KR900000185B1 - Mounting chip type circuit elements for method apparatus - Google Patents

Abstract

The mounting head includes a suction pin (46) for sucking up the chip type circuit elements and an air cylinder casing having a partiton member separating the casing into a cylinder chamber and a vaccum chamber. A piston is slidable with respect to the cylindr chamber, and has a lower rod portion projecting from the lower end of the casing and an upper rod portion projecting through the partition member into the vaccum chamber. A vaccum suction passage in the piston extends from the lower end of the lower rod portion to the upper end of the upper rod portion. The suction pin (46) is affixed to the lower end of the lower rod portion. An air filter closes the upper end of the vaccum suction passage.

Description

Method and device for attaching chip type circuit elements to printed circuit board

FIG. 1 shows the location of the chip-shaped circuit elements sucked on the suction pins.

Figure 1a is when the chip-shaped circuitry is in the correct position,

Figures 1b and 1d are at the wrong position.

2 is a perspective view showing one example of an apparatus suitable for implementing a method of attaching a chip-shaped circuit element to a printed circuit board according to the present invention.

3 is a front view of the apparatus shown in FIG.

4 is a side view of the apparatus shown in FIG.

5 is a schematic diagram showing a sequence of movement in a direction perpendicular to the Y axis direction.

6 is a schematic diagram showing the relationship between the distance (1) of moving the attachment device in the X-axis direction and the distance between adjacent attachment devices.

FIG. 7 is a schematic diagram showing the relationship between the distance (1) of moving the attachment device in the X-axis direction and the number of suction pins covering the divided area along the X-axis direction of the printed circuit board. FIG.

8 is a side cross-sectional view showing one example of an apparatus for attaching a chip-shaped circuit element to a printed circuit board according to the present invention.

9 is a front view showing the basic part of the apparatus shown in FIG.

FIG. 10 is a side cross-sectional view showing an example of a chip type circuit element supply device coupled to the apparatus shown in FIG.

FIG. 11 is a side sectional view showing a chip-shaped circuit element center rotating apparatus coupled to the apparatus shown in FIG.

12 is a side view showing, in partial cross section, an example of a chip-type circuit element attachment device that can be used in the circuit element attachment device according to the present invention.

13 is a rear view of the attachment device shown in FIG.

14 is a side view showing another example of a chip type circuit element attachment device.

FIG. 15 is a plan view showing a state in which a plurality of attachment devices shown in FIG. 14 are arranged on a support frame; FIG.

FIG. 16 is a front view of FIG. 15. FIG.

FIG. 17 is a side view showing the cam driving portion of the attachment device shown in FIG.

FIG. 18 is a front view of FIG. 17. FIG.

19 is a right side view showing a detection device for detecting a chip-like circuit element sucked on a suction pin.

FIG. 20 is a left side view of the detector shown in FIG. 19 in partial cross section; FIG.

FIG. 21 is a front view showing the basic part of the detection device shown in FIG.

FIG. 22 is a bottom view of FIG. 21. FIG.

23 to 25 are front views each showing the positional relationship between the sleeve and the suction pin in each operation step of the detection device.

* Explanation of symbols for main parts of the drawings

10: frame base 12: feeder

14: slide rail 16: conveyor belt

18: printed circuit board 20: member for placing the printed circuit board

44: attachment device 46: suction pin

50: supply device 52: position adjustment rotating device

54: Chip Tape

TECHNICAL FIELD The present invention relates to an apparatus for attaching a chip-shaped circuit element on a printed circuit board, and more particularly, to a method and apparatus for enabling the construction of a highly efficient production line.

In general, in a systematic production line for attaching a chip-like circuit element to a printed circuit board, a mounting head which is capable of suction-supporting at least one chip-type circuit element may be placed on the printed circuit board. (The circuit element attachment position) or the "attachment position" (hereinafter referred to as "attachment position") or by attaching the circuit elements by pulling the chip-type circuit elements one by one by moving the attachment device in the XY direction in the same manner as Nc control. It is common to work in such a way that it is moved to a position and attached.

However, this known method has the drawback that the organized production line is too long and it is very difficult to replace the attachment device. A representative example of the latter method is U.S. Patent No. 4,372,802, issued to Harry G. S. on February 8, 1983.

However, this US patent also has the drawback that it does not shorten the time it takes to attach one chip-like circuit element onto a printed circuit board. In addition, this US patent has the drawback that it increases the manufacturing cost of the device attachment device.

Another known attachment method for organizing a production line includes a plurality of supply chambers (magazines) containing chip-shaped circuit elements of different shapes, each arranged in correspondence with each circuit element attachment position of a printed circuit board. It is to use a circuit element attachment device that can be attached to the circuit elements of the printed circuit board by a plurality of vacuum suction pads at the same time. Known devices of this structure effectively shorten the attachment time, but suffer from a very cumbersome drawback as the chip-like circuitry must be replaced in a lot-to-lot. In addition, this method has the drawback that the device is very complicated because it requires the use of a magazine.

As another known method of attaching circuit elements, the chip-shaped circuit elements are continuously supplied to a plurality of circuit element feeders in accordance with a predetermined attachment order to move the printed circuit board to the XY table, and to attach the circuit elements thereon one by one by the attachment device. There is one composed of steps. However, this method is not suitable for organizing the production line because the attachment device used is too large and must have an X-Y table.

The chip type circuit element attaching device used in the known attaching device allows the vertical movement of the suction pin by the air cylinder, and the suction of the chip type circuit element by the suction pin is through the suction pin separately from the air cylinder and at the same time the air filter and the vacuum. It is constructed by using a vacuum suction pipe with a valve. The air filter serves to prevent foreign matter from entering the vacuum valve and damaging the valve, and the vacuum valve closes or opens the vacuum suction passage through the suction pin, causing the suction pinch to suck or drop the chip circuit element. It is to play a role. However, the attachment device of such a structure has the drawback that the structure of the circuit attachment device is very complicated, making it bulky and expensive.

There are two types of known attachment devices, one having a single suction pin type or a single suction pin that moves vertically by an air cylinder, and the other has a plurality of suction pin type or suction pins installed correspondingly. It has a plurality of suction pins moved vertically by a cylinder. In each of these types of attachment devices, it takes a lot of time to supply air to the air cylinders so that the pistons supported by the suction pins move vertically by overcoming the static friction force in the cylinders. In addition, since the dynamic friction coefficient is smaller than the static friction coefficient, once the piston moves, the speed is relatively high, and the high speed operation is continued until the piston stops. Due to this characteristic, it becomes difficult to suck the chip-shaped circuit element with the suction pin or to attach the sucked circuit element to the substrate or the printed circuit board. Furthermore, at the beginning, at a relatively low speed, at a maximum speed in the middle, and so as not to exert high acceleration on the chip-like circuitry when the suction pin moves vertically to suck and attach the chip-like circuitry to the substrate or the printed circuit board. Just before the end, you need to make sure that the speed is very slow. However, the air cylinder used in the known attachment device is not configured to cause the suction pin to do so. Therefore, in the known attachment device, the operating speed of the air cylinder must be kept low enough so that the chip-shaped circuit element can be sucked and supported well by the suction pin, thereby greatly reducing the operating efficiency.

Moreover, the well-known detection apparatus which detects suction of a chip-shaped circuit element by the suction pin of each attachment device of a single suction pin type is made to detect the suction vacuum pressure of a suction pin. However, this known detection device suffers from the drawback that its operation reliability is lowered because its vacuum suction pressure is unstable due to air leakage between the suction pin and the sucked circuit element. In addition, this known detection device cannot detect the posture of a sucked circuit element. In particular, this well-known detection device is designed so that the chip-shaped circuit element 58 is sucked to the correct position as shown in FIG. 1 by the suction pin 46 or in the wrong position as shown in FIGS. 1B to 1D. It does not identify whether it exists.

In addition, in the detection device for the attachment device of the single suction pin type, in order to effectively detect the presence and the posture of the chip type circuit elements, a plurality of photosensitive devices must be fixedly arranged. In the detecting device having such a structure, the photosensitive devices are arranged in a plane to have a displacement angle at a predetermined position on the frame base side rather than the attachment device side, and the presence of the chip-shaped circuit element is caused by the height difference between the light rays emitted from the photosensitive devices. Allows you to detect your posture. However, these known detection devices have the drawback of having a large space for arranging with two or more photosensitive devices.

In the case of many suction pin-type detection devices, a vacuum sensor must be provided for each suction pin. Such a detection device lacks the reliability of operation and cannot detect whether or not the position of the sucked chip-shaped circuit element is wrong. Due to these shortcomings, a detector using a photosensitive device has been proposed, but it is virtually impossible to secure a space in which a plurality of photosensitive devices are arranged.

This invention is made | formed in order to solve the fault of the said well-known technique.

Accordingly, it is an object of the present invention to provide a method capable of significantly shortening the time for attaching a chip-shaped circuit element to a printed circuit board and at the same time constructing a highly efficient production line.

It is still another object of the present invention to provide a method for greatly simplifying the structure of the attachment device since there is no need to install an X-Y table when attaching the chipped circuit element to the printed circuit board.

It is still another object of the present invention to provide a method for easily changing a circuit element attachment position according to a predetermined program within a range in which a suction pin covers a printed circuit board when attaching a chip type circuit element on a printed circuit board. .

It is still another object of the present invention to provide a method for constructing a highly efficient production line by continuously moving a printed circuit board to a predetermined transfer path when attaching a chip-shaped circuit element on a printed circuit board.

It is still another object of the present invention to provide an apparatus that can shorten the attaching time when attaching a chip-shaped circuit element on a printed circuit board and at the same time make a production line with high efficiency.

It is still another object of the present invention to provide an apparatus which can simplify the structure by eliminating the need to arrange the X-Y table when attaching the chip-shaped circuit element to the printed circuit board.

It is still another object of the present invention to provide an apparatus that can easily change the attachment position of a circuit element according to a predetermined program within a range in which a suction pin covers the printed circuit board when attaching the chip type circuit element to the printed circuit board. .

It is also an object of the present invention to provide an apparatus capable of constructing a highly efficient production line while simultaneously moving a printed circuit board on a predetermined transfer path when attaching a chipped circuit element to a printed circuit board.

It is still another object of the present invention to provide an apparatus having a circuit element attachment device having a very simple structure when attaching a chip type circuit element to a printed circuit board.

It is still another object of the present invention to provide a chip type circuit element attaching device which can make the structure very simple.

Another object of the present invention is to attach a chip-shaped circuit element to a printed circuit board, and to provide an apparatus capable of minimizing the acceleration applied to the chip-type circuit element and at the same time performing the attaching operation at a high speed.

It is still another object of the present invention to provide a chip-type circuit element attaching device which allows the overall attachment speed to be highly increased while reducing the acceleration applied to the circuit element by a vertical moving rod instead of the air cylinder to a minimum. will be.

Another object of the present invention is to attach a chip-shaped circuit element on a printed circuit board, and to provide an apparatus capable of effectively detecting the presence and posture of the chip-shaped circuit element sucked on the suction pin.

It is still another object of the present invention to provide a device for attaching a circuit element, which is capable of effectively detecting the presence and posture of a circuit element by a single photosensitive device for each suction pin.

According to the present invention, a method for attaching a chip-shaped circuit element on a printed circuit board is made by suctioning and extracting the chip-shaped circuit element from the circuit element supply portion by a plurality of suction pins provided in the attachment device provided on the XY table stand, and the supply portion thereof. The chipped circuitry, taken out of it and supported on the suction pins, is sent to a positioning rotary device to hold the center of the chipped circuitry, rotate it as necessary, and then place the chipped circuitry at the predetermined number of circuitry attachment positions on each printed circuit board. The step of attaching the elements continuously.

As an example of the present invention, it is preferable that the attachment device performs one reciprocating motion in the Y direction while simultaneously performing a plurality of reciprocating motions in the X direction.

As an example of the present invention, the plurality of suction pins are arranged in the X direction, and the moving distance in the X direction of the attachment device is smaller than the total length of the suction pins plus the length of the printed circuit board in the X direction. It is desirable to make it.

According to the present invention, a device for attaching a chip-shaped circuit element on a printed circuit board includes an attachment device disposed on an XY table stand, a plurality of suction pins installed to move in a vertical direction with respect to the attachment device, and transported on each chip tape. A supply device for exposing the chip-shaped circuit elements at the position where the circuit elements are moved, a printed circuit board support device for supporting the printed circuit board to which the circuit elements are to be attached, and a suction device disposed between the supply device and the printed circuit board support device in correspondence with the suction pins. It is preferable to configure a plurality of positioning rotary devices.

As an example of the present invention, it is preferable that the supply device is arranged in numbers corresponding to the plurality of suction pins, and the suction pins suck the chip-shaped circuit element from the supply device.

Further, according to the present invention, an apparatus for installing a chip-shaped circuit element on a printed circuit board is provided on at least one single suction pin type attachment device for attaching the suction pin to move in a vertical direction, supported on at least one chip tape. A supply device for exposing the chip-shaped circuit elements to the chip-circuit moving position, a printed circuit board device for supporting a printed circuit board to which the chip-shaped circuit elements are to be attached, and an arrangement corresponding to the attachment device in the supply device and the printed circuit board support device Consists of one positioning rotary device.

As a preferred embodiment of the present invention, the chip type circuit element attachment device is to include a detection device for detecting the chip type circuit element sucked by the suction pin.

As a preferred embodiment of the present invention, the detection device is composed of a movable support member arranged to be movable in a vertical direction with respect to the attachment device attached to the suction pin in a vertical direction, and a photosensitive member having a photosensitive portion disposed on the support member. It is configured to detect that the chip-shaped circuit element is sucked on the suction pin when the movable support member is raised, and to detect that the chip-shaped circuit element is sucked to the wrong position when the movable support member is lowered.

As a preferred example of the present invention, the photosensitive portion of the photosensitive member is composed of a light emitting portion and a light receiving portion to be disposed so as to face each other on both ends of the suction pin.

In addition, according to the present invention for use in the device for attaching the chip-shaped circuit element to the printed circuit board, the attachment device is an air cylinder cylinder divided into a cylinder chamber and a vacuum chamber by the suction pin, the partition wall, It consists of a lower rod protruding to the lower end of the cylinder and an upper rod protruding into the vacuum chamber through the partition member so that the piston can slide against the cylinder chamber and the lower end of the lower rod attached with the suction pin to the upper end of the upper rod. A vacuum suction passage formed in the piston, and an air filter disposed at the upper end at the upper end portion to cover the upper end of the vacuum suction passage.

In addition, the attachment device for use in the device for attaching the chip-shaped circuit element to the printed circuit board according to the present invention is a suction pin for sucking the chip-type circuit element, a vertical rod arranged to move in the vertical direction, the suction pin into the vertical rod It consists of a vacuum suction passage formed so as to pass through, a support member for supporting the vertical rod to slide, a follower member coupled to the vertical rod to move by the cam device, and a spring pushing the vertical rod downward.

In addition, according to the present invention, a chip-type circuit element detecting device for use in a device for attaching a chip-type circuit element to a printed circuit board is arranged to be moved vertically with respect to the attachment device to which the suction pin is moved vertically. It consists of a movable support member and a photoreceptor attached to the movable support member so that the chip-like circuit element is sucked into the suction pin so that it can be detected when the movable support member is raised, and the chip-like circuit element is sucked into the wrong position on the suction pin. It is to be detected when the movable support member is lowered.

As an example of the present invention, it is preferable that the photosensitive portion of the photosensitive member includes a light emitting portion and a light receiving portion so as to face each other on both sides of the tip of the suction pin.

With reference to the accompanying drawings with respect to the present invention will be described in more detail as follows.

2-4 illustrate an example apparatus consisting of a one-block manufacturing line that implements a method for attaching a chipped circuit element onto a printed circuit board in accordance with the present invention.

The apparatus illustrated in FIGS. 2 to 4 includes a frame base 10, which has a printed circuit board conveying device 12 arranged in the front portion. The conveying device comprises a pair of slide rails 14, a conveyor belt 16 and a plate 18 for moving the printed circuit board 18 slidably conveyed to the rails 14 in the direction indicated by the arrow a. A member 20 for arranging the printed circuit board 18 in a predetermined position at the time of attaching the chip-shaped circuit element on it, and a stopper 22 for stopping the printed circuit board 18 in the predetermined position.

The illustrated device attachment device also includes a support frame 24 disposed thereon to cover the printed circuit board. The support frame 24 receives the XY table stand 26, which is provided on the Y direction slide shaft 28, the Y direction screw shaft 30, and the Y direction slide shaft 28 so as to slide in the Y direction. Y-direction slide 32, X-direction slide shaft 36, X-direction screw shaft (not shown), which is engaged with the Y-direction slide shaft 30 driven by the Y-direction motor while being supported, and slides in the X direction. It is composed of an X-direction slide table 38 which is supported by the X-direction slide shaft 36 and driven in the X-direction by the X-direction motor so as to be joined to the X-axis screw shaft.

The illustrated attachment device also includes a attachment device 44 in the form of a multistage suction pin fixedly disposed at the lower end of the X-direction slide 38. In the illustrated embodiment, the attachment device 44 includes ten suction pins arranged at equal distances in the X direction. Each of these suction pins 46 is attached with an air cylinder 48 for moving the suction pins 46 in a vertical state. The apparatus furthermore comprises a supply means 50 arranged in the frame base 10 for supplying the chip-shaped circuit elements to the attachment device 44 and a position control rotary device disposed between the supply device 50 and the conveying device 12 ( 52). Positioning rotating device 52 includes a suction pipe provided corresponding to the ten suction pins 46, the suction pipe is capable of performing the position adjustment rotation operation in a way independent of each other.

In the supply device 50, a chip tape having respective chip-shaped circuit elements carried from the chip tape reel device 56 supported at the rear portion of the frame base 10 is introduced. Each of the chip tapes 54 has chip circuit elements corresponding to the ten suction pins 46. The illustrated embodiment shows that the circuitry on the chip tape 54 supplied from the chip tape reel device 56 is supported by the suction pin 46 in FIG. 4 at P ₁ in FIG. 4. It is composed of a strategy that can be absorbed at the front end of the circuit element determined at.

The method of implementing the above-described method will now be described with reference to FIGS.

First, the attachment device 44 is moved to the delivery position P ₁ at the front end of the supply device 50, and then the air cylinder 48 acts to move the suction pin 46 downward so that the suction pin is moved. 46 removes or pulls the chip-shaped circuit element from the chip tape 54 by vacuum suction, and then the suction pin 46 is moved upward by the air cylinder 48. Then, as shown in FIG. 4, the attachment device 44 is moved horizontally as a distance a to the position P ₂ above the positioning rotary device 52, where the air cylinder is a suction pin 46. ) Acts downward. At this time, the suction pin is released from the vacuum suction of the air cylinder in order to transfer the chip-shaped circuit element to the position adjustment rotating device 52, so that the position operation of the chip-shaped circuit element and, in some cases, each rotational operation of, for example, 90 or 45 degrees. To do this. After the position adjustment and rotation operation, the angle of the suction pin 46 attracts the chip-shaped circuit element by vacuum suction of the circuit element and moves the element to the distance b. Then, the attachment device 44 is moved in the X and Y directions so that the suction pin 46 is set on the printed circuit board 18 for each chip-shaped circuit element in the region indicated by P ₃ in FIG. The operation of attaching the circuit elements to the two circuit element attachment positions is performed gradually. Then, the attachment device 44 is returned to the delivery position P ₁ at the front portion of the supply device 50.

FIG. 5 shows the Y-direction motion and the vertical motion of the respective suction pins 46 at the positions indicated by P ₁ , P ₂ and P ₃ in FIG. 4. In Fig. 5, the symbol indicated by the arrow indicates the direction of movement. In the illustrated device, the number of circuit element attachment positions P ₃ on the printed circuit board is ten because the suction device 46 is provided in the attachment device 44, and each arrow in FIG. The operations indicated by 6) and (7) are repeated 10 times. In this case, at each of the positions P ₃ and the positions P ₁ and P ₂ different from each other, the installation operation is common to the chip-shaped circuit elements held on the respective suction pins 46, so that the circuit elements of 1 on the printed circuit board are The time required to perform the attaching operation is significantly shortened.

During the briefly described operation, the attachment device 44 reciprocates only once in the Y direction for efficient movement of the attachment device 44 in the Y direction, and the position adjustment and rotation operations are moved to the position adjustment rotation device 52. After completion, it is attached to the printed circuit board 18 away from the positioning rotary device 52 by the suction pin 46, and the final chip type circuit element is positioned in the Y direction on the printed circuit board 18. Attached at the attaching position furthest from the rotator 52 and then achieved under the condition that the attaching device 44 returns to its original position P ₁ . Such conditions minimize the movement of the attachment device 44 in the Y direction. In this case, the execution of the attaching operation is performed in such a way that the next printed circuit board is supplied within a period of time while the printed circuit board on which the attaching operation is completed is moved to the next point and the attaching device is returned to the original position. Further improve the efficiency.

6 shows the relationship between the moving distance of the attachment device in the Y direction and the distance between adjacent attachment devices. In Fig. 6, L and 1 respectively indicate the length of the attachment device and the movement of the attachment device in the X direction. Thus, L + (1 + α) is the width of the gap defined between these two adjacent attachment devices as they move in the direction of approaching each other. In addition, when the length of the printed circuit board in the X and Y directions is represented by lx and ly, and the width of the gap between the printed circuit boards is represented by G as shown in FIG. 6, the pitch of the supply of the printed circuit board (1t ) Can be represented by G + lx. As can be seen in FIG. 6, the reduction of the movement 1 of the attachment device in the X direction reduces the distance between the attachment devices. Therefore, the manufacturing line constructed by arranging a plurality of devices along the conveying device is substantially reduced in its overall length as well as the area of the suction pins covering the printed circuit board. Further, the shortening of the distance between the attachment devices causes the position 1t of the supply of the printed circuit board to be reduced, thereby further shortening the time required to supply the printed circuit board.

7 shows the relationship between the movement of the attachment device and the number of suction pins covering the area defined on the printed circuit board. The pitch between the disposed suction pins is denoted by P and the movement of the attachment device 44 in the X direction ( 1) is determined equal to 4P. In this case, assuming that there is a region distributed in the X direction by the pitch P between the suction pins 46 of the printed circuit board, the individual suction pins 46 have a distance corresponding to 2P in each of the left and right directions. Can be moved. Thus, the seven center zones of the printed circuit board can be covered by four suction pins, and the number of suction pins is gradually reduced with the distance from the center of the printed circuit board. Similarly for 1 = 2P, 1 = 6P and 1 = 8P, the number of suction pins covering each section of the printed circuit board is as shown in FIG. Thus, the number of suction pins that cover the central area of the printed circuit board with a plurality of suction pins and cover other areas gradually decreases with the distance from the center of the substrate.

In addition, if the ear canal 1 of the attachment device is larger than the entire placement length of the disposed suction pins, all the zones can be covered with either suction pin. Further, when the movement 1 is greater than the sum of the length lx of the printed circuit board in the X direction and the previous length of the arrangement of the suction pins, the entire suction pins may cover the printed circuit board. However, the increase in movement 1 causes the distance between the attachment devices to be increased as described above, thereby implicitly extending the manufacturing line to be constructed. In fact, since the fabrication of the manufacturing line is carried out using a plurality of devices as described above, the reduction in the quantity of suction pins covering the short area of the printed circuit board does not unreasonably drive the circuit efficiency. The element attachment position can be selected. For example, it becomes more convenient to set the movement 1 up to the sum of the lengths of the printed circuit boards in the X direction of the entire length of the arrangement of the suction pins. Such a choice also allows the attachment device to be moved for a short period of time in the X direction with respect to ten circuit element attachment positions on the printed circuit board to achieve the attachment operation at high speed. It should be noted that it is not necessary to set the movement 1 of the attachment device in the X direction to be a plurality of pitches P between the disposed attachment devices.

Various chip type circuit elements to be attached are basically determined to be equal to the number of suction pins. However, it is also possible to make various circuit elements twice as large as the suction pins by reducing the pitch between circuit elements by 1/2 and moving each circuit element to 1 / 2P. In addition, the method of the present invention consists of a method of automatically replacing the entire circuit element supply end face or changing the type of the chip type circuit element to be attached by the sequencer.

The present manufacturing line has a loader for automatically supplying a printed circuit board to a device provided at the front end of the line by arranging a plurality of such devices as shown in FIGS. 2 and 3. ), An unloader that automatically accepts printed circuit boards placed behind the lines, buffers to balance the lines, means for supplying adhesive to the printed circuit boards, printed circuit boards, etc. It is formed by using a checker or the like for checking the attachment of circuit elements on top of the thing.

As can be seen from the foregoing, the circuit element attachment method of the illustrated embodiment simplifies the procedure from the supply of the chip-like circuit element to the attachment of the element on the printed circuit board and to the attachment device in order to minimize the occurrence of an accident. As a result, the frequency of moving the circuit elements can be reduced, thereby performing a high reliability attaching operation. The method is also simple in structure and allows the device to be divided into units and used. In addition, the method of the illustrated embodiment allows the circuitry device and attachment device to be used in a manner common to multiple suction pins.

8 to 11 show an embodiment of an apparatus for attaching chipped circuit elements on printed circuit boards according to the present invention. The device of the illustrated embodiment is also suitable for use in practicing the circuit attachment method described above.

8 through 11 illustrate the frame base 10 having a printed circuit board or substrate conveyor device 12 disposed in the front portion. The conveying apparatus 12 is suitable for movably supporting the printed circuit boards 18 to which the chip-shaped circuit elements 58 are attached, and prints sliding on the pair of slide rails 14 and the slide rails 14. A conveyor belt (not shown) for moving the circuit boards 18 in the setting direction, a placement device (not shown) for arranging the printed circuit board 18 in the setting position when attaching the chip type circuit elements, and a predetermined position. An apparatus member (not shown) for stopping the substrate 18. The conveyor belt, the disposition device and the stop member may be configured in almost the same way as those of the device shown in Figs.

The device of the illustrated embodiment also includes a support frame 24 arranged to cover it on the printed circuit board transfer device 12. The support frame 24 is provided with an XY table stand 26, and the XY table stand 26 has an X-direction slide shaft 36 fixed on the support frame 24, and an X-direction screw shaft 60. ) And an X-direction slide table which is screwed with the X-direction screw shaft 60 to be driven by the X-axis motor, and which is supported on the X-direction slide shaft 36 so as to be able to slide in the X-direction ( 38) and driven in the Y-direction by the Y-direction slide shaft 28, the Y-direction screw shaft 30, and the Y-axis electric motor 34, which are arranged next to the X-direction slide 38. And a Y-direction slide table 32 supported on the Y-direction slide shaft 28 so as to be screwed with the Y-direction screw shaft 30 and slidable in the Y-direction.

The device of the illustrated embodiment also includes a plurality of suction pin-type attachment devices 44 fixedly disposed at the lower end of the Y-direction slideway 32. In the illustrated embodiment, the attachment device 44 includes ten suction pins 46 arranged at equal intervals in the X-direction. An air cylinder 48 is attached that serves to vertically move each suction pin 46. The device of the illustrated embodiment also includes a supply device 50 disposed on the frame base 10 to supply the chipped circuit elements 52 to the attachment device 44, and between the supply device 50 and the conveying device 12. Positioning rotating device 52 disposed in the. The feeding device 50 and the positioning rotary device 52 are installed in a number corresponding to the rotating pins 46. The feeder 50 and the positioning rotor 52 are arranged at the same prices in the X-direction so that the spacings in the X-direction coincide with those of the suction pins 46.

Each supply device 50 is inserted with chip tapes 54 each having chip-shaped circuit elements 58 (FIG. 10) transferred from the chip tape rail 56 supported at the rear of the frame base 10. FIG. . In the illustrated embodiment, as shown in FIG. 10, the cover tape 64 is bonded to an embossed tape body 62 with chipped circuit elements 58 installed therein, each of the chip tapes 54. Is formed. Alternatively, the chip tape 54 may consist of a paper tape having a plurality of through holes into which chip-shaped circuit elements are inserted therein and covers covering the through holes. The chip tapes 54 are formed to support the chip-shaped circuit elements 58 corresponding to the ten suction pins 46, respectively.

Each of the feeders 50 is configured as shown in FIG. More specifically, the feeder 50 includes feed wheels 66 with feed pin pins 68 to engage the feed holes of the chip tape 54 to transfer the chip tapes. 70). The supply wheel 66 is supported on the rotary shaft 72 via the unidirectional clutch mechanism or the ratchet mechanism, with the arm 74 rotatably attached to one end, and the arm 74 attaches the gear 76 to the other end. An adjoining portion of its other end is connected to an upper end of a rod 78 which is formed by attachment and is pushed up by the provided drive air cylinder 80 of the frame base so as to extend upwardly through the frame base 10. The supply wheel 66 may be rotated by one pitch corresponding to the angular spacing between two adjacent pins 58 by one stroke of the drive air cylinder 80. The gear 76 provided at the end of the arm 74 is engaged with the gear wheel 82 axially supported by the feed frame 70. The reference load 84 is supported coaxially with the gear wheel 82 via the one-way clutch mechanism on the feed frame 70, and is provided with a second friction car 86 rotatably attached to one end of the support arm 88. Points to the first friction car to be bound. The support arm 88 also has a rail 90 rotatably mounted thereon to be coaxial with the second friction car 86. The second friction car 86 is provided with a unidirectional bearing (not shown) which acts to regulate the rotation of the friction wheel 86.

In the supply device 50 configured as described above, the chip tape introduced into the gap 92 between the supply guide surface 94 and the supply guide member 96 of the supply frame 70 from the chip tape rail 56 ( The feed tape 66 for which the cover tape 64 is peeled off from the tape peel groove 98 of the feed guide member 96 and intermittently conveys the chip tape 54 peeled off one pitch at a time. Is guided). The chip-shaped circuit elements 58 inserted in the stripped chip tape 54 are exposed from the chip tape so that the circuit elements can be drawn out by the suction pins 46 to the movement position P ₁ set at the front end of the supply device 50. have.

The cover tape 64 removed from the chip tape 54 is wound around the rail 90. The embossed tape body 62 emptied at the moving position P ₁ is tape ejection guide member 100 below the frame base 10 where the tape body is cut to a predetermined length by the cutter 102, as shown in FIG. Is guided through).

The positioning rotary devices 52 are arranged to correspond with the ten suction pins 46, and are suitable for performing the positioning rotating operation independently of each other. Reference numeral 104 denotes a pulse motor disposed with respect to each positioning rotary device 52, as shown in FIG. As shown in FIG. 11, the rotational output of the pulsed electric motor 104 is transmitted through the gear device 106 to the rotational shaft 108 extending vertically through the frame base 10. The upper end of the rotary shaft 108 is attached to the rotary block 11 having a pair of first support lever 112 rotatably installed on the first surface by the shaft pin 114. Similarly, the rotary block 110 is also provided on a second surface which, even though they are not shown in FIG. 11, is almost equally a pair of second support levers perpendicular to the first surface. As such, the positioning rotary device includes two pairs of support levers 58 for centrally positioning chip-shaped circuit elements arranged to be perpendicular to each other. Each of the support levers 112 is provided with a spring member 116 that serves to bias the support lever 112 in the direction of opening the upper end of the support lever. In addition, the rotating shaft 108 is applied to the stop block 118 fixedly installed in the middle portion and the spring block 122 is applied to the upper direction relative to the stop block 118, the first push-up member 120 installed around Has) The first pushing member 120 serves to operate the pair of first support levers 58.

Around the axis of rotation 108 is also arranged a second pushing member 124 which is used to exert a force upwardly with respect to the first pushing member 120 by the compression spring 126. The first and second sealing members 120 and 124 act to operate the first support levers 112 and the second support levers (not shown). For this purpose, each of the first and second sealing members 120 and 124 has an upper end coupled to the lower ends of the corresponding support levers. The positioning rotary devices 52 also include an actuating member 128 common to the first and second sealing members 120 and 124. Reference numeral 130 denotes a pin provided on the rotary block 110 to put the chip-shaped circuitry 58 there.

In each positioning rotary device 52 constructed in the manner as described above, when the operating member 128 is moved downward as indicated by the arrow F in FIG. 10, the pushing members 120 and 124 The two pairs of support levers 58 can be moved in the same direction to open at their end ends, so that the positioning rotary device can be prepared to perform the positioning operation.

The operation of the apparatus of the embodiment shown in FIGS. 8 to 11 will now be described.

First, the attachment device 44 is moved to the circuit element movement position P ₁ provided at the front end of the supply device 50, and then the air cylinders 48 are operated to move the suction pins 48 together downward. Thus, the suction pins 46 extract the chipped circuitry 58 by vacuum suction from the embossed tape bodies 62 from which the cover tapes 64 have been removed. Then, the suction pins 46 with the circuit elements supported thereon are moved upwards by the air cylinder 48.

Then, the attachment device 44 is moved to the position P ₂ (FIG. 11) above the positioning rotary device 52. The actuation member 128 is then in the lowered position to allow the two pairs of support levers 112 to open at their end ends. Then, when the respective air cylinders 48 are actuated again to move the actuating member 128 upwards, the vacuum applied to the suction pin 46 is released, and the two pairs of support levers rotate with the rotary element positioning operation. Then, the chip-shaped circuit elements are pressed together to perform the circuit element rotation operation (for example, 90 degrees or 45 degrees angle) due to the rotation of the pulse motor 104 as necessary. After the positioning rotation operation, a vacuum is applied to each of the suction pins 46 so that the suction pins support the circuit element by vacuum suction, and then the suction pins 46 are raised and moved to the printed circuit board. Then, the suction pins 46 are arranged for the ten circuit attachment positions by moving the attachment device in the X- and Y-directions, and gradually perform the circuit attachment operation. Thereafter, the attachment device 44 returns to the movement position P ₁ .

Thus, the attachment devices shown in FIGS. 8 to 11 are necessary for attaching one chip-shaped circuit element on a printed circuit board because the operation at positions other than the attachment position on the substrate is performed in common for each chip-shaped circuit element. Note that this greatly reduces the time.

In brief, in the above-described operation, the most efficient movement of the attachment device 44 in the Y direction is achieved by suction after the attachment device is reciprocated only once in the Y-direction, and the positioning rotation operation is completed in the positioning rotation device 52. The pins 46 attach the circuit elements on the printed circuit board 18 according to the distance from the positioning rotor 52, and the final circuit elements are positioned in the Y-direction based positioning rotor 52. Under the conditions of being attached on the printed circuit board 18 to the attachment position furthest from Such conditions will minimize the movement of the attachment device in the Y-direction. In this example, the implementation of the operation improves the operating efficiency of the apparatus in such a manner that the printed circuit board on which the attaching operation is completed is moved to the next place and the next printed circuit board is supplied in a time period in which the attaching device is returned to the initial position. .

The types of chip-like circuit elements to be attached are basically determined to be equal to the number of suction pins. However, it is possible to double the types of circuit elements by the size of the suction pins by reducing the pitch between circuit elements by 1/2 and moving each of the circuit elements by 1/2 pitch. The illustrated embodiment can also be configured in such a way as to automatically replace the entire circuitry supply and change the type of circuitry to be attached by the sequencer.

As can be seen from the above, the circuit device attaching apparatus of the illustrated embodiment can simplify the process from supplying the chip-shaped circuit elements to the attachment on the printed circuit board, and minimizes the occurrence of problems, thereby ensuring high reliability. The frequency of movement of the circuit elements by the attachment devices is reduced to perform the attachment operation. In addition, the apparatus is simple in structure and can be divided into several units. In addition, in the device of the illustrated embodiment, the attachment device of the circuit element supply device is commonly used for a plurality of suction pins.

12 and 13 show a circuit element attachment device suitable for use in the circuit element attachment device of the present invention and configured to simplify the structure to the attachment device.

12 and 13, reference numeral 140 denotes a case for the air cylinder. The inside of the case 140 is divided into the cylinder chamber 142 and the vacuum chamber 144 by the partition member 146. The piston for air cylinder 148 is slidably disposed with respect to the cylinder chamber 142 formed integrally with the lower rod 150 protruding downward from the lower end surface of the case 140 and the vacuum chamber through the partition member 146. It consists of an upper rod 152 extending to 144. The piston 148 is formed therein with a vacuum suction passage 154 extending from the front end or the bottom end surface of the bottom rod 150 to the rear end or the top end surface of the top rod 152. The lower end of the lower rod 150 of the piston 148 is connected to at least one suctioned 46 of pipe type with a through hole formed therein. The air filter 156 of the upper rod 150 of the piston 148 is fixedly mounted on the upper end surface. The air filter 156 is comprised with a porous block, for example. The piston 148 is constantly pushed upwards by the return spring 158.

The attachment device also includes a vacuum valve 160 and an air valve 162 attached to the outer shaft of the air cylinder case 140. The vacuum valve 160 is constituted by a switching valve suitable for being connected to a vacuum tube when suctioning the circuit element on the suction pin and connected to the discharge part when the circuit element is left from the suction pin, and the air valve 162 is a pressure circuit. And a switching valve for switching between and discharge circuits. The vacuum valve 160 is in communication with the vacuum chamber 144 through the suction hole 164 formed in the case 140, the air valve 162 is an air supply hole formed through the cylinder chamber 142 and the case 140 ( 166). In addition, as shown in FIG. 13, the case 140 has a discharge hole 168 communicating with the lower end of the cylinder chamber 142. The piston 148 has a magnet 170 highlighted therein, and the case 140 is fixed on its outer axis which serves to detect the position of the magnet 168 when the piston 148 is in the raised position. It has a magnetic sensor 172. In addition, the piston is formed in the upper end of the hole 174, the vacuum sensor is connected to the case 140. Reference numeral 176 denotes an annular cushion spring installed on the piston that is used to abut the lower wall of the cylinder chamber 142 to inhibit the downward movement at a given level when the piston is moved down.

In the attachment device 44 configured as described above, the air cylinder serves as a protruding single acting cylinder. In particular, when the air is supplied to the cylinder chamber 142 through the air supply hole 166 by opening the air valve 162, the piston 148 is lowered so that the suction pin with the piston 148 connected to the lower rod 150. (46) also goes down. The lowering of the piston is limited due to the encounter between the cushion spring 176 and the bottom wall of the cylinder chamber 142. In order to return the suction pin 46 to the lifted position, the cylinder chamber 142 may be led to the atmosphere with the air valve 162 in the exhaust state. This causes the piston 148 to return to the raised position by the force of the return spring 158.

In order to allow the chip-shaped circuit element to be sucked on the suction surface 46, the vacuum valve 16 is opened to open the suction hole 164, the vacuum chamber 144, the air filter 156, and the vacuum suction passage 154 of the piston 148. Through the suction pin 46 to make a vacuum state. In the suction operation, even if foreign matter such as dust enters into the vacuum suction device through the suction pin, the air filter 156 does not reach the vacuum valve 160, thereby ensuring an effective operation of the vacuum valve.

Therefore, the attachment device as described above is very simple in structure because it does not require a connection device such as a tube for connecting the air filter and the vacuum valve to the air cylinder, because the air filter is not disposed in the air cylinder. Because.

14 to 18 are used as the attachment device of the present invention as another example of the attachment device. In this example, a plurality of attachment devices of the single suction pin type are arranged vertically at equal intervals on the frame base 24 as shown in Figs. The attachment devices 44 are each constructed in the same manner.

As shown in FIG. 14, which is a cross section taken along the line XVI-XVI in FIG. 16, the attachment device 44 is supported on the frame base 24, and the support member 140 'connected upward is supported. It includes a rod 148 'supported so as to slide in a vertical direction with respect to the member 140', and a vacuum valve 160 and an electromagnetic plunger 180 fixedly disposed outside the support member 140 ', respectively. . The lower end of the vertical rod 148 ', for example, is capable of connecting a hollow cylindrical suction pin 46, in which a vacuum suction passage 154 is drilled toward the bottom to communicate with the suction pin 46. have. In addition, the vertical rod 148 'forms a groove 182 extending perpendicular to the side surface, and the support member 140' forms a through hole 166 '. The vacuum valve 160 is connected to the vacuum suction path 154 of the vertical rod 148 'through the suction path 166' and the groove 182. In addition, the vertical rod 148 'forms a recess 184 on its outer surface that is adapted to engage the rotation stop member 186 securely attached to the support member 140'.

In addition, the vertical rods 148 'form grooves 188 extending perpendicularly to the outer surface thereof, which grooves 188 and the locking rod 190 coated on the support member 140' and are coated with a coating. It is supposed to be combined. The locking rod 190 is connected to the electronic plunger 180 at its upper end and is also adapted to be properly coupled to the groove 188 by the expansion spring 192 when the plunger 180 is not operated, The vertical rods 148 'may be wound in the raised position in some cases. When the electronic plunger 180 acts to be retracted, the locking rod 190 is detached from the groove 188 to allow the vertical rod 148 'to move freely in the vertical direction. Spirally fixed to the upper surface of the support member 140 'is a hollow spring restraining member 194 that is closed at its upper end and open at its lower end. The spring 196 received in the siphon suppressing member 194 is forcibly embedded between the upper end of the spring suppressing member and the upper end of the vertical bar 148 ', so that the rod 148' Accordingly, the spring 196 may be uniformly downwardly knitted.

The vertical rod 148 'has horizontal pins 198 fixed on both sides of the portion between the groove 188 and the upper end of the rod, and the dual rod 148' acts to receive a driving force from the outside. Each of the pins 198 is coupled to a lower surface with an upper surface of each of the follower arms 200 firmly attached to the cam follower shaft 202, as shown in FIGS. 14 and 15. Act as. The cam follower shaft 202 extends long in the longitudinal direction of the shaft to be used as a support shaft member common to the plurality of attachment devices 44. 17 and 18, reference numeral 204 denotes a servo motor fixed on the frame base 178. The servo motor 204 has a rotational shaft abutting the roller 208 pivotally mounted to the distal end of the cam follower 210 securely attached to the cam follower shaft 202 with the cam 206 securely attached thereto. Have The cam 206 has a one-cycle reciprocating motion of the follower arm 200 from the raised position to the raised position via the lowered position, and the follower arm 200 at a low speed in the raised and lowered positions. And it is made of a shape to perform the highway movement in the intermediate position. In addition, the cam follower shaft 202 has an arm 212 that is firmly installed where the servo motor faces the cam follower 210 as a way in which the servo motor is interposed therebetween, as shown in FIG. have. The arm 212 is drawn in a direction to force the roller 208 into the cam 206 by a spring (not shown).

Then, the operation aspect of the above-mentioned attachment apparatus is demonstrated with reference to FIGS. 14-18.

The reciprocating rotational movement of the cam follower shaft 202 due to the rotation of the cam 206 causes the follower arm 200 to correspond to each attachment device 44 selected. In each attachment that is not selected, the electronic plunger 180 does not operate to keep the vertical rod 148 'fixed in the raised position, and therefore the suction pin 46 at the lower end of the rod 148'. ) Is stopped at the raised position. In each of the attachments selected, when the electronic plunger 180 operates the lock rod 190 to be in close contact with the groove 188, the vertical rod 148 'causes downward movement of the distal end of the follower arm 200. Start to move down. The movement speed of the rod 148 'reaches its maximum in the intermediate position and gradually decreases toward the lowered position. When the rod 148 'reaches the lowered position, the chipped circuitry 58 sucked into the lower end of the suction pin 46 is forced to be attached thereto relative to the printed circuit board 18. At this time, the impact applied to the circuit element 58 becomes minimum since the rod 148 'is stopped at a minimum or approximately at a downward speed. The rod 148 'then returns back to its raised position with the movement of the follower arm 200.

During positioning and rotation of the chip-shaped circuit element sucked on the suction pin 46, the cam 206 stops after half rotation and then performs the other half rotation. Thus, the vertical rod 148 'moves from the raised position to the lowered position and then stops only once to perform the positioning and rotation of the circuit elements, and then returns to the raised position.

As can be seen from the above, the attachment device shown in Figs. 14 to 18 is configured to operate the suction pin by a vertical rod driven as a cam rather than an air cylinder, thereby minimizing the acceleration applied to the chip-like circuitry. The ideal kinetic characteristic is that it can be exerted during the vertical movement of the suction pin. More specifically, the circuitry is moved at low speeds in the rising and falling positions and on the highway at the intermediate position, minimizing the acceleration applied to the circuitry and greatly increasing the overall vertical movement. The cam device is also operated with high reliability compared to the air cylinders used in conventional attachments, so that independent operations can be achieved in a way that overlaps each other. For example, it is possible to start the movement of the vertical rods before the X-Y table stage has come to a complete stop. Thus, it should be noted that the attachment device shown in FIGS. 14 to 18 allows the entire attachment operation to be executed at high speed and improved reliability.

The attachment device of the present invention may include a detection device for detecting a chip-shaped circuit element sucked by the suction pin. 19-22 illustrate such a detection device suitable for use in the attachment device of the present invention. The detection device shown in FIGS. 19 to 22 is suitable for use in a plurality of suction pin type attachment devices and is disposed for each of the suction pins. The attachment device, generally indicated at 44, has a head frame 220, a plurality of air cylinders 48 fixedly arranged at equal intervals on the head frame 220, each of which sucks chip-shaped circuit elements therein. And a plurality of suction pins 46 connected to the corresponding air cylinders 48 to support them. The head frame 220 has a support plate 222 on which all the suction pins 46 are fixed, to which the fixed support member 224 which slidably supports the " -type slide table 226, which acts as a movable support member. Has) “-Sliding slide 226 arranges all suction pins 46 to be movable perpendicular to fixed support member 224. Each slide 226 has a screw 228 screwed thereto, and a stop bolt 230 is installed to adjust the lowering position of the slide 226. The support plate 222 also has a spring pin 232 inserted therein that serves to support the compression coil spring 234 for moving the slide 226 downward, so that the slide 226 is the compression spring 234. It can be forced down by

As shown in FIGS. 22 to 25, the " -type slide table 226, which acts as a movable support member, includes one light port 236 and a light receiver, which are disposed laterally at the ends of the suction pins so as to face each other. The light detector of the sensor is provided. In addition, the slide 240 is attached to the slide 240 in a manner that surrounds the end of the suction pin 46 in a semicircular shape. The light emitter 236 and the light receiver 238 of the photosensor include a conveyor for converting the optical axis by 90 degrees by employing a mirror or prism. The light emitting portion 236 is suitable for converting the optical axis emitted from the optical fiber 242 by 90 degrees to emit a light beam traversing the extension of the suction pin 46, the light receiving portion 238 receives the light beam, 244 is adapted to divert the optical axis by 90 degrees to emit light. In the illustrated detection device, sleeve 240 is formed of slits 246 that act to narrow the light beam sufficiently, so that emission and reception of light beam b (FIG. 23) is carried out through slits 246. do. Each of the optical fibers 242 and 244 is connected to the photoelectric amplifier section 248 provided next to all the suction pins 46 of the attachment device so that the optical signal supplied from the light receiving section 238 is converted into an electrical signal and amplified. Note that there is no need to place the optical axis converter when enough space is provided around the suction pin 46 to bend the optical fibers 242 and 244 so that the end faces of the optical fibers face each other.

The head frame 220 is also a square shaft 250 supported around an axis 252, which is engaged with the '-shaped slides 226 and the adjacent working arms 254 are fixed to the lower ends of the screws 228. ) The square shaft 250 also has a lever 256 fixedly connected thereto as shown in FIG. 20, which is adjacent to the rod of the air cylinder 258 fixed next to the head frame 220. . The lever 256 is exerted by the extension spring 260 in the direction of forcible contact with the rod of the air cylinder 258. Thus, such a configuration should be noted that the square axis 250 and the actuating arms 254 cause the rod of the air cylinder 258 to vibrate all movement. In addition, a solenoid valve 262 is fixedly attached on the head frame 220 to control the operation of the air cylinder 258.

An operation method of the detection apparatus configured as described above will be described later with reference to FIGS. 19 to 25.

First, when the rod of the air cylinder 258 is actuated to retract, the lever 256 is in a state as indicated by solid lines in FIG. 19, and the screw 228 of each of the -type slideways 226 is Pushed by the actuating arm 254, the slide table 226 and the sleeve 240 are in the raised position; This is because the force of the extension spring 260 is stronger than the sum of the forces of the respective compression springs 234. The positional relationship between the sleeve 240 in the raised position and the suction pin 46 in the raised position obtained upon contraction of the rod of the air cylinder 48 is as shown in FIG.

In this example, the height of the light beam b that is emitted from the light emitting portion 236 through the slit 246 to pass through the range of the suction pin 46 is the chip circuit element sucked in the correct position on the suction pin 46. (58) is such a level that can block the light. This adjustment is made with screws 228. Therefore, whether the chip-shaped circuit element is sucked on the suction pin and is present is detected by the light beam b emitted from the sleeve 240 in its raised position. In particular, when the light beam b emitted from the light emitting unit 236 is blocked by the chip type circuit element 58 as shown in FIG. 22, the optical signal is not generated in the light receiving unit 238. Therefore, the fact that the suction pin sucked the circuit element is detected. However, the light beam b emitted from the sleeve in its raised position does not detect the posture of the circuit element sucked on the suction pin. This is done in the following way.

When the air cylinder 258 is operated to protrude the rod, the lever 256 moves clockwise in FIG. 20. This causes the rectangular axis 250 and the operating arm 254 to rotate clockwise to lower the final end of the operating arm 254. In this case, the slide gage 226 and the sleeve fixed there are moved to the lowered position. The positional relationship between the sleeve 240 which is in the lowered position and the suction pin 46 which is in the raised position when the rod of the air cylinder 258 is retracted is as shown in FIGS. 24 and 25 degrees. In this example, the height of the light beam b emitted from the light emitting portion 236 through the slit 246 to pass through the range of the suction pin 46 is on the suction pin 46 as shown in FIG. The chip-shaped circuit element 58 sucked in the correct posture cannot block the light beam b, and the chip-like circuit device sucked in the wrong posture on the suction pin as shown in FIG. 25 blocks the light beam. Tuned to This adjustment is made by stop bolt 230. Therefore, it can be seen that the posture of the chip-shaped circuit element sucked on the suction pin can be detected by the light ray b emitted when the sleeve 240 is in the lowered position. When the light beam b emitted from the light emitting unit 236 reaches the light receiving unit 238 as shown in FIG. 24, it is possible to detect that the circuit element is sucked in the correct posture by the optical signal generated by the light receiving unit. Will be. On the other hand, when the light is blocked, it is possible to detect that the circuit element is sucked to the wrong position.

In this way, it can be seen that the above-described detection device effectively detects whether the circuit element is sucked in the correct posture by the suction pin and whether the circuit element is sucked and exists on the suction pin. This detection device is also very convenient for use with a plurality of suction pin attachment devices in which suction pins are arranged at short intervals. This detection device has another advantage that the structure is simple despite being able to detect every suction pin. This detection device can easily change the detection position by adjusting the screw 228 and the stop bolt 230 as necessary even if the chip-like circuit elements sucked on each suction pin are different in shape, size, and the like. In addition, since the detection device detects the presence and the posture of the chip-like circuit element sucked by the suction pin with a single photosensitive device, space is saved. In addition, since the detector is configured to be arranged on the attachment device, the positional relationship between the photoreceptor and the suction pin can be kept stable without biasing, and they can be easily aligned with each other. In addition, according to such a structure, even when the attachment device is moved, the detection function can be performed regardless of the position of the attachment device.

The detection device detects the chip-shaped circuit elements sucked from the supply device as described above by the suction pins, detects the posture of the circuit elements moved to the position adjusting rotary device, and detects the presence and posture of the circuit elements after the position adjustment. In addition, the circuit element is detected just before being attached onto the printed circuit board.

As can be seen from the foregoing, the detection device shown in Figs. 19 to 25 is perpendicular to the attachment device with a plurality of suction pins to which the movable support member attached to the photosensitive portion of the photoreceptor can be moved vertically. The chip-like circuit element is configured to be movable so that the suction of the chip-shaped circuit element on the suction pin is detected at the rising position of the movable support member and the incorrect posture of the circuit element is detected at the lower position of the movable support member. Each suction pin can be detected by a single photoreceptor, and the structure of the detector can be very simple.

The present invention has been described with reference to the accompanying drawings as an example, but it will be apparent that the present invention can be implemented in various ways without departing from the spirit and scope of the following claims.

Claims (15)

In order to attach the chip-shaped circuit element to the printed circuit board, the suction of the chip-shaped circuit element is drawn out from the circuit element supply part by a plurality of suction pins installed in the attachment device installed on the XY table stand, and is pulled from the supply part and supported on the suction pin. Sending the circuit elements to the positioning rotary device, centering the chip-shaped circuit elements, turning them as necessary, and then successively attaching the chip-shaped circuit elements to a predetermined number of circuit element attachment positions on each printed circuit board. How you configured it. The method of claim 1, wherein the attachment device performs a plurality of reciprocating motions in the X direction and at least one reciprocating motion in the Y direction. 2. The apparatus of claim 1, wherein the plurality of suction pins are arranged in the X direction, and the moving distance in the X direction of the attachment device is smaller than the total length of the suction pins plus the length of the printed circuit board in the X direction. Neat way. For attaching chip-shaped circuit elements on a printed circuit board, an attachment device disposed on an XY table stand, a plurality of suction pins installed so as to move in a vertical direction with respect to the attachment device, and a chip-shaped circuit carried on each chip tape A supply device for exposing the element at a circuit movement position, a printed circuit board support device for supporting a printed circuit board to which the circuit element is attached, and a plurality of positions disposed between the supply device and the printed circuit board support device in correspondence with suction pins Device consisting of an adjustable rotator. 5. The device of claim 4, wherein the supply device is arranged in numbers corresponding to the plurality of suction pins, and the suction pins suck the chipped circuit elements from the supply device. At least one single suction pin attachment device for attaching a chip-shaped circuit element on a printed circuit board so as to move the suction pin in a vertical direction, and a chip type circuit element supported on at least one chip tape. A feeder for exposing at the circuit moving position, a printed circuit board support for supporting a printed circuit board to which the chip-shaped circuit element is to be attached, and a position adjustment disposed between the supply device and the printed circuit board support device in correspondence with the attachment Device composed of a rotating device. 7. The mounting apparatus of claim 6, wherein the attachment device comprises an air cylinder cylinder divided into a cylinder chamber and a vacuum chamber as a partition member, a lower rod projecting to the lower end of the cylinder cylinder, and an upper rod projecting into the vacuum chamber through the partition member. A piston installed so as to slide against the air, a vacuum suction passage formed into the piston from the lower end of the lower rod to which the suction pin is attached to the upper end of the upper rod, and the upper end of the upper rod to cover the upper end of the vacuum suction passage. One device with one air filter. The device of claim 6, wherein the attachment device comprises a vertical rod disposed to move in a vertical direction, a vacuum suction passage formed to communicate with a suction pin in the vertical rod, a support member for supporting the slide of the vertical rod, and a vertical rod. It is made to be a spring which pushes a follower member and a vertical rod downward so that it may couple to a rod and move by a cam apparatus. The device according to claim 6, further comprising a detection device for detecting a chip circuit element sucked by the suction pin. 10. The apparatus of claim 9, wherein the detection device comprises a movable support member arranged to be movable in a vertical direction with respect to the attachment device to which the suction pin is movable in a vertical direction, and a photosensitive member having a photosensitive unit disposed on the support member. A device in which a chip circuit element is sucked on the suction pin is detected when the movable support member is raised, and a device in which the chip circuit element is sucked in the wrong position is detected when the movable support member is lowered. The device according to claim 10, wherein the photosensitive portion of the photosensitive member is composed of a light emitting portion and a light receiving portion, and arranged to face each other on both sides of the tip of the suction pin. It is for use in the device for attaching chip-like circuit elements on a printed circuit board. It is a suction pin for sucking chip-like circuit elements, an air cylinder cylinder divided into a cylinder chamber and a vacuum chamber by a partition wall, and protrudes to the bottom of the cylinder cylinder. A vacuum suction passage formed in the piston from the lower end of the lower end of the lower rod to the upper end of the upper end of the lower end of the lower rod and the partition member. And an air filter disposed at an upper end of the upper rod to cover an upper end of the vacuum suction passage. It is for use in the device for attaching chip type circuit elements on a printed circuit board. It is a suction pin that sucks the chip type circuit elements, a vertical bar arranged to move in the vertical direction, and a vacuum formed through the suction pins in the vertical bar. An attachment device comprising a suction passage, a support member for supporting the vertical rod to slide, a follower member coupled to the vertical rod to move by a cam device, and a spring for pushing the vertical rod downward. For use in a device for attaching a chip-shaped circuit element on a printed circuit board, a movable support member arranged to move vertically with respect to the attachment device attached to the suction pin to move vertically, and the photosensitive portion movable support It consists of a photosensitive device attached to the member so that the suction of the chip type circuit element on the suction pin is detected when the movable support member is raised, and the suction of the chip type circuit element on the suction pin is caused to lower the movable support member. Chip-type circuit element detection device to be detected when. 15. The detection device according to claim 14, wherein the photosensitive portion of the photosensitive member includes a light emitting portion and a light receiving portion, and is disposed to face each other on both sides of the tip of the suction pin.

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