JP3755181B2 - Electronic component mounting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus used when mounting a chip-type electronic component for surface mounting used in various electronic circuits on a printed circuit board.
[0002]
[Prior art]
A conventional electronic component mounting apparatus will be described with reference to FIGS. FIGS. 10 to 12 are recently developed, but reference numerals 2 and 3 denote first and second supply units arranged on the housing 1 adjacent to a plurality of cassettes 4 for sequentially supplying electronic components. The first and second supply units 2 and 3 are arranged on a straight line with a predetermined interval between them, and are the predetermined parts that are intermediate portions of the first and second supply units 2 and 3. A table portion 6 is disposed in the interval portion. The table portion 6 holds a printed circuit board 19 on which electronic components are to be mounted, and rotates the drive motor 14 in the same direction as the electronic component supply direction (Y direction). Through the guide rail 7.
[0003]
FIG. 12 shows a part of the first and second mounting head portions 60 and 61 (only one of them is shown in the figure), and the rotary drive motor 20 and the vertical slide drive motor 28 are attached. The drive gear 21 attached to the rotation drive motor 20 meshes with the rack 23 slidably held by the rack receiver 36, and this rack 23 is connected to the driven gear 22 held by each suction nozzle 18. Because of the meshing structure, all the suction nozzles 18 rotate with the rotation of the rotation drive motor 20.
[0004]
A crank 29 is attached to the vertical slide drive motor 28, and the crank 29 is rotatably attached to a plate 30 to which a claw 32 is attached via a pin 19. With the rotation of the vertical slide drive motor 28, the crank 29 and the pin 19 are moved up and down, whereby the plate 30 and the tab 32 are also moved up and down, so that all the suction nozzles 18 are moved up and down.
[0005]
[Problems to be solved by the invention]
Recently, a high-speed electronic component mounting device is required. However, in the above-described configuration, the plurality of suction nozzles 18 are rotated and moved up and down at the same time in one mounting operation, and the rotation angle and the vertical movement of the suction nozzles 18 are simultaneously controlled. Since the amount of movement is the same for all the suction nozzles 18, the arrangement pitch of the plurality of suction nozzles 18 held by the mounting head portion is equal to the mounting pitch of the electronic component mounting pattern on the printed circuit board 19, and the mounting angle and the electronic component are the same. If the thicknesses are equal, it has the advantage that a plurality of electronic components can be mounted on the printed circuit board 19 at the same time. However, if each mounting angle is different or each component thickness is different, a plurality of electronic components can be simultaneously mounted. There was a problem that parts could not be mounted and the speed could not be increased.
[0006]
An object of the present invention is to solve such a conventional problem and to provide an electronic component mounting apparatus capable of high-speed mounting.
[0007]
[Means for Solving the Problems]
In order to solve this problem, according to the present invention, the mounting head unit is provided with the same number of suction nozzle rotating motors as the plurality of suction nozzles held by the mounting head unit, and the plurality of suction nozzles are simultaneously rotated at different angles. It is configured.
[0008]
According to the present invention, an electronic component mounting apparatus capable of high-speed mounting is obtained.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
According to the first aspect of the present invention, a plurality of cassettes that house a plurality of electronic components and sequentially supply them are arranged, each of which is arranged on a straight line at a predetermined interval. And a printed circuit board for mounting an electronic component, which is slidably disposed in the same direction as the supply direction of the electronic component, is held in the intermediate portion between the first and second supply units. A first portion and a second portion that are slidably arranged in a direction perpendicular to the sliding direction of the table portion above the table portion by holding the table portion and a plurality of suction nozzles that suck electronic components. Consists of a mounting head section and a control section for controlling these, and configured to operate so that the plurality of suction nozzles respectively held by the first and second mounting head sections rotate simultaneously at different angles. Held by the mounting head Also mounting angle of the electronic component sucked by the suction nozzle numbers are different individually, has the effect of speed can be of be installed simultaneously.
[0010]
According to a second aspect of the present invention, in the first aspect of the present invention, the plurality of suction nozzles respectively held by the first and second mounting head portions are moved up and down at different amounts of movement simultaneously. Even if the component thicknesses of the electronic components sucked by the plurality of suction nozzles held by the mounting head unit are different from each other, they can be simultaneously mounted and the speed can be increased.
[0011]
Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
1 is a perspective view showing the overall configuration of the electronic component mounting apparatus according to the embodiment, FIG. 2 is a plan view thereof, FIG. 3 is a perspective view showing the mounting head portion, and FIG. 4 is a side view thereof.
[0012]
The electronic component mounting apparatus according to the embodiment of the present invention shown in FIGS. 1 and 2 has basically the same configuration as the conventional electronic component mounting apparatus shown in FIGS. Are given the same numbers, and detailed description thereof is omitted.
[0013]
In FIGS. 1 and 2, reference numerals 10 and 11 denote first and second mounting head units 10 that hold a plurality of suction nozzles 18 that suction and hold electronic components so as to be movable up and down. , 11 are slidable independently in the direction (X direction) perpendicular to the supply direction of the electronic components via the guide rail 8 on the lower surface of the upper frame 9 coupled on the housing 1.
[0014]
15 is a loader unit for transporting the printed circuit board 19 to the table unit 6, 16 is an unloader unit for unloading the printed circuit board 19 from the table unit 6, and 12 and 13 are allocated to the first and second supply units 2 and 3, respectively. These are first and second line sensors for detecting the height of the electronic components sucked and held by the suction nozzles 18 of the first and second mounting head portions 10 and 11, respectively. The second line sensors 12 and 13 are provided with grooves through which the suction nozzle 18 that sucks and holds electronic components can pass in the X direction. A control unit 38 controls the whole.
[0015]
3 is a perspective view showing the first and second mounting head portions 10 and 11 (only one of them is shown in the figure), FIG. 4 is a side view thereof, and a plurality of suction nozzles 18 are connected to the shaft 17. The shaft 17 is attached to the block 37 so as to be vertically movable and rotatable. The same number of suction nozzle rotating motors 51 and suction nozzle up / down motors 54 as the suction nozzles 18 are attached to the block 37, and the suction nozzles 18 are paired with each other.
[0016]
A first drive gear 52 attached to the suction nozzle rotating motor 51 is attached so as to mesh with a second drive gear 53 attached to the shaft 17.
[0017]
A small-diameter portion of the shaft 17 is rotatably engaged with a groove provided in the nut 57, and the nut 57 is attached to the suction nozzle vertical motor 54 and is guided by a ball screw 55 held at the lower end by a bearing 56. It is attached to be slidable in the vertical direction via
[0018]
FIG. 5 shows the configuration of a plurality of cassettes 4 disposed adjacent to the first and second supply units 2 and 3, and as shown in FIG. 5, the case 41 has a lid for containing the electronic component 50. 44, the first space 45, and the weir 47 for sending the electronic component 50 to the second space 46 little by little are provided. In the second space 46, an elevating block 49 that moves up and down is inserted and coupled to the lower part, and a chute groove 43 for aligning and lowering and transporting the electronic components 50 is provided.
[0019]
In addition, the entire surface of the case 41 is covered with an acrylic plate 42 that is electrostatically protected, so that the electronic component 50 can be seen from this surface. On the exit side of the chute groove 43, a shutter 31 that opens and closes only during supply, a guide pin 32 that guides the shutter 31, and a lever 33 that opens and closes the shutter 31 are provided.
[0020]
FIG. 6 is a perspective view of a main part for explaining the positioning part of the cassette 4 shown in FIG. 5, and FIG. 7 is a plan view of the main part. 5 and 6, a lever 33 is provided at the tip of the chute groove 43 to open and close the shutter 31 and to move the stopper 34 back and forth. Further, the first vacuum groove 35 and the first vacuum hole 36 for positioning the electronic component 50 are provided on the front end of the chute groove 43 and the side surface in the vicinity of the front end, and the electrons in the chute groove 43 are located slightly before the front end. A second vacuum groove 39 and a second vacuum hole 40 for facilitating the feeding of the component 50 to the outlet side and for separating the electronic component 50 behind the leading electronic component 50 are provided.
[0021]
The operation of the electronic component mounting apparatus of the present invention configured as described above will be described below. First, positioning of the electronic component 50 in the cassette 4 will be described with reference to FIGS. The electronic component 50 that has flowed through the chute groove 43 is stopped by a stopper 34 at the tip of the cassette 4. The second vacuum hole 40 and the second vacuum groove 39 are also under negative pressure, and the electronic component 50 is sucked and fixed by the positioning side wall 62 of the second vacuum groove 39, and the stopper 34 is moved by the movement of the lever 33. Moves in the same direction as the flow direction of the electronic component 50 by the amount of movement indicated by a in the figure, and the electronic component 50 at the tip becomes free. At this time, the first vacuum hole 36 and the first vacuum groove 35 are under negative pressure, and the electronic component 50 is attracted to the first vacuum hole 36 and positioned by the positioning end 63 and the positioning side wall 62.
[0022]
Next, the suction operation of the electronic component 50 positioned in this way will be described. As shown in FIGS. 3 and 4, the ball screw 55 is rotated by the rotation of the suction nozzle up / down motor 54, and the nut 57 is lowered along the guide rail 58, whereby the shaft 17 and the suction nozzle 18 are lowered. The suction nozzle 18 that has moved down stops at a height at which the suction nozzle 18 is in contact with the electronic component 50 positioned by the positioning portion of the cassette 4 and is switched to a vacuum by an electromagnetic valve (not shown). Adsorb 50.
[0023]
Next, the suction nozzle up / down motor 54 rotates in the direction opposite to the above rotation, the suction nozzle 18 rises and stops at the top dead center, and the first mounting head portion 10 moves in the direction of the line sensor 12, The presence / absence of the electronic component 50, standing suction and the like are detected, and the thickness of the electronic component 50 is stored in the control unit 38 for each suction nozzle 18. In this way, the first mounting head unit 10 that has attracted the electronic component 50 moves to a predetermined mounting position on the printed circuit board 19 held by the table unit 6.
[0024]
In order to rotate the electronic components 50 sucked by the plurality of suction nozzles 18 in the individually determined mounting directions, the plurality of suction nozzle rotation motors 51 are individually controlled by the control unit 38 and rotated. This is transmitted to the second drive gear 53 meshed with the one drive gear 52, and the shaft 17 and the suction nozzle 18 are rotated accordingly.
[0025]
Next, the ball screw 55 is rotated by the rotation of the suction nozzle up / down motor 54, and the nut 57 is lowered along the guide rail 58, whereby the shaft 17 and the suction nozzle 18 are lowered.
[0026]
When the mounting head 10 passes the line sensor 12 from the height (a in FIG. 8) between the lower end of the suction nozzle 18 and the printed circuit board 19 when the suction nozzle 18 is at the top dead center, it is stored in the control unit 38. The height (c in FIG. 8) obtained by subtracting the thickness (b in FIG. 8) of the electronic component 50 is calculated by the control unit 38, and the suction vertical motor 54 is controlled so that the suction nozzle 18 is lowered by this height. Control is performed by the unit 38. In addition, the above operation is performed simultaneously for each of the plurality of suction nozzles 18.
[0027]
Then, as shown in FIG. 9, when the electronic component 50 sucked by the plurality of suction nozzles 18 reaches a height at which it abuts against the printed circuit board 19, it is switched from vacuum to positive pressure by a solenoid valve (not shown). The electronic component 50 is mounted on the substrate 19.
[0028]
Next, the suction nozzle up / down motor 54 rotates in the direction opposite to the above rotation, the suction nozzle 18 rises and stops at the top dead center, the vertical movement is repeated, and the electronic component 50 is mounted. The mounting head unit 10 moves to the first supply unit 2, and at the same time, the plurality of suction nozzle rotating motors 51 rotate in the opposite direction to the above and stop at the origin.
[0029]
As described above, the first mounting head unit 10 sucks and mounts the electronic component 50 supplied from the first supply unit 2 on the printed circuit board 19 and is held by the first mounting head unit 10. The arrangement pitch of the plurality of suction nozzles 18 and the arrangement pitch of the plurality of cassettes 4 arranged in the first supply unit 2 are set to the same size, and the first mounting head unit 10 and the first supply unit 2 are a pair. It has become a relationship. With such a configuration, a plurality of different types of electronic components can be mounted at different mounting angles in a single mounting operation.
[0030]
In addition, the second mounting head unit 11 and the second supply unit 3 have a paired relationship as described above, and the first mounting head unit 10 sucks the electronic component 50 by the first supply unit 2. During the operation, the second mounting head unit 11 operates to mount the sucked electronic component 50 on the printed circuit board 19, and conversely, the electronic component 50 sucked by the first mounting head unit 10 is printed. The second mounting head unit 11 is configured to suck the electronic component 50 with the second supply unit 3 when mounted on the substrate 19, and eliminates wasteful operations and at a high speed. It is possible to perform mounting.
[0031]
In the above description, the example in which the table unit 6 is configured to slide with the drive motor 14 and the ball screw 5 has been described. However, other linear motors, rack and pinions, wires, and the like can be similarly implemented. is there.
[0032]
Moreover, although the example which comprised rotation of the adsorption nozzle 18 of the mounting head parts 10 and 11 with the adsorption nozzle rotation motor 51, the 1st drive gear 52, and the 2nd drive gear 53 was shown, it is comprised with a pulley and a belt other than that. Even implementation is possible.
[0033]
In addition, although the example in which the vertical movement of the suction nozzle 18 of the mounting head portions 10 and 11 is configured to slide with the suction nozzle vertical motor 54 and the ball screw 55 is shown, the suction nozzle vertical motor 54 and the ball screw 55 are also linear motors. Alternatively, the ball screw 55 can be implemented similarly by using a crank.
[0034]
【The invention's effect】
As described above, according to the present invention, the following advantageous effects can be obtained.
[0035]
1. Since the rotation angles of multiple suction nozzles can be controlled individually, multiple electronic components can be mounted in different mounting directions in a single mounting operation, and the mounting time per electronic component can be shortened. I can plan.
[0036]
2. Since the amount of descending of multiple suction nozzles can be controlled individually, even if the thickness of the electronic components sucked by multiple suction nozzles is different, it is possible to install them simultaneously without changing the suction nozzle for each electronic component. Yes, it is possible to deal with a wide variety of electronic components with a single suction nozzle and to shorten the mounting time per electronic component.
[0037]
3. Since the rotation angle of multiple suction nozzles can be controlled individually, the direction of the suction nozzles can be adjusted individually in the direction of electronic component supply, even if the supply directions of electronic components supplied from multiple cassettes installed in the supply unit are different. It is possible to pick up a plurality of electronic components at the same time, and the total tact time can be shortened.
[0038]
4). Since the lowering amount of the plurality of suction nozzles can be individually controlled, the lowering amount of the suction nozzle can be set to the height of the electronic component even if the heights of the electronic components supplied from the plurality of cassettes installed in the supply unit are different. By combining them individually, a plurality of electronic components can be picked up at the same time, and the total tact time can be shortened.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a plan view. FIG. 3 is a perspective view showing details of a mounting head portion of the electronic component mounting apparatus. FIG. 5 is a perspective view showing an overall configuration of a cassette mounted on the electronic component mounting apparatus. FIG. 6 is a perspective view of a main part showing a front end portion of the cassette. FIG. FIG. 8 is a main part plan view showing a state before the electronic component mounting apparatus shown in FIG. 1 is mounted. FIG. 9 is a main part plan view showing a state when the electronic component mounting apparatus shown in FIG. 10 is a perspective view showing a configuration of a conventional electronic component mounting apparatus. FIG. 11 is a plan view of the electronic component mounting apparatus shown in FIG. 10. FIG. 12 shows details of a mounting head portion of the electronic component mounting apparatus shown in FIG. Perspective view showing essential parts [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Housing 2 1st supply part 3 2nd supply part 4 Cassette 5 Ball screw 6 Table part 7 Guide rail 8 Guide rail 9 Upper frame 10 First mounting head part 11 Second mounting head part 12 First line sensor 13 Second line sensor 14 Drive motor 15 Loader unit 16 Unloader unit 17 Shaft 18 Suction nozzle 19 Printed circuit board 37 Bearing block 38 Control unit 50 Electronic component 51 Suction nozzle rotation motor 52 First drive gear 53 Second drive gear 54 Suction nozzle vertical motor 55 Ball screw 56 Bearing 57 Nut 58 Guide rail

Claims (2)

A plurality of cassettes that house a plurality of electronic components and sequentially supply them are arranged, and each of the first and second supply units is arranged on a straight line with a predetermined interval between the first and second supply units. A table unit for holding a printed circuit board for mounting electronic components, which is slidably arranged in the same direction as the supply direction of the electronic components at the predetermined interval portion that is in the middle of the supply unit, and a plurality of suctions for sucking the electronic components From the first and second mounting head portions that are arranged to be slidable in a direction perpendicular to the sliding direction of the table portion above the table portion while holding the nozzles up and down, and a control unit that controls them An electronic component mounting apparatus configured to be operable to simultaneously rotate a plurality of suction nozzles respectively held by the first and second mounting head portions at different angles. 2. The electronic component mounting apparatus according to claim 1, wherein the plurality of suction nozzles respectively held by the first and second mounting head portions can be moved up and down by different amounts of movement simultaneously.

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