JPH1032399A - Electronic component mounting equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize an electronic component mounting equipment which is capable of carrying out a mounting operation at a high speed by a method in which the mounting equipment is equipped with two mounting heads provided with many suction nozzles each, the mounting heads are arranged on the same line sandwiching a table which holds a printed board between them, and one of the mounting heads carries out a suction operation while the other carries out a mounting operation. SOLUTION: A first mounting head 10 is moved towards a first line sensor 12, it is detected by the sensor 12 whether the suction nozzles of the mounting head 10 pick up electronic components or not, and the height of an electronic component is stored for each nozzle. At this point, a second mounting head 11 mounts electronic components picked up by its nozzles at a second part feed station 3 on a printed board placed on a table 6. The first mounting head 10 is moved to a mounting position to mount electronic components on a printed board placed on the table 6 at the same time when the second mounting head 11 finishes its mounting operation. At this point, the second mounting head 11 is moved to a certain position indicated by the program of the second feed station 3 to pick up electronic components and then transferred to a second line sensor 13. This procedure is repeatedly carried out for mounting electronic components on a printed board, so that an electronic component mounting equipment of this constitution is capable of carrying out a mounting operation at a higher speed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus used for mounting a chip-type electronic component for surface mounting used on various electronic circuits on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, this type of electronic component mounting apparatus is roughly classified into a general-purpose mounting apparatus using a robot and a high-speed mounting apparatus using a rotary mounting head. .

A general-purpose mounting device of a robot type is disclosed in
-85492 is known,
As shown in FIG. 33, the electronic component supply unit 70 on which the cassette 77 for supplying the taped electronic components one by one is mounted, and the board holding unit 7 for holding the printed board 75
9, a mounting head 72 to which a suction nozzle 71 for sucking an electronic component is rotatably slidably mounted to mount an electronic component on a printed circuit board 75; a first drive shaft 73 to which the mounting head 72 is mounted; The second drive shaft 7 that drives the first drive shaft 73 in a direction orthogonal to the first drive shaft 73
4, the mounting head 72 moves in the X and Y directions to suck and mount the electronic component.

A rotary type high-speed mounting device disclosed in Japanese Patent Application Laid-Open No. 7-202491 is known. In FIG. 34, a suction nozzle 82 is arranged on a circumference as shown in FIG. The rotary head 81 intermittently moves, the component supply unit 80 on the XY table 83 movable to a position where the suction nozzle 82 stops, the electronic component recognition unit 86, and the printed circuit board 85 for mounting electronic components. XY table 83 that can be held and moved in two orthogonal directions
The rotary head 81 is sequentially rotated to suck, recognize, and mount the electronic component.

[0005]

However, in the above-mentioned conventional configuration, while a small, inexpensive and high-speed electronic component mounting device is required, a general-purpose mounting device of a robot type has a simple configuration and a small size. Since the electronic components are sucked one by one and then the electronic components are mounted on the printed circuit board 75, the speed cannot be increased because of the configuration of the rotary type high-speed mounting device. However, there is a problem that the equipment is large, and the equipment price is high, but the realization of this intermediate type electronic component mounting apparatus has been desired.

SUMMARY OF THE INVENTION An object of the present invention is to solve such a conventional problem and to provide an electronic component mounting apparatus which is compact and can be mounted at high speed.

[0007]

In order to solve this problem, an electronic component mounting apparatus according to the present invention has two mounting heads holding a large number of suction nozzles which are the same across a table holding a printed circuit board. The two mounting heads are arranged on a line, and when one of the two mounting heads performs the suction operation, the other performs the mounting operation.

According to the present invention, a small and high-speed electronic component mounting apparatus can be obtained.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, a plurality of cassettes for sequentially supplying electronic components are arranged adjacent to each other, and each cassette is linearly arranged with a predetermined interval. A second supply unit and a printed circuit board for mounting an electronic component, which is slidably disposed in the same direction as the supply direction of the electronic component at the predetermined space between the first and second supply units. A table section for holding, and a plurality of suction nozzles for sucking electronic components are held in a vertically movable manner, and are slid above the table section and the first and second supply sections in a direction orthogonal to the sliding direction of the table section. It is composed of freely arranged first and second mounting heads and a control unit for controlling them, and has an effect that the structure can be simple and inexpensive.

According to a second aspect of the present invention, in the first aspect of the invention, the arrangement pitch of the plurality of suction nozzles respectively held by the first and second mounting heads is the first and second supply nozzles. The configuration is the same as the arrangement pitch of each cassette placed adjacent to the unit, and a large number of electronic components can be mounted at the same time, so that the suction time is the same as the time for picking up one electronic component. It has the effect of speeding up.

According to a third aspect of the present invention, in the first or second aspect of the present invention, the suction nozzle held by the first mounting head unit sucks an electronic component supplied from the first supply unit. During the operation, the suction nozzle held by the second mounting head operates to suck the electronic component onto the printed circuit board held by the table, and conversely, the suction nozzle is held by the second mounting head. While the suction nozzle is sucking the electronic component supplied from the second supply unit, the suction nozzle held by the first mounting head unit mounts the electronic component on the printed circuit board held by the table unit. Since the suction operation and the mounting operation can be performed at the same time, the loss time is small, and the total mounting tact can be improved.

According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, in a direction perpendicular to a sliding direction of the table section above the first and second supply sections. The support member that supports the first and second mounting heads slidably disposed has a H-shaped cross section in a direction orthogonal to the sliding direction of the first and second mounting heads. Both ends of the first and second mounting heads are slidably supported at both lower ends of the H-shape.
The second mounting head has a configuration with a drive mechanism for sliding, has high strength against twisting and twisting,
It has the effect that mounting can be performed with high accuracy.

According to a fifth aspect of the present invention, in the invention according to any one of the first to fourth aspects, a plurality of suction nozzles are simultaneously moved up and down, respectively. At the time of mounting, a large number of suction and mounting can be performed at the same time, so that the suction time and the mounting time can be reduced, and the total tact can be improved.

According to a sixth aspect of the present invention, in the first aspect of the invention, the plurality of suction nozzles respectively held by the first and second mounting heads are each provided with a predetermined number. The electronic component at an arbitrary position can be sucked by an arbitrary suction nozzle.

According to a seventh aspect of the present invention, in the fifth or sixth aspect, a plurality of suction nozzles respectively held by the first and second mounting heads are selected from a plurality of suction nozzles. At least one or more arbitrary suction nozzles are operated, and the electronic components at arbitrary positions in the supply unit are sequentially sucked, and the number of electronic components is equal to the number of suction nozzles attached to the mounting head unit. Since the components can be sucked, the time required to move from the suction position to the mounting position can be shortened as compared with the operation of repeating the suction and mounting each time, and the total mounting tact can be improved.

According to an eighth aspect of the present invention, in the invention of the seventh aspect, a selection mechanism for operating only an arbitrary suction nozzle from among a plurality of suction nozzles is attached to the first and second mounting heads, respectively. A simple structure, in which a plurality of suction nozzles that move up and down following the raising and lowering members are selected by a switching mechanism provided to hold the suction nozzles and prevent the lowering of the suction nozzles Has the effect that a number of suction nozzles can be selected and moved up and down.

According to a ninth aspect of the present invention, in the first aspect of the present invention, a plurality of suction nozzles respectively held by the first and second mounting heads are rotated. The mechanism is configured to be provided on the first and second mounting heads, respectively, and can correct the displacement of suction,
It has the effect that mounting can be performed with high accuracy.

The invention described in claim 10 is the invention according to claims 1 to 9
In the invention according to any one of the first, the first, a plurality of nozzle height adjustment mechanism that varies the bottom dead center position when the plurality of suction nozzles held in the second mounting head unit is moved up and down, The height of the suction nozzle and the height of the electronic component can be changed depending on the height of the suction nozzle and the thickness of the electronic component, so that the damage to the electronic component can be changed. It has the effect that it can be reduced.

The invention according to claim 11 is the invention according to claims 1 to 1.
0, the sensor for detecting the presence or absence and the suction state of the electronic component sucked by the suction nozzle is provided in the first and second supply units, respectively. Since the pick-up, component inspection, and recovery operation in the case of a pick-up error can be performed in the optimal time, the total tact can be improved, and one of the first and second mounting heads performs the component detection operation. , When the other mounting head is performing the mounting operation,
Even if the distance between the supply unit and the table is minimized, the machine size can be reduced without interference between the mounting head units.

FIG. 1 shows an embodiment of the present invention.
This will be described with reference to FIGS. (Embodiment 1) FIG. 1 is a perspective view showing an overall configuration of an electronic component mounting apparatus according to a first embodiment of the present invention, and FIG.
3 (a) and 3 (b) are front and side views of a main part showing a driving unit of the mounting head, FIG. 4 is a perspective view showing the mounting head, and FIG. FIG.

In FIGS. 1 and 2, reference numerals 2 and 3 denote a casing 1 in which a plurality of cassettes 4 for sequentially supplying electronic components are arranged adjacent to each other.
The first and second supply units 2 and 3 are disposed linearly at predetermined intervals, respectively. The table unit 6 is disposed at the above-mentioned predetermined interval, which is an intermediate portion between the supply units 2 and 3, and the table unit 6 holds the printed circuit board 19 on which the electronic components are mounted, and supplies the electronic components in the supply direction (Y direction). And the guide rail 7 is slidable through the ball screw 5 by the rotation of the drive motor 14 in the same direction.

Reference numerals 10 and 11 denote first and second mounting heads respectively holding a plurality of suction nozzles 18 for sucking and holding the electronic components so as to be movable up and down. Are independently slidable in a direction (X direction) orthogonal to the supply direction of the electronic components via a guide rail 8 on the lower surface of the upper frame 9 coupled to the housing 1.

In FIG. 3, reference numeral 9 denotes an upper frame. The upper frame 9 has an H-shaped cross section. Two rails 115 are fixed to a lower portion of the upper frame 9, and the upper frame 9 is slidably attached to the rail 115. 2 pairs of bearings 1
16 are attached to the four corners of the plate 117 so that the first mounting head unit 10 coupled to the plate 117 can slide in the longitudinal direction of the rail 115.

On the other hand, a motor 110 fixed by a bracket 119 is attached to the upper frame 9, and a coupling 111 is attached to an output shaft of the motor 110.
A ball screw 113 whose both ends are fixed by a bracket 112 via a bracket is attached.
A ball screw nut 118 for moving the rotation of a ball screw 113 in the longitudinal direction of the rail 115 is screwed into the ball screw 13, and the ball screw nut 118 is mounted on the upper surface of the plate 117 via a bracket 114. .

With this structure, the first mounting head 10
Is stable because it is supported by the two pairs of bearings 116 and between the bearings 116, and twisting does not work on the upper frame 9; There is nothing.

1 and 2, reference numeral 15 denotes a loader for transferring the printed circuit board 19 to the table 6, reference numeral 16 denotes an unloader for transferring the printed circuit board 19 from the table 6, and reference numerals 12 and 13 denote first and second, respectively. Second supply units 2 and 3
And a second line for detecting the height of the electronic component held by the suction nozzles 18 of the first and second mounting head units 10 and 11 respectively. The first and second line sensors 1
The grooves 2 and 13 are provided with grooves through which the suction nozzle 18 holding the electronic components by suction can pass in the X direction.

Reference numeral 38 denotes a control unit for controlling the entire mounting. FIG. 4 is a partial cross-sectional view of the first and second mounting head units 10 and 11 (only one is shown in FIG. 4).
FIG. 5 shows the mounting head.

As shown in FIGS. 4 and 5, a plurality of suction nozzles 18 are attached to the inside of a shaft 17 so as to be vertically movable, and the shaft 17 is attached to a bearing block 37 so as to be vertically movable and rotatable. ing. Shaft 17
A positioning holder 25 is attached to the upper end of
The positioning holder 25 is provided with a groove which engages with a positioning pin 27 fixed to a plate 94 attached to the front surface of the bearing block 37 when the shaft 17 comes to a dead center.

A rotation drive motor 20 and a vertical slide drive motor 28 are mounted on the bearing block 37, and the drive gear 21 mounted on the rotation drive motor 20 is slidably held by a rack receiver 36. Rack 2
3 and the rack 23 is mounted so as to mesh with the driven gear 22 fixed to the shaft 17.

A crank 29 is eccentrically and rotatably mounted on the vertical slide drive motor 28, and a plate 30 is slidably mounted in a vertical direction by a pin 24 mounted on one side of the crank 29 and a slider 31. A first claw 32 is attached to the plate 30. The first claw 32 is attached to the electromagnet 33 so as to be vertically movable. 34 is attached so as to abut on the lower surface.

A receiver 98 fixed to the upper end of the shaft 17 is rotatably abutted on the upper surface of the second claw 34, and a receiver 98 is provided between the receiver 98 and the block 93. A spring 26 for urging the shaft 17 downward via the shaft 26 is attached.

A switch 90 and a power supply 91 are attached to the electromagnet 33 via a wiring 92 so that the electromagnet 33 can be controlled.

FIGS. 6, 7 and 8 show the configuration of a plurality of cassettes 4 arranged adjacent to the first and second supply units 2 and 3, respectively. Is the Japanese
As shown in FIG. 6, a case 41 includes a lid 44 for accommodating an electronic component 50, a first space 45, and a small amount of an electronic component 50 in a second space 4 as shown in FIG.
There is provided a weir 47 for feeding to 6.

In the second space 46, an elevating block 49 which moves up and down is inserted into the lower part and is connected thereto, and a chute groove 43 for aligning and lowering and transporting the electronic components 50 is provided. The front surface of the case 41 is covered with an acrylic plate 42 provided with a countermeasure against static electricity so that the electronic component 50 can be seen from this surface. A guide pin 52 for guiding and a lever 53 for opening and closing the shutter 51 are provided.

FIG. 7 is a perspective view of a main part for explaining the positioning part of the cassette 4 shown in FIG. 6, and FIG. 8 is a plan view of the main part. It is located at the exit.

6 and 7, a lever 53 is provided at the tip of the chute groove 43 to open and close the shutter 51 and to move the stopper 63 back and forth. Also, the chute groove 43
A first vacuum groove 59 and a first vacuum hole 58 for positioning the electronic component 50 are provided on the front end and a side surface near the front end, and the electronic component 50 in the chute groove 43 is located slightly before the front end.
A second vacuum groove 62 and a second vacuum hole 61 for facilitating feeding to the outlet side and separating the first electronic component 50 from the rear electronic component 50 are provided.

The operation of the thus-configured electronic component mounting apparatus of the present invention will be described below.

First, the operation of the mounting head unit will be described with reference to FIG.
This will be described with reference to FIGS. 10 (a) and 10 (b) and FIGS. 10 (a) and 10 (b).

As shown in FIG. 9A, the first mounting head unit 10 moves to the position specified by the program of the first supply unit 2 and sucks the electronic component 50.

Next, as shown in FIG. 9B, the first mounting head unit 10 moves in the direction of the first line sensor 12, and detects the presence / absence of the sucked electronic component 50, the standing suction, and the like. At the same time, the height of the electronic component 50 is stored for each suction nozzle 18. At this time, the second mounting head unit 11 is performing the mounting operation on the printed circuit board 19 on the table unit 6 with the electronic component 50 already sucked by the second supply unit 3.

Next, as shown in FIG. 10A, the first mounting head 10 is moved to the mounting position of the printed circuit board 19 on the table 6 at the same time when the mounting of the second mounting head 11 is completed. Then, the sucked electronic component 50 is transferred to the printed circuit board 19
Attach to At this time, the second mounting head unit 11 moves to the position specified by the program of the second supply unit 3 to suck the electronic component 50, and after the suction is completed, the second mounting head unit 11 moves to the second position as shown in FIG. Moving to the second line sensor 13, the presence / absence of the sucked electronic component 50, standing suction, and the like are detected, and the height of the electronic component 50 is stored for each suction nozzle 18.

By repeating this operation, the electronic components 50 are sequentially mounted on the printed circuit board 19.

Next, the suction and mounting operations will be described.
First, the positioning of the electronic component 50 in the cassette 4 will be described with reference to FIGS. 6, 7, and 8. FIG.

The electronic component 50 flowing through the chute groove 43
Is stopped by the stopper 63 at the tip of the cassette. The second vacuum hole 61 and the second vacuum groove 62 are also at a negative pressure, and the electronic component 50 is mounted on the positioning side wall 6 of the second vacuum groove 62.
5, the stopper 63 is moved by the movement amount indicated by a in the drawing in the same direction as the flow direction of the electronic component 50 by the movement of the lever 53, and the electronic component 50 at the tip end is moved.
Becomes free. At this time, the first vacuum hole 58 and the first vacuum groove 59 are under negative pressure, and the electronic component 50 is drawn to the first vacuum hole 58 and positioned by the positioning end 64 and the positioning side wall 65.

Subsequently, the suction operation of the electronic component 50 positioned as described above will be described with reference to FIGS. 4 and 5, and FIGS. 11A and 11B and FIGS. I do.

As shown in FIG. 11A, when the switch 90 is off, the second claw 34 is not attracted to the electromagnet 33 and is on the upper surface of the first claw 32.

The rotation of the vertical slide drive motor 28 lowers the pin 24 attached to the crank 29, whereby the plate 30 and the first claw 32 are lowered along the slider 31 and attached to the upper end of the shaft 17. The stopper 98 is provided between the spring 2 and the block 93.
6 through the second claw 34 by the urging force of the first claw 3
It descends in conjunction with the decline of 2. At this time, the positioned positioning pin 27 enters the groove of the positioning holder 25, and the suction nozzle 18 is positioned in the rotation direction.

When the suction nozzle 18 descends, the rotation of the vertical slide drive motor 28 stops at a height at which the suction nozzle 18 comes into contact with the electronic component 50 positioned by the positioning portion of the cassette 4. And the electronic component 50 is sucked, and the vertical slide driving motor 2 is
8 rotates in the opposite direction to the above, and the suction nozzle 18 rises and stops at the top dead center.

When the switch 90 is turned on as shown in FIG. 12, the electromagnet 33 is excited by the power supply 91, and the second claw 34 is attracted to the electromagnet 33. This allows
Even if the first claw 32 is lowered by the rotation of the vertical slide drive motor 28, the second claw 34, the receiver 98, the shaft 17, and the suction nozzle 18 do not move down, and the electronic component 50 of the cassette 4 is sucked. It is not configured.

Next, the operation of sucking the electronic component 50 sucked by the suction nozzle 18 will be described.

First, as shown in FIG. 11 (b), the pin 24 attached to the crank 29 is lowered by the rotation of the vertical slide drive motor 28, whereby the slider 31 is moved.
The plate 30 and the first claw 32 move down along, and the receiver 98 attached to the upper end of the shaft 17 pushes the second claw 34 by the urging force of the spring 26 provided between the plate 98 and the block 93. The first claw 32 descends in conjunction with the downward movement of the first claw 32. At this time, the positioned positioning pin 27 enters the groove of the positioning holder 25, and the suction nozzle 18 is positioned in the rotation direction.

When the suction nozzle 18 is lowered, the rotation of the vertical slide drive motor 28 is stopped at a height at which the electronic component 50 contacts the printed circuit board 19, and the pressure is switched from vacuum to positive pressure by a solenoid valve (not shown). Then, the electronic component 50 is mounted on the printed circuit board 19, and the vertical slide drive motor 28 rotates again in the opposite direction to the above, and the suction nozzle 18 rises and stops at the top dead center.

When the switch 90 is on as shown in FIG. 12, the electromagnet 33 is excited by the power supply 91 and is attracted to the second claw 34. As a result, even if the first claw 32 is lowered by the rotation of the vertical slide drive motor 28, the second claw 34, the receiver 98, the shaft 17, and the suction nozzle 18 are not lowered, and the electronic component 50 is mounted on the printed circuit board. Do not attach to 19.

When the electronic component 50 is mounted on the printed circuit board 19, the suction nozzle is mounted on the printed circuit board 19 while moving from the component detection line sensor 12 to the printed circuit board 19 in order to mount the electronic component 50 in the predetermined mounting direction. The rotation 18 is transmitted to the drive gear 21 of the rotation drive motor 20, the rack 23 slidably held by the rack receiver 36 slides, and the driven gear 22 attached to the shaft 17 is rotated. The suction nozzle 18 attached to the end of the electronic component 17 and the sucked electronic component 50 are configured to rotate.

FIGS. 13 (a), 13 (b) and 14 show the first mounting head section 10 in the order of the suction operation. This operation is the same for the second mounting head section 11 as well. The description will be omitted, and only the first mounting head unit 10 will be described.

First, as shown in FIG. 13A, the first mounting head unit 10 moves to a predetermined position of the first supply unit 2 to suck the electronic component 50.

As shown in FIG. 13B, the electronic component 50
All the switches 90 of the ten suction nozzles 18 for sucking are turned off and the holding is released by the electromagnet 33,
As the first claw 32 is lowered, the ten suction nozzles 18 are lowered by the urging force of the spring 26, and the mounting pitch of each suction nozzle 18 and the mounting pitch of each cassette 4 are the same. The ten electronic components 50 positioned at the tips of the four can be simultaneously sucked by the respective suction nozzles 18.

Next, as shown in FIG.
Rises and the ten suction nozzles 18 rise and stop at the top dead center. Then, the first mounting head unit 10 sends the signal to the first line sensor 12 to inspect the suction state of the electronic component 50. Move to the next operation.

As described above, the first mounting head unit 10 sucks the electronic component 50 supplied from the first supply unit 2 and mounts the electronic component 50 on the printed circuit board 19. The arrangement pitch of the plurality of held suction nozzles 18 and the plurality of cassettes 4 arranged in the first supply unit 2
Are set to the same size, and the first mounting head unit 10 and the first supply unit 2 have a paired relationship.

The second mounting head section 11 and the second supply section 3 also have a paired relationship in the same manner as described above.
The first mounting head unit 10 is connected to the first supply unit 2 by the electronic component 5.
When the first mounting head unit 10 sucks the electronic component 50, the second mounting head unit 11 operates to mount the sucked electronic component 50 on the printed circuit board 19. When 50 is mounted on the printed circuit board 19,
The second mounting head 11 is connected to the second supply unit 3 by the electronic component 5.
0 is adsorbed, and component mounting can be performed at high speed without unnecessary operation.

As described above, by simultaneously moving the plurality of suction nozzles 18 up and down, a plurality of electronic components 50 can be simultaneously suctioned and mounted.

(Embodiment 2) Hereinafter, a second embodiment of the present invention will be described with reference to FIGS. 15 to 17 and FIG. The operation of the suction head is the same as that of the first embodiment, and the second mounting head is the same.

FIGS. 15 to 17 show the first mounting head unit 1.
0 are shown in the order of the suction operation.
As shown in FIG. 1, the first mounting head 10 is
The first supply unit 2 is moved to a predetermined position in order to adsorb 0.

Subsequently, as shown in FIG. 15B, only the suction nozzle 18 operated by the electromagnet 33 is selected by turning off only the switch 90 of the suction nozzle 18 to which the electronic component 50 is to be sucked. One claw 32
Is lowered, only the selected suction nozzle 18 is lowered by the urging force of the spring 26 and sucks the electronic component 50 positioned at the leading end of the cassette 4.

Next, as shown in FIG. 16A, the first claw 32 rises, and the suction nozzle 18 that has sucked the electronic component 50 rises and stops at the top dead center.

Next, as shown in FIG. 16B, the switch 90 of the suction nozzle 18 that has already sucked the electronic component 50 is turned on, and the switch 90 of the suction nozzle 18 that has not yet sucked the electronic component 50 is turned off. The suction nozzle 18 whose switch 90 is turned off is the first claw 32.
After the electronic component 50 is sucked by the lowering of the electronic component 50, the electronic component 50 is again raised to the top dead center as shown in FIG.

By repeating this operation, the electronic components 50 are sequentially sucked, and after all the ten suction nozzles 18 have sucked the electronic components 50, the first mounting head unit 10 inspects the sucked state of the electronic components 50. Line sensor 12
To move to the next operation.

As described above, by sequentially moving up and down the plurality of suction nozzles 18, it is possible to suck and mount an arbitrary electronic component 50 with an arbitrary suction nozzle 18.

(Embodiment 3) Hereinafter, a third embodiment of the present invention will be described with reference to FIGS. 18 to 20 and FIG. The operation of the suction head is the same as that of the first embodiment, and the second mounting head is the same.

FIGS. 18 to 20 show the first mounting head unit 1.
0 is shown in the order of the suction operation.
As shown in FIG. 1, the first mounting head 10 is
The first supply unit 2 is moved to a predetermined position in order to adsorb 0.

Subsequently, as shown in FIG. 18B, only the suction nozzle 18 operated by the electromagnet 33 is selected by turning off only the switch 90 of the suction nozzle 18 to which the electronic component 50 is to be sucked. One claw 32
Is lowered, only the selected suction nozzle 18 is lowered by the urging force of the spring 26 and sucks the electronic component 50 positioned at the leading end of the cassette 4.

Next, as shown in FIG. 19A, the first claw 32 rises, and the suction nozzle 18 that has sucked the electronic component 50 rises and stops at the top dead center.

Next, as shown in FIG. 19B, the mounting head unit 10 moves to the position of the electronic component 50 to be mounted next, and
The switch 90 of the suction nozzle 18 that has already sucked the electronic component 50 is turned on, and the switch 90 of the suction nozzle 18 that has already sucked the electronic component 50 is turned off.
As shown in FIG. 20B, the suction nozzle 18 in which the switch 90 is turned off descends with the lowering of the first claw 32 to suck the electronic component 50, and then returns to the top dead center again as shown in FIG. To rise.

The electronic components 50 are sequentially sucked by repeating the operations of the sucking and moving, and after the required number of electronic components 50 have been suctioned, the first mounting head unit 10 checks the suction state of the electronic components 50. It moves to the first line sensor 12 and shifts to the next operation.

As described above, by raising and lowering only the suction nozzle 18 arbitrarily selected from the plurality of suction nozzles 18, it is possible to efficiently suck and mount an arbitrary electronic component 50.

(Embodiment 4) Hereinafter, a fourth embodiment of the present invention will be described with reference to FIGS.

As shown in FIGS. 21 and 22, a plurality of suction nozzles 18 are vertically movably mounted inside a shaft 17, and the shaft 17 is vertically and rotatably mounted on a bearing block 37. . Frame 10
9 is provided with a rotation drive motor 20 and a vertical slide drive motor 28.
Is engaged with a rack 23 slidably held by a rack receiver 36 mounted on a bearing block 37, and the rack 23 is fixed to a shaft 17 having a suction nozzle 18 mounted on the tip. It is mounted so as to mesh with the driven gear 22.

A crank 29 is eccentrically and rotatably mounted on the vertical slide driving motor 28, and a plate 30 slidably mounted in a vertical direction by a pin 24 mounted on one side of the crank 29 and a slider 31. A first claw 32 is attached to the plate 30, and a second claw 34 is attached to the electromagnet 33 so as to be vertically movable. It is attached so that it may contact the lower surface of.

A receiver 98 fixed to the upper end of the shaft 17 is rotatably mounted on the upper surface of the second claw 34 as described with reference to FIG. A spring 26 for urging the shaft 17 downward through a receiver 98 is attached to the shaft 93.

At the center of the supply units 2 and 3, a component recognition unit 121 for reading the attitude of the electronic component sucked by the suction nozzle 18 and calculating the shift amount of the electronic component 50 is provided.
122 are provided respectively.

Next, the operation of the thus-configured electronic component mounting apparatus according to the present embodiment will be described.

At the origin position of the rotary drive motor 20, the pin 24 attached to the crank 29 is lowered by the rotation of the vertical slide drive motor 28, whereby the plate 30 and the first claw 3 are moved along the slider 31.
2 is lowered, and the receiver 98 attached to the upper end of the shaft 17 is interlocked with the lowering of the first claw 32 via the second claw 34 by the urging force of the spring 26 arranged between the block 98 and the block 98. Then, the electronic component 50 is sucked.

Next, the posture of the electronic component 50 picked up by the component recognizing units 121 and 122 is read, the amount of displacement of the electronic component 50 is calculated and stored in the control unit 38 (not shown). The mounting head unit 10 moves to the mounting position corrected according to the deviation amount in the direction and the Y direction.

At this time, regarding the θ rotation direction, the control unit 38 controls the rotation driving motor 20 to rotate the suction nozzle 18 by an angle obtained by adding a deviation amount in the θ direction to a predetermined rotation angle. The rotation is performed in response to the instruction, so that the component mounting can be performed with high accuracy.

(Embodiment 5) Hereinafter, a fifth embodiment of the present invention will be described with reference to FIGS.
This will be described with reference to (a) and (b).

As shown in FIG. 23, a vertical slide driving motor 28 is mounted on a frame 109 via a bracket 119.
The output shaft 8 is provided with a shaft 102 to which a disk 103 is fixed at the tip via a coupling 101.
One end of a pin 104 is fixed to the disc 103 eccentrically to the shaft 102, the other end of the pin 104 is rotatably engaged with a plate 105, and the end of the plate 105
It has a structure in which a pin 108 rotatably engaged with the plate 30 is fixed.

A rail 106 fixed to a frame 109 and two bearings 107 slidably mounted in the vertical direction are fixed to the plate 30. Further, the plate 30 is slidable to a bearing block 37. A holder 98 is fixed to the upper part of the shaft 17 attached to the plate 30, and is in contact with the first claw 32 attached to the plate 30 via the second claw 34 by the bias of the spring 26. The shaft 17 is moved up and down by the up and down movement.

Next, the vertical movement of the suction nozzle 18 will be described with reference to FIGS.

First, as shown in FIGS. 23A and 23B, a state in which the suction nozzle 18 is raised with the pin 104 positioned above the shaft 102 is shown.
The vertical slide drive motor 2 is driven by a command (not shown).
8 rotates, and the rotation power is transmitted to the disk 103 attached to the tip of the shaft 102 via the coupling 101, and the pin 104 rotates.

With this rotation, the plate 105 is pushed down, and the pins 108 attached to the plate 105 push down the plate 30 along the rails 106. The downward movement of the plate 30 causes the first claw 32 to move downward. And the second claw 34 descends, and the spring 26
The shaft 17 is lowered by the urging force of the above to approach the printed circuit board 19 disposed below.

FIGS. 24A and 24B show a state in which the suction nozzle 18 has reached the lowest point.
As shown in FIGS. 25A and 25B, the suction nozzle 1 is controlled by controlling the rotation angle of the vertical slide drive motor.
The height of the electronic component 50 can be controlled, and the difference in height of the electronic component 50 and the variation in the height of the suction nozzle 18 at the time of suction and mounting can be controlled, and the impact on the electronic component 50 can be reduced. Can be.

Embodiment 6 Hereinafter, a sixth embodiment of the present invention will be described with reference to FIGS. 26 (a) and 26 (b).

FIG. 26A shows the first printed circuit board 95.
And the second printed circuit board 96 are one printed circuit board, and the distance A between the same electronic component 50 mounted on the first printed circuit board 95 and the second printed circuit board 96 is the suction nozzle 18. 3 shows a printed circuit board having a positive multiple of the mounting pitch.

FIG. 26 (b) shows a first printed circuit board 95, a second printed circuit board 96 and third,..., Fourth,.
Thus, a plurality of printed circuit boards are one printed circuit board, and the interval B between the same electronic components 50 mounted on each printed circuit board is a positive multiple of the mounting pitch of the suction nozzle 18. FIG. 2A shows a method of mounting the electronic component 50 on the printed circuit board shown in FIGS.
7, and will be described with reference to FIG.

First, as shown in FIG. 27, the selected suction nozzle 18 which sucks the same electronic component 51 to the suction nozzle 18 at the same interval as the interval between the first printed board 95 and the second printed board 96 is It has moved to the mounting position on the printed circuit board positioned on the rail 97.

Next, as shown in FIG.
The suction nozzle 18 that sucks the electronic component 51 descends, and simultaneously mounts the electronic component 51 at the component mounting position on the first printed board 95 and the second printed board 96.

Thus, it is possible to eliminate the movement of the mounting head during mounting, and mount electronic components at high speed.

(Embodiment 7) Hereinafter, a seventh embodiment of the present invention will be described with reference to FIG. 2, FIG. 29, and FIG.

First, as shown in FIG. 2, the first line sensor 12 and the second line sensor 13 for checking the suction state of the electronic component 50 are connected to the first supply unit 2 and the second supply unit 3. It is configured to be arranged at each central part.

With this arrangement, the first mounting head 10
After the electronic component 50 is sucked from the cassette 4 in the first supply unit 2 and the electronic component 50 is detected by the first line sensor 12, the electronic component 50 waits until the mounting of the second mounting head unit 11 is completed. In the state, when the first line sensor 12 is disposed between the table section 6 and the first supply section 2 as shown in FIG. 30, the first mounting head section 10 is mounted until the mounting of the second mounting head section 11 is completed. It is necessary to increase the gap B between the table unit 6 and the first line sensor 12 in order to avoid interference with the second mounting head unit 11 in a standby state. However, as shown in FIG. By arranging 12 at the center of the first supply unit 2, the gap A between the table unit 6 and the first supply unit 2 can be approached, can be smaller than the gap B, and the size of the entire apparatus Can be reduced.

After the electronic component 50 is sucked, when the first line sensor 12 recovers due to an abnormal mounting of the electronic component 50, the first line sensor 12 is set at the center of the first supply unit 2. As a result, the amount of movement of the mounting head is reduced, and the time can be reduced.

Embodiment 8 Hereinafter, an eighth embodiment of the present invention will be described with reference to FIGS. 31 (a) and 31 (b).

FIGS. 31 (a) and 31 (b) show a suction nozzle selecting mechanism according to the present embodiment, which is to be realized with a configuration different from that described in the first embodiment. is there.

In FIGS. 31 (a) and 31 (b), reference numeral 99 denotes a lock lever.
And by being attached by a spring 26 in a biased state,
As shown in FIG. 31A, the suction nozzle 18 does not descend when the tip of the lock lever 99 is engaged with the lower end of the receiver 98.

As shown in FIG. 31B, when the distal end of the lock lever 99 is disengaged from the lower end of the receiving member 98, the suction nozzle 18 is selected, and the suction nozzle 1 is selected.
8 can be lowered as the plate 30 and the first claw 32 are lowered. The configuration other than the components related to the lock lever 99 is the same as that of the first embodiment, and thus the detailed description is omitted.

FIG. 32 shows another example of the suction nozzle selecting mechanism according to the embodiment. As shown in FIG. 32, the shaft 17 is vertically movable and rotatable on the bearing block 37. Attached, a receiver 125 is fixed to the upper end of the shaft 17, and a receiver 126 is fixed to an intermediate portion. An electromagnet 33 is disposed above the receiver 125, and a hook 124 is fixed to a lower end of a shaft slidably mounted in the electromagnet 33, and the hook 124 is engaged with the receiver 125. The lower end of the receiver 125 is fixed to the plate 30, and is in contact with a second claw 32 that moves up and down in conjunction with the plate 30.

A spring 12 is provided between the bearing block 37 and the receiver 126 to urge the shaft 17 upward.
The shaft 17 and the suction nozzle 18 move up and down in conjunction with the up and down movement of the second claw 32 so that the mounting operation is possible.

By arranging the electromagnet 33 above the nozzle 17 in this manner, there is no uneven load on the shaft 17 and the sliding of the bearing block 37 and the nozzle 17 can be performed more smoothly.

In the above description, an example is shown in which the table section 6 is slid by the drive motor 14 and the ball screw 5, but other linear servo motors, racks &
A driving method for a pinion, a wire, or the like can be similarly implemented.

Further, the example in which the rotation of the mounting head unit is constituted by the rotation driving motor 20, the driving gear 21, and the rack 23 has been described, but it is also possible to employ a pulley and a belt.

The vertical movement of the mounting head can be similarly performed by performing the vertical slide drive motor 28 and the crank 29 with a cylinder, the slider 31 with a linear servomotor, or the crank 29 with a ball screw. is there.

[0112]

As described above, according to the present invention, the following advantageous effects can be obtained.

1. Since two mounting heads can simultaneously perform suction and mounting, the total tact can be reduced.

[0114] 2. When the arrangement pitch of a plurality of suction nozzles and the mounting pitch of a plurality of cassettes are configured to be the same size, a large number of electronic components can be suctioned at a time, the suction time can be reduced, and when mounting electronic components. The mounting head section only needs to move on the printed circuit board, and there is no movement of the suction head for picking up electronic components each time, so that the total time can be reduced.

3. Each of the suction nozzles can be sequentially moved up and down at a predetermined timing, and by operating only at least one of the plurality of suction nozzles selected from a plurality of nozzles, the electron at any position can be controlled by any of the suction nozzles. The component can be sucked and mounted, and the time required to move from the suction position to the mounting position can be shortened, and the total tact time can be improved, as compared with the operation of repeating suction and mounting each time.

4. On a printed circuit board having two or more identical circuits on a single printed circuit board, the electronic components of a plurality of circuits are simultaneously mounted by setting the mounting pitch of the circuit to be a positive multiple of the pitch of the suction nozzles of the mounting head. And the mounting time can be shortened.

5. By arranging a line sensor for detecting the sucked electronic component at the center of the component supply unit, the total tact time can be reduced and the machine size can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of the same.

FIG. 3A is a front view of a main part showing a driving unit of a mounting head of the apparatus. FIG.

FIG. 4 is a partially cutaway perspective view showing details of a mounting head of the electronic component mounting apparatus.

FIG. 5 is a side view of a mounting nozzle in the electronic component mounting apparatus.

FIG. 6 is a perspective view showing the overall configuration of a cassette mounted on the electronic component mounting apparatus.

FIG. 7 is an essential part perspective view showing a front end portion of the cassette.

FIG. 8 is a main part plan view for explaining the positioning operation of the cassette.

FIG. 9 is a plan view for explaining an operation from suction to mounting in the electronic component mounting apparatus.

FIG. 10 is a plan view for explaining an operation from suction to mounting in the electronic component mounting apparatus.

FIG. 11 is a front view for explaining an operation of simultaneously sucking electronic components in the electronic component mounting apparatus.

FIG. 12 is a side view of the suction nozzle for explaining the operation of the suction nozzle in the electronic component mounting apparatus.

FIG. 13 is a side view of the suction nozzle for explaining the operation of the suction nozzle in the electronic component mounting apparatus.

FIG. 14 is a side view of the suction nozzle for describing the operation of the suction nozzle in the electronic component mounting apparatus.

FIG. 15 is an exemplary front view for explaining an operation of sequentially sucking electronic components according to the second embodiment of the present invention;

FIG. 16 is an exemplary front view for explaining an operation of sequentially sucking electronic components according to the second embodiment of the present invention;

FIG. 17 is an exemplary front view for explaining an operation of sequentially sucking electronic components according to the second embodiment of the present invention;

FIG. 18 is an exemplary front view for explaining an operation of sequentially sucking and moving electronic components according to the third embodiment of the present invention;

FIG. 19 is an exemplary front view for explaining an operation of sequentially sucking and moving electronic components according to the third embodiment of the present invention;

FIG. 20 is an exemplary front view for explaining an operation of sequentially sucking and moving electronic components according to the third embodiment of the present invention;

FIG. 21 is a partially cutaway perspective view showing details of a mounting head unit according to a fourth embodiment of the present invention.

FIG. 22 is a plan view of the electronic component mounting apparatus.

FIG. 23A is a side sectional view for explaining the operation of the mounting head unit according to the fifth embodiment of the present invention.

FIG. 24 (a) is a side sectional view of the same, and (b) is a front view of the same.

FIG. 25 (a) is a side sectional view of the same, and (b) is a front view of the same.

FIG. 26 is a plan view of a printed circuit board having many circuits on one printed circuit board according to the sixth embodiment of the present invention.

FIG. 27 is an essential part perspective view for explaining the operation in the case of mounting a printed circuit board having a large number of circuits in the sixth embodiment;

FIG. 28 is an essential part perspective view for explaining the operation when a printed circuit board having a large number of circuits is mounted in the sixth embodiment;

FIG. 29 is a front view of an electronic component mounting apparatus according to a seventh embodiment of the present invention.

FIG. 30 is a front view of the electronic component mounting apparatus according to the seventh embodiment.

FIG. 31 is a side view of the suction nozzle for describing the operation of the suction nozzle according to the eighth embodiment of the present invention.

FIG. 32 is a side view of a suction nozzle according to another example of the eighth embodiment.

FIG. 33 is a perspective view showing the configuration of a conventional electronic component mounting apparatus.

FIG. 34 is a perspective view showing a configuration of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Housing 2 1st supply part 3 2nd supply part 4 Cassette 6 Table part 7 Guide rail 8 Guide rail 9 Upper frame 10 First mounting head part 11 Second mounting head part 12 First line sensor 13 Second line sensor 14 Drive motor 15 Loader section 16 Unloader section 17 Shaft 18 Suction nozzle 19 Printed circuit board 20 Rotary drive motor 21 Drive gear 22 Follower gear 23 Rack 24 Pin 25 Positioning holder 26 Spring 27 Positioning pin 28 For vertical sliding drive Motor 29 Crank 30 Plate 31 Slider 32 First claw 33 Electromagnet 34 Second claw 36 Rack receiver 37 Bearing block 38 Control unit 50 Electronic component

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Takashi Munemi 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Manabu Morioka 1006 Odaka Kadoma Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (72) Inventor Takayoshi Kado 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Takaaki Fuji 1006 Odaka Kazuma Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Noboru Furuta Osaka Matsushita Electric Industrial Co., Ltd.

Claims (11)

[Claims] A plurality of cassettes for sequentially supplying electronic components are arranged adjacent to each other, each of which is linearly arranged at a predetermined interval; A table section for holding a printed circuit board for mounting electronic components, which is slidably disposed in the same direction as the electronic component supply direction in the predetermined space between the supply sections, and a plurality of suction sections for sucking the electronic components; First, the nozzle is held movably up and down, and the first and the second table are slidably disposed in the direction orthogonal to the sliding direction of the table above the first and second supply units.
An electronic component mounting apparatus comprising a second mounting head and a control unit for controlling the second mounting head. 2. The arrangement pitch of the plurality of suction nozzles respectively held by the first and second mounting head units is the same as the arrangement pitch of each cassette arranged adjacent to the first and second supply units. The electronic component mounting device according to claim 1. 3. The suction nozzle held by the second mounting head unit when the suction nozzle held by the first mounting head unit is sucking an electronic component supplied from the first supply unit. It operates so as to suck the electronic component on the printed circuit board held by the table unit, and conversely, the suction nozzle held by the second mounting head unit sucks the electronic component supplied from the second supply unit. 3. The electronic component mounting apparatus according to claim 1, wherein the suction nozzle held by the first mounting head operates to mount the electronic component on the printed circuit board held by the table. . 4. A supporting member for supporting first and second mounting heads slidably disposed in a direction orthogonal to a sliding direction of the table above the first and second supply units, first,
A cross section in a direction orthogonal to the sliding direction of the second mounting head is formed in an H-shape, and ends of the first and second mounting heads are slidably supported at both lower ends of the H-shape. The electronic component mounting apparatus according to any one of claims 1 to 3, further comprising a drive mechanism for sliding the first and second mounting heads on the lower surface side of the substantially central portion of the H-shape. 5. The electronic component mounting according to claim 1, wherein a plurality of suction nozzles respectively held by the first and second mounting heads are simultaneously moved up and down. apparatus. 6. The electronic device according to claim 1, wherein the plurality of suction nozzles respectively held by the first and second mounting head units sequentially move up and down at predetermined timings. Component mounting device. 7. A plurality of suction nozzles respectively held by the first and second mounting heads, each of which operates only at least one or more arbitrary suction nozzles selected from the plurality. Item 7. The electronic component mounting device according to Item 5 or 6. 8. A pick-up mechanism for operating only an arbitrary suction nozzle from among a plurality of suction nozzles which moves up and down in accordance with the elevating and lowering members respectively attached to the first and second mounting heads. 8. The electronic component mounting apparatus according to claim 7, wherein the selection is performed by a switching mechanism provided to hold the suction nozzle and prevent the suction nozzle from descending. 9. The first and second mounting heads each include a rotation mechanism for rotating a plurality of suction nozzles respectively held by the first and second mounting heads.
Electronic component mounting apparatus according to any one of the above. 10. A nozzle height adjusting mechanism for changing a position of a bottom dead center when a plurality of suction nozzles respectively held by the first and second mounting heads are moved up and down. The electronic component mounting device according to any one of claims 1 to 9, wherein 11. The electronic device according to claim 1, wherein sensors for detecting the presence and absence of an electronic component sucked by the suction nozzle and a suction state are provided in the first and second supply units, respectively. Component mounting device.