JPS61264788A - Chip part mounting machine - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a chip component mounting machine for mounting chip components onto a printed circuit board, and more particularly, to a mounting machine suitable for forming a highly efficient line II.

(Prior art and problems) Conventionally, chip component mounting machines have a structure in which a head for mounting chip components one by one is fixed at the mounting position in line IiJ&, or a mounting head with a single suction pin. The chip components are movable in the X and Y directions by NC control, etc., and a head takes out chip components one by one from the supply section and moves them to a predetermined printed circuit board position to mount them. However, the former uses line organization. It has the disadvantage that it is extremely long, and it is difficult to change the mounting loft. Furthermore, in the latter head moving type configuration, there is a problem that it is difficult to shorten the time required for mounting one chip component per stick when mounting one chip component, and there is a drawback that the manufacturing cost of the device increases.

In addition, in a conventional configuration as a device suitable for line JI, chip components are stored in a magazine, and the magazine is placed in a positional relationship corresponding to the mounting position of each component on a printed circuit board, so that multiple chip components can be mounted at the same time. Some chip parts are mounted using a vacuum suction cup. In this case, the time required for mounting can be shortened, but there are disadvantages in that the mounting process is difficult and a magazine must be used. Furthermore, as another device, there is a method in which the chip components are transported from multiple supply units to the mounting equipment, and the printed circuit board is moved to a predetermined position using an X-Y table while the chip components are mounted one by one using a mounting head. However, even if it is an excellent method to use as a standalone machine, the whole machine becomes large and
Since an X-Y table is sometimes used, 1± is not suitable for use in line organization.

(Means and effects for solving the problem) In view of the above points, the present invention provides a mounting head having a plurality of suction pins on an X-Y table head to simultaneously suction a plurality of chip components. The above problems are solved by using an elliptical structure that is transferred onto the printed circuit board, and it is possible to shorten the mounting time per chip component, and there is no need for an X-Y table on the printed circuit board side, and each suction pin on the printed circuit board is The aim is to provide a chip component mounting machine that can easily change the mounting position by program within the coverage range, can move printed circuit boards sequentially along a fixed transfer path, and is suitable for line organization. be.

(Example) Hereinafter, an example of a chip component mounting machine according to the present invention will be described with reference to the drawings.

In FIGS. 1 to 4, a substrate transport path 3 having a pair of slide rails 2 is arranged near the front of the base 1. As shown in FIGS. The board conveyance path 3 forms a support Wi groove that movably supports a printed circuit board 4 on which a chip component 30 is to be mounted, and is a belt conveyor for moving the printed circuit board 4 sliding on the slide rail 2 in a predetermined direction. , a positioning member for positioning the printed circuit board 4 at a predetermined position when chip components are mounted, a stopper for stopping the printed circuit board 4, and the like.

On the other hand, a support frame 10 that protrudes above the substrate transport path 3 is provided with a ladder 11 for an XY table. That is, the X-Y table head 11 is supported slidably in the X direction by an X direction slide shaft 16 fixed to the 7 frame 10 side, and is screwed onto an X direction ball screw shaft 17 and operated by an X motor. The Y-direction slider 18 and the Y-direction slide pongee 12 arranged on the side of the X-direction slider 18 are capable of freely sliding in the Y-direction, and are screwed onto the Y-direction ball screw shaft 13 and operated by the Y-direction motor 14. It has a Y-direction slider 15.

Then, the lower end of the Y-direction slider 15 is attached to the mounting head 20.
is fixed. Even if the installation RAD 20 is 1!1
Zero suction pins 21 are arranged at equal intervals in the X direction. Each suction pin 21 is attached with an air ring 22 for raising and lowering it (up and down).

Further, the same number of supply mechanisms 25 as the number of suction pins 21 are arranged on the base 1, and the supply mechanisms 25 and the substrate transport path 3
The same number of centering and turning between 8! A structure 26 is arranged. These supply mechanisms 25 and centering and direction changing mechanisms 26 are arranged at equal intervals in the X direction, and the intervals in the X direction match those of the suction pins 21.

In each supply mechanism 25, a series of chip components (taping of chip components) 28 is drawn out from a chip tape reel 27 supported at the rear position. As shown in FIG. 3, the chip component series 28 is made by pasting a lid tape 32 onto an embossed tape 31 containing chip components 30 (
Or cut a hole in paper tape and cover it from both sides)
In this case, each chip component series 28 holds chip components 30 corresponding to the ten suction pins 21.

As shown in FIG. 3, in the supply mechanism 25, a pin-equipped feed wheel 33 having pins 34 that engage with the feed round holes of the chip component series 28 at equal angular intervals is pivotally supported by a supply frame 40. That is, a rod 35A provided to be pushed up by a rod of a driving air cylinder 35 fixed to the base 1 side is connected to an arm 37 whose tip is a gear 36, and the arm 37 is fixed. The pinned feed 11133 is provided to the rotary shaft 38 via a one-way clutch mechanism (ratchet mechanism). Therefore, one stroke (one extension) of the driving air cylinder 35 moves the pinned feed wheel 33 once.
It rotates by the pitch (the angular spacing of the pins 34). Further, a gear 41 that meshes with the gear 36 at the tip of the arm 37 is pivotally supported by the supply frame 40, a friction wheel 41A is pivotally supported coaxially with the gear 41 via a one-way clutch mechanism, and the friction wheel 41A is attached to the support arm 42A. Pivotally supported friction wheel 42
They are engaged. A take-up reel 43 coaxially provided on the support arm 42A is rotated by a friction wheel 42. Note that a one-way bearing is also used for the friction wheel 42 to prevent rotation.

Therefore, the chip series 28 drawn from the chip tape reel 27 into the gap 47 between the supply guide surface 45 of the chip series formed on the supply frame 40 and the supply guide member 46' is At the peeling step 48, the lid tape 32 is peeled off and reaches the feed wheel 33 with a pin, where it is intermittently transferred one pitch at a time.

The chip parts 30 of the chip part series 28 from which the lid tape 32 has been peeled off are exposed, and can be directly picked up by the suction pins 21 at the transfer position P1 at the front end of the supply mechanism.

The peeled rod tape 32 is wound up by a take-up reel 43. Further, the embossed tape 31 that has passed through the transfer position P1 and is now empty is guided below the base 1 through the discharge tape guide 50 as shown in FIG. The cutting process is performed.

The centering and direction change mechanism 26 is provided corresponding to each of the ten suction pins 21, and is configured to be able to center and change direction independently. That is, as shown in FIG. 1, a pulse motor 55 is provided corresponding to each centering and direction changing mechanism 26, and the rotation of the pulse motor 55 is controlled by the teeth 11 as shown in FIG.
The power is transmitted to the rotary shaft 56 which is supported so as to pass through the base 1 via the m structure 56A. and,
A pair of centering clamping levers 58 are pivotally attached to a first surface of a rotation block 57 above the rotation shaft 56 at a fulcrum 59 . Although not shown in FIG. 4, the rotating block 5
A pair of centering clamping levers 58 are similarly disposed on a second surface perpendicular to the first surface of 7. That is, the centering and direction changing mechanism 26 includes two pairs of centering clamping levers 58 that are orthogonal to each other. A spring member 60 is provided at the lower end of each clamping lever 58, and urges the tip of each clamping lever 58 in the direction of opening. Further, a stopper block 6 is provided in the middle of the rotating shaft 56.
1 is fixed, and a push-up member 63 that is urged upward by a compression spring 62 is provided around the rotating shaft 56. This push-up member 63 is connected to a corresponding pair of clamping levers 5.
8, opening and closing fabrications are performed. Another push-up member 65 is provided around the rotating shaft 56 and is urged upward by a compression spring 64 with respect to the push-up member 63 . The pushing up member 65 is connected to the remaining pair of holding levers 58r.
This is a Wi-closing fabrication. That is, the upper ends of these push-up members 63 and 65 are engaged with the lower ends of each corresponding pair of the centering clamping levers 58. Lifting member 63.65 of each centering and redirection mechanism 26
An actuating member 70 is provided in common for both. Note that a chip mounting pin 66 is provided on the rotation block 57.

In the centering and direction change mechanism 26, when the actuating member 70 is lowered as shown by arrow F in FIG. Chip parts 3
It enters a state of waiting for zero centering.

Next, the operation of the above embodiment will be described. First, the mounting rod 20 moves to the point transfer position shown in FIG.
The exposed chip components 30 on the top 1 are each sucked by vacuum suction, and then the suction pins 21 are raised.

The mounting rod 20 is then moved to point P2 in FIG. 4 on the centering and turning mechanism 26.

At this time, the actuating member 70 is in the lowered position, and the two pairs of centering clamping levers 58 of the centering and direction changing mechanism 26 are waiting with their tips open. Then, the air cylinder 22 is activated again, and each suction pin 21 is lowered.
At the same time, the actuating member 70 rises, and in this state, the vacuum suction operation on the suction pin side is stopped, and the chip component 30 is held by the two pairs of clamping levers of the centering and direction changing mechanism 26 (111), and the predetermined centering and If necessary, the direction is changed by rotating the pulse motor 55 (for example, every 90 degrees or every 45 degrees).After centering and direction change, the suction pin 21 again attracts the chip component by vacuum suction and ascends to print. Move the rad 20 in the direction of the board and place the pins in the Y direction and the The mounting head 20 sequentially performs mounting according to its vertical movement, and after completing the last mounting, the mounting head 20 returns to the tip position p of the supply mechanism 25.

In the case of the above operation, considering the time required for mounting each chip component, the operation other than on the printed circuit board is common to each chip component, and the time required for each chip component is short. I understand.

The above is an outline of the operation, but for the most efficient installation, Rad2
If we consider the movement of 0, the movement of the mounting head 20 in the Mounting is performed using the suction pin 21 in order from the nearest mounting position on the board, and after mounting the last mounting point at the farthest position when viewed in the X-axis direction, the mounting head 20 is returned to the original supply section. This is efficient because the movement of the mounting head in the Y direction can be minimized. in this case,
If the return period of the mounting head 20 is used to transport the mounted printed circuit board 4 to the next station, the time for board transport and the return time of the mounting head 20 can overlap. Efficiency is further improved.

The number of types of chip parts supplied is basically the same as the number of suction pins in a one-to-one relationship, but the number of types can be doubled by halving the pitch of the arrangement and shifting the whole by half a pitch. It is also possible to do so. Furthermore, it is also possible to combine the system with a method of automatically exchanging the supply side all at once, or with a structure in which a sequencer is installed to enable the supply type to be changed as appropriate.

(Effects of the Invention) As explained above, according to the chip component mounting machine of the present invention, the following effects can be achieved.

(1) The operating procedure from chip component supply to board mounting is simple, and the number of times chip components are changed is small, so there is little chance of defects occurring and high reliability is achieved.

(2) The configuration is simple, and each part can be made into a unit to easily organize functions.

(3) The structure is simple, and the manufacturing cost can be reduced because it is a multi-system system in which the supply mechanism and mounting head are commonly used for a plurality of suction pins.

(4) Since a plurality of suction pins are provided for the mounting head, it is possible to simultaneously suction and center the chip components, thereby reducing the time required to take out each chip component.

Furthermore, when mounting, it is possible to reduce the movement of the mounting head by sequentially mounting from the side closest to the origin in the X-axis direction and by appropriately selecting suction pins in accordance with the mounting position in the X-axis direction. It is also possible to shorten the wearing time.

(5) Since multiple suction pins simultaneously suction chip components at the transfer positions of multiple supply mechanisms, after the suction pin operation, the suction pins return to the next transfer position of the supply fi4N. You can lengthen the time interval until it comes, and supply 8! The feeding operation of the series of chip parts in the system may be relatively slow. Therefore, the supply mechanism can be operated reliably.

(6) Since there are a plurality of suction pins and the structure is shared, the length of the machine per number of attachment points is shortened, and the line formation can be shortened.

(7) The parts supply side can be easily replaced by, for example, making a chip tape reel into a cassette, or by making multiple reels into a unit, and changing the mounting position can also be programmed based on the coverage range of each suction pin on the printed circuit board. Therefore, it is easy.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view showing an embodiment of a chip component mounting machine according to the present invention, FIG. 2 is a front view showing main parts of the embodiment, and FIG.
The figure is a side sectional view of the feeding mechanism, and FIG. 4 is a side sectional view showing the centering and direction changing mechanism. DESCRIPTION OF SYMBOLS 1... Base, 3... Board conveyance path, 4... Printed circuit board, 10... Support 7 frame, 11... X-Y table head, 20... Mounting head, 21...・Suction pin, 22... Air sill, 25... Supply mechanism,
26... Centering and direction change mechanism, 27...
Chip tape reel, 28... Chip parts series, 30.
...Chip parts.

Claims (2)

[Claims] (1) A mounting head provided on the X-Y table head, a plurality of suction pins provided to the mounting head so as to be movable up and down, and a supply mechanism that exposes a series of chip components so that they can be freely suctioned at a transfer position. , comprising: a board support mechanism that supports a printed circuit board on which the chip component is to be mounted; and a centering and direction changing mechanism that has the same number as the suction pins and is disposed between the supply mechanism and the board support mechanism. A chip component mounting machine featuring: (2) The chip component mounting machine according to claim 1, wherein the plurality of suction pins simultaneously suction the chip components from the same number of supply mechanisms.