JPH09275299A - Electronic component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting device, which mounts surface mounting correspondence chip-type electronic components, which are used for multiple types of electronic circuits, on a printed board and can mount simultaneously a plurality of types of the chip-type electronic components in the individually decided directions. SOLUTION: An electronic component mounting device is formed into a constitution, wherein each of first and second mounting head parts 10 and 11, which are respectively provided with a plurality of pieces of suction nozzles 18 for sucking electronic components, is provided with suction nozzle rotating motor 51 and upper and lower suction nozzle motor 54 of the same number as that of the nozzles 18, and the vertical motion of the plurality of the nozzles 18 and the amount of rotation of the nozzles 18 can be individually controlled simultaneously, whereby a plurality of types of the electronic components can be simultaneously mounted on a printed board and the speedup of an electronic component mounting device is contrived.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus used for mounting a chip-type electronic component for surface mounting used on various electronic circuits on a printed circuit board.

[0002]

2. Description of the Related Art A conventional electronic component mounting apparatus is shown in FIG.
This will be described with reference to FIG. 10 to 12, which have been recently developed, 2 and 3 are first and second supply units in which a plurality of cassettes 4 for sequentially supplying electronic components are arranged adjacent to each other on the housing 1. The first and second supply sections 2 and 3 are arranged on a straight line with a predetermined interval therebetween, and the predetermined section becomes an intermediate section between the first and second supply sections 2 and 3. A table portion 6 is disposed in the space, and the table portion 6 holds a printed circuit board 19 on which electronic components are mounted, and rotates the drive motor 14 in the same direction as the electronic component supply direction (Y direction) to rotate the ball screw 5. Through the guide rail 7
It is slidable by.

FIG. 12 shows the first and second mounting head portions 6
0, 61 (only one of them is shown in the figure) is shown, and the rotary drive motor 20 and the vertical slide drive motor 28 are attached to the rotary drive motor 20. The drive gear 21 has a rack receiver 36.
Meshes with a rack 23 slidably held by the driven gear 22 held by each suction nozzle 18.
Since it has a structure that meshes with the rotary drive motor 20,
All the suction nozzles 18 also rotate with the rotation of.

A crank 29 is attached to the vertical slide drive motor 28, and the crank 29 is rotatably attached to a plate 30 to which a claw 32 is attached via a pin 19. With the rotation of the vertical slide drive motor 28, the crank 29 and the pin 19 move up and down, and the plate 30 and the tab 32 also move up and down, whereby all the suction nozzles 18 move up and down.

[0005]

Recently, a high-speed electronic component mounting apparatus has been demanded, but in the above configuration, a plurality of suction nozzles 18 are simultaneously rotated and moved up and down in one mounting operation. Since the rotation angle and the amount of vertical movement are the same in all the suction nozzles 18,
If the arrangement pitch of the plurality of suction nozzles 18 held by the mounting head portion and the mounting pitch of the electronic component mounting pattern on the printed circuit board 19 are equal, and the mounting angle and the thickness of the electronic component are equal, a plurality of electronic components are simultaneously formed. However, if the respective mounting angles are different or the respective component thicknesses are different, it is not possible to mount a plurality of electronic components at the same time and it is not possible to achieve high speed. Had.

The present invention solves such a conventional problem,
It is an object of the present invention to provide an electronic component mounting device capable of high-speed mounting.

[0007]

In order to solve this problem, the present invention provides a plurality of suction nozzle rotation motors in the mounting head portion as many as the plurality of suction nozzles held in the mounting head portion. Is configured to rotate at different angles at the same time.

According to the present invention, an electronic component mounting apparatus capable of high-speed mounting can be obtained.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION According to the first aspect of the present invention, a plurality of cassettes for accommodating a plurality of electronic components and sequentially supplying them are arranged, and each cassette is arranged on a straight line at a predetermined interval. The first and second supply parts, and the electronic component mounting slidably arranged in the same direction as the electronic component supply direction in the predetermined space between the first and second supply parts. And a plurality of suction nozzles for sucking electronic components are held in a vertically movable manner, and are arranged above the table so as to be slidable in a direction orthogonal to the sliding direction of the table. The first and second mounting head sections and a control section for controlling them, so that the plurality of suction nozzles respectively held by the first and second mounting head sections are simultaneously rotated at different angles. It is configured to work with Tsu also mounting angle of the electronic component sucked to the plurality of suction nozzles held by the de unit is individually different, has the effect of speed can be of be installed simultaneously.

According to a second aspect of the present invention, in the first aspect of the invention, the plurality of suction nozzles respectively held by the first and second mounting head portions are simultaneously moved up and down by different movement amounts. Since the electronic components sucked by the plurality of suction nozzles held by the mounting head portion have different thicknesses, the components can be simultaneously mounted and the speed can be increased.

FIG. 1 shows an embodiment of the present invention.
This will be described with reference to FIG. 1 is a perspective view showing the overall configuration of the electronic component mounting apparatus of the same embodiment, FIG. 2 is a plan view thereof, FIG. 3 is a perspective view showing the mounting head portion, and FIG. 4 is a side view thereof.

The electronic component mounting apparatus of the embodiment of the present invention shown in FIGS. 1 and 2 has basically the same configuration as the conventional electronic component mounting apparatus shown in FIGS. 10 and 11.
The same components are assigned the same reference numerals and detailed description thereof will be omitted.

In FIGS. 1 and 2, reference numerals 10 and 11 denote first and second mounting head portions that hold a plurality of suction nozzles 18 that suction-hold electronic components so that they can be raised and lowered. The head portions 10 and 11 are independently slidable in a direction (X direction) orthogonal to the supply direction of electronic components via a guide rail 8 on the lower surface of an upper frame 9 coupled to the housing 1.

Reference numeral 15 is a loader section for carrying the printed circuit board 19 to the table section 6, 16 is an unloader section for carrying out the printed circuit board 19 from the table section 6, and 12 and 13
Are arranged in the first and second supply units 2 and 3, respectively, and are used to detect the height of the electronic components sucked and held by the suction nozzles 18 of the first and second mounting head units 10 and 11, respectively. first,
This is a second line sensor, and the first and second line sensors 12 and 13 are provided with a groove through which a suction nozzle 18 that suction-holds an electronic component can pass in the X direction. Reference numeral 38 is a control unit for controlling the whole.

FIG. 3 shows the first and second mounting head portions 10,
11 (only one is shown in the figure), and FIG. 4 is a side view of the same. A plurality of suction nozzles 18 are attached inside a shaft 17 so as to be vertically movable, and the shaft 17 is The block 37 is attached so as to be vertically movable and rotatable. The same number of suction nozzle rotation motors 51 and suction nozzle vertical motors 54 as the suction nozzles 18 are attached to the block 37, and the suction nozzles 18 and the vertical motors 54 are in a pair with the suction nozzles 18, respectively.

A first drive gear 52 attached to the suction nozzle rotation motor 51 is attached so as to mesh with a second drive gear 53 attached to the shaft 17.

The shaft 17 is inserted into the groove formed in the nut 57.
The small diameter portion of the guide rail 5 is rotatably engaged, and the nut 57 is attached to the suction nozzle vertical motor 54 and is guided by the ball screw 55 whose lower end is held by the bearing 56.
It is attached so as to be slidable in the vertical direction via 8.

FIG. 5 shows the structure of a cassette 4 which is arranged adjacent to the first and second supply sections 2 and 3.
As shown in FIG. 5, the case 41 is provided with a lid 44 for containing the electronic component 50, a first space 45, and a weir 47 for feeding the electronic component 50 little by little into the second space 46. In addition, an elevating block 49, which moves up and down, is inserted into the lower space of the second space 46 and is coupled to the second space 46, and a chute groove 43 for aligning and lowering and transporting the electronic components 50.
Is provided.

Further, the entire surface of the case 41 is covered with an antistatic acrylic plate 42 so that the electronic component 50 can be seen from this surface. At the exit side of the chute groove 43, a shutter 31 that opens and closes only when supplied, and a shutter 31
A guide pin 32 for guiding the shutter and a lever 33 for opening and closing the shutter 31 are provided.

FIG. 6 is a perspective view of a main part for explaining the positioning part of the cassette 4 shown in FIG. 5, and FIG. 7 is a plan view of the main part. The chute groove 43 in FIGS.
A lever 33 is provided at the tip of the shutter to open and close the shutter 31 and move the stopper 34 back and forth. A first vacuum groove 35 and a first vacuum hole 36 for positioning the electronic component 50 are provided on the tip of the chute groove 43 and on the side surface near the tip.
And, a little before the tip, a second vacuum groove for facilitating the feeding of the electronic component 50 into the chute groove 43 to the outlet side and separating the electronic component 50 behind the leading electronic component 50. 39 and a second vacuum hole 40 are provided.

The operation of the electronic component mounting apparatus of the present invention thus constructed will be described below. First, the positioning of the electronic component 50 on the cassette 4 will be described with reference to FIGS. 6 and 7. Electronic component 5 flowing through chute groove 43
0 is stopped by a stopper 34 at the tip of the cassette 4. The second vacuum hole 40 and the second vacuum groove 39 are also under negative pressure, and the electronic component 50 is sucked and fixed by the positioning side wall 62 of the second vacuum groove 39, and the stopper 34 is moved by the movement of the lever 33. Moves in the same direction as the flow direction of the electronic component 50 by the amount of movement indicated by a in the figure, and the electronic component 50 at the tip end becomes free. At this time, the first vacuum hole 3
6, the first vacuum groove 35 has a negative pressure, the electronic component 5
0 is attracted to the first vacuum hole 36 and positioned by the positioning end 63 and the positioning side wall 62.

Next, the suction operation of the electronic component 50 thus positioned will be described. As shown in FIGS. 3 and 4, by the rotation of the suction nozzle up / down motor 54,
The ball screw 55 rotates and the nut 57 descends along the guide rail 58, whereby the shaft 17 and the suction nozzle 18 descend. The suction nozzle vertical motor 54 is stopped at the height of the lowered suction nozzle 18 at the height at which the suction nozzle 18 contacts the electronic component 50 positioned by the positioning portion of the cassette 4, and the solenoid valve (not shown) switches the vacuum to the electronic component. Adsorb 50.

Next, the suction nozzle vertical motor 54 rotates in the opposite direction to the above-mentioned rotation, the suction nozzle 18 rises and stops at the top dead center, and the first mounting head portion 10 moves toward the line sensor 12.
Moves, and when the electronic component 50 is present, the presence or absence of the electronic component 50, vertical suction, etc. are detected, and the thickness of the electronic component 50 is detected by the suction nozzle 1.
It is stored in the control unit 38 every eight. In this way, the first mounting head unit 10 that sucks the electronic component 50 is the table unit 6
It moves to a predetermined mounting position on the printed circuit board 19 held by.

In order to rotate the electronic components 50 sucked by the plurality of suction nozzles 18 in the individually determined mounting directions,
The plurality of suction nozzle rotation motors 51 are individually controlled and rotated by the control unit 38, and the rotations thereof are transmitted to the second drive gear 53 meshed with the first drive gear 52, and accordingly, the shaft 17 and the suction motor. The nozzle 18 is rotated.

Next, the ball screw 55 is rotated by the rotation of the suction nozzle vertical motor 54, and the nut 57 is lowered along the guide rail 58, whereby the shaft 17 and the suction nozzle 18 are lowered.

When the mounting head 10 passes the line sensor 12 from the height (a in FIG. 8) between the lower end of the suction nozzle 18 and the printed circuit board 19 when the suction nozzle 18 is at the top dead center, the control unit 38 is detected. The control unit 38 calculates a height (c in FIG. 8) obtained by subtracting the thickness (b in FIG. 8) of the electronic component 50 stored in the suction unit 18 and lowers the suction nozzle 18 by this height. The control unit 38 controls 54.
Further, the above operation is simultaneously performed individually for each of the plurality of suction nozzles 18.

Then, as shown in FIG. 9, when the electronic components 50 sucked by the plurality of suction nozzles 18 reach a height at which they come into contact with the printed circuit board 19, a solenoid valve (not shown) switches from vacuum to positive pressure. Then, the electronic component 50 is mounted on the printed circuit board 19.

Next, the suction nozzle up / down motor 54 rotates in the opposite direction to the above rotation, the suction nozzle 18 rises and stops at the top dead center, and this up / down operation is repeated to mount the electronic component 50. The first mounting head unit 10 moves to the first supply unit 2, and simultaneously a plurality of suction nozzle rotation motors 51
Rotates in the opposite direction and stops at the origin.

As described above, the first mounting head portion 10 sucks the electronic component 50 supplied from the first supply portion 2 and mounts it on the printed circuit board 19, and the first mounting head portion 10 is mounted on the printed circuit board 19. Arrangement pitch of the plurality of suction nozzles 18 held and the plurality of cassettes 4 arranged in the first supply unit 2.
Are set to the same size, and the first mounting head unit 10 and the first supply unit 2 have a paired relationship.
With such a configuration, it is possible to mount a plurality of different types of electronic components at different mounting angles with a single mounting operation.

Further, the second mounting head portion 11 and the second supply portion 3 also have a pair of relationships as in the above, and
The first mounting head unit 10 is connected to the first supply unit 2 by the electronic component 5.
When the first mounting head unit 10 sucks the electronic component 50, the second mounting head unit 11 operates to mount the sucked electronic component 50 on the printed circuit board 19. When 50 is mounted on the printed circuit board 19,
The second mounting head 11 is connected to the second supply unit 3 by the electronic component 5.
Since it is configured to adsorb 0, it is possible to mount the electronic component 50 at high speed without wasteful operation.

In the above description, an example in which the table 6 is slid by the drive motor 14 and the ball screw 5 has been shown, but the other linear motors, rack & pinion, wire, etc. driving methods are also the same. It is feasible.

Further, an example in which the rotation of the suction nozzles 18 of the mounting heads 10 and 11 is constituted by the suction nozzle rotation motor 51, the first drive gear 52, and the second drive gear 53 is shown. It can also be implemented with a belt.

Further, although an example in which the vertical movement of the suction nozzle 18 of the mounting heads 10 and 11 is slid by the suction nozzle vertical motor 54 and the ball screw 55 is shown, the suction nozzle vertical motor 54 and the ball screw 55 are also used. The same operation can be performed by using a linear motor or a ball screw 55 by a crank.

[0034]

As described above, according to the present invention, the following advantageous effects can be obtained.

1. Since the rotation angles of multiple suction nozzles can be controlled individually, it is possible to mount multiple electronic components in different mounting directions with a single mounting operation.
The mounting time per electronic component can be shortened.

2. Since the descending amount of multiple suction nozzles can be controlled individually, even if the thickness of the electronic components sucked by the multiple suction nozzles differs, it is possible to mount them simultaneously without changing the suction nozzle for each electronic component. Therefore, one suction nozzle can be used for a wide variety of electronic components, and the mounting time per electronic component can be shortened.

3. Since the rotation angles of multiple suction nozzles can be controlled individually, the directions of the suction nozzles can be individually adjusted to the electronic component supply direction even if the electronic component supply directions from the multiple cassettes installed in the supply unit are different. It is possible to adsorb a plurality of electronic components at the same time by adjusting to, and the total tact can be shortened.

4. Since the descending amount of multiple suction nozzles can be controlled individually, the descending amount of the suction nozzle can be adjusted to the height of electronic components even if the heights of electronic components supplied from multiple cassettes installed in the supply unit are different. It is possible to adsorb a plurality of electronic components at the same time by individually adjusting them, and the total tact can be shortened.

[Brief description of drawings]

FIG. 1 is a perspective view showing an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of the same.

FIG. 3 is a perspective view showing details of a mounting head portion of the electronic component mounting apparatus.

FIG. 4 is a side view of the same.

FIG. 5 is a perspective view showing an overall configuration of a cassette mounted in the electronic component mounting apparatus.

FIG. 6 is a perspective view of a main part showing a front end of the cassette.

FIG. 7 is a plan view of a main part for explaining a positioning operation of the cassette.

8 is a plan view of a main part showing a state before mounting of the electronic component mounting apparatus shown in FIG.

9 is a plan view of a main part showing a state when the electronic component mounting apparatus shown in FIG. 1 is mounted.

FIG. 10 is a perspective view showing a configuration of a conventional electronic component mounting apparatus.

11 is a plan view of the electronic component mounting apparatus shown in FIG.

FIG. 12 is a perspective view of a main part showing details of a mounting head portion of the electronic component mounting apparatus shown in FIG.

[Explanation of symbols]

 1 Housing 2 First Supply Section 3 Second Supply Section 4 Cassette 5 Ball Screw 6 Table Section 7 Guide Rail 8 Guide Rail 9 Upper Frame 10 First Mounting Head Section 11 Second Mounting Head Section 12 First Line Sensor 13 Second line sensor 14 Drive motor 15 Loader section 16 Unloader section 17 Shaft 18 Adsorption nozzle 19 Printed circuit board 37 Bearing block 38 Control section 50 Electronic component 51 Adsorption nozzle rotation motor 52 First drive gear 53 Second drive gear 54 Vertical motor for suction nozzle 55 Ball screw 56 Bearing 57 Nut 58 Guide rail

Claims (2)

[Claims] 1. A plurality of cassettes for accommodating a plurality of electronic parts and sequentially supplying them are arranged, and first and second supply parts arranged on a straight line at predetermined intervals, respectively. First, a table portion for holding a printed circuit board for electronic component mounting, which is slidably arranged in the same direction as the electronic component supply direction in the above-mentioned predetermined interval portion which is an intermediate portion of the second supply portion, and the electronic component First and second mounting heads, which are arranged above the table and slidably arranged in a direction orthogonal to the sliding direction of the table, while holding a plurality of suction nozzles for suction up and down. An electronic component mounting apparatus comprising a control unit for controlling, and operable so as to simultaneously rotate a plurality of suction nozzles respectively held by the first and second mounting head sections at different angles. 2. The electronic component mounting apparatus according to claim 1, wherein a plurality of suction nozzles respectively held by the first and second mounting head portions can be simultaneously moved up and down by different movement amounts.