JP2011035080A - Electronic component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve production efficiency of a printed board by enabling a plurality of suction nozzles to be lowered simultaneously so as to take electronic components from a component supply device or mount them on the printed board. <P>SOLUTION: Solenoid valves 36 corresponding to two suction nozzles 5 provided to a mounting head 12 and disposed at positions of 3 o'clock and 9 o'clock are placed in operation to move rod members 41 toward centers of cylinder units 35 with air pressure against energizing force of coil springs 43, and nozzle shafts 27 corresponding to the suction nozzles 5 are released from being locked. Further, when a nozzle elevation motor is driven to rotate a ball screw 16 and a nozzle suspension support 11 is lowered through a nut body 13, the nozzle suspension support 11 and two suction nozzles 5 are lowered in a state wherein a cam follower 28 is pressed against a roller rest 23 from above with energizing force of a coil spring 37, so that electronic components can be sucked and taken out of two component supply units simultaneously. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus that takes out electronic components supplied from a component supply device by a plurality of suction nozzles provided on a mounting head and mounts the electronic components on a printed board.

  The electronic component mounting apparatus is disclosed in, for example, Patent Document 1, but generally includes a plurality of suction nozzles when taking out an electronic component from the electronic component supply apparatus or mounting the electronic component on a printed circuit board. However, only one suction nozzle can be lowered in order for taking out the electronic component or mounting the electronic component.

JP 2009-60132 A

  However, in the case where only one suction nozzle can be lowered for taking out an electronic component or mounting an electronic component at the same time, a plurality of suction nozzles cannot be used at the same time. This has been a problem in improving the production efficiency of printed circuit boards.

  Therefore, the present invention aims to improve the production efficiency of the printed circuit board by allowing a plurality of suction nozzles to be lowered at the same time for taking out the electronic component from the component supply device or mounting the electronic component on the printed circuit board. With the goal.

For this reason, according to a first aspect of the present invention, there is provided an electronic component mounting apparatus for taking out electronic components supplied from a component supply device by a plurality of suction nozzles provided in a mounting head and mounting the electronic components on a printed circuit board.
Suspending and supporting the plurality of suction nozzles on a suspension support body that can be lifted and lowered by a drive source in a state of being always lowered by each biasing body,
Each suction nozzle supported by being suspended by the suspension support is locked by a lock mechanism so as not to descend,
The suspension support body is lowered by the driving source, and the suction nozzle unlocked by the corresponding lock mechanism is lowered by the urging force of the corresponding urging body.

According to a second aspect of the present invention, there is provided an electronic component mounting apparatus for taking out electronic components supplied from a component supply device by a plurality of suction nozzles provided on the mounting head and mounting the electronic components on a printed circuit board.
The plurality of suction nozzles are suspended and supported by a suspension support body that can be lifted and lowered by a drive source in a state of being constantly lowered by each first biasing body,
The suction nozzles supported by the suspension support can be moved around the nozzle shafts connected to the suction nozzles urged by the second urging members so that the suction nozzles are not lowered. Each rod member is urged by each second urging body to be locked and locked.
The suspension nozzle is lowered by the drive source, and the suction nozzle that is unlocked by moving the rod member against the urging force of the second urging body by the operation of the corresponding air cylinder corresponds to the corresponding suction nozzle. It descends by the urging force of the first urging body.

According to a third aspect of the present invention, there is provided an electronic component mounting apparatus for taking out electronic components supplied from the component supply device by a plurality of suction nozzles provided on the mounting head and mounting the electronic components on a printed circuit board.
Suspending and supporting the plurality of suction nozzles on a suspension support body that can be lifted and lowered by a drive source in a state of being always lowered by each biasing body,
A magnetic body provided around the nozzle shaft connected to each suction nozzle by de-energization of a voice coil motor provided with a magnet so that the suction nozzles supported by the suspension support are not lowered. The magnet locks the nozzle shaft to attract by magnetic force,
The suspension nozzle is lowered by the drive source and energized to the corresponding voice coil motor, so that the suction nozzle connected to the nozzle shaft that has been unlocked by canceling the magnetic force corresponds to the corresponding biasing body. It descends by the urging force of.

  According to the present invention, a plurality of suction nozzles can be lowered at the same time for taking out an electronic component from a component supply device or mounting an electronic component on a printed circuit board, thereby improving the production efficiency of the printed circuit board. be able to.

The top view of an electronic component mounting apparatus is shown. It is a front view of the mounting head body of a 1st embodiment. It is a top view of the mounting head of a 1st embodiment. It is a front view of the mounting head body of a 1st embodiment which cut an air cylinder longitudinally. The front view of the mounting | wearing head body of 1st Embodiment of the state which one suction nozzle fell is shown. The front view of the mounting | wearing head body of 1st Embodiment of the state which two suction nozzles fell is shown. It is a front view of the mounting head body of a 2nd embodiment. It is a front view of the mounting head body of 2nd Embodiment which cut the voice coil motor longitudinally. The front view of the mounting | wearing head body of 2nd Embodiment of the state in which one adsorption nozzle fell is shown. The front view of the mounting | wearing head body of 2nd Embodiment of the state which two suction nozzles fell is shown.

  An embodiment of an electronic component mounting apparatus 1 for mounting an electronic component on a printed circuit board P, which is a circuit board provided with a circuit on the substrate, will be described below with reference to FIG. The electronic component mounting device 1 includes a transport device 2 for transporting the printed circuit board P, a component supply device 3 for supplying electronic components disposed on the front side and the back side across the transport device 2, and a drive. A pair of beams 4A and 4B that can be moved in one direction (Y direction) by a source and a plurality of (for example, 14) suction nozzles 5 as holding means, respectively, are provided in the direction along each of the beams 4A and 4B. A mounting head body 6 that can be moved by each driving source is provided.

  The transport device 2 is disposed in an intermediate part of the electronic component mounting device 1, and includes a substrate supply unit that inherits the printed circuit board P from the upstream device, and an electronic component that is sucked and held by the suction nozzle 5 of each mounting head body 6. A board positioning unit that positions and fixes the printed board P supplied from the board supply unit for mounting, and a board discharge unit that inherits the printed board P on which the electronic component is mounted and transfers the printed board P to the downstream device. Composed.

  The component supply device 3 includes a feeder base 3A attached to the main body of the electronic component mounting device 1, and a plurality of electronic components arranged in parallel on the feeder base 3A, one for each component take-out portion (component suction position). It is composed of a group of component supply units 3B to be supplied one by one. The component supply unit 3B is equipped with a storage tape that covers a large number of electronic components with cover tapes that are stored at regular intervals in each storage section formed of a concave portion of the carrier tape. By peeling the cover tape, one electronic component is supplied to the component extraction unit of the component supply unit 3B one by one and is extracted from each storage unit by the suction nozzle 5 of the mounting head body 6.

  The pair of front and rear beams 4A and 4B that are long in the X direction are individually moved by sliding sliders fixed to the beams 4A and 4B along a pair of left and right front and rear guides driven by a Y direction linear motor. Move in the Y direction. The Y-direction linear motor includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover 7A fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. Consists of

  The beams 4A and 4B are respectively provided with the mounting head bodies 6 that move along the guides in the longitudinal direction (X direction) by an X-direction linear motor (not shown). The linear motor includes a pair of front and rear stators fixed to the beams 4A and 4B, and a mover provided on the mounting head body 6 and positioned between the stators.

  Accordingly, each mounting head body 6 is provided inside each beam 4A, 4B so as to face each other, and moves above the component pick-up position of the printed circuit board P and the component supply unit 3B on the positioning portion of the transport device 2.

  Next, the first embodiment of the mounting head body 6 will be described with reference to FIGS. 2 to 6. Reference numeral 11 denotes a nozzle suspension support body that suspends and supports the suction nozzle 5 via a nozzle shaft 27. A ball screw 16 rotated by a nozzle lifting / lowering motor 15 is fitted to a nut body 13 provided on the upper part of the nozzle suspension support 11, and the ball screw 16 is rotated by driving of the nozzle lifting / lowering motor 15, thereby guiding the guide. The nozzle suspension support body 11 moves up and down through the nut body 13 along the rail.

  In addition, 20 is a slip ring, 21 is a coupling, 22 is a rotary joint, and the inside of the roller rest body 24 provided with the roller rest 23 under the said nozzle suspension support body 11 has an air vacuum suction pipe, air A pipe 25 that accommodates the compressed air outlet pipe and the wiring cord is rotatably arranged.

  A cam follower 28 is provided on the top of the mounting member 26 fixed to the nozzle shaft 27 connected to each suction nozzle 5. The cam follower 28 is engaged with the roller rest 23 from above, and the mounting head 12 has 14 suctions. The nozzles 5 are arranged on the circumference at predetermined intervals, and a rotor 30 of a θ drive motor 29 (direct drive motor) for rotating the mounting head 12 is built in. The rotor 30 is connected to the nozzle shaft. 27 penetrates so that raising and lowering is possible.

  Reference numeral 31 denotes a head rotation support body that rotatably supports the mounting head 12, and this rotation support body 31 is fixed to an attachment body (not shown) of the mounting head body 6 through a cable 32. A coil 33 is accommodated in the rotary support 31 and constitutes a θ drive motor 29 for rotating the mounting head 12 together with the rotor 30.

  Reference numeral 35 denotes a cylinder unit fixed to the upper portion of the head rotation support 31. The cylinder unit 35 is provided with air cylinders 35S corresponding to the 14 nozzle shafts 27. A solenoid valve 36 is disposed corresponding to the cylinder 35S. The nozzle shaft 27 can be moved up and down in the head rotation support 31 and the cylinder unit 35.

  A coil spring 37, which is a first urging body, is disposed around the nozzle shaft 27 above the suction nozzle 5. The lower end of the coil spring 37 is locked to the upper portion of the suction nozzle 5, and the upper end is The coil spring 37 urges the suction nozzle 5 (nozzle shaft 27) to be always lowered by engaging with an upper wall 39 that forms a groove 38 formed in the lower surface of the head rotation support 31.

  A locking groove 40 is formed around the upper and lower intermediate positions of the nozzle shaft 27, and the rod member 41 of the air cylinder 35 </ b> S as a locking device is opened in the cylinder unit 35 in the locking groove 40. The storage groove 42 is movably disposed. A coil spring 43, which is a second urging body, is disposed in a portion near the center of the cylinder unit 35 that forms the storage groove 42, and the nozzle shaft 27 is loosely fitted in a through hole 41B extending in the vertical direction. The coil spring 43 urges the rod member 41 so that the locking portion 41 </ b> A of the rod member 41 in the state of being engaged is fitted in the locking groove 40 of the nozzle shaft 27.

  Then, air enters the solenoid valve 36 through a communication groove 35A communicating with the compressed air blowing pipe disposed in the pipe 25. When the solenoid valve 36 is switched, the rod member 41 is moved to the cylinder unit 35. From the state in which the locking portion 41A of the rod member 41 is locked to the locking groove 40 of the nozzle shaft 27, the locking is released from the state of moving to the center direction. For this reason, the nozzle shaft 27 is unlocked and can be moved up and down.

  Therefore, when the electronic valve is switched when the electronic component is taken out from the component supply unit 3A or when the electronic component is mounted on the printed circuit board P, the rod is caused by the air pressure against the urging force of the coil spring 43. The member 41 is moved, and the nozzle shaft 27 is unlocked. For this reason, when the nozzle lifting motor 15 is driven to rotate the ball screw 16 and lower the nozzle suspension support 11 through the nut body 13, the suction nozzle 5 (nozzle shaft 27) is also moved by the biasing force of the coil spring 37. It will descend.

  Reference numeral 8 denotes a component recognition camera that images the electronic component sucked and held by the suction nozzle 5 and images the electronic component sucked and held by the suction nozzle 5 while the mounting head 12 moves.

  With the above configuration, when the electronic component mounting apparatus 1 is automatically operated, the first printed circuit board P is transported from the upstream apparatus to the board positioning unit by the transport apparatus 2, and is positioned and fixed by the positioning mechanism.

  Next, the mounting head body 6 moves according to the mounting data relating to the mounting coordinates of the electronic component stored in the storage device, and the electronic component to be mounted by the suction nozzle 5 corresponding to the component type of the electronic component to be mounted is predetermined. Are sucked out from the component supply unit 3B.

  More specifically, for example, an X-direction linear motor is placed in the X direction at a position above a component supply unit 3B that supplies an electronic component to be mounted by a predetermined suction nozzle 5 of the mounting head body 6 provided on the back beam 4A. The Y direction linear motor is driven and moved in the Y direction while being driven. And since the above-mentioned component supply unit 3B is already in a state where the feeding motor and the peeling motor are driven and the components can be taken out at the component suction position, the θ driving motor 29 is driven to rotate the mounting head 12, After the suction nozzle 5 corresponding to the electronic component to be extracted is moved above the component extraction portion of the component supply unit 3B that supplies the electronic component to be extracted, the nozzle lifting motor 15 is driven to rotate the ball screw 16 and the nut body 13 The nozzle suspension support body 11 is lowered via

  At this time, as shown in FIG. 5, the adsorption corresponding to the component type of the electronic component to be taken out via the communication groove 35A communicating with the compressed air blowing pipe disposed in the pipe 25 and the operated solenoid valve 36. When air enters the air cylinder 35S corresponding to the nozzle 5 (the right suction nozzle 5 shown in FIG. 5), the air cylinder 35S is operated, and the cylinder unit 35 is operated by the air pressure against the urging force of the coil spring 43. The rod member 41 is moved toward the center of the nozzle shaft 27, and the nozzle shaft 27 corresponding to the suction nozzle 5 is unlocked.

  For this reason, when the nozzle raising / lowering motor 15 is driven to rotate the ball screw 16 and the nozzle suspension support 11 is lowered via the nut body 13, the cam follower 28 is moved from above to the roller rest 23 by the urging force of the coil spring 37. In the pressed state, the nozzle suspension support 11 and the suction nozzle 5 (nozzle shaft 27) unlocked are also lowered. Therefore, the electronic component D can be picked up and taken out from the predetermined component supply unit 3B.

  At this time, since the solenoid valve 36 corresponding to the suction nozzle 5 that does not take out the electronic component does not operate, the nozzle suspension support 11 is lowered, but the engagement of the nozzle shaft 27 that corresponds to the suction nozzle 5 that does not take out the electronic component. Since the locking portion 41A of the rod member 41 is locked in the stop groove 40, the suction nozzle 5 remains raised and does not descend (see FIG. 5).

  Since a plurality of component supply units 3B are arranged side by side on the feeder base 3A, as shown in FIG. 6, among the plurality of suction nozzles 5 provided on the mounting head 12, for example, 2 located at 3 o'clock and 9 o'clock. The solenoid valves 36 corresponding to the respective suction nozzles 5 are actuated, and as described above, the two suction nozzles 5 are lowered together with the lowering of the nozzle suspension support 11 so that the two component supply units 3B At the same time, the electronic components D can be picked up and taken out.

  After the electronic parts are taken out, the solenoid valve 36 is operated to stop air blowing, and the rod member 41 is moved outward of the cylinder unit 35 by the urging force of the coil spring 42. 15 is driven to raise the nozzle suspension support 11 and raise the suction nozzle 5. When the suction nozzle 5 finishes rising, the locking portion 41A of the rod member 41 is locked in the locking groove 40 of the nozzle shaft 27, and the nozzle shaft 27 is locked and can be moved up and down. Disappear.

  When the next electronic component is taken out, the mounting head body 6 is moved above the component supply unit 3B that supplies the electronic component to be taken out, and the θ driving motor 29 is driven to rotate the mounting head 12 and take it out. The suction nozzle 5 corresponding to the electronic component to be taken out is moved above the component take-out portion of the component supply unit 3B for supplying the electronic component to be taken, and the suction nozzle 5 corresponding to the electronic component to be taken out is supported as described above. The electronic head is lowered together with the body 11 to pick up and take out the electronic component from the predetermined component supply unit 3B, and the mounting head 12 is raised.

  In this way, electronic components can be taken out from the component supply unit 3B one after another by the corresponding suction nozzles 5, and the electronic components are sucked and held by the 14 suction nozzles 5 of the mounting head 12 on the back side. Next, the mounting head 12 moves so as to mount the electronic component at a predetermined position on the printed circuit board P positioned by the substrate positioning unit by driving the Y direction linear motor and the X direction linear motor. In the middle of the movement of 12, the electronic component picked up and held by each suction nozzle 5 is picked up by the component recognition camera 8 when passing the upper position of the component recognition camera 8 while moving (fly recognition).

  At the time of this fly recognition, the mounting head body 6 is lowered, or all the solenoid valves 36 are operated to lower the nozzle suspension support body 11 and all the suction nozzles 5 are lowered. An electronic component may be imaged by the component recognition camera 8.

  Based on this imaging result, how much the electronic component is displaced and held with respect to the suction nozzle 5 is recognized by a recognition processing device (not shown) for the XY direction and the rotation angle, and Y The suction nozzle 5 that holds the electronic component by driving the direction linear motor and the X direction linear motor moves to the printed circuit board P.

  Then, the position recognition processing result of each electronic component captured by the above-described component recognition camera 8 and recognized by the recognition processing device is added to each mounting coordinate of the mounting data, and Y is controlled by a control device (not shown). The direction linear motor, the X direction linear motor, and the θ drive motor 29 are corrected and controlled, and the electronic nozzles are mounted at predetermined positions on the printed circuit board P while the suction nozzle 5 of the mounting head 12 on the back side corrects the positional deviation. The

  Also in this case, as described above, the θ drive motor 29 is corrected and driven to rotate the mounting head 12, and then the nozzle lifting / lowering motor 15 is driven to lower and mount the nozzle suspension support 11. The solenoid valve 36 corresponding to the suction nozzle 5 corresponding to the component type of the electronic component to be operated is operated, and the suction nozzle 5 holding the electronic component by suction is lowered with the lowering of the nozzle suspension support 11, so that printing is performed. An electronic component is mounted on the substrate P.

  Similarly, by mounting the electronic component taken out from the component supply unit 3b on the printed circuit board P, the mounting operation on the first printed circuit board P is completed, and the printed circuit board P is moved downstream, and the next The printed board P is transported to the board positioning unit and used for mounting electronic components.

  Next, a second embodiment of the mounting head body 6 will be described with reference to FIG. 7 to FIG. 10, but the points different from the first embodiment will be described, and the description of the common ones will be omitted.

  In FIG. 7, reference numeral 45 denotes a fixing member fixed to the upper portion of the mounting head 12, and a cylindrical coil 47 of the voice coil motor 46 is fixed to the upper portion of the fixing member 45. As shown in FIG. 8, a magnet 48 is fixed to the upper end of the cylindrical coil 47, and an iron 49, which is a magnetic body, is provided around the nozzle shaft 27.

  When the voice coil motor 46 is not energized, the magnet 48 and the iron 49 are attracted by the magnetic force by the magnetic force, and the nozzle shaft 27 is prevented from descending and locked. When the voice coil motor 46 is energized, the magnetic force is canceled ( The suction nozzle 5 (nozzle shaft 27) can be lowered by the biasing force of the coil spring 37.

  Therefore, when the electronic component is taken out from the component supply unit 3A or mounted on the printed circuit board P, the magnetic force is canceled (cancelled) when the voice coil motor 46 corresponding to the suction nozzle 5 is energized. The nozzle shaft 27 is unlocked, and the suction nozzle 5 (nozzle shaft 27) can be lowered by the urging force of the coil spring 37. Therefore, when the nozzle lifting motor 15 is driven to rotate the ball screw 16 and lower the nozzle suspension support 11 through the nut body 13, the suction nozzle 5 (the lock is released by the biasing force of the coil spring 37 ( Only the nozzle shaft 27) is lowered (see FIG. 9).

  And after taking out this electronic component, the nozzle raising / lowering motor 15 drives, the nozzle suspension support body 11 is raised against the urging | biasing force of the coil spring 37, and this adsorption nozzle 5 is also raised. Then, when the voice coil motor 46 is de-energized when the suction nozzle 5 finishes raising, the magnet 48 and the iron 49 are attracted by the magnetic force to prevent the nozzle shaft 27 from descending and lock.

  Since a plurality of component supply units 3B are arranged side by side on the feeder base 3A, as shown in FIG. 10, among the plurality of suction nozzles 5 provided on the mounting head 12, for example, 2 located at 3 o'clock and 9 o'clock. Each of the suction nozzles 5 is energized by the corresponding voice coil motor 46, and as described above, the two suction nozzles 5 are lowered together with the lowering of the nozzle suspension support 11, and the two component supply units 3B. At the same time, the electronic components D can be picked up and taken out simultaneously.

  In the first and second embodiments, the arrangement position of any of the plurality of suction nozzles 5 out of 14 provided in the mounting head 12 and the mounting position of the electronic component on the printed circuit board P are the same. If it is in the position, as described above, the plurality of suction nozzles 5 can be lowered at the same time as the nozzle suspension support 11 is lowered, and electronic components can be mounted on the printed circuit board P at the same time.

  In the first and second embodiments, the component supply unit 3A is used as the component supply device 3. However, the present invention is not limited to this, and electronic components are regularly and horizontally arranged on the tray used in the tray feeder. Since it is placed, even in this tray feeder, electronic components can be sucked and taken out simultaneously by a plurality of suction nozzles.

  As described above, the present invention improves the production efficiency of the printed circuit board by allowing a plurality of suction nozzles to be lowered at the same time for taking out the electronic component from the component supply device or mounting the electronic component on the printed circuit board. Can be achieved.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Component supply apparatus 3B Component supply unit 5 Adsorption nozzle 11 Nozzle suspension support body 12 Mounting head 13 Nut body 15 Nozzle raising / lowering motor 16 Ball screw 23 Roller rest 27 Nozzle shaft 28 Cam follower 35 Cylinder unit 35S Air cylinder 36 Solenoid Valve 37 Coil spring (first biasing body)
43 Coil spring (second biasing body)
46 Voice coil motor 47 Coil 48 Magnet 49 Iron

Claims (3)

In an electronic component mounting apparatus that takes out electronic components supplied from a component supply device by a plurality of suction nozzles provided in the mounting head and mounts them on a printed circuit board.
Suspending and supporting the plurality of suction nozzles on a suspension support body that can be lifted and lowered by a drive source in a state of being always lowered by each biasing body,
Each suction nozzle supported by being suspended by the suspension support is locked by a lock mechanism so as not to descend,
The electronic component mounting apparatus according to claim 1, wherein the suspension support body is lowered by the driving source, and the suction nozzle unlocked by the corresponding lock mechanism is lowered by the urging force of the corresponding urging body. In an electronic component mounting apparatus that takes out electronic components supplied from a component supply device by a plurality of suction nozzles provided in the mounting head and mounts them on a printed circuit board.
The plurality of suction nozzles are suspended and supported by a suspension support body that can be lifted and lowered by a drive source in a state of being constantly lowered by each first biasing body,
The suction nozzles supported by the suspension support can be moved around the nozzle shafts connected to the suction nozzles urged by the second urging members so that the suction nozzles are not lowered. Each rod member is urged by each second urging body to be locked and locked.
The suspension nozzle is lowered by the drive source, and the suction nozzle that is unlocked by moving the rod member against the urging force of the second urging body by the operation of the corresponding air cylinder corresponds to the corresponding suction nozzle. An electronic component mounting apparatus, wherein the electronic component mounting apparatus is lowered by an urging force of a first urging body. In an electronic component mounting apparatus that takes out electronic components supplied from a component supply device by a plurality of suction nozzles provided in the mounting head and mounts them on a printed circuit board.
Suspending and supporting the plurality of suction nozzles on a suspension support body that can be lifted and lowered by a drive source in a state of being always lowered by each biasing body,
A magnetic body provided around the nozzle shaft connected to each suction nozzle by de-energization of a voice coil motor provided with a magnet so that the suction nozzles supported by the suspension support are not lowered. The magnet locks the nozzle shaft to attract by magnetic force,
The suspension nozzle is lowered by the drive source and energized to the corresponding voice coil motor, so that the suction nozzle connected to the nozzle shaft that has been unlocked by canceling the magnetic force corresponds to the corresponding biasing body. The electronic component mounting apparatus is lowered by the urging force of the electronic component.

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