JPS6097700A - Electronic part mounting machine - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an apparatus for mounting electronic components onto an electronic circuit board, etc., in which electronic components housed in a tape-like elongated material are mounted one by one onto an electronic circuit board. This invention relates to an electronic component mounting machine that sequentially mounts electronic components.

Conventional configurations and their problems Traditionally, leadless type electronic components (hereinafter referred to as chip components), such as chip-type resistors and chip-type multilayer capacitors, are mounted on a substrate that constitutes an electronic circuit. The apparatus for this purpose was as shown in FIGS. 1 and 2.

IQl is a chip part, tape-shaped storage tape 10
They are arranged in order in 2. Reference numeral 103 denotes a parts supply device that transports the storage table 102 at a predetermined pitch.

104 (is a lever that performs predetermined pitch feeding I of the component supply device 1Q3).

A supply lever 105 drives the lever 104, and is attached to the door 106 for mounting the chip component 10i. Reference numeral 107 is an XY table to which the mounting head 106 is attached and is movable back and forth and left and right.

108 is a circuit board on which the chip part 101 is mounted.
It is attached by the card 106.

However, in such a configuration, after supplying the storage tape 102 and feeding it one pitch at /<-105, the chip component IC is
) 1 is suctioned and held by the mounting head 106, and the circuit board 108 is
Since the chip component 103 is mounted on the chip, the mounting tact takes a long time, and since the XY table 107 is placed facing the component supply device 103, the component supply device can only be installed on one side.
It had two major drawbacks: the number of types of 01 was reduced.

OBJECTS OF THE INVENTION The present invention solves the above-mentioned conventional drawbacks, and provides an electronic component mounting machine that can mount many types of chip components onto a circuit board in a short time with a small machine space.

Structure of the Invention The present invention provides a component supply device that sequentially intermittently feeds a storage tape storing chip components at a predetermined pitch, a drive means that drives the intermittent feed of the component supply device, and a drive means that drives the component supply device to supply a desired component. Since it is equipped with a moving means that can be moved to the position of the device, while the mounting head is mounting chip components on the circuit board, the component supply device can be moved intermittently, and the next chip component to be mounted can be prepared. This is an extremely advantageous device that can shorten the mounting tact time, can place component supply devices on both sides of the circuit board, and can store many types of chip components in a small space.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 3 to 7.

1 is a chip component, which is stored in a storage tape 2 in an open manner and covered with a cover tape 3 to prevent it from falling off.

4 is a parts supply device, and by the swinging movement of the lever 5,
It has a structure in which the storage tape 2 is intermittently fed 9 at a predetermined pitch. The chip component 1 supplied to a predetermined position of the component supply device 4 is in a state where the covering tape 3 is wound onto the reel 6 and the lid is open.

Next, the driving means for intermittent feeding of the component supply device 4 will be described.

The feed lever 7 is slidably guided in the vertical direction by a guide 8, is connected to a feed cylinder 9, and has a structure in which the other end is interlocked with the lever 5.

The feed lever 7, guide 8, and feed cylinder 9 are mounted on a movable block 11 guided by a spline shaft 10.

This block 11 is connected to a drive belt 12 and can be moved to any position on the spline shaft 10 by rotation of a servo motor 13.

Therefore, the feed lever 7 moves to the desired position of the component supply device 4 and swings the lever 6. Thereby, the chip component 1 can be supplied to a predetermined position of the component supply device 4.

14 is a circuit board on which the chip component 1 is mounted.

The above-mentioned parts supply device 4. Feed lever 7, block 1
The first and second circuit boards are installed on both sides of this circuit board 14.

Reference numeral 15 denotes a transport section, which discharges the circuit board 14 for which the device of the chip component 1 has been completed and carries in a new circuit board 14'. Also, the new circuit board 14 sent by this transportation
A device (not shown) is also provided for positioning ' in a predetermined position. The circuit boards 14, 14' are transported by a motor 16 running a belt 17.

Reference numeral 18 denotes an XY table, which is suspended above the circuit board 14. This XY table 18 is driven by servo motors 19° and 19', and has a structure that allows it to move horizontally in the XY directions and can be positioned at any position. It becomes.

Reference numeral 20 denotes a mounting head, which is attached to the XY table 18.

The mounting head 2o includes a nozzle 21 that sucks and holds the chip component 1, a tube 22 connected to a straight-line holder (not shown) that generates a suction force, and an air cylinder 23 that moves the nozzle 21 up and down. It functions to transfer the chip components 1 from the component supply device 4 to the circuit board 14.

Next, regarding the electronic component mounting machine configured as above,
The operation will be explained below.

The circuit board 14 that has been installed and the new circuit board 14
′ rides on the belt 17 and is rotated by the rotation of the motor 16.
When they are ejected and carried in, and arrive at a predetermined position, the rotation of the motor 16 is stopped and a new circuit board 14' is positioned.

Next, the do 20 is mounted on the XY table 18,
The desired chip component 1 is moved directly above the predetermined position of the storage tape 2 set in the component supply device 4, and by the operation of the air cylinder 23, the nozzle 21 is lowered and suction force is generated through the tube 22, and the chip is removed. After sucking and holding the component 1, the nozzle 21 rises again.

After the XY table 18 moves to the position where the circuit board 14 is to be mounted, the chip component 1 which is suctioned and held on the mounting plate 2o is mounted on the circuit board 14 by the nozzle 21 being lowered.

Upon completion of installation, the nozzle 21 turns off its suction force and rises.

Furthermore, at the same time that the XY table 18 starts moving onto the circuit board 14, the next chip component 1' to be mounted is placed on the circuit board 14.
The supply section starts operating. This operation will be described below.

First, the block 11 is placed in the position of the component supply device 4' where the chip component 1' to be mounted next is set.
The spline shaft 10± is moved by the rotation of the length homotor 13.

When the feeder 11 reaches the desired position, the feed cylinder 9 connected to the feeder lever 7 moves up and down (the lever 5' of the parts feeder 4' makes a swinging movement, The tape 2' is fed intermittently at a fixed pitch.

This operation causes the chip component 11 to be attached next.
is supplied to a predetermined position of the component supply device 4'.

Next, the device head 20, which has completed the first installation,
It is moved by the Y table 18 directly above the chip component 1' to be mounted next.

By repeating the above cycle, desired chip components can be sequentially mounted on the circuit board one by one.

As described above, according to this embodiment, while the mounting head is mounting a chip component onto a circuit board, the storage tape is intermittently fed at a predetermined pitch by the component supply device, thereby preparing the next chip component at a predetermined position. As a result, the mounting tact time can be shortened, and the mounting head can pick up chip components from the component supply devices installed on both sides of the circuit board. chip parts can be installed.

Effects of the Invention The present invention provides a parts supply device that sequentially and intermittently feeds storage tapes for storing electronic components at a predetermined pitch, a drive unit that drives the intermittent feed of the component supply device, and a drive unit that moves the drive unit to an arbitrary position. By being equipped with a moving means for the drive unit that moves the drive unit, it is possible to place the next component in the component supply unit at a predetermined position while the component is being mounted on the circuit board with the mounting head. The tact time for mounting parts can be shortened, and the effect is significant.

[Brief explanation of drawings]

FIG. 1 is a side view showing a schematic configuration of a conventional electronic component mounting machine, FIGS. 2 and 4 are sectional views of a storage tape, and FIG. 3 shows the entire electronic component mounting machine according to an embodiment of the present invention. FIG. 5 is a side view showing a component supply device used in the same embodiment, FIG. 6 is a partial cross-sectional view showing the drive section of the component supply device in the same embodiment, and FIG. It is an AA sectional view in . 1...Electronic parts, 2...Storage tape, 4...
Parts supply device, 7... Feed lever, 9...
Feed cylinder, 10... Spline shaft, 12
...1 drive heald, 13...servo motor,
14 ・Circuit board, 18...XY table, 2Q
- Mounting head. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure ←→ Figure 2 ot Figure 4

Claims (2)

[Claims] (1) An X-Y table that moves a mounting head that is movable up and down at a predetermined position within a predetermined range, and a component receiving system that receives parts from the mounting throat within the movement range of the mounting throat. a plurality of component supply devices provided with a plurality of parts and located at positions that do not impede transportation of the board and movement of the mounting head;
one or more intermittent feeding means that is in charge of at least a plurality of the component supply devices and intermittently feeds the component storage tape of the component supply device at a predetermined pitch; A method for mounting electronic parts in which a feed drive unit moves at position 1 of the device and drives the intermittent feed means within its assigned range. (2) The electronic component mounting machine according to claim 1, wherein the component supply devices are located on both sides of the board guide section in the transport direction.