JP3128367B2 - Electronic component supply method and electronic component supply device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component supply method and an electronic component supply device for mounting electronic components with high precision.

[0002]

2. Description of the Related Art FIG. 4 is a plan view of an axial electronic component showing taping accuracy, and FIG. 5 is a perspective view of a conventional electronic component supply device. 4 and 5, an axial type electronic component 3 having a lead wire 2 taped at a predetermined interval with a tape 1 and extending coaxially is supplied to a component supply unit 4.
The tape 1 is pulled out by one step by the transfer unit 5, the tape 1 is cut by the tape cutter 6, and the lead wire 2 of the electronic component 3 supplied from the product supply unit 4 is further inserted by the inserter 7. The electronic component 3 was cut and bent, and was transported and inserted into a predetermined hole of the substrate. When the lead wire 2 is bent, the bending die 8 is bent at a predetermined pitch with respect to the main body of the electronic component 3 and the lead wire 2 as shown in FIG.

[0003]

However, in the above-described conventional configuration, when the lead wire 2 is bent and inserted at a pitch substantially equal to the length of the electronic component main body, variation in the position between the taping and the electronic component main body causes a problem. As shown in FIG. 6B, there is a problem that the electronic component 3 is destroyed by interference between the main body of the electronic component 3 and the bending die 8 that bends the lead wire 2 at a predetermined pitch. In order to avoid such troubles, the taping and the positional accuracy of the electronic component 3 must be strictly controlled, which is difficult.

An object of the present invention is to solve the above-mentioned conventional problems, and to provide an electronic component supply method and an electronic component supply method capable of correcting an error during supply of electronic components before mounting to improve reliability in component mounting. It is intended to provide a device.

[0005]

In order to solve the above-mentioned problems, an electronic component supply method according to the present invention comprises cutting a tape of an electronic component supplied from a component supply section and taped at regular intervals by a cutter section. An electronic component supply method for supplying an electronic component to an inserter that mounts the electronic component on a circuit board, wherein the tape is cut by the cutter unit, and then a correction chuck unit having a diameter larger than a lead wire diameter of the electronic component. The electronic components are transferred to the correction chuck portion by sandwiching the lead wires in the groove portions, and the correction chuck portions are respectively parallel to the lead wires while driving the lead wires in the groove portions by the driving means. By holding the electronic component body in a linear motion, the electronic component is coaxial with the lead wire so that the center position of the electronic component body matches the center position of the inserter. A first step of position correction in direction,
Transferring the position-corrected electronic component from the correction chuck portion to the insert.

The first step in the electronic component supply method of the present invention is to make the center position of the electronic component body coincide with the center position of the inserter and to correct the bending of the lead wire of the electronic component.

Further, in the first step of the electronic component supply method of the present invention, the type of the electronic component is checked by making the center position of the electronic component body coincide with the center position of the inserter and applying a current to the electronic component. It has a verifier function to perform this.

Further, according to the present invention, there is provided an inserter for cutting a tape of an electronic component, which is supplied from a component supply unit and taped at regular intervals, with a cutter unit, and mounts the electronic component on a circuit board. An electronic component supply device for supplying an electronic component to the electronic component, wherein a groove having a diameter larger than a lead wire diameter of the electronic component is provided, and the lead wire is configured to be sandwiched by the groove, and the lead is inserted into the groove. The electronic component main body is configured so as to be able to pinch the electronic component body by linearly moving in parallel with the lead wire while following the wire, and the electronic component is inserted into the lead wire so that the center position of the electronic component matches the center position of the inserter. It is provided with a position correcting means for correcting the position in the coaxial direction.

[0009]

With the above arrangement, when transferring the electronic component from the component supply section to the inserter, the electronic component is centered using the correction chuck section, and the electronic component is positioned so that the center position of the electronic component matches the center position of the inserter. Since the position is corrected in the coaxial direction of the lead wire, the component can be supplied without leaving the taping error and the error in the component supply section to the inserter, and the reliability in component mounting is improved.

[0010]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a configuration of an electronic component supply device according to one embodiment of the present invention. In FIG. 1, a component supply unit 11 supplies an axial electronic component 12 taped at regular intervals. Also, the transfer unit 13 is a tape of the axial electronic component 12 supplied from the component supply unit 11.
Hold 14 and pull out. Further, the tape cutter 15 is disposed so as to be orthogonal to the direction of the tape 14, and separates the electronic components 12 by cutting the tape 14 pulled out by the transfer unit 13. Further, the correction chuck 16 is provided with springs 18 for urging inward so that the electronic component 12 is sandwiched between the tip members 17 thereof. The correction chuck 16
The two front end members 17 are configured so as to sandwich the lead wire 19 of the electronic component 12, respectively. Inside the front end member 17, grooves 20 having a diameter larger than the diameter of the lead wire 19 are respectively formed as shown in FIG. The lead wire 19 is provided
The tip member 17 is configured so as to be linearly movable in parallel with the lead wire 19 while sandwiching the lead wire 19 along the groove 20 and sandwiching the lead wire 19 in the groove 20. One end of a link member 21 is rotatably supported on the correction chuck 16 on the side opposite to the side where the tip member 17 is provided, and the drive shaft of the air thin lid 22 is mounted on the other end. 23 are supported.

The operation of the above configuration will be described below. First, a transfer section for transferring the electronic component 12 in step S1.
After holding the leading end of the tape 14 by 13, the tape 14 is pulled out by one pitch in step S 2, and the tape 14 is cut by the tape cutter 15 in step S 3 to separate the electronic component 12. Then, in step S4, the lead wires 19 of the electronic component 12 are respectively inserted into the grooves 20 provided inside the tip member 17, and in step S5, the chuck of the transfer unit 13 is opened to correct the electronic component 12. Tip member 17 of chuck 16
And the correction chuck from the transfer unit 13
The electronic component 12 is transferred to the 16 tip members 17. At this time, as shown in FIG. 2, a groove 20 having a diameter larger than the diameter of the lead wire 19 is provided in the distal end member 17 of the correction chuck 16, and the lead wire 19 is sandwiched by the groove 20 so that the longitudinal direction of the electronic component 12 is Only in a state where linear motion is possible.

Next, in this state, in step S6, the linear movement of the drive shaft 23 of the air cylinder 22 via the link member 21 causes the electronic components 12 to move along the lead wires 19 in the grooves 20 of the tip member 17, respectively. Lead wire in the longitudinal direction
The tip member 17 is linearly moved inward in parallel with 19 to pinch and center the electronic component 12 so that the center position of the electronic component 12 matches the center position of the inserter that mounts the electronic component 12 on the circuit board. Thus, the position of the electronic component 12 is corrected in the coaxial direction of the lead wire 19, and the bending of the lead wire 19 is also corrected. That is, the center line perpendicular to the longitudinal direction of the electronic component 12 coincides with the center line of the air cylinder 22 regardless of the taping state. The center line between the air cylinder 22 and the insert has a structure that coincides when the transfer unit 13 transfers the center line to the insert, whereby the center line perpendicular to the longitudinal direction of the electronic component 12 is Coincides with the center line of At this time, the bending of the lead wire 19 of the electronic component 12 is also corrected at the same time by aligning the lead wire 19 with the groove 20 of the tip member 17 of the correction chuck 16. Further, the electronic component 12 whose position has been corrected in step S7 is again held by the transfer unit 13, and the correction chuck 16 is opened in step S8.
In step 9, the electronic component 12 is transferred to the inserter, transported to a predetermined hole of the board of the electronic component 12, and inserted.

Therefore, the tape 14 of the electronic component 12 supplied from the component supply unit 11 is held by the transfer unit 13 and pulled out, and then cut by the cutter 15, and has a diameter larger than the lead wire diameter of the electronic component 12. The electronic components 12 are transferred to the tip member 17 while holding the lead wires 19 in the grooves 20 of the both tip members 17 respectively, and the correction chuck 16 is moved via the air cylinder 22 and the link member 21.
Respectively, the lead wire 19 is inserted into the groove 20.
The tip member 17 in parallel with the lead wire 19
The electronic components 12 are linearly moved inward, and the center of the electronic component 12 is sandwiched and centered.
When transferred from 11 to the insert, position correction and lead wire correction can be performed.

In the present embodiment, the air cylinder 22 and the link member 21 are used as a drive source for centering the correction chuck 16 with respect to the electronic component 12, but a motor or other power source may be used. Further, in the present embodiment, the center position of the electronic component body is made to match the center position of the inserter and the bending of the lead wire of the electronic component is corrected, but the center position of the electronic component body is changed to the center position of the inserter. And a verifier function for checking the type of the electronic component by passing a current through the electronic component.

[0015]

As described above, according to the present invention, the electronic components are transferred by sandwiching the lead wires in the grooves of the correction chuck portion having a diameter larger than the lead wire diameter of the electronic components, and the driving means The correction chucks are linearly moved in parallel with the lead wires while holding the lead wires in the grooves, respectively, so that the main body of the electronic component is sandwiched. An error in the component supply unit can be corrected, and highly reliable mounting of electronic components can be realized.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of an electronic component supply device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which the electronic component 12 is sandwiched by a tip member 17 in the electronic component supply device of FIG. 1;

FIG. 3 is a flowchart showing the operation of the electronic component supply device of FIG. 1;

FIG. 4 is a plan view of an axial electronic component showing taping accuracy.

FIG. 5 is a perspective view showing a configuration of a conventional electronic component supply device.

FIG. 6 is a plan view showing a positional relationship between a bending die 8 and an electronic component 3 in a conventional electronic component supply device,
Is a plan view when the electronic component is at the center of the inserter, and b is a plan view when the electronic component is not at the center of the inserter

[Explanation of symbols]

 7 Inserter 11 Component supply section 12 Electronic component 14 Tape 15 Tape cutter 16 Correction chuck 17 Tip member 18 Spring 19 Lead wire 20 Groove 21 Link member 22 Air cylinder

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-291799 (JP, A) JP-A-4-365399 (JP, A) JP-A-61-16599 (JP, A) JP-A-62-1987 106693 (JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 13/04

Claims (4)

(57) [Claims] An electronic component supply for supplying an electronic component to an insert for mounting the electronic component on a circuit board by cutting a tape of the electronic component taped at a predetermined interval supplied from a component supply unit with a cutter unit. After the tape is cut by the cutter unit, the lead wires are sandwiched by grooves of the correction chuck unit having a diameter larger than the lead wire diameter of the electronic component, and the electronic component is transferred to the correction chuck unit. By placing the lead wires in the grooves by the driving means and linearly moving the correction chuck portions in parallel with the lead wires to clamp the electronic component body, the center position of the electronic component body is set. A first step of correcting the position of the electronic component in the coaxial direction of the lead wire so as to match the center position of the inserter; Electronic component supplying method and a second step of transferring from the click portion on the inserter. 2. The electronic component supply method according to claim 1, wherein, in the first step, the center position of the electronic component body is matched with the center position of the inserter, and the lead wire of the electronic component is bent. 3. The first step has a verifier function for matching the center position of the electronic component main body with the center position of the inserter and checking the type of the electronic component by flowing a current through the electronic component. 2. The electronic component supply method according to 1. 4. An electronic component supply for supplying an electronic component to an insert for mounting the electronic component on a circuit board by cutting a tape of the electronic component taped at a predetermined interval supplied from a component supply unit with a cutter unit. An apparatus, wherein grooves each having a diameter larger than the lead wire diameter of the electronic component are provided, and the lead wire is configured to be able to be sandwiched by the groove portions, and the lead wire is arranged along the groove. Position correcting means for linearly moving each of the electronic components in parallel so as to be able to clamp the electronic component body, and for correcting the position of the electronic component in the coaxial direction of the lead wire so that the center position of the electronic component coincides with the center position of the inserter. Electronic component supply device equipped with.