JP3296221B2 - Electronic component mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus used for mounting a chip-type electronic component for surface mounting used on various electronic circuits on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, this type of electronic component mounting apparatus is roughly classified into a general-purpose mounting apparatus using a robot and a high-speed mounting apparatus using a rotary mounting head. .

A general-purpose mounting device of a robot type is disclosed in
-85492 is known,
As shown in FIG. 33, the electronic component supply unit 70 on which the cassette 77 for supplying the taped electronic components one by one is mounted, and the board holding unit 7 for holding the printed board 75
9, a mounting head 72 to which a suction nozzle 71 for sucking an electronic component is rotatably slidably mounted to mount an electronic component on a printed circuit board 75; a first drive shaft 73 to which the mounting head 72 is mounted; The second drive shaft 7 that drives the first drive shaft 73 in a direction orthogonal to the first drive shaft 73
4, the mounting head 72 moves in the X and Y directions to suck and mount the electronic component.

A rotary type high-speed mounting device disclosed in Japanese Patent Application Laid-Open No. 7-202491 is known. In FIG. 34, a suction nozzle 82 is arranged on a circumference as shown in FIG. The rotary head 81 intermittently moves, the component supply unit 80 on the XY table 83 movable to a position where the suction nozzle 82 stops, the electronic component recognition unit 86, and the printed circuit board 85 for mounting electronic components. XY table 83 that can be held and moved in two orthogonal directions
The rotary head 81 is sequentially rotated to suck, recognize, and mount the electronic component.

[0005]

However, in the above-mentioned conventional configuration, while a small, inexpensive and high-speed electronic component mounting device is required, a general-purpose mounting device of a robot type has a simple configuration and a small size. Since the electronic components are sucked one by one and then the electronic components are mounted on the printed circuit board 75, the speed cannot be increased because of the configuration of the rotary type high-speed mounting device. However, there is a problem that the equipment is large, and the equipment price is high, but the realization of this intermediate type electronic component mounting apparatus has been desired.

SUMMARY OF THE INVENTION An object of the present invention is to solve such a conventional problem and to provide an electronic component mounting apparatus which is compact and can be mounted at high speed.

[0007]

[Means for Solving the Problems] In order to solve the above-mentioned problems
The present invention has a positioning portion for positioning an electronic component.
And transport the electronic components to this positioning part
A cassette that supplies electronic components in sequence from the
Hold the printed circuit board on which the child parts are mounted and only in the Y direction
A sliding table part, and X
The cassettes are arranged linearly in
A first supply unit and a second supply unit
A supply unit, the first supply unit, the table unit, and the second supply unit.
A support member extending in the X direction above the feeding section;
The electronic components supplied from the supply unit or the second supply unit
Take it out and put it on the printed circuit board held on the table
The suction nozzle to be mounted and whether this suction nozzle
At a given pitch in the X direction
The first supply unit supported by the lower end of the support member
The first mounting head that slides only between the tables in the X direction
And the suction nozzle can be moved up and down in the X direction.
Are mounted at a predetermined pitch on the
The second supply unit and the table supported by the lower end of the member
A second mounting head portion that slides only in the X direction between the portions,
And a control unit for controlling these components.
The head section and the second mounting head section are sandwiched by the table section.
And are arranged on the same line in the X direction.
The suction nozzle of the receiving head section is moved from the first supply section to the electronic section.
Suction of the second mounting head while the product is being taken out
Nozzles charge the printed circuit board held by the table.
Operate to mount the child component, and conversely, the second
The suction nozzle of the mounting head unit is configured to supply the electron from the second supply unit.
While taking out parts, the suction of the first mounting head
A receiving nozzle is attached to the printed circuit board held by the table.
It is configured to operate to mount electronic components.
You.

[0008] With the above configuration, the structure is
It is simple and the whole equipment and each part can be made small.
Also, when one of the two mounting heads is performing suction operation
The other performs the mounting operation, and the suction operation and the mounting operation are performed.
Simultaneous operation eliminates unnecessary movement and reduces lost time
The total mounting tact can be improved with less
You.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention
Has a positioning part for positioning electronic components,
Electronic components are transported to this positioning part and
And a cassette that supplies electronic components in sequence.
Sliding only in the Y direction while holding the printed circuit board to be mounted
A table section and the table section interposed in the X direction.
The cassettes are arranged in a line and each cassette is moved in the X direction.
Supply unit and second supply unit arranged adjacent to each other
And the first supply unit, the table unit and the second supply unit
A support member extending in the X direction above, and the first supply
Take out electronic components supplied from the section or the second supply section
To the printed circuit board held by the table section.
Suction nozzle and the suction nozzle
Are mounted at a predetermined pitch in the
The first supply unit and the tape supported by the lower end of the holding member;
Mounting head that slides only in the X direction between
And the suction nozzle is movable up and down and in the X direction.
A plurality of the support members are attached at a fixed pitch.
Supported by the lower end of the second supply section and the table section.
A second mounting head that slides only in the X direction between
And a control unit for controlling the first mounting head.
Section and the second mounting head section with the table section interposed
Arranged on the same line in the X direction, and
The suction nozzle of the pad section picks up electronic components from the first supply section.
When taking out, the suction noise of the second mounting head
Electronic part on the printed circuit board held by the table
Operative to mount the article, and conversely, the second mounting
The suction nozzle of the head unit is configured to supply electronic components from the second supply unit.
When taking out, the suction nozzle of the first mounting head
The whirl is electronically printed on the printed circuit board held by the table.
It is configured to operate to mount components.
With the above configuration, the structure is simple and
The body and each part can be made small, and two wearing
While one of the heads is performing suction operation, the other is
To perform the suction operation and the mounting operation at the same time.
In order to reduce wasted time and lost time,
The mounting tact time can be improved.

[0010] The invention described in claim 2 of the present invention is defined by the claims.
In the invention described in 1, the first mounting head portion has an X-direction
Pitch of suction nozzles attached to multiple
Of cassettes arranged adjacent to each other in the X direction
The installation pitch must be the same, and
Arrangement of multiple suction nozzles installed in the X direction
A plurality of units are arranged adjacent to the pitch and the second supply unit in the X direction.
The arrangement pitch of the cassettes is the same size,
Because many electronic components can be picked up at the same time,
This shortens the time for electronic component adsorption and speeds up the operation of equipment.
can do.

[0011] The invention described in claim 3 of the present invention is the invention claimed in claim 3.
In the invention described in 1 or 2, it is extended in the X direction.
The cross-sectional shape of the support member in the Y direction is H-shaped.
The lower end supports the first mounting head and the second mounting head.
While holding the first shape on the lower surface side of the substantially central portion of the H-shape.
Slide the mounting head or the second mounting head in the X direction
With a drive mechanism for
The member is less likely to twist, and as a result,
At the tip of the suction nozzle of each mounting head supported by
Is less likely to occur, allowing accurate mounting
You.

The invention described in claim 4 of the present invention is the invention
In the invention described in any one of 1 to 3, the first
Suction nose on the mounting head and the second mounting head
One lifting member for raising and lowering the nozzle is provided, and each suction nozzle is
When attached to the shaft with the receiver fixed at the upper end
In both cases, this receiver is urged downward to bring the
A spring to be contacted is provided for each shaft and suction nozzle.
It is designed to be installed in each mounting head.
Simultaneously move up and down the attached suction nozzles to suction
At the same time when mounting or mounting, pick up many electronic components
Or you can put it on, shorten this time
The operation of the equipment can be sped up.

[0013] The invention described in claim 5 of the present invention is the invention claimed in claim 5.
In the invention described in Item 4, the shaft is fixed to the upper end of each shaft.
By engaging the lower end of the receiver,
The switching mechanism for blocking the shaft and the suction nozzle
It is a structure that is provided for each
The multiple suction nozzles attached to each mounting head
Select any number of suction nozzles in the
It can be moved up and down sequentially or simultaneously at a certain timing.
Wear.

[0014] The invention described in claim 6 of the present invention is the invention claimed in claim 6.
In the invention described in 4 or 5, the first mounting head portion
And the second mounting head with sliders
Slide up and down by attaching a member to this slider
And can be rotated forward and backward on each of the mounting heads.
Crank with one motor and one pin
Are rotatably and eccentrically mounted on each of the motors.
And the pin is rotatably attached to the elevating member.
It is designed to be attached to each mounting head.
When multiple suction nozzles are attached or mounted
The height of the bottom dead center when ascending and descending to
By changing the thickness depending on the thickness of the parts,
The damage to it can be reduced.

[0015] The invention described in claim 7 of the present invention is the invention claimed in claim 7.
In the invention described in Item 6, the disk is replaced with a motor instead of the crank.
Attached to the output shaft of the motor.
A pin at an eccentric position, and turn this pin to the plate.
Attach to the end of this plate as well as rollable
The pin that is rotatably engaged with the member is fixed.
The plurality of mounting heads attached to each mounting head
Bottom dead center when the suction nozzle moves up and down during suction or mounting
The height depends on the height of the suction nozzle and the thickness of the electronic components.
To reduce damage to electronic components
can do.

[0016] The invention described in claim 8 of the present invention is the invention claimed in claim 8.
The invention according to any one of 1 to 7, wherein the first
The suction head is attached to each of the mounting head and the second mounting head.
One rotation drive motor for rotating the chile and this rotation
When one rack is slid by the drive motor,
In addition, each suction nozzle is driven by meshing with the rack.
It is configured to attach the gear to the fixed shaft
There are multiple suction heads attached to each mounting head
By rotating the nozzle, the electrons adsorbed by the suction nozzle
It is possible to correct the displacement of parts and perform accurate mounting.
Wear.

According to the ninth aspect of the present invention,
The invention according to any one of 1 to 8, wherein the adsorption
Checks for the presence and state of electronic components
Outgoing sensor in the first supply or in the second supply
It is installed in the center, and picks up parts from inspection to suction
Recovery operation can be performed in the optimal time
With this, the total mounting tact can be improved.
And one of the two mounting heads
When the other is performing the mounting operation, the supply unit and the table
Even if the distance between the two mounting heads is minimized,
The size of the entire equipment can be reduced without interference
Wear.

[0018]

[0019]

FIG. 1 shows an embodiment of the present invention.
This will be described with reference to FIGS. (Embodiment 1) FIG. 1 is a perspective view showing an overall configuration of an electronic component mounting apparatus according to a first embodiment of the present invention, and FIG.
3 (a) and 3 (b) are front and side views of a main part showing a driving unit of the mounting head, FIG. 4 is a perspective view showing the mounting head, and FIG. FIG.

In FIGS. 1 and 2, reference numerals 2 and 3 denote a casing 1 in which a plurality of cassettes 4 for sequentially supplying electronic components are arranged adjacent to each other.
The first and second supply units 2 and 3 are disposed linearly at predetermined intervals, respectively. The table unit 6 is disposed at the above-mentioned predetermined interval, which is an intermediate portion between the supply units 2 and 3, and the table unit 6 holds the printed circuit board 19 on which the electronic components are mounted, and supplies the electronic components in the supply direction (Y direction). And the guide rail 7 is slidable through the ball screw 5 by the rotation of the drive motor 14 in the same direction.

Reference numerals 10 and 11 denote first and second mounting heads respectively holding a plurality of suction nozzles 18 for sucking and holding the electronic components so as to be movable up and down. Are independently slidable in a direction (X direction) orthogonal to the supply direction of the electronic components via a guide rail 8 on the lower surface of the upper frame 9 coupled to the housing 1.

In FIG. 3, reference numeral 9 denotes an upper frame. The upper frame 9 has an H-shaped cross section. Two rails 115 are fixed to a lower portion of the upper frame 9, and the upper frame 9 is slidably attached to the rail 115. 2 pairs of bearings 1
16 are attached to the four corners of the plate 117 so that the first mounting head unit 10 coupled to the plate 117 can slide in the longitudinal direction of the rail 115.

On the other hand, a motor 110 fixed by a bracket 119 is attached to the upper frame 9, and a coupling 111 is attached to an output shaft of the motor 110.
A ball screw 113 whose both ends are fixed by a bracket 112 via a bracket is attached.
A ball screw nut 118 for moving the rotation of a ball screw 113 in the longitudinal direction of the rail 115 is screwed into the ball screw 13, and the ball screw nut 118 is mounted on the upper surface of the plate 117 via a bracket 114. .

With this structure, the first mounting head 10
Is stable because it is supported by the two pairs of bearings 116 and between the bearings 116, and twisting does not work on the upper frame 9; There is nothing.

1 and 2, reference numeral 15 denotes a loader for transferring the printed circuit board 19 to the table 6, reference numeral 16 denotes an unloader for transferring the printed circuit board 19 from the table 6, and reference numerals 12 and 13 denote first and second, respectively. Second supply units 2 and 3
And a second line for detecting the height of the electronic component held by the suction nozzles 18 of the first and second mounting head units 10 and 11 respectively. The first and second line sensors 1
The grooves 2 and 13 are provided with grooves through which the suction nozzle 18 holding the electronic components by suction can pass in the X direction.

Reference numeral 38 denotes a control unit for controlling the entire mounting. FIG. 4 is a partial cross-sectional view of the first and second mounting head units 10 and 11 (only one is shown in FIG. 4).
FIG. 5 shows the mounting head.

As shown in FIGS. 4 and 5, a plurality of suction nozzles 18 are attached to the inside of a shaft 17 so as to be vertically movable, and the shaft 17 is attached to a bearing block 37 so as to be vertically movable and rotatable. ing. Shaft 17
A positioning holder 25 is attached to the upper end of
The positioning holder 25 is provided with a groove, and this groove engages with a positioning pin 27 fixed to a plate 94 attached to the front surface of the bearing block 37 when the shaft 17 reaches the bottom dead center. .

A rotation drive motor 20 and a vertical slide drive motor 28 are mounted on the bearing block 37, and the drive gear 21 mounted on the rotation drive motor 20 is slidably held by a rack receiver 36. Rack 2
3 and the rack 23 is mounted so as to mesh with the driven gear 22 fixed to the shaft 17.

A crank 29 is eccentrically and rotatably mounted on the vertical slide drive motor 28, and a plate 30 is slidably mounted in a vertical direction by a pin 24 mounted on one side of the crank 29 and a slider 31. A first claw 32 is attached to the plate 30. The first claw 32 is attached to the electromagnet 33 so as to be vertically movable. 34 is attached so as to abut on the lower surface. In the above configuration, the lifting member
Are the plate 30 and the first claw 32 and the
It is constituted by a second claw 34.

A receiver 98 fixed to the upper end of the shaft 17 is rotatably abutted on the upper surface of the second claw 34, and a receiver 98 is provided between the receiver 98 and the block 93. A spring 26 for urging the shaft 17 downward via the shaft 26 is attached.

A switch 90 and a power supply 91 are attached to the electromagnet 33 via a wiring 92 so that the electromagnet 33 can be controlled.

FIGS. 6, 7 and 8 show the configuration of a plurality of cassettes 4 arranged adjacent to the first and second supply units 2 and 3, respectively. Is the Japanese
As shown in FIG. 6, a case 41 includes a lid 44 for accommodating an electronic component 50, a first space 45, and a small amount of an electronic component 50 in a second space 4 as shown in FIG.
There is provided a weir 47 for feeding to 6.

In the second space 46, an elevating block 49 which moves up and down is inserted into the lower part and is connected thereto, and a chute groove 43 for aligning and lowering and transporting the electronic components 50 is provided. The front surface of the case 41 is covered with an acrylic plate 42 provided with a countermeasure against static electricity so that the electronic component 50 can be seen from this surface. A guide pin 52 for guiding and a lever 53 for opening and closing the shutter 51 are provided.

FIG. 7 is a perspective view of a main part for explaining the positioning part of the cassette 4 shown in FIG. 6, and FIG. 8 is a plan view of the main part. It is located at the exit.

6 and 7, a lever 53 is provided at the tip of the chute groove 43 to open and close the shutter 51 and to move the stopper 63 back and forth. Also, the chute groove 43
A first vacuum groove 59 and a first vacuum hole 58 for positioning the electronic component 50 are provided on the front end and a side surface near the front end, and the electronic component 50 in the chute groove 43 is located slightly before the front end.
A second vacuum groove 62 and a second vacuum hole 61 for facilitating feeding to the outlet side and separating the first electronic component 50 from the rear electronic component 50 are provided.

The operation of the thus-configured electronic component mounting apparatus of the present invention will be described below.

First, the operation of the mounting head unit will be described with reference to FIG.
This will be described with reference to FIGS. 10 (a) and 10 (b) and FIGS. 10 (a) and 10 (b).

As shown in FIG. 9A, the first mounting head unit 10 moves to the position specified by the program of the first supply unit 2 and sucks the electronic component 50.

Next, as shown in FIG. 9B, the first mounting head unit 10 moves in the direction of the first line sensor 12, and detects the presence / absence of the sucked electronic component 50, the standing suction, and the like. At the same time, the height of the electronic component 50 is stored for each suction nozzle 18. At this time, the second mounting head unit 11 is performing the mounting operation on the printed circuit board 19 on the table unit 6 with the electronic component 50 already sucked by the second supply unit 3.

Next, as shown in FIG. 10A, the first mounting head 10 is moved to the mounting position of the printed circuit board 19 on the table 6 at the same time when the mounting of the second mounting head 11 is completed. Then, the sucked electronic component 50 is transferred to the printed circuit board 19.
Attach to At this time, the second mounting head unit 11 moves to the position instructed by the program of the second supply unit 3 to suck the electronic component 50, and after the suction is completed, the second mounting head unit 11 moves to the second position as shown in FIG. Moving to the second line sensor 13, the presence / absence of the sucked electronic component 50, standing suction, and the like are detected, and the height of the electronic component 50 is stored for each suction nozzle 18.

By repeating this operation, the electronic components 50 are sequentially mounted on the printed circuit board 19.

Next, the suction and mounting operations will be described.
First, the positioning of the electronic component 50 in the cassette 4 will be described with reference to FIGS. 6, 7, and 8. FIG.

The electronic component 50 flowing through the chute groove 43
Is stopped by the stopper 63 at the tip of the cassette. The second vacuum hole 61 and the second vacuum groove 62 are also at a negative pressure, and the electronic component 50 is mounted on the positioning side wall 6 of the second vacuum groove 62.
5, the stopper 63 moves by the movement of the lever 53 in the same direction as the flow direction of the electronic component 50 by the movement amount indicated by a in the figure, and the electronic component 50 at the tip end portion is moved.
Becomes free. At this time, the first vacuum hole 58 and the first vacuum groove 59 are under negative pressure, and the electronic component 50 is drawn to the first vacuum hole 58 and positioned by the positioning end 64 and the positioning side wall 65.

Subsequently, the suction operation of the electronic component 50 positioned as described above will be described with reference to FIGS. 4 and 5, and FIGS. 11A and 11B and FIGS. I do.

As shown in FIG. 11A, when the switch 90 is off, the second claw 34 is not attracted to the electromagnet 33 and is on the upper surface of the first claw 32.

The rotation of the vertical slide drive motor 28 lowers the pin 24 attached to the crank 29, whereby the plate 30 and the first claw 32 are lowered along the slider 31 and attached to the upper end of the shaft 17. The stopper 98 is provided between the spring 2 and the block 93.
6 through the second claw 34 by the urging force of the first claw 3
It descends in conjunction with the decline of 2. At this time, the positioned positioning pin 27 enters the groove of the positioning holder 25, and the suction nozzle 18 is positioned in the rotation direction.

When the suction nozzle 18 descends, the rotation of the vertical slide drive motor 28 stops at a height at which the suction nozzle 18 comes into contact with the electronic component 50 positioned by the positioning portion of the cassette 4, and a vacuum is applied by a solenoid valve (not shown). And the electronic component 50 is sucked, and the vertical slide driving motor 2 is
8 rotates in the opposite direction to the above, and the suction nozzle 18 rises and stops at the top dead center.

When the switch 90 is turned on as shown in FIG. 12, the electromagnet 33 is excited by the power supply 91, and the second claw 34 is attracted to the electromagnet 33. This allows
Even if the first claw 32 is lowered by the rotation of the vertical slide drive motor 28, the second claw 34, the receiver 98, the shaft 17, and the suction nozzle 18 do not move down, and the electronic component 50 of the cassette 4 is sucked. It is not configured.

Next, the operation of sucking the electronic component 50 sucked by the suction nozzle 18 will be described.

First, as shown in FIG. 11 (b), the pin 24 attached to the crank 29 is lowered by the rotation of the vertical slide drive motor 28, whereby the slider 31 is moved.
The plate 30 and the first claw 32 move down along, and the receiver 98 attached to the upper end of the shaft 17 pushes the second claw 34 by the urging force of the spring 26 provided between the plate 98 and the block 93. The first claw 32 descends in conjunction with the downward movement of the first claw 32. At this time, the positioned positioning pin 27 enters the groove of the positioning holder 25, and the suction nozzle 18 is positioned in the rotation direction.

When the suction nozzle 18 is lowered, the rotation of the vertical slide drive motor 28 is stopped at a height at which the electronic component 50 contacts the printed circuit board 19, and the pressure is switched from vacuum to positive pressure by a solenoid valve (not shown). Then, the electronic component 50 is mounted on the printed circuit board 19, and the vertical slide drive motor 28 rotates again in the opposite direction to the above, and the suction nozzle 18 rises and stops at the top dead center.

When the switch 90 is on as shown in FIG. 12, the electromagnet 33 is excited by the power supply 91 and is attracted to the second claw 34. As a result, even if the first claw 32 is lowered by the rotation of the vertical slide drive motor 28, the second claw 34, the receiver 98, the shaft 17, and the suction nozzle 18 are not lowered, and the electronic component 50 is mounted on the printed circuit board. Do not attach to 19.

When the electronic component 50 is mounted on the printed circuit board 19, the suction nozzle is mounted on the printed circuit board 19 while moving from the component detection line sensor 12 to the printed circuit board 19 in order to mount the electronic component 50 in the predetermined mounting direction. The rotation 18 is transmitted to the drive gear 21 of the rotation drive motor 20, the rack 23 slidably held by the rack receiver 36 slides, and the driven gear 22 attached to the shaft 17 is rotated. The suction nozzle 18 attached to the end of the electronic component 17 and the sucked electronic component 50 are configured to rotate.

FIGS. 13 (a), 13 (b) and 14 show the first mounting head section 10 in the order of the suction operation. This operation is the same for the second mounting head section 11 as well. The description will be omitted, and only the first mounting head unit 10 will be described.

First, as shown in FIG. 13A, the first mounting head unit 10 moves to a predetermined position of the first supply unit 2 to suck the electronic component 50.

As shown in FIG. 13B, the electronic component 50
All the switches 90 of the ten suction nozzles 18 for sucking are turned off and the holding is released by the electromagnet 33,
As the first claw 32 is lowered, the ten suction nozzles 18 are lowered by the urging force of the spring 26, and the mounting pitch of each suction nozzle 18 and the mounting pitch of each cassette 4 are the same. The ten electronic components 50 positioned at the tips of the four can be simultaneously sucked by the respective suction nozzles 18.

Next, as shown in FIG.
Rises and the ten suction nozzles 18 rise and stop at the top dead center. Then, the first mounting head unit 10 sends the signal to the first line sensor 12 to inspect the suction state of the electronic component 50. Move to the next operation.

As described above, the first mounting head unit 10 sucks the electronic component 50 supplied from the first supply unit 2 and mounts the electronic component 50 on the printed circuit board 19. The arrangement pitch of the plurality of held suction nozzles 18 and the plurality of cassettes 4 arranged in the first supply unit 2
Are set to the same size, and the first mounting head unit 10 and the first supply unit 2 have a paired relationship.

The second mounting head section 11 and the second supply section 3 also have a paired relationship in the same manner as described above.
The first mounting head unit 10 is connected to the first supply unit 2 by the electronic component 5.
When the first mounting head unit 10 sucks the electronic component 50, the second mounting head unit 11 operates to mount the sucked electronic component 50 on the printed circuit board 19. When 50 is mounted on the printed circuit board 19,
The second mounting head 11 is connected to the second supply unit 3 by the electronic component 5.
0 is adsorbed, and component mounting can be performed at high speed without unnecessary operation.

As described above, by simultaneously moving the plurality of suction nozzles 18 up and down, a plurality of electronic components 50 can be simultaneously suctioned and mounted.

(Embodiment 2) Hereinafter, a second embodiment of the present invention will be described with reference to FIGS. 15 to 17 and FIG. The operation of the suction head is the same as that of the first embodiment, and the second mounting head is the same.

FIGS. 15 to 17 show the first mounting head unit 1.
0 are shown in the order of the suction operation.
As shown in FIG. 1, the first mounting head 10 is
The first supply unit 2 is moved to a predetermined position in order to adsorb 0.

Subsequently, as shown in FIG. 15B, only the suction nozzle 18 operated by the electromagnet 33 is selected by turning off only the switch 90 of the suction nozzle 18 to which the electronic component 50 is to be sucked. One claw 32
Is lowered, only the selected suction nozzle 18 is lowered by the urging force of the spring 26 and sucks the electronic component 50 positioned at the leading end of the cassette 4.

Next, as shown in FIG. 16A, the first claw 32 rises, and the suction nozzle 18 that has sucked the electronic component 50 rises and stops at the top dead center.

Next, as shown in FIG. 16B, the switch 90 of the suction nozzle 18 that has already sucked the electronic component 50 is turned on, and the switch 90 of the suction nozzle 18 that has not yet sucked the electronic component 50 is turned off. The suction nozzle 18 whose switch 90 is turned off is the first claw 32.
After the electronic component 50 is sucked by the lowering of the electronic component 50, the electronic component 50 is again raised to the top dead center as shown in FIG.

By repeating this operation, the electronic components 50 are sequentially sucked, and after all the ten suction nozzles 18 have sucked the electronic components 50, the first mounting head unit 10 inspects the sucked state of the electronic components 50. Line sensor 12
To move to the next operation.

As described above, by sequentially moving up and down the plurality of suction nozzles 18, it is possible to suck and mount an arbitrary electronic component 50 with an arbitrary suction nozzle 18.

(Embodiment 3) Hereinafter, a third embodiment of the present invention will be described with reference to FIGS. 18 to 20 and FIG. The operation of the suction head is the same as that of the first embodiment, and the second mounting head is the same.

FIGS. 18 to 20 show the first mounting head unit 1.
0 is shown in the order of the suction operation.
As shown in FIG. 1, the first mounting head 10 is
The first supply unit 2 is moved to a predetermined position in order to adsorb 0.

Subsequently, as shown in FIG. 18B, only the suction nozzle 18 operated by the electromagnet 33 is selected by turning off only the switch 90 of the suction nozzle 18 to which the electronic component 50 is to be sucked. One claw 32
Is lowered, only the selected suction nozzle 18 is lowered by the urging force of the spring 26 and sucks the electronic component 50 positioned at the leading end of the cassette 4.

Next, as shown in FIG. 19A, the first claw 32 rises, and the suction nozzle 18 that has sucked the electronic component 50 rises and stops at the top dead center.

Next, as shown in FIG. 19B, the mounting head unit 10 moves to the position of the electronic component 50 to be mounted next, and
The switch 90 of the suction nozzle 18 that has already sucked the electronic component 50 is turned on, and the switch 90 of the suction nozzle 18 that has already sucked the electronic component 50 is turned off.
As shown in FIG. 20B, the suction nozzle 18 in which the switch 90 is turned off descends with the lowering of the first claw 32 to suck the electronic component 50, and then returns to the top dead center again as shown in FIG. To rise.

The electronic components 50 are sequentially sucked by repeating the operations of the sucking and moving, and after the required number of electronic components 50 have been suctioned, the first mounting head unit 10 checks the suction state of the electronic components 50. It moves to the first line sensor 12 and shifts to the next operation.

As described above, by raising and lowering only the suction nozzle 18 arbitrarily selected from the plurality of suction nozzles 18, it is possible to efficiently suck and mount an arbitrary electronic component 50.

(Embodiment 4) Hereinafter, a fourth embodiment of the present invention will be described with reference to FIGS.

As shown in FIGS. 21 and 22, a plurality of suction nozzles 18 are vertically movably mounted inside a shaft 17, and the shaft 17 is vertically and rotatably mounted on a bearing block 37. . Frame 10
9 is provided with a rotation drive motor 20 and a vertical slide drive motor 28.
Is engaged with a rack 23 slidably held by a rack receiver 36 mounted on a bearing block 37, and the rack 23 is fixed to a shaft 17 having a suction nozzle 18 mounted on the tip. It is mounted so as to mesh with the driven gear 22.

A crank 29 is eccentrically and rotatably mounted on the vertical slide driving motor 28, and a plate 30 slidably mounted in a vertical direction by a pin 24 mounted on one side of the crank 29 and a slider 31. A first claw 32 is attached to the plate 30, and a second claw 34 is attached to the electromagnet 33 so as to be vertically movable. It is attached so that it may contact the lower surface of.

A receiver 98 fixed to the upper end of the shaft 17 is rotatably mounted on the upper surface of the second claw 34 as described with reference to FIG. A spring 26 for urging the shaft 17 downward through a receiver 98 is attached to the shaft 93.

At the center of the supply units 2 and 3, a component recognition unit 121 for reading the attitude of the electronic component sucked by the suction nozzle 18 and calculating the shift amount of the electronic component 50 is provided.
122 are provided respectively.

Next, the operation of the thus-configured electronic component mounting apparatus according to the present embodiment will be described.

At the origin position of the rotary drive motor 20, the pin 24 attached to the crank 29 is lowered by the rotation of the vertical slide drive motor 28, whereby the plate 30 and the first claw 3 are moved along the slider 31.
2 is lowered, and the receiver 98 attached to the upper end of the shaft 17 is interlocked with the lowering of the first claw 32 via the second claw 34 by the urging force of the spring 26 arranged between the block 98 and the block 98. Then, the electronic component 50 is sucked.

Next, the posture of the electronic component 50 picked up by the component recognizing units 121 and 122 is read, the amount of displacement of the electronic component 50 is calculated and stored in the control unit 38 (not shown). The mounting head unit 10 moves to the mounting position corrected according to the deviation amount in the direction and the Y direction.

At this time, regarding the θ rotation direction, the control unit 38 controls the rotation driving motor 20 to rotate the suction nozzle 18 by an angle obtained by adding a deviation amount in the θ direction to a predetermined rotation angle. The rotation is performed in response to the instruction, so that the component mounting can be performed with high accuracy.

(Embodiment 5) Hereinafter, a fifth embodiment of the present invention will be described with reference to FIGS.
This will be described with reference to (a) and (b).

As shown in FIG. 23, a vertical slide driving motor 28 is mounted on a frame 109 via a bracket 119.
The output shaft 8 is provided with a shaft 102 to which a disk 103 is fixed at the tip via a coupling 101.
One end of a pin 104 is fixed to the disc 103 eccentrically to the shaft 102, the other end of the pin 104 is rotatably engaged with a plate 105, and the end of the plate 105
It has a structure in which a pin 108 rotatably engaged with the plate 30 is fixed.

A rail 106 fixed to a frame 109 and two bearings 107 slidably mounted in the vertical direction are fixed to the plate 30. Further, the plate 30 is slidable to a bearing block 37. A holder 98 is fixed to the upper part of the shaft 17 attached to the plate 30, and is in contact with the first claw 32 attached to the plate 30 via the second claw 34 by the bias of the spring 26. The shaft 17 is moved up and down by the up and down movement.

Next, the vertical movement of the suction nozzle 18 will be described with reference to FIGS.

First, as shown in FIGS. 23A and 23B, a state in which the suction nozzle 18 is raised with the pin 104 positioned above the shaft 102 is shown.
The vertical slide drive motor 2 is driven by a command (not shown).
8 rotates, and the rotation power is transmitted to the disk 103 attached to the tip of the shaft 102 via the coupling 101, and the pin 104 rotates.

With this rotation, the plate 105 is pushed down, and the pins 108 attached to the plate 105 push down the plate 30 along the rails 106. The downward movement of the plate 30 causes the first claw 32 to move downward. And the second claw 34 descends, and the spring 26
The shaft 17 is lowered by the urging force of the above to approach the printed circuit board 19 disposed below.

FIGS. 24A and 24B show a state in which the suction nozzle 18 has reached the lowest point.
As shown in FIGS. 25A and 25B, the suction nozzle 1 is controlled by controlling the rotation angle of the vertical slide drive motor.
The height of the electronic component 50 can be controlled, and the difference in height of the electronic component 50 and the variation in the height of the suction nozzle 18 at the time of suction and mounting can be controlled, and the impact on the electronic component 50 can be reduced. Can be.

Embodiment 6 Hereinafter, a sixth embodiment of the present invention will be described with reference to FIGS. 26 (a) and 26 (b).

FIG. 26A shows the first printed circuit board 95.
And the second printed circuit board 96 are one printed circuit board, and the distance A between the same electronic component 50 mounted on the first printed circuit board 95 and the second printed circuit board 96 is the suction nozzle 18. 3 shows a printed circuit board having a positive multiple of the mounting pitch.

FIG. 26 (b) shows a first printed circuit board 95, a second printed circuit board 96 and third,..., Fourth,.
Thus, a plurality of printed circuit boards are one printed circuit board, and the interval B between the same electronic components 50 mounted on each printed circuit board is a positive multiple of the mounting pitch of the suction nozzle 18. FIG. 2A shows a method of mounting the electronic component 50 on the printed circuit board shown in FIGS.
7, and will be described with reference to FIG.

First, as shown in FIG. 27, the selected suction nozzle 18 which sucks the same electronic component 51 to the suction nozzle 18 at the same interval as the interval between the first printed board 95 and the second printed board 96 is It has moved to the mounting position on the printed circuit board positioned on the rail 97.

Next, as shown in FIG.
The suction nozzle 18 that sucks the electronic component 51 descends, and simultaneously mounts the electronic component 51 at the component mounting position on the first printed board 95 and the second printed board 96.

Thus, it is possible to eliminate the movement of the mounting head during mounting, and mount electronic components at high speed.

(Embodiment 7) Hereinafter, a seventh embodiment of the present invention will be described with reference to FIG. 2, FIG. 29, and FIG.

First, as shown in FIG. 2, the first line sensor 12 and the second line sensor 13 for checking the suction state of the electronic component 50 are connected to the first supply unit 2 and the second supply unit 3. It is configured to be arranged at each central part.

With this arrangement, the first mounting head 10
After the electronic component 50 is sucked from the cassette 4 in the first supply unit 2 and the electronic component 50 is detected by the first line sensor 12, the electronic component 50 waits until the mounting of the second mounting head unit 11 is completed. In the state, when the first line sensor 12 is disposed between the table section 6 and the first supply section 2 as shown in FIG. 30, the first mounting head section 10 is mounted until the mounting of the second mounting head section 11 is completed. It is necessary to increase the gap B between the table unit 6 and the first line sensor 12 in order to avoid interference with the second mounting head unit 11 in a standby state. However, as shown in FIG. By arranging 12 at the center of the first supply unit 2, the gap A between the table unit 6 and the first supply unit 2 can be approached, can be smaller than the gap B, and the size of the entire apparatus Can be reduced.

After the electronic component 50 is sucked, when the first line sensor 12 recovers due to an abnormal mounting of the electronic component 50, the first line sensor 12 is set at the center of the first supply unit 2. As a result, the amount of movement of the mounting head is reduced, and the time can be reduced.

Embodiment 8 Hereinafter, an eighth embodiment of the present invention will be described with reference to FIGS. 31 (a) and 31 (b).

FIGS. 31 (a) and 31 (b) show a suction nozzle selecting mechanism according to the present embodiment, which is to be realized with a configuration different from that described in the first embodiment. is there.

In FIGS. 31 (a) and 31 (b), reference numeral 99 denotes a lock lever.
And by being attached by a spring 26 in a biased state,
As shown in FIG. 31A, the suction nozzle 18 does not descend when the tip of the lock lever 99 is engaged with the lower end of the receiver 98.

As shown in FIG. 31B, when the distal end of the lock lever 99 is disengaged from the lower end of the receiving member 98, the suction nozzle 18 is selected, and the suction nozzle 1 is selected.
8 can be lowered as the plate 30 and the first claw 32 are lowered. The configuration other than the components related to the lock lever 99 is the same as that of the first embodiment, and thus the detailed description is omitted.

FIG. 32 shows another example of the suction nozzle selecting mechanism according to the embodiment. As shown in FIG. 32, the shaft 17 is vertically movable and rotatable on the bearing block 37. Attached, a receiver 125 is fixed to the upper end of the shaft 17, and a receiver 126 is fixed to an intermediate portion. An electromagnet 33 is disposed above the receiver 125, and a hook 124 is fixed to a lower end of a shaft slidably mounted in the electromagnet 33, and the hook 124 is engaged with the receiver 125. The lower end of the receiver 125 is fixed to the plate 30, and is in contact with a second claw 32 that moves up and down in conjunction with the plate 30.

A spring 12 is provided between the bearing block 37 and the receiver 126 to urge the shaft 17 upward.
The shaft 17 and the suction nozzle 18 move up and down in conjunction with the up and down movement of the second claw 32 so that the mounting operation is possible.

By arranging the electromagnet 33 above the nozzle 17 in this manner, there is no uneven load on the shaft 17 and the sliding of the bearing block 37 and the nozzle 17 can be performed more smoothly.

In the above description, an example is shown in which the table section 6 is slid by the drive motor 14 and the ball screw 5, but other linear servo motors, racks &
A driving method for a pinion, a wire, or the like can be similarly implemented.

Further, the example in which the rotation of the mounting head unit is constituted by the rotation driving motor 20, the driving gear 21, and the rack 23 has been described, but it is also possible to employ a pulley and a belt.

The vertical movement of the mounting head can be similarly performed by performing the vertical slide drive motor 28 and the crank 29 with a cylinder, the slider 31 with a linear servomotor, or the crank 29 with a ball screw. is there.

[0112]

As described above, the electronic component mounting apparatus according to the present invention has a simple structure, can reduce the size of the entire equipment and each unit, and one of the two mounting heads performs a suction operation. At this time, since the other performs the mounting operation and performs the suction operation and the mounting operation at the same time, it is possible to eliminate unnecessary movement, reduce the loss time, and improve the total mounting tact. According to a first aspect of the present invention, there is provided a cassette having a positioning portion for positioning an electronic component, transporting the electronic component to the positioning portion and sequentially supplying the electronic component from the positioning portion, and mounting the electronic component. A table section that holds a printed circuit board to be slid and slides only in the Y direction, and a first section in which a plurality of the cassettes are arranged adjacent to each other in the X direction while being linearly arranged in the X direction with the table section interposed therebetween. Supply unit and a second supply unit, the first supply unit, a support member extending in the X direction above the table unit and the second supply unit, and the first supply unit or the second supply unit A suction nozzle for taking out an electronic component supplied from the supply unit and mounting it on a printed circuit board held by the table unit, and a plurality of suction nozzles being attached at a predetermined pitch in the X direction so as to be vertically movable. Between the said is supported by the lower end of the support member first feed unit and the table portion X
A plurality of suction nozzles, which are slidably moved up and down and are also mounted at a predetermined pitch in the X direction, and are supported by the lower end of the support member. A second mounting head unit that slides only in the X direction between the unit and the table unit, and a control unit that controls these units. The first mounting head unit and the second mounting head unit are connected to the table unit. Are arranged on the same line in the X direction with the interposition therebetween, and when the suction nozzle of the first mounting head section takes out the electronic component from the first supply section, the second mounting head section The suction nozzle operates to mount the electronic component on the printed circuit board held by the table unit, and conversely, the suction nozzle of the second mounting head unit takes out the electronic component from the second supply unit and When the first Suction nozzle of wearing the head portion is obtained by a configuration that operates to mount the electronic components on a printed board held on the table portion. With the above configuration, the structure is simple and the whole equipment and each part can be reduced in size. Further, when one of the two mounting heads performs the suction operation, the other performs the mounting operation. Since the suction operation and the mounting operation are performed at the same time, useless movement can be eliminated, loss time can be reduced, and total mounting tact can be improved. According to a second aspect of the present invention, in the first aspect, an arrangement pitch of a plurality of suction nozzles attached in the X direction to the first mounting head unit and an X direction in the first supply unit are provided. In the same manner, the arrangement pitch of a plurality of cassettes arranged adjacent to each other is set to the same size, and similarly, the arrangement pitch of a plurality of suction nozzles attached in the X direction to the second mounting head unit and the arrangement pitch in the X direction to the second supply unit. A plurality of cassettes arranged adjacent to each other have the same arrangement pitch, and a large number of electronic components can be picked up at the same time. This shortens the time for picking up electronic components and speeds up the operation of equipment. can do. The invention described in claim 3 of the present invention is the invention according to claim 1 or 2,
The support member extending in the X direction has an H-shaped cross section in the Y direction. The lower end portions of the H shape support the first mounting head section and the second mounting head section, and the H-shaped section. A drive mechanism that slides the first mounting head or the second mounting head in the X direction is provided on the lower side of the substantially central portion, and the supporting member is unlikely to be twisted, and as a result, Since the mounting heads supported by the support member are less likely to be displaced at the tip of the suction nozzle, accurate mounting can be performed. The invention described in claim 4 of the present invention is the invention according to any one of claims 1 to 3, wherein one of the first mounting head and the second mounting head is configured to raise and lower a suction nozzle. A lifting member is provided, and each suction nozzle is attached to a shaft having a receiver fixed at the upper end, and a spring is provided for each shaft and suction nozzle for urging the receiver downward to abut on the upper surface of the lifting member. In this configuration, a plurality of suction nozzles attached to each mounting head unit can be simultaneously moved up and down to suction or mount a large number of electronic components at the time of suction or mounting. The operation of the equipment can be speeded up by shortening the time. According to a fifth aspect of the present invention, in accordance with the fourth aspect of the present invention, there is provided a switch for engaging with a lower end of a receiver fixed to an upper end of each shaft to prevent the abutment of the receiver from being brought into contact with the elevating member. A mechanism is provided for each of the shafts and suction nozzles. With a simple structure, an arbitrary number of suction nozzles can be selectively selected from a plurality of suction nozzles attached to each mounting head unit. In addition, they can be moved up and down sequentially or simultaneously at a predetermined timing. According to a sixth aspect of the present invention, in the invention of the fourth or fifth aspect, a slider is provided on each of the first mounting head portion and the second mounting head portion, and the elevating member is attached to the slider. By slidable up and down, provided with one motor that can be rotated forward and reverse to each of the mounting head,
A crank provided with a pin on one side is rotatably and eccentrically mounted on each of the motors, and the pin is rotatably mounted on the elevating member. The damage to the electronic component can be reduced by changing the height of the bottom dead center when the individual suction nozzles move up or down during suction or mounting depending on the height of the suction nozzle and the thickness of the electronic component. In the invention according to claim 7 of the present invention, in the invention according to claim 6, a disk is attached to the output shaft of the motor instead of the crank, and a pin is provided at a position eccentric from the motor output shaft of the disk. The pin is rotatably attached to a plate, and a pin rotatably engaged with an elevating member is fixed to an end of the plate. A plurality of pins attached to each mounting head are provided. The damage to the electronic component can be reduced by changing the height of the bottom dead center when the suction nozzle moves up or down during suction or mounting depending on the height of the suction nozzle and the thickness of the electronic component. According to an eighth aspect of the present invention, in the invention according to any one of the first to seventh aspects, the suction nozzle is rotated by each of the first mounting head and the second mounting head. A plurality of rotation drive motors and a rack slidable by the rotation drive motor, and each suction nozzle is attached to a shaft on which a driven gear meshing with the rack is fixed. By rotating a plurality of suction nozzles attached to the unit, the displacement of the electronic components sucked by the suction nozzles can be corrected, and accurate mounting can be performed. According to a ninth aspect of the present invention, in the invention according to any one of the first to eighth aspects, a sensor for detecting presence / absence of an electronic component sucked by a suction nozzle and a suction state is provided by a first sensor. It is provided at the center of the supply unit or the second supply unit, and the recovery operation in the case of a suction error, a component inspection and a suction error can be performed in an optimum time, thereby improving the total mounting tact time. When one of the two mounting heads performs the component detecting operation and the other performs the mounting operation, the equipment does not interfere with the two mounting heads even if the distance between the supply unit and the table is minimized. The overall size can be reduced.

[0113]

[0114]

[0115]

[0116]

[0117]

[Brief description of the drawings]

FIG. 1 is a perspective view showing an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of the same.

FIG. 3A is a front view of a main part showing a driving unit of a mounting head of the apparatus. FIG. 3B is a side view of the same.

FIG. 4 is a partially cutaway perspective view showing details of a mounting head of the electronic component mounting apparatus.

FIG. 5 is a side view of a mounting nozzle in the electronic component mounting apparatus.

FIG. 6 is a perspective view showing the overall configuration of a cassette mounted on the electronic component mounting apparatus.

FIG. 7 is an essential part perspective view showing a front end portion of the cassette.

FIG. 8 is a main part plan view for explaining the positioning operation of the cassette.

FIG. 9 is a plan view for explaining an operation from suction to mounting in the electronic component mounting apparatus.

FIG. 10 is a plan view for explaining an operation from suction to mounting in the electronic component mounting apparatus.

FIG. 11 is a front view for explaining an operation of simultaneously sucking electronic components in the electronic component mounting apparatus.

FIG. 12 is a side view of the suction nozzle for explaining the operation of the suction nozzle in the electronic component mounting apparatus.

FIG. 13 is a side view of the suction nozzle for explaining the operation of the suction nozzle in the electronic component mounting apparatus.

FIG. 14 is a side view of the suction nozzle for describing the operation of the suction nozzle in the electronic component mounting apparatus.

FIG. 15 is an exemplary front view for explaining an operation of sequentially sucking electronic components according to the second embodiment of the present invention;

FIG. 16 is an exemplary front view for explaining an operation of sequentially sucking electronic components according to the second embodiment of the present invention;

FIG. 17 is an exemplary front view for explaining an operation of sequentially sucking electronic components according to the second embodiment of the present invention;

FIG. 18 is an exemplary front view for explaining an operation of sequentially sucking and moving electronic components according to the third embodiment of the present invention;

FIG. 19 is an exemplary front view for explaining an operation of sequentially sucking and moving electronic components according to the third embodiment of the present invention;

FIG. 20 is an exemplary front view for explaining an operation of sequentially sucking and moving electronic components according to the third embodiment of the present invention;

FIG. 21 is a partially cutaway perspective view showing details of a mounting head unit according to a fourth embodiment of the present invention.

FIG. 22 is a plan view of the electronic component mounting apparatus.

FIG. 23 (a) is a side sectional view for explaining the operation of the mounting head unit according to the fifth embodiment of the present invention.

FIG. 24 (a) is a side sectional view of the same, and (b) is a front view of the same.

FIG. 25 (a) is a side sectional view of the same, and (b) is a front view of the same.

FIG. 26 is a plan view of a printed circuit board having many circuits on one printed circuit board according to the sixth embodiment of the present invention.

FIG. 27 is an essential part perspective view for explaining the operation in the case of mounting a printed circuit board having a large number of circuits in the sixth embodiment;

FIG. 28 is an essential part perspective view for explaining the operation in the case of mounting a printed circuit board having a large number of circuits in the sixth embodiment;

FIG. 29 is a front view of an electronic component mounting apparatus according to a seventh embodiment of the present invention.

FIG. 30 is a front view of the electronic component mounting apparatus according to the seventh embodiment.

FIG. 31 is a side view of the suction nozzle for describing the operation of the suction nozzle according to the eighth embodiment of the present invention.

FIG. 32 is a side view of a suction nozzle according to another example of the eighth embodiment.

FIG. 33 is a perspective view showing the configuration of a conventional electronic component mounting apparatus.

FIG. 34 is a perspective view showing a configuration of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Housing 2 1st supply part 3 2nd supply part 4 Cassette 6 Table part 7 Guide rail 8 Guide rail 9 Upper frame 10 First mounting head part 11 Second mounting head part 12 First line sensor 13 Second line sensor 14 Drive motor 15 Loader section 16 Unloader section 17 Shaft 18 Suction nozzle 19 Printed circuit board 20 Rotary drive motor 21 Drive gear 22 Follower gear 23 Rack 24 Pin 25 Positioning holder 26 Spring 27 Positioning pin 28 For vertical sliding drive Motor 29 Crank 30 Plate 31 Slider 32 First claw 33 Electromagnet 34 Second claw 36 Rack receiver 37 Bearing block 38 Control unit 50 Electronic component

Continued on the front page (72) Inventor Takashi Munemi 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Inventor Manabu Morioka 1006 Odaka Kadoma, Kadoma City Osaka Prefecture Inside Matsushita Electric Industrial Co. 72) Inventor Takayoshi Kado 1006 Kazuma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. (72) Inventor Takaaki Fuji 1006 Odaka Kazuma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 13/04

Claims (9)

(57) [Claims] 1. A positioning section for positioning an electronic component.
And transport the electronic components to this positioning part.
A cassette that sequentially supplies electronic components from the placement unit,
Hold the printed circuit board on which the electronic components are mounted
Table part that slides only
The cassettes are arranged linearly in the X direction and
A first supply unit and a second supply unit in which a plurality of
Supply unit, the first supply unit, the table unit and the second
A support member extending in the X direction above the supply unit;
Electronic components supplied from one supply unit or second supply unit
Take out the printed circuit board held on the table
Suction nozzle to be attached to
Also, when multiple units are attached at a predetermined pitch in the X direction,
At the lower end of the support member, the first supply unit
To the first mounting part that slides only in the X direction between
Head and the suction nozzle can be moved up and down
Are mounted at a predetermined pitch in the
The second supply unit and the tape supported by the lower end of the holding member
Second mounting head section that slides only between X sections in the X direction
And a control unit for controlling these, and the first device
Place the mounting head and the second mounting head between the table
And are disposed on the same line in the X direction,
The suction nozzle of the mounting head section is powered from the first supply section.
While taking out the child part, the second mounting head part
Printed circuit board with suction nozzle held on the table
Operates to mount electronic components on the other hand, and conversely,
The suction nozzle of the second mounting head is moved from the second supply unit.
When taking out the electronic component, the first mounting head section
Of the print base held by the table unit
An electronic device that operates to mount electronic components on a board
Component mounting device. 2. The apparatus according to claim 1 , wherein a plurality of heads are mounted on the first mounting head in the X direction.
To the arrangement pitch of the attached suction nozzles and the first supply unit
The arrangement pitch of the cassettes arranged adjacent to each other in the X direction
The same dimensions, and similarly, the X mounting
Pitch and the number of suction nozzles
Of two or more cassettes arranged adjacent to each other in the X direction
2. The electronic component according to claim 1, wherein the arrangement pitch is the same.
Mounting device. 3. The support member extending in the X direction has a Y-direction.
The cross-sectional shape is H-shaped, and the first mounting is performed at both lower ends of the H-shaped.
While supporting the head section and the second mounting head section,
The first mounting head portion or the lower surface side of the substantially central portion of the H type
A drive mechanism is provided to slide the second mounting head in the X direction.
3. The electronic component mounting according to claim 1, wherein the electronic component is mounted.
apparatus. 4. A first mounting head and a second mounting head.
One lifting member that raises and lowers the suction nozzle in each part
Each suction nozzle has a receiver fixed at the upper end.
Attach it to the shaft and urge this receiver down
Each of the shafts, which is in contact with the upper surface of the elevating member,
And a configuration provided for each suction nozzle.
Electronic component mounting apparatus according to any one of the above. 5. A lower end of a receiver fixed to an upper end of each shaft.
To stop the abutment of this receiver against the elevating member.
A switching mechanism is provided for each shaft and suction nozzle.
The electronic component mounting apparatus according to claim 4, wherein 6. A first mounting head and a second mounting head.
A slider is provided in each part, and the lifting member is
Slidable up and down by attaching to
One motor that can rotate in both forward and reverse directions on the mounting head
And a crank provided with a pin on one side
Each is rotatably and eccentrically mounted, and
The pin was rotatably attached to the elevating member.
The electronic component mounting device according to claim 4. 7. A motor is used as an output shaft for a disk instead of a crank.
Mounted on the disk, eccentric from the motor output shaft
Position a pin and rotatably mount the pin on the plate.
At the end of this plate, rotate on the lifting member
7. The structure according to claim 6, wherein the pin engaged is fixed.
Electronic component mounting device. 8. A first mounting head and a second mounting head.
One rotation drive to rotate the suction nozzle for each of the parts
Motor and one that slides with this rotary drive motor
Of each suction nozzle,
Attach the driven gear meshing with the rack to the fixed shaft
The configuration according to any one of claims 1 to 7, wherein
Electronic component mounting device. 9. The presence or absence of an electronic component sucked by a suction nozzle.
And a sensor for detect the attracted state, or the first supply unit
2. The method according to claim 1, wherein the first supply unit is provided at a central portion of the second supply unit.
9. The electronic component mounting device according to any one of items 1 to 8.