). Thereafter, the overall control unit 62 moves the work carry 101 to the outside of the processing stage and takes out the soldered work W (FIG. 3F).

  According to the soldering apparatus S1 configured as described above, the deposition surface is cleaned or surface-modified by irradiating the plume P from the plasma generation nozzle 20 with the deposition surface of the workpiece W positioned at the target position. In addition to the quality, the linear solder member H can be melted and bonded. Therefore, the soldering method using flux-free solder can be simplified and speeded up. In addition, since the plasma gas is generated based on the microwave energy, a general-purpose product such as a magnetron can be configured as an energy source (microwave generator).

  Further, since the plasma generating nozzle 20 can be freely positioned three-dimensionally by the robot hand 10, the functionality of the soldering device S1 can be further improved. In addition, since microwave energy is supplied to the plasma generation nozzle 20 mounted on the robot hand 10 through the coaxial cable 41, there is an advantage that the robot hand 10 can be reduced in weight and can be improved in mobility.

  As mentioned above, although soldering apparatus S1 which concerns on one Embodiment of this invention was demonstrated, this invention is not limited to this, For example, the following modified embodiment (1)-(3) can be taken.

(1) In the above embodiment, an example in which the plasma generating nozzle 20 is mounted on the robot hand 10 has been described. However, various position adjusting means other than the robot hand 10 can be applied to the present invention. Moreover, although the example which transmits the microwave energy using the coaxial cable 41 was shown, you may make it abbreviate | omit use of such a power feeding cable. FIG. 5 is a front view showing a soldering apparatus S2 according to a modified embodiment in view of these points.

  This soldering apparatus S2 is configured to move the plasma generating nozzle 200 two-dimensionally, a base frame 81, a pair of left and right vertical frames 82 erected on the base frame 81, A horizontal frame 83 that bridges between the vertical frames 82 at the top, and a moving head 84 that slides in a guide groove provided in the horizontal frame 83 are configured. The horizontal frame 83 is movable between the vertical frames 82 in the vertical direction indicated by the arrow h in the figure. The moving head 84 is movable in the left-right direction indicated by the arrow g in the figure.

  A plasma generation nozzle 200 and a solder supply mechanism 300 are mounted on the moving head 84. As in the previous embodiment, the plasma generating nozzle 200 generates a gas that has been converted to plasma, and includes an internal conductor (not shown), a nozzle holder 202, a nozzle body 203, and a protective tube 204. The solder supply mechanism 300 includes a solder member guide member 301 and a solder supply device 304. Further, the moving head 84 is equipped with a magnetron 42 and a power supply device 43 for the magnetron.

  According to such a soldering apparatus S2, the height position of the plasma generating nozzle 200 is adjusted using the vertical frame 82 with respect to the workpiece W mounted on the work carry 801, using the horizontal frame 83. Position adjustment in the left-right direction can be performed. Accordingly, the plume P can be irradiated from the plasma generation nozzle 200 to a predetermined part of the work W while the work W is transferred by the work carry 801, and the same soldering process as that of the soldering apparatus S1 is performed. Can do. Further, since the magnetron 42 and its power supply device 43 are mounted on the moving head 84 and microwave energy is directly supplied to the plasma generating nozzle 200, the use of a coaxial cable or the like can be omitted, and energy transmission loss can be minimized. be able to.

(2) In the above embodiment, an example in which only one plasma generating nozzle 20 is mounted on the robot hand 10 has been shown, but two or more plasma generating nozzles may be mounted. Alternatively, the tip of the protective tube 24 may be narrowed to narrow the plume P irradiation area, or the tip may be bifurcated.

(3) A microwave output detection sensor and a process gas flow sensor are installed at appropriate positions, and the amount of plasma generated and plasma are controlled by controlling the microwave energy output (or high frequency power output) and / or process gas flow rate. It is desirable that the temperature of the converted gas is controlled by the overall control unit 62. With such a configuration, an optimal plume P can be generated according to the melting point of the solder member to be used, the material of the adherend to be soldered, the soldering area, and the like.

It is a block diagram which shows an example of soldering apparatus S1 for enforcing the soldering method which concerns on this invention. It is a principal part expanded sectional view of soldering apparatus S1 shown in FIG. It is a flowchart which shows an example of the soldering method with respect to the workpiece | work W performed by soldering apparatus S1. (A) is a schematic diagram for demonstrating the surface modification | change condition of the workpiece | work W by the plume P, (b) is a schematic diagram for demonstrating the welding state of a solder member. It is a front view which shows soldering apparatus S2 which concerns on deformation | transformation embodiment.

Explanation of symbols

10 Robot hand (position adjustment means)
100 base 101 work carry (work supply means)
20 Plasma generating nozzle 21 Central conductor 22 Nozzle holder 23 Nozzle body 24 Protective tube 25 Insulating holding member 30 Solder supply mechanism (solder supply means)
40 Microwave generator (energy generating means)
41 Coaxial cable (feeding cable)
42 Magnetron 43 Power supply device 50 Process gas supply device (gas supply means)
60 control unit 61 robot control unit 62 overall control unit 63 operation unit S1, S2 soldering device (work processing device)
W Work Wa Surface

Claims (7)

A soldering method for melting and bonding a solder member to a predetermined adherend surface,
A first step of performing surface modification of the deposition surface by irradiating the region including the deposition surface with a plasma gas;
A solid-phase flux-free solder member is supplied to the surface-modified part in the first step, and a plasma gas having a temperature higher than the melting point of the solder member is irradiated to the solder member. And a second step of melt-bonding a solder member to the adherend surface. Energy generating means for generating electric energy;
A plasma generating nozzle that generates and discharges plasma gas based on the power energy;
Gas supply means for supplying a predetermined processing gas to the plasma generating nozzle;
Position adjusting means for adjusting the position of the plasma generating nozzle so that the plasma-ized gas can be irradiated to a predetermined target position;
Soldering means comprising: a solder supply means for supplying a flux-free solder member to the target position.   The soldering apparatus according to claim 2, wherein the energy generating means includes microwave generating means for generating microwaves.   4. The position adjusting means comprises a robot hand that mounts the plasma generating nozzle and is capable of moving the plasma generating nozzle in a two-dimensional direction or a three-dimensional direction. The soldering apparatus described.   The soldering apparatus according to claim 4, further comprising: a power supply cable that supplies power energy generated from the energy generation unit to the plasma generation nozzle mounted on the robot hand.   The soldering apparatus according to claim 4, wherein the energy generating unit is mounted on the robot hand, and electric power energy is directly supplied from the energy generating unit to the plasma generating nozzle. A soldering apparatus according to any one of claims 2 to 6;
A workpiece processing apparatus, comprising: a workpiece supply unit that continuously supplies a predetermined workpiece having a solder member attachment surface to the target position.

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