JPS601900A - Device for mounting electronic part with recognition - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an apparatus for transferring and mounting electronic components onto a printed circuit board.

Structure of the conventional example and its problems When mounting the electronic component 2 on the printed circuit board 1 positioned as shown in FIG. 1, conventionally, as shown in FIG. and 4d
f: The position of electronic components was adjusted by applying force.

At the time of installation, the electronic component 2 is held in the center 5 of the throat due to the mechanical looseness of the regulating claws 4a, 4b, 4C, and 4d and the size of the external dimensions of the electronic component 2.
It was difficult to align the centers 6 of the two, and high-density mounting of electronic components was difficult.

Furthermore, the accuracy of the external dimensions of the leads 3 of the electronic component 2 is poor, and accurate positioning is difficult with the conventional method of regulating the position by biasing the lead with a regulating claw.

Furthermore, the electronic component pattern 7 of the printed circuit board 1 has poor dimensional accuracy from the reference hole 8 for regulating the printed circuit board.
When implementing this, accurate positioning was still difficult.

Purpose of the Invention The present invention solves the conventional drawbacks such as misalignment of electronic component patterns on printed circuit boards and electronic components held in mounting heads.
To provide an electronic component mounting apparatus which eliminates the problem of difficulty in accurately positioning and mounting electronic components on a printed circuit board due to misalignment, etc., and which mounts electronic components accurately and at high density.

Structure of the Invention The present invention provides a supply unit for supplying electronic components, a mounting head for holding the electronic components, a center position error of the electronic component held by the mounting head, and a head center position error. A fixed recognition unit that recognizes, a recognition unit held by the mounting head that recognizes a pattern of mounted components on a positioned printed circuit board, and a drive unit that relatively moves the mounting head and the printed circuit board. It is made of It is something to do.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 3 is a plan view of the entire device in the embodiment of FIG. 1;
FIG. 4 shows a front view of the same, and the outline will be explained in the order of steps. Reference numeral 9 denotes a transport device that transports, positions and holds the printed circuit board 1. Reference numeral 10 denotes a component supply section, which supplies the electronic components 2 housed in the tray 11 to the tray 12 for mounting.

FIG. 6 shows that the device head 12 transfers electronic components 2 to printed circuit board 1.
This shows the process of implementing it. As shown in FIG. 6a, the mounting head 12 holds the electronic component 2 housed in the tray 11 and moves to above the component recognition device 13 as shown in FIG. 6. At this time, the mounting head 12 and the component recognition device 14 is known in advance, by recognizing the electronic component 2, it is possible to obtain data such as the direction of the electronic component 2 and the positional error between the center of the electronic component 2 and the center of the mounting head 12. Next, as shown in FIG. Data No. 2 such as position and direction can be obtained.As shown in FIG. Then, the electronic component 2 is mounted on the printed circuit board 1 so that the electronic component 2 and the pattern 7 of the electronic component are not misaligned.Electronic component 2
The printed circuit board 1 that has been completely mounted is transported to the next process by the transport device 9.

Next, details of the apparatus will be explained in order of steps.

FIG. 6 shows the process of supplying the electronic component 2 to the throat 12 for mounting. Tray 1 containing electronic components 2
1 are stacked in the parts supply section 10. The slider 17, which is moved horizontally along the slide shaft 16 by the swing lever 16, pushes out the tray 11 at the lowest stage and supplies the electronic component 2 to the mounting head 12.

FIG. 7a is a plan view of an apparatus for mounting the electronic component 2 on the printed circuit board 1, and FIG. 7a is a side view. This device includes a slide shaft 1 that is movable in a direction parallel to a transport device 9 that transports, positions, and holds the printed circuit board 1, and a slide shaft 20 that is movable in a direction perpendicular to a drive unit 19 and a forward transport device 9. and the drive unit 21
It has a table 22 and can be moved arbitrarily in a horizontal plane. The mounting head 12 attached to the xy table 22 can be rotated about a vertical axis and moved in the vertical direction by a drive unit 23, and the electronic component 2 is placed on the tray 11.
The film is then rolled out, held, and mounted on the printed circuit board 1. Furthermore, a pattern recognition device 14 is attached to the head portion.

FIG. 8 is a sectional view of the drive unit 23 of the AIT mounting head 12, b
is a front view. In FIG. 8(a), the mounting head 1
2 is a piston 2 driven by an actuator 24;
6 is driven in the vertical direction by swinging the leno<-26 which swings around one point. In FIG. 8, a pulley 28 fixed to a motor 27 drives a pulley 29 via a belt 29. A speed reducer 3o is fixed coaxially with the pulley 29, and the speed reducer 31 drives a gear 32.

The gear 32 meshes with a gear 33 fixed to the mounting head 12. Attach the head as described above.

12 is rotatable around a vertical axis. Furthermore, the mounting head 12 is hollow, and the upper end is vacuum-suctioned, and the lower end attracts and holds the Naruko component 2. FIG. This figure shows the process of recognizing the position and rotation angle in the horizontal plane. The component recognition device 13 includes:
By recognizing the position of the guide 3 within the fields of view 34 and 36, the deviation of the mounting head 12 from the 7-inch diameter of the electronic component 2 and the rotation angle 3 of the reference lines in the horizontal plane are determined.
Get 6. FIG. 10 is a diagram showing the inside of the field of view 34 in detail.
37a, b, and c are leads of the electronic component 2.

The component recognition device 13 recognizes the tips 38a and 38b of the lead 37b located second from the corner, calculates the position of the center point 39b, and determines the reference point for mounting the center point 4 of the electronic component 2. shall be.

Similarly, in the field of view 35, the reference point 2 is recognized as the word 1.
Then, the average value of the coordinates with reference point No. 1 is taken as the centerus of the electronic component 2. At the same time, the rotation angle 36 of the entire centerline of the electronic component 2 in the horizontal plane can be set. Furthermore, the leads 37a and 37c in FIG. 10! Similarly, the center points 39a and 39b of Hold part 2 and repeat these steps.

FIG. 11 shows a process in which the pattern recognition device 14 recognizes the position of the electronic component pattern 7 on the printed circuit board 1 and the rotation angle in the horizontal plane. The printed circuit board 1 has IC marks 40a and 40b formed at the same time as the electronic component pattern 7, and the pattern recognition device 14 recognizes the positions of these marks and determines the center point of the two points as the center point of the electronic component pattern. . Cut IC mark 40a, 4
From the position 0b, the rotation angle of the center line of the electronic component pattern 7 in the horizontal plane changes.

Based on the first data on the position and rotation angle of the electronic component 2 and the second data on the position and rotation angle of the electronic component putter/end obtained as described above, a misalignment between the electronic component 2 and the electronic component pattern 7 is generated. The mounting head 12 moves one rotation,
Electronic components 2 are mounted on a printed circuit board 1 with high precision and high density.

FIG. 12 is a plan view of the entire device in the second embodiment, and FIG. 13 is a front view of the entire device. Reference numeral 9 denotes a transport device that transports, positions and holds the printed circuit board. A component supply section 41 supplies the taped electronic component 2 to the mounting head 12. 13 is an electronic component recognition device, 14 is an electronic component pattern recognition device, and 22 is an X7 table.

In this embodiment, the equipment and steps other than the parts supply section 41 are the same as in the first embodiment, so only the differences will be explained.

FIG. 14 is a detailed view of the taped electronic components, and FIG. 15 is a detailed view of the component supply section.

In FIG. 14, 2 is an electronic component, 42 is a tape mount,
43 is an adhesive tape, and the electronic component 2 is attached to the adhesive tape 43
It is pasted on the mount 42 by. In FIG. 15, 44 is a mount reel, 46 is an adhesive tape take-up reel, 46 is a parts cassette, and 47 is a ratchet. The mount 42 is wound around a mount reel 44, and the leading end is supplied to a parts cassette 46. The adhesive tape 43 passes through the parts cassette 46 and is wound onto a take-up reel 46 driven by the motor 4B. The mount 42 in the parts cassette 46 is attached to the ratchet 4
7 feeds the electronic component 2 one by one to the mounting head 12.

Effects of the Invention As described above, the present invention recognizes the matching pattern of the electronic component and the printed circuit board, corrects the position, and mounts the electronic component on the printed circuit board, making it possible to mount electronic components with high precision and high mounting density. There is.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of electronic component mounting, FIG. 2 is a process diagram of conventional electronic component regulation, FIG. 3 is a plan view of a mounting apparatus according to the first embodiment of the present invention, and FIG. 4 is a front view of the same. - Plan view and front view of the pull, Figures 8a and b are sectional views and front views of the mounting head, Figure 9 is a process diagram of electronic component recognition, Figure 10 is a detailed diagram of electronic component recognition, and Figure 11 is a process diagram of part pattern recognition,
FIG. 12 is a plan view of a mounting apparatus according to the second embodiment of the present invention;
FIG. 13 is a front view of the same, FIG. 14 is a perspective view of taped electronic components, and FIG. 16 is a perspective view of the component supply section. 1...Printed circuit board, 2...Electronic components, 3...
...Lead, 7...Electronic component pattern,
9... Conveyance device, 1o... Component supply unit, 12... Mounting head, 13 - Electronic component recognition device, 14... Electronic component pattern recognition device, 22・
...-X"l table, 41...Parts supply department. Name of agent: Patent attorney Satoshi Nakao, and one other person
1 Figure 2 Figure 13 Figure 5 <(L) Cbn (C) (d) Figure 6 Figure 7 Figure 958 (α) (b) Figure 9 Figure 10 Figure 11 Figure #j Figure 12 Fig. 13 Fig. 141Δ 42 Fig. 15

Claims (1)

[Claims] 11. In an apparatus for mounting electronic components supplied from a component supply section onto a positioned printed circuit board, the electronic components are held by a mounting head; 11. A recognition device comprising a mounted component recognition unit that recognizes a positional error between the center of the electronic component and the center of the mounting head, and a recognition unit held by the mounting head that recognizes the pattern of the mounted component on the printed circuit board. Electronic component mounting equipment.