JPH10209680A - Electronic component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a small size and high accuracy and high speed mounting apparatus by providing a recognizer for recognizing electronic components held by a suction nozzle, rotating a table by specified angle based on the recognition result to correct and mounting the electronic components on a printed board. SOLUTION: A first and second feeders 2, 3 are disposed linearly with specified spacing in which a table 6 is disposed between these feeders and a first and second recognizers 12, 13 for recognizing the sucked electronic components are disposed between the table 6 and feeders 2, 3 whereby the table 6 is rotated by specified angle to correct, based on the recognized results of electronic components by the recognizers 12, 13 and then the electronic components are mounted on a printed board 19, thereby mounting them at a high speed and high accuracy.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus used for mounting a chip-type electronic component for surface mounting used on various electronic circuits on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, this type of electronic component mounting apparatus is roughly classified into a general-purpose mounting apparatus using a robot and a high-speed mounting apparatus using a rotary mounting head. .

A general-purpose mounting device of a robot type is disclosed in
-85492 is known,
As shown in FIG. 26, the electronic component supply unit 110 on which the cassette 116 for supplying the taped electronic components one by one is mounted, the board holding unit 117 for holding the printed circuit board 115, and the suction for sucking the electronic components. A mounting head 112 to which a nozzle 111 is rotatably slidably mounted for mounting electronic components on a printed circuit board 115, a first drive shaft 113 to which the mounting head 112 is mounted, and a direction orthogonal to the first drive shaft 113. Drive shaft 113 in the direction
, And the mounting head 112 is configured to move in the X and Y directions to suck and mount the electronic component.

A rotary type high-speed mounting device disclosed in Japanese Patent Application Laid-Open No. 7-202491 is known. In FIG. 27, a suction nozzle 120 is arranged on a circumference as shown in FIG. The rotary head 119 that is rotated intermittently, a component supply unit 118 that can move to a position where the suction nozzle 120 stops, a recognition unit 122 that recognizes the electronic component sucked by the suction nozzle 120, and a print for mounting the electronic component. It has an XY table 121 that can move in two orthogonal directions while holding the substrate 123, and is configured to perform suction, recognition, and mounting of electronic components by intermittent rotation of the rotary head 119 sequentially. Was.

Further, as an intermediate type between the general-purpose mounting device of the robot type and the high-speed mounting device of the rotary type, a small-sized electronic component mounting device with a simple configuration, high mounting accuracy and quick mounting tact is realized. The present inventors have proposed a device in Japanese Patent Application No. Hei 8-117633. As shown in FIG. 28, this device holds a plurality of suction nozzles 125 for sucking electronic components on a first drive shaft 124. First and second mounting heads 126 and 127 are slidably mounted, and mounted on first and second supply units 128 and 129 disposed below the mounting heads 126 and 127, respectively. The suction nozzle 125 sucks the electronic components sequentially supplied from the cassette 130 that has been supplied, and the two supply units 128,
The electronic component adsorbed on the printed circuit board 132 held on the table 131 disposed between the 129 is mounted.

[0006]

However, in the above-mentioned conventional configuration, while a small, inexpensive and high-speed electronic component mounting device is required, a general-purpose mounting device of a robot type has a simple configuration and a small size. Since the electronic components are sucked one by one and then the electronic components are mounted on the printed circuit board 115, the speed cannot be increased. In the rotary type high-speed mounting device, the rotary head 119 is used.
However, there has been a problem that the mounting speed is increased, but the equipment becomes large, and the equipment price becomes high.

Furthermore, in the electronic component mounting apparatus proposed as the intermediate type, the number of suction nozzles 125 is large and the speed can be increased. However, when the angle of the electronic component is corrected according to the suction state of the electronic component, each suction nozzle 125 is required. When the nozzles 125 are to be individually rotated, the number of components is increased and the structure becomes complicated. Also, when the interval between the suction nozzles 125 is reduced, the nozzle rotation drive system becomes smaller, resulting in poor rotation correction accuracy. Therefore, there is a problem that miniaturization is difficult from these.

The present invention solves such a conventional problem,
It is an object of the present invention to provide an electronic component mounting apparatus that is small, has high precision, and can be mounted at high speed.

[0009]

In order to solve this problem, an electronic component mounting apparatus according to the present invention is arranged such that two mounting heads holding a large number of suction nozzles are placed above a table section holding a printed circuit board. And a recognition unit for recognizing the electronic component sucked and held by the suction nozzle, while one of the two mounting heads performs the suction operation while the other is performing the suction operation, Based on the recognition result, the table section is rotated by θ and corrected, and then the electronic component is mounted on the printed circuit board.

According to the present invention, a compact, high-accuracy, and high-speed electronic component mounting apparatus can be obtained.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, a plurality of cassettes for sequentially supplying electronic components are arranged adjacent to each other, and each of the cassettes is arranged linearly at a predetermined interval. A direction in which the second supply unit and a plurality of suction nozzles for sucking electronic components supplied from the two supply units are vertically movable and connect the two supply units above the first and second supply units. First and second mounting heads slidably disposed on the first and second mounting heads, and first and second mounting heads disposed adjacent to the two supply units for recognizing the electronic components sucked by the suction nozzle. 2 is slidable in the same direction as the electronic component supply direction between the first and second supply units and in the θ direction based on the recognition results of the first and second recognition units. A table section for holding a printed circuit board for mounting electronic components rotatably arranged, It is obtained by a configuration an electronic component mounting apparatus comprising a control unit for controlling these, an effect that can provide high precision and high-speed placement electronic component mounting apparatus capable compact.

According to a second aspect of the present invention, in the first aspect, the first and second recognition units determine the presence / absence of the electronic component sucked by the suction nozzle, the suction attitude, and the component height of the electronic component. This is a configuration that can be recognized from below and from the horizontal direction, and has an effect that it is possible to surely confirm in advance the presence or absence, inclination, standing suction, and the like of electronic components that are in a state of failure when mounted.

According to a third aspect of the present invention, in the first or the second aspect of the present invention, the table holding the printed circuit board for mounting the electronic component is a motor serving as a θ-rotation driving unit, and the rotation of the motor is controlled. Speed reducer, a table coupled to the speed reducer and rotating, and a substrate holding portion mounted on the table so as to be movable up and down. This has the effect that good correction can be made.

According to a fourth aspect of the present invention, in the third aspect of the present invention, there is provided a transport mechanism for transporting the printed circuit board from the loading side to the unloading side on the table holding the printed circuit board for mounting electronic components. It has a configuration in which a positioning mechanism for positioning the printed circuit board is provided, and has an effect that the loading and unloading of the printed circuit board can be accurately performed, and the electronic component can be accurately positioned and mounted at a fixed position.

According to a fifth aspect of the present invention, in the first aspect of the present invention, there is provided a board supply section for supplying a printed board to the table section, and a printed board discharged from the table section. The board discharge section to be conveyed is provided so as to be connected to the table section when the table section is at a predetermined position, so that the printed circuit board can be automatically supplied to the table section and discharged. Have.

According to a sixth aspect of the present invention, in the invention of the fifth aspect, a driving force transmitting mechanism for driving the transport mechanism by contacting the transport mechanism for transporting the printed circuit board provided on the table portion. Is provided in either the substrate supply section or the substrate discharge section, and unnecessary parts need not be mounted on the table part that rotates θ, so the table part can be made smaller and lighter, and the accuracy can be improved. Has the effect of achieving

According to a seventh aspect of the present invention, in the fifth or sixth aspect, a belt driven by a motor is stretched in a direction perpendicular to the direction of transport of the printed circuit board, and the printed circuit board is mounted on the belt. A guide rail that guides one side surface is coupled, and the printed circuit board is held by a fixed guide rail provided so as to guide the other side surface of the printed circuit board facing the guide rail. By driving the motor to move the guide rail to an arbitrary position, it is possible to easily and surely hold printed boards of different sizes.

According to an eighth aspect of the present invention, in the first aspect of the present invention, there is provided a driving force for engaging with and driving the printed board positioning mechanism provided on the table. The transmission mechanism is provided in either the substrate supply unit or the substrate discharge unit.Since it is not necessary to attach unnecessary things to the table unit that rotates θ, the table unit can be reduced in size and weight, This has the effect of improving accuracy.

According to a ninth aspect of the present invention, in the first aspect of the present invention, a board stopper for temporarily stopping the printed board discharged from the table section at a fixed position is provided in the board supply section or the board supply section. The printed circuit board is provided on one of the board discharge sections, and has an effect that the printed board on which the electronic components have been mounted can be smoothly transferred when being transferred to the next step.

The invention according to claim 10 is the invention according to claims 1 to 9
In the invention according to any one of the above, one or both of a bulk-type cassette containing chip-shaped electronic components in a loose state, and a taping-type cassette in which electronic components are taped at predetermined intervals, The mounting portion is provided on the cassette mounting surface of the supply portion, so that a single mounting device can mix and use a bulk type cassette and a taping type cassette. Have.

[0021] The invention according to claim 11 is the invention according to claims 1-1.
0, when the suction nozzle held by the first mounting head unit is sucking the electronic component supplied from the first supply unit, the second mounting head unit The suction nozzle held by the nozzle operates to mount the electronic component on the printed circuit board held by the table, and conversely, the suction nozzle held by the second mounting head moves to the second position.
When sucking electronic components supplied from the supply unit of
The suction nozzle held by the first mounting head is configured to operate to mount an electronic component on the printed circuit board held by the table, so that the suction operation and the mounting operation can be performed simultaneously. Less loss time,
This has the effect that the total mounting tact can be improved.

The twelfth aspect of the present invention is the first to first aspects.
In the invention according to any one of the first to third aspects, the plurality of suction nozzles respectively held by the first and second mounting heads are arranged adjacent to the first and second supply units with respect to the arrangement pitch of the plurality of suction nozzles. The component supply pitch of each cassette is the same or an integer multiple, and since a large number of electronic components can be picked up at the same time, the suction time is the same as the time for picking up one electronic component, It has the effect of speeding up.

[0023] The invention according to claim 13 is the invention according to claims 1-1.
2. In the invention described in any one of 2. above, the first and second mounting heads are configured to raise and lower plates holding a plurality of suction nozzles respectively by end face cams driven by a motor. This has the effect of achieving small size and light weight with a simple configuration and high accuracy.

According to a fourteenth aspect of the present invention, in the thirteenth aspect of the present invention, the plate is raised and lowered by reversing the end face cam within a predetermined rotation angle from the reference position as a starting point, and The position of the bottom dead center of the suction nozzle is changed by changing the position of the suction nozzle. By adjusting the position of the bottom dead center of the suction nozzle according to the height of the electronic component to be mounted, various electronic components can be adjusted. Can be mounted efficiently.

According to a fifteenth aspect of the present invention, in the thirteenth or fourteenth aspect, the shape of the end face cam is formed so that the descent speed at the start of descent of the suction nozzle and near the bottom dead center is reduced. This has the effect of reducing the impact on the electronic component and of being able to suck and mount at high speed.

[0026] The invention according to claim 16 is the invention according to claims 13 to
In the invention according to any one of the fifteenth aspects, the motor for driving the end face cam is configured to be variable in speed, and has an effect that the suction and mounting speeds can be arbitrarily set.

[0027] The invention according to claim 17 is the invention according to claims 1-1.
6. A plurality of suction nozzles respectively held in the first and second mounting heads are simultaneously moved up and down by a plurality of suction nozzles respectively in the invention according to any one of the above items 6, In this case, since a large number of pieces can be sucked and mounted at the same time, the suction time and the mounting time can be reduced, and the total tact can be improved.

[0028] The invention described in claim 18 is the invention according to claims 1-1.
In the invention described in any one of the sixth to sixth aspects, the plurality of suction nozzles respectively held by the first and second mounting heads are configured to sequentially move up and down at predetermined timings. This has an effect that an electronic component at an arbitrary position can be sucked and mounted by the nozzle.

According to a nineteenth aspect of the present invention, in the invention of the seventeenth or eighteenth aspect, the plurality of suction nozzles respectively held by the first and second mounting heads are selected from a plurality of suction nozzles. At least one or more arbitrary suction nozzles are operated, and the electronic components at arbitrary positions in the supply unit are sequentially sucked, and the number of electronic components is equal to the number of suction nozzles attached to the mounting head unit. The time required to move from the suction position to the mounting position can be reduced compared to the operation of repeating suction and mounting every time,
This has the effect that the total mounting tact can be improved.

According to a twentieth aspect of the present invention, in the invention according to the fourteenth aspect, a selection mechanism for operating only an arbitrary suction nozzle from among a plurality of suction nozzles is attached to the first and second mounting heads, respectively. A simple configuration in which a plurality of suction nozzles that move up and down following the lifting and lowering members are selected by a switching mechanism provided to hold the suction nozzles and prevent the lowering of the suction nozzles. Has the effect that a number of suction nozzles can be selected and moved up and down.

[0031] The invention of claim 21 is the invention of claims 11 to
20. The invention according to any one of 20), wherein a spring for urging the suction nozzle downward is disposed above the suction nozzle, and the electronic component is sucked and mounted by the suction nozzle. This has the effect of reducing the impact on the electronic component.

[0032] The invention according to claim 22 is the invention according to claims 1-2.
In the invention according to any one of the first to third aspects, when the result of recognizing the electronic component sucked by the first and second mounting heads by the first and second recognition units is determined to be a suction failure,
The first and second defective discharge portions for discharging the poorly adsorbed electronic components are provided, and have an effect that the poorly adsorbed electronic components can be easily collected.

Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. (Embodiment 1) FIG. 1 is a perspective view showing an overall configuration of an electronic component mounting apparatus according to a first embodiment of the present invention, and FIG.
3 is a front view, FIG. 3 is a plan view, FIG. 4 is a front view showing the recognition unit, and FIG. 5 is a side view.

In FIGS. 1, 2, and 3, a plurality of cassettes 2 and 3 for sequentially supplying electronic components are arranged adjacent to each other via engaging portions 2A and 3A, and are arranged on the housing 1. A first and a second supply unit, and the first and the second supply units 2 and 3
Are arranged linearly at predetermined intervals, and a table portion 6 is disposed at the predetermined interval portion which is an intermediate portion between the first and second supply portions 2 and 3, and the table portion is 6 and a first recognizing unit 12 for recognizing an electronic component sucked between the first and second supply units 2 and 3, respectively.
Are respectively disposed, and between the first recognition unit 12 and the second recognition unit 13, each of the recognition units 12,
The first and second defective discharge units 17 and 18 for discharging the electronic component determined to have the suction abnormality in 13 are arranged.

The table section 6 holds a printed circuit board 19 on which electronic components are mounted, and rotates the drive motor 14 in the same direction as the supply direction (Y direction) of the electronic components to rotate the guide rail 7 via the ball screw 5. Is slidable along.

Reference numerals 10 and 11 denote first and second mounting heads respectively holding a plurality of suction nozzles 20 for sucking and holding the electronic components so as to be able to move up and down. The first and second mounting heads 10 and 11 are shown. Are independently slidable in a direction (X direction) orthogonal to the supply direction of the electronic components via a guide rail 8 on the lower surface of the upper frame 9 coupled to the housing 1.

Reference numeral 15 denotes a loader section for transporting the printed circuit board 19 to the table section 6, reference numeral 16 denotes an unloader section for carrying out the printed circuit board 19 from the table section 6, and reference numerals 21 and 22 denote the first supply section 2 and the second supply section 22, respectively. A first feed unit and a second feed unit 23 for driving the cassette 4 mounted on the supply unit 3 are control units for controlling the entire apparatus.

FIGS. 4 and 5 show the first and second recognition units 1 respectively.
2 and 13, as shown in the figure, an adsorption nozzle 20 is attached to a tip of a shaft 24, and an I-shaped bracket coupled to an upper surface of the housing 1 below the suction nozzle 20. The electronic component 5 sucked by the suction nozzle 20 by the recognition camera 27 in which the lens barrel 26 is attached to the side surface of the nozzle 25
It is mounted facing upwards to see the zero position. The upper surface of the I-shaped bracket 25 has a slit in the same direction as the moving direction of the suction nozzle 20, and has a structure in which a line sensor 28 for detecting the height of the electronic component 50 is attached. .

Next, the detailed configuration of the table section 6 will be described with reference to FIGS. 6 is a perspective view showing the entire configuration of the table unit 6, FIG. 7 is a perspective view showing a part of FIG. 6 cut away to show the internal configuration, and FIG. 8 is a front view of FIG. In FIG. 8, 29 is a Y table,
Supported by a linear guide 31 fixed to the base 30,
It is mounted so as to be capable of reciprocating linear movement in the Y direction via a ball screw 33 by a Y-axis motor 32. Reference numeral 34 denotes a θ frame, which is a θ-axis reduction gear 3 fixed to the Y table 29.
5 is fixed to the output shaft. Reference numeral 36 denotes a θ-axis motor, which is attached to the Y table 29 and is connected to the θ-axis reduction gear 35. With this configuration, the table unit 6
It can move in the direction and the θ direction (rotation direction).

The origin sensor 37 of the θ frame 34 is Y
It is attached to the table 29 and does not rotate in the θ direction.

38 is a θ attached to the θ frame 34
The origin detection plate rotates together with the θ frame 34. 3
Reference numeral 9 denotes a Y-axis origin detection sensor for detecting the origin of the Y table 29, and reference numeral 40 denotes a Y-axis origin detection plate attached to the Y table 29. Reference numeral 41 denotes a rail frame, which is mounted so as to be vertically movable while being guided by a guide 42 fixed to the θ frame 34.

Reference numeral 43 denotes a rail frame vertical cylinder fixed to the base 30 so that the rail frame 41 can move up and down at the origin position of the Y axis.

Reference numeral 44 denotes a backup pin for supporting the printed circuit board 19 when the rail frame 41 is lowered. The backup pin 44 is inserted into a hole provided in the θ frame 34 and installed. A bearing 45 is fixed to the rail frame 41, and a fixed transport rail 47 for guiding a transport belt 46 driven by an external power (not shown) for transporting the printed circuit board 19 is mounted on the bearing 45. And a pulley 48 for belt guide are provided.

On the other hand, the moving transport rail 49 and the transport belt 5
0 are installed in parallel with the fixed transport rail 47, but these are ball screws 51 installed on the rail frame 41.
, And can be moved to a position corresponding to the size of the printed circuit board 19 by turning the ball screw 51.

It should be noted that the ball screw 51 is mounted on the fixed transport rail 47.
And two sets of ball screws 51 are attached to the pulleys 53 fixed to the respective ends thereof.
And a timing belt 54 hung thereon, and rotating one of the ball screws 51 causes the other ball screw 51 to move simultaneously.

A shaft 55 is rotatably mounted on the bearing 45 fixed to the rail frame 41. The shaft 55 has three positioning pins 56 for determining the position of the printed circuit board 19. Lever 57,5
8, 59 are fixed, and the positioning levers 57,
Reference numeral 58 is a reference for determining the position of the printed circuit board 19, and the remaining positioning lever 59 is fixed to the shaft 55 with its position shifted according to the size of the printed circuit board 19.

A positioning pin opening / closing lever 60 is fixed to the right end of the shaft 55. When the rail frame 41 is raised and is pushed down by the external power transmission member 61, the positioning levers 57, 58 and 59 also swing. Down,
The structure is such that the positioning of the printed circuit board 19 is released. Further, the tension spring 6 is attached to the positioning pin opening / closing lever 60.
2, the positioning levers 57, 58, 59 swing back to the original position when the pushing force by the external power is lost. 63 is a detection plate attached to the positioning pin opening / closing lever 60, and a sensor (not shown) is attached to another unit.

Reference numeral 64 denotes a board stopper for stopping the printed board 19 carried by the conveyor belt 50 at a predetermined position.
5 and is rotatable, and can swing in the direction of arrow A in the figure. Further, this cylinder 65 has a fulcrum 66
Is attached to the frame 67 via
A substrate presence / absence detection sensor 68 is attached to the frame 67.

With such a configuration, since no sensor is installed on the turntable (θ frame 34), there is no risk of disconnection of the sensor due to rotation, and the wiring can be loosened due to rotation. Since there is no table, a simple table section 6 can be provided.

The operation of the table unit 6 configured as described above will be described below. First, electronic components (not shown) are printed on the printed circuit board 19 by the NC program.
When the mounting is completed, the Y table 29 and the θ frame 34 return to the origin, and when the return to the origin is completed, the rail frame vertical cylinder 43 is driven to push up the rail frame 41, and is guided by the fixed transport rail 47 and the movable transport rail 49. The belt surface is moved up to the same height as the loader unit and the unloader unit (not shown) for supplying and removing the printed circuit board on the left and right sides of the table unit 6.

Next, the positioning pin opening / closing lever 60 is pushed down by the external power transmission member 61, and the pins 56 of the printed circuit board 19 on the table section 6 are pulled out to be in a free state.

Next, the pulley 48 is driven by a lever 69 which is another external power transmission member, and
0 rotates to carry out the printed circuit board 19 on the table section 6. When the reaction of the board presence / absence detection sensor 68 is turned off, the cylinder 65 that drives the board stopper 64 is driven, and the board stopper 64 swings down to the transport position of the printed board 19 and descends.

Next, a new printed circuit board 19 is carried in from the loader section for supplying the printed circuit board, and
Stops at 4 At this time, the board presence / absence detection sensor 68
Reacts to the ON state, the transport belt 50 stops, and at the same time, the tension spring 62 pressing the positioning pin opening / closing lever 60 acts in the opposite direction. Move to position a new printed circuit board 19. At this time, since the detection plate 63 attached to the positioning pin opening / closing lever 60 turns on the detection sensor (not shown), it is confirmed that the positioning is surely performed, and the cylinder 65 driving the substrate stopper 64 also moves in the reverse direction. And the substrate stopper 64 returns to the original position.

Thereafter, the rail frame vertical cylinder 43 which has raised the rail frame 41 also moves in the opposite direction, and the rail frame 41 descends and stops at a predetermined position.

When the replacement of the printed circuit board 19 is completed in this way, the table unit 6 independently moves the Y-axis and the θ-axis to the position determined by the NC program + the position corresponding to the correction amount for the electronic component suction attitude recognition. Movement, suction nozzle (not shown)
The electronic components carried by the above are accurately mounted on the printed circuit board 19. When such an operation is completed by the amount of the NC program, the table section 6 returns to the origin position, and the same operation is repeated with the supply of a new printed circuit board 19 as described above.

As described above, by using the table section 6 which can move in the Y-axis and θ (rotation) directions, the suction nozzle 20 does not rotate only by vertical movement, so that the durability of the bearing of the suction nozzle 20 is improved, and The suction nozzle 20 sucks the electronic component and moves as it is after recognizing the position, and
Since it is only placed on the upper side, the mounting position is not shifted due to centrifugal force due to rotation or misalignment of the center of rotation, and a high mounting accuracy is obtained. By adopting a structure in which no sensor is arranged, many excellent effects can be obtained, such as high reliability and simple equipment.

Next, the detailed structure of the board transfer section for transferring the printed circuit board will be described with reference to FIGS.

FIG. 9 is a plan view showing the overall configuration of an unloader section for transporting a printed board discharged from a table section in the board transport section. In FIG. 9, reference numeral 70 denotes a base. Printed circuit board 19 on the top surface
A fixed transport rail 71 and a movable transport rail 72 for transporting the movable board 72 are arranged. Two linear rails 73 for sliding the movable transport rail 72 in accordance with the size of the printed circuit board 19 are arranged in parallel. Combined pulley 7
The belt 77 and the moving / conveying rail 72 are connected by a connecting member 78 via a pulley 76 connected to the base 5 and the base 70, and the moving / conveying rail 72 is slidable by the rotation of the drive motor 74.

Reference numeral 79 denotes a motor, which is a drive source of the transport belt 46 of the fixed transport rail 47 of the table section 6 and the transport belt 80 of the fixed transport rail 71 of the substrate transport section. It is configured to be.

Reference numeral 82 denotes a motor, which serves as a drive source of the transport belt 50 of the movable transport rail 49 of the table section 6 and the transport belt 83 of the movable transport rail 72 of the substrate transport section. It is configured to be driven.

FIG. 10 shows the fixed transport rail 4 of the table section 6.
7 shows details of drive units 81 and 84 for driving the transfer belts 46 and 50 of the movable transfer rail 49.
It comprises a roller 85 attached to the motors 79 and 82, and a roller 87 that contacts the pulley 48 of the table unit 6 via a belt 86 to rotate the roller 85 to drive the table unit 6 to convey the belt. I have.

The tension spring 88 applies a force for urging the roller 87 downward through the lever 69, thereby increasing the drive transmission efficiency when the pulley 48 contacts the roller 87.

FIG. 11 shows a fixed transfer rail 71 of the board transfer section.
7 shows the details of driving units 81 and 84 for driving the conveyor belt 80 and the conveyor belt 83 of the moving conveyor rail 72, and is connected to motors 79 and 82 in order to make the same direction as the belt conveying direction of the table unit 6. From the gear 89
The driving force is transmitted to a gear 90 supported at a lower portion thereof, and a pulley 91 and a pulley 92 are mounted coaxially with the gear 90.
Are configured to drive the conveyor belts 80 and 83 via the.

A description will now be given of the width shifting operation of the substrate transport unit configured as described above. 9 and 12, when the width of the printed circuit board 19 is large, the drive motor 74 is rotated in the direction of arrow A in the figure, and the rotation causes the belt 77 to move in the same direction C, and is connected to the belt 77 by the connecting member 78. Moving the movable transport rail 72 in the direction C along the linear motion rail 73, thereby increasing the width between the fixed transport rail 71 and the movable transport rail 72, and shifting the width to the large printed circuit board 19. It is.

When the width of the printed circuit board 19 is small, the drive motor 74 is rotated in the direction B, and the belt 77 is pulled through the pulleys 75 and 76 by this rotation.
The moving conveyance rail 72 connected by the belt 77 and the connecting member 78 moves in the direction D along the linear motion rail 73, thereby reducing the width between the fixed conveyance rail 71 and the moving conveyance rail 72. , Narrow printed circuit board 1
9 is performed.

Next, the operation of transporting the printed circuit board 19 will be described. FIGS. 10 and 13 show the substrate transport structure in the table section 6. The table section 6 operates at the lower portion (shown in FIG. 10) at a timing other than the normal substrate transport, and the substrate transport is performed. Only at the time is the mechanism ascending as shown in FIG.

When the table is raised, the impact when the drive transmitting portion 87a of the roller 87 of the driving portion 81 comes into contact with the drive receiving portion 48a of the pulley 48 is absorbed by the tension spring 88 via the lever 69.

Next, the rotation of the roller 85 connected to the motors 79 and 82 in the direction E is applied to the roller 87 via the belt 86.

Next, the driving force is transmitted from the drive transmitting portion 87a of the roller 87 to the drive receiving portion 48a of the pulley 48, and the transport belt 46 of the table 6 stretched over the pulley 48 is driven.

Next, the substrate transfer operation in the substrate transfer section will be described with reference to FIG. FIG. 11 shows a substrate transport structure in the substrate transport unit, and the table unit 6
Motor 79,
The drive in the same G direction is transmitted from a gear 89 connected to the gear 82 to a gear 90 supported below the same, and the same drive in the G direction is transmitted to a pulley 91 mounted coaxially with the gear 90. Are used to drive the conveyor belts 80 and 83.

With the structure of the drive section 81 described above, the belt transport of the substrate transport section and the substrate transport of the table section 6 can be carried out by the same motor, so that the apparatus can be reduced in size, weight and cost. It is.

Next, the detailed structure of the mounting head will be described with reference to the drawings. FIG. 14 is a perspective view showing the configuration of the mounting head unit, and as shown in FIG.
A plurality of slide shafts 94 for holding the slide shaft 94 are vertically movably attached to a holder 96 connected to the frame 95, and the slide shaft 94 is in a state where it cannot be rotated by a pin 97 fixed to the holder 96. I have.

An end cam 99 is connected to the vertical slide driving motor 98, and a cam follower 100 abutting on the end cam 99 is attached to a plate 102 which can be slid in the vertical direction by a slider 101.
A hook 103 that fits into the slide shaft 94 is attached to 2, and a compression spring 104 that urges the slide shaft 94 downward elastically contacts the hook 103.

Further, above the slide shaft 94,
A solenoid 105 for selecting a slide shaft 94 to be lowered is attached via a block 106.

The operation of the mounting head configured as described above will be described below. FIGS. 15A and 15B are front views for explaining the operation of the plate 102, and FIGS.
(A), (b) and (c) are side views for explaining the lowering operation of the slide shaft 94, and FIG. 17 is a front view for explaining the lowering operation of an arbitrary slide shaft 94.

In FIG. 15A, when the end face cam 99 is rotated by the rotation of the vertical slide drive motor 98,
The cam follower 100 abutting on the end face cam 99 is pressed downward, whereby the plate 102 descends along the slider 101 as shown in FIG.

As shown in FIG. 16A, when the plate 102 is at the upper limit, the slide shaft 94 is also at the upper limit via the block 106 on the claw 103. Next, as shown in FIG.
When the plate 102 descends in a state where 05 is OFF, the claw 103 pushes down the compression spring 104 and the slide shaft 94 descends accordingly. When the slide shaft 94 is raised, the claw 103 is in a state of directly pushing up the block 106.

When the plate 102 descends while the solenoid 105 is turned on, the slide shaft 94 is fixed by the solenoid 105 as shown in FIG. The slide shaft 94 remains held at the upper limit position only by bending the 104.

As described above, the solenoid 105 is turned ON,
By performing F, it is possible to lower only an arbitrary slide shaft 94 among a plurality of slide shafts 94 as shown in FIG.

FIG. 18 is a characteristic diagram showing the relationship between the amount of descent of the slide shaft 94 and the time when the end cam 99 is used. As shown in FIG. This makes it possible to keep the speed of the slide shaft 94 near the upper and lower limits low,
Thus, the electronic component 50 can be mounted on the printed circuit board 19 without giving an impact, and the maximum acceleration at the time of descent can be set at an arbitrary position by changing the shape of the end cam 99. Therefore, the speed of the vertical movement of the slide shaft 94 can be increased without giving an impact to the electronic component 50.

Even if the lower limit position of operation of the slide shaft 94 changes due to the difference in the thickness of the electronic component 50 to be mounted, the rotation speed of the vertical slide drive motor 98 is controlled so that the vertical movement of the slide shaft 94 can be controlled. The speed of the electronic component 50 can be changed arbitrarily without impact.
Can be mounted on the printed circuit board 19.

The basic operation of the thus-configured electronic component mounting apparatus of the present embodiment will be described below.

First, the operation from suction to mounting of the electronic component will be described with reference to FIGS. 19A to 19D. As shown in FIG. 19A, the second mounting head 11 When the mounting operation is performed at a position designated in advance on the first mounting unit 6, the first mounting head unit 10 moves onto the cassette 4 of the first supply unit 2 designated in advance and mounts the electronic component 50 to be sucked. The lever (not shown) of the cassette 4 is pushed by the force of the first feed portion 21 of the cassette 4 to open the shutter (not shown), and the suction nozzle 20 moves up and down to suck the electronic component 50 and rise again. .

Next, as shown in FIG. 19B, the first mounting head unit 10 that has sucked the electronic component 50 by the suction nozzle 20 moves to the first recognition unit 12 and The height and posture are read, the deviation from the reference position is calculated, and the data is stored in a memory (not shown) of the control unit 23.

Next, as shown in FIG. 19C, when the second mounting head unit 11 finishes mounting, the first mounting head unit 10 moves the first mounting head unit 10 to a predetermined position on the table unit 6. The electronic component 50 is moved to a position where the position is corrected by an amount corresponding to the shift amount obtained by the recognition unit 12, and the suction nozzle 20 is lowered by an amount corresponding to the height of the electronic component 50 to place the electronic component 50 on the printed circuit board 19. Mounting. At this time, at the same time, the second mounting head unit 11 moves onto the cassette 4 mounted on the predetermined second supply unit 3 and sucks the electronic component 50, and then, as shown in FIG. As described above, the suction nozzle 20
Mounting head 11 that has sucked electronic component 50 by means of
Moves to the second recognition unit 13 and reads the height and posture of the sucked electronic component 50. The electronic components 50 are sequentially mounted on the printed circuit board 19 by repeating this series of operations.

Next, the operation when a suction failure occurs will be described with reference to FIGS.

First, as shown in FIG. 20A, when the second mounting head 11 is performing a mounting operation at a position designated in advance on the table 6, the first mounting head 1
Reference numeral 0 denotes a lever (not shown) of the cassette 4 which is moved in advance on the cassette 4 of the first supply unit 2 and is moved by the force of the first feed unit 21 of the cassette 4 on which the electronic component 50 to be attracted is mounted. To open a shutter (not shown), the suction nozzle 20 moves up and down to suck the electronic component 50,
Rise again.

Next, as shown in FIG. 20B, the first mounting head unit 10 moves to the first recognition unit 12 to read the height and posture of the electronic component 50. At this time, the suction nozzle In the case of a suction error at the same height as 20, the electronic component 50 is again
Then, the operation of moving to the first recognition unit 12 to read the height and the posture of the electronic component 50 is performed.

When this operation is repeated and the number of times reaches a preset number, the control unit (not shown) displays a message indicating that the component has run out and stops.

Further, in the case of abnormal suction such as standing suction or erroneous suction different from the height of the sucked electronic component 50, FIG.
As shown in FIG. 20 (c), the first mounting head unit 10 moves to the first defective discharging unit 17 and discharges the electronic component 50 having abnormal suction, and as shown in FIG. The first mounting head unit 10 moves to the cassette position where the component 50 is located, performs the suction operation again, and moves to the first recognition unit 12 to perform the re-recognition after the suction.

Although the operation at the time of the suction failure has been described only for the first mounting head section 10, it goes without saying that the same applies to the second mounting head section 11.

Next, the operation of correcting the mounting position will be described with reference to FIG.
This will be described with reference to FIG. First, as shown in FIG. 21, the first mounting head unit 10 reads the height and posture of the electronic component 50 sucked by the first recognition unit 12 and calculates a shift amount of the sucked position. As shown in FIG. 22, the first mounting head unit 10 moves to a predetermined position on the printed circuit board 19 held by the table unit 6 to perform the mounting operation. Of the θ deviation, the table unit 6
Rotates, and at the same time, the first mounting head unit 10 moves in the X direction by an amount obtained by adding the amount of displacement in the X and Y directions and the amount of displacement of the mounting position due to the rotation of the table unit 6,
The Y direction is configured to correct the displacement of the electronic component 50 sucked by the movement of the table unit 6.

With such a configuration, one of the mounting heads can continue to mount the electronic component 50, so that the mounting tact can be increased.
In addition, by performing the θ rotation and the θ correction in the table section 6, the durability is high, and the mounting of the recognition section enables the mounting with high reliability.

(Embodiment 2) Hereinafter, a second embodiment of the present invention will be described with reference to the drawings.

In this embodiment, the suction nozzle 20
Is different from the above-described first embodiment, and the rest is the same as the first embodiment. Therefore, only different portions will be described with reference to the drawings, and description of the other portions will be omitted.

FIGS. 23 (a) and 23 (b) are cross-sectional views showing a mounting portion of the suction nozzle 20 of the electronic component mounting apparatus according to the embodiment. As shown in FIG. Numeral 20 is attached to the slide shaft 94 while being urged downward by the compression spring 107. When a load is applied to the suction nozzle 20 from below, the suction is performed while the compression spring 107 is bent as shown in FIG. Nozzle 20
Are configured to slide upward, and the other configuration is the same as that of the first embodiment. Therefore, the same reference numerals are given and the description is omitted.

The operation of sucking the electronic component 50 by the electronic component mounting apparatus according to the present embodiment thus configured will be described below.

First, as shown in FIG. 24A, depending on the supply mode of the electronic component 50 and the type of the electronic component 50,
A difference occurs in the position of the upper surface of the electronic component 50. However, as can be seen from the configuration in the first embodiment, when the plurality of suction nozzles 20 move down at the same time, the lower limit positions of the suction nozzles 20 cannot be set individually. If the lower limit position is adjusted to the lowest position, the electronic component 50 having a higher upper surface position may be impacted when the suction nozzle 20 is lowered.

Therefore, as shown in FIG. 24B, combinations of the electronic components 50 in which the difference between the positions of the upper surfaces of the electronic components 50 is within a certain range that does not give an impact are extracted. The lower limit position of the suction nozzle 20 is set at a lower position on the upper surface, and the suction nozzle 2 that sucks the electronic component 50 outside the range is set.
When 0 does not fall, the suction operation is performed. At this time,
The suction nozzle 20 that suctions the electronic component 50 having a high upper surface position is in a state where the compression spring 107 (not shown) is bent so that the electronic component 50 is not overloaded.

Next, as shown in FIG. 24 (c), the suction nozzle 20 which has performed the suction operation is moved to the upper limit position, and the same determination is made. As shown in FIGS. 24 (d) and (e), The suction operation of the electronic component 50 is sequentially performed, and the suction of the electronic component 50 to the plurality of suction nozzles 20 is completed.

By performing the above-described operation, it is possible to perform a highly reliable suction operation that does not cause an impact and an overload on the electronic component 50.

(Embodiment 3) Hereinafter, a third embodiment of the present invention will be described with reference to the drawings.

In this embodiment, only the suction operation is different from that of the second embodiment, and the other parts are the same as those of the second embodiment. Therefore, only different parts will be described with reference to the drawings. The description of the part is omitted.

As shown in FIG. 25A, the electronic component 50
The suction operation in a state where there is a difference in the position of the upper surface of the device will be described.

First, as shown in FIG. 25B, a combination of electronic components 50 whose difference from the position of the upper surface of the highest electronic component 50 is within a certain range that does not give an impact is extracted. The suction nozzle 20 is located at the lowest position on the upper surface.
Is set, and all of the suction nozzles 20 that perform the suction operation are lowered, and only the suction nozzles 20 corresponding to the electronic components 50 within the range are suctioned.

Next, as shown in FIG. 25 (c), the lowermost position is adjusted to the electronic component 50 having a lower upper surface position, and the remaining suction nozzles 20 are suctioned. At this time, the suction nozzle 20 corresponding to the electronic component 50 having a high upper surface position is compressed by the compression spring 107.
(Not shown) is bent, and only the pressing force of the compression spring 107 is applied to the electronic component 50.

Thereafter, as shown in FIG. 25D, all suction nozzles 20 are raised to complete the suction operation.

By performing the above operation, the lowering operation is performed only once, and it is possible to perform a highly reliable high-speed suction operation that does not cause an impact or overload on the electronic component 50. is there.

[0109]

As described above, in the electronic component mounting apparatus according to the present invention, two mounting heads holding a large number of suction nozzles are arranged on the same line above the table section, and the two mounting heads are arranged. When one of the units is performing the suction operation, the other performs the mounting operation, and a recognition unit that recognizes the electronic component held by suction is provided. Based on the result, the table unit is rotated by θ to correct and mount. Therefore, it is possible to provide an excellent electronic component mounting apparatus that can be mounted at high speed and with high accuracy while being small in size, at a low price.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the overall configuration of an electronic component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a front view of the same.

FIG. 3 is a plan view of the same.

FIG. 4 is a front view of a recognition unit of the electronic component mounting apparatus.

FIG. 5 is a side view of the same.

FIG. 6 is a perspective view showing a configuration of a table unit of the electronic component mounting apparatus.

FIG. 7 is a partially cutaway perspective view of FIG. 6;

FIG. 8 is a front view of the same.

FIG. 9 is a plan view showing a configuration of a board transfer unit of the electronic component mounting apparatus.

FIG. 10 is an essential part front view showing a driving force transmission mechanism of the substrate transport unit and a driving mechanism of the table unit;

FIG. 11 is a front view showing a driving mechanism of the substrate transfer unit.

FIG. 12 is a side view for explaining a width shifting operation of the substrate transport unit.

FIG. 13 is an essential part front view for explaining the operation of the driving force transmission mechanism of the substrate transport unit.

FIG. 14 is a perspective view showing a configuration of a mounting head of the electronic component mounting apparatus.

FIG. 15 is a front view for explaining the operation of the mounting head unit.

FIG. 16 is a side view for explaining a lowering operation of a slide shaft of the mounting head unit.

FIG. 17 is a front view for explaining a lowering operation of an arbitrary slide shaft of the mounting head unit.

FIG. 18 is a characteristic diagram showing a relationship between a descending amount of a slide shaft of the mounting head unit and time.

FIG. 19 is an exemplary front view for explaining the operation from suction to mounting in the electronic component mounting apparatus.

FIG. 20 is a front view for explaining an abnormal suction operation in the electronic component mounting apparatus.

FIG. 21 is a plan view of the electronic component mounting apparatus at a recognition position.

FIG. 22 is a plan view showing a state in which the table in the electronic component mounting apparatus is rotated.

FIG. 23 is a front sectional view showing a suction nozzle of the electronic component mounting apparatus according to the second embodiment of the present invention;

FIG. 24 is a main part front view for explaining the suction operation.

FIG. 25 is an essential part front view for explaining the suction operation of the electronic component mounting apparatus according to the third embodiment of the present invention;

FIG. 26 is a perspective view showing a configuration of a conventional electronic component mounting apparatus.

FIG. 27 is a perspective view of a main part showing a configuration of a conventional electronic component mounting apparatus.

FIG. 28 is a perspective view showing the configuration of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Housing 2 1st supply part 2A engaging part 3 2nd supply part 3A engaging part 4 Cassette 5 Ball screw 6 Table part 7, 8 Guide rail 9 Upper frame 10 First mounting head part 11 2nd Mounting head section 12 First recognition section 13 Second recognition section 14 Drive motor 15 Loader section 16 Unloader section 17 First defective discharge section 18 Second defective discharge section 19 Printed circuit board 20 Suction nozzle 21 First feed section 22 second feed unit 23 control unit 24 shaft 25 bracket 26 lens barrel 27 recognition camera 28 line sensor 29 Y table 30 base 31 linear guide 32 Y axis motor 33, 51 ball screw 34 θ frame 35 θ axis reducer 36 θ axis Motor 37 origin sensor 38 θ origin detection plate 39 Y-axis origin detection sensor 40 Y-axis origin detection plate 4 Rail frame 42 Guide 43 Rail frame up / down cylinder 44 Backup pin 45 Bearing 46,50 Transport belt 47 Fixed transport rail 48,53 Pulley 48a Drive receiving section 49 Moving transport rail 52 Nut 54 Timing belt 55 Shaft 56 Pin 57,58, 59 Positioning lever 60 Positioning pin opening / closing lever 61 External power transmission member 62 Tension spring 63 Detection plate 64 Board stopper 65 Cylinder 66 Support point 67 Frame 68 Board presence / absence detection sensor 69 Lever 70 Base 71 Fixed conveyance rail 72 Moving conveyance rail 73 Linear movement rail 74 Drive motors 75, 76, 91, 92 Pulleys 77, 86 Belts 78 Connecting members 79, 82 Motors 80, 83 Conveying belts 81, 84 Drive units 85, 87 Rollers 87a Drive transmission units 88 Extension spring 89, 90 Gear 94 Slide shaft 95 Frame 96 Holder 97 Pin 98 Motor for vertical slide drive 99 End face cam 100 Cam follower 101 Slider 102 Plate 103 Claw 104, 107 Compression spring 105 Solenoid 106 Block

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kimio Iizuka 1006 Kazuma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. 72) Inventor Toga Soga 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (22)

[Claims] 1. A plurality of cassettes for sequentially supplying electronic components are arranged adjacent to each other, and first and second supply units, each of which is linearly arranged at a predetermined interval, are supplied from both supply units. A plurality of suction nozzles for sucking electronic components to be held are vertically movable, and are respectively slidably disposed above the first and second supply units in a direction connecting the two supply units. Mounting head unit, first and second recognition units arranged adjacent to the two supply units for recognizing the electronic component sucked by the suction nozzle, and the first and second supply units, respectively. A printed circuit board for mounting an electronic component, which is slidable in the same direction as the supply direction of the electronic component and rotatable in the θ direction based on the recognition results of the first and second recognition units, is provided in the middle of the unit. An electronic component device consisting of a table section for holding and a control section for controlling these. Apparatus. 2. The electronic device according to claim 1, wherein the first and second recognition units recognize presence / absence, a suction posture, and a component height of the electronic component sucked by the suction nozzle from below and horizontally of the electronic component. Electronic component mounting device. 3. A motor for driving a .theta.-rotation unit, a reduction unit for reducing the rotation of the motor, and a table connected to the reduction unit and rotating, the table unit holding a printed circuit board for mounting electronic components. 3. The electronic component mounting apparatus according to claim 1, further comprising a board holding portion mounted on the table so as to be vertically movable. 4. A table unit for holding a printed circuit board for mounting electronic components, wherein a transport mechanism for transferring the printed circuit board from the loading side to the unloading side and a positioning mechanism for positioning the printed circuit board are provided. Electronic component mounting device. 5. A board supply section for supplying a printed board to the table section, and a board discharge section for transporting the printed board discharged from the table section are provided so as to be connected to the table section when the table section is at a predetermined position. Claims 1-4
Electronic component mounting apparatus according to any one of the above. 6. A driving force transmission mechanism for abutting a transport mechanism for transporting a printed board provided on a table section and driving the transport mechanism is provided in one of the substrate supply section and the substrate discharge section. An electronic component mounting device according to claim 5. 7. A belt driven by a motor is stretched in a direction perpendicular to the direction of transport of the printed circuit board, and a guide rail for guiding one side of the printed circuit board is connected to the belt. 7. The electronic component mounting apparatus according to claim 5, wherein the printed circuit board is held by a fixed guide rail provided to guide the other side surface of the printed circuit board. 8. The substrate supply unit or the substrate discharge unit according to claim 5, wherein a driving force transmitting mechanism that engages with and drives the printed circuit board positioning mechanism provided on the table unit is provided. The electronic component mounting device according to any one of the above. 9. The printed circuit board according to claim 5, wherein a board stopper for temporarily stopping the printed board discharged from the table section at a fixed position is provided in one of the board supply section and the board discharge section. Electronic component mounting device. 10. An engaging portion capable of mounting one or both of a bulk type cassette accommodating chip-type electronic components in a loose state and a taping type cassette in which electronic components are taped at predetermined intervals. The electronic component mounting apparatus according to any one of claims 1 to 9, wherein the device is provided on a cassette mounting surface of a supply unit. 11. When the suction nozzle held by the first mounting head is sucking an electronic component supplied from the first supply unit, the suction nozzle held by the second mounting head is It operates to mount electronic components on the printed circuit board held by the table unit, and conversely, the suction nozzle held by the second mounting head unit sucks the electronic components supplied from the second supply unit. Wherein the suction nozzle held by the first mounting head is operable to mount an electronic component on a printed circuit board held by the table. Electronic component mounting apparatus according to the above. 12. The component supply pitch of each cassette arranged adjacent to the first and second supply units, respectively, with respect to the arrangement pitch of the plurality of suction nozzles respectively held by the first and second mounting head units. 2. The method according to claim 1, wherein the number is the same or an integer multiple.
12. The electronic component mounting device according to any one of items 11 to 11. 13. The apparatus according to claim 1, wherein the first and second mounting heads respectively move up and down the plate holding the plurality of suction nozzles by means of an end cam driven by a motor. Electronic component mounting apparatus according to the above. 14. An end face cam reversing operation within a predetermined rotation angle from a reference position as a starting point moves up and down the plate, and changes the predetermined rotation angle to change a bottom dead center position of the suction nozzle. Claim 13
Electronic component mounting apparatus according to the above. 15. The electronic component mounting apparatus according to claim 13, wherein the shape of the end face cam is formed such that the lowering speed of the suction nozzle at the start of descent and near the bottom dead center is reduced. 16. The electronic component mounting apparatus according to claim 13, wherein a motor for driving the end face cam is variable in speed. 17. The electronic component mounting according to claim 1, wherein a plurality of suction nozzles respectively held by the first and second mounting heads are simultaneously moved up and down. apparatus. 18. The electronic device according to claim 1, wherein the plurality of suction nozzles respectively held by the first and second mounting head units are sequentially moved up and down at predetermined timings. Component mounting device. 19. A plurality of suction nozzles respectively held by the first and second mounting heads, each of which operates only at least one or more arbitrary suction nozzles selected from the plurality. Item 18. The electronic component mounting device according to Item 17 or 18. 20. A selection mechanism for operating only an arbitrary suction nozzle from among a plurality of suction nozzles which moves up and down in accordance with elevating members which are respectively attached to first and second mounting heads. 20. The electronic component mounting apparatus according to claim 19, wherein the selection is performed by a switching mechanism provided to hold the suction nozzle and prevent the lowering. 21. The electronic component mounting device according to claim 11, wherein a spring for urging the suction nozzle downward is disposed above the suction nozzle. 22. When the electronic components picked up by the first and second mounting heads are recognized by the first and second recognition units, respectively, and the result of the determination is a suction failure, the electronic component having the suction failure is removed. The electronic component mounting apparatus according to any one of claims 1 to 21, further comprising first and second defective discharge units for discharging.