JP3270600B2 - Electronic component lead forming method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus, and more particularly, to a method for correcting the lead of an electronic component to be mounted, which is suitable for correcting the lead of the electronic component to be mounted. It relates to a forming method.

[0002]

2. Description of the Related Art In general, a circuit board constituting an electronic circuit is formed by mounting various electronic components on a printed circuit board (circuit board) and then soldering the leads (legs) of the mounted electronic components and the wiring of the printed circuit board. It is constituted by attaching. In order to mount an electronic component on a printed circuit board in this way, a lead of the electronic component is inserted into a through hole formed in the printed circuit board using an electronic component mounting apparatus such as a robot, and then the printed circuit board is mounted. This is performed by clinching (bending) a lead projecting to the lower surface side of the substrate.

[0003]

However, when electronic components are mounted by the conventional method as described above,
The following problems exist. Electronic components are usually manufactured based on a predetermined standard, but some of the components actually supplied to the mounting apparatus include, for example, impact during transportation, malfunction of the component manufacturing machine, careless handling, and the like. As a result, the lead may be bent or deformed, and the lead pitch (lead interval) may deviate from a regular dimension, or the leading end position may deviate from the regular position. Also, in particular, so-called irregularly shaped parts include those whose main body is made of dip-molded resin. In such a part, the dimensions and shape of the main body, the shape and length of the lead, etc. For example ± 1m
Usually, there is a large variation of about m. As described above, when a component with deformed leads is to be mounted by a mounting apparatus, when the main body of the component is gripped by a gripping means such as a chuck mechanism, the tip position of the lead with respect to the gripping means varies. In addition, the lead of the component cannot be properly inserted into the through hole of the printed circuit board. As a result, various problems have been caused, such as the equipment being stopped due to a component insertion error and the equipment operating rate being reduced, and the occurrence of defective products resulting in increased defective costs.

To solve such a problem, a method of forcibly positioning the position of a lead by gripping a lead itself, not a main body of a component, and securely inserting the lead into a through hole of a printed circuit board in a mounting apparatus. There is. However, in such a method, when a large number of components are mounted on a printed circuit board at a high density, the member holding the lead of the component interferes with other components mounted earlier on the printed circuit board. In such a case, there is a problem that the method of gripping the lead cannot be applied. SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and leads of electronic components capable of securely mounting components on a circuit board, thereby improving equipment operation rate and reducing defective costs. It is an object of the present invention to provide a forming method.

[0005]

SUMMARY OF THE INVENTION According to the present invention, there is provided an electronic component mounting apparatus for correcting leads of an electronic component prior to mounting the electronic component having a plurality of leads on a circuit board. Lead forming method,
In the mounting device, a first jig having the same number of first guide grooves as the leads, formed at intervals different from the regular lead pitch of the electronic component by a certain dimension, substantially the same as the regular lead pitch A second jig having the same number of second guide grooves as the leads formed at intervals is provided so as to be opposed to each other, and after the main body of the electronic component is gripped by component gripping means, the lead alignment means In, the first step of aligning the position of the lead end of the electronic component with respect to the component gripping means,
By moving one or both of the component gripping means and the first jig and pressing the tip of the lead of the electronic component against the first guide groove, the lead pitch of the electronic component is set to the second pitch. A second step of correcting to the set interval of one guide groove, and moving one or both of the component gripping means or the second jig,
A third step of correcting a lead pitch of the electronic component to a set interval of the second guide groove by pressing a tip end of a lead of the electronic component against the second guide groove.

[0006]

According to the method of forming leads of an electronic component of the present invention, first, in a first step, the position of the leading end of the electronic component relative to the component holding means is aligned by the lead alignment means. Next, in a second step, the lead is deformed by the first jig, and the lead pitch is corrected to a set interval of the first guide groove, that is, a dimension different from the regular lead pitch by a certain dimension. Then, in the third step, the lead of the component is reliably corrected to the regular lead pitch by deforming the lead with the second jig and correcting the lead pitch to the set interval of the second guide groove. Can be. In addition,
The set interval of the first guide groove of the first jig is at least a certain distance so that the lead corrected by the first jig is surely plastically deformed without elastic deformation by the second jig. It is preferable to set the distance. In addition, the setting interval of the second guide groove of the second jig is smaller than the regular lead pitch in consideration that when the pressed lead is separated from the second guide groove, the lead returns to some extent due to the elasticity of the lead itself. It is preferable to set the dimensions larger or smaller. Further, when correcting the lead pitch as described above, the first jig and the second jig are arranged to face each other, and the lead of the component gripped by the component gripping means is first fixed to the first jig. After being pressed against the jig, it was moved to the opposite side and pressed against the second jig.
Thereby, even if the lead of the component is displaced to either side from the line connecting the regular positions of the leads, the lead is pressed against at least one of the first and second jigs. The position of the lead can be corrected on the line.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to an embodiment shown in the drawings. Here, an example in which an electronic component having two leads is mounted is used. 1 to 6
1 shows an example of an electronic component mounting apparatus for mounting an electronic component by applying a method for forming leads of an electronic component according to the present invention. As shown in FIGS. 1 and 2, an electronic component mounting apparatus (hereinafter abbreviated as “mounting apparatus”) 1 includes:
A base 2, a conveyor unit 3 provided on the base 2, for transporting a printed circuit board (circuit board) Z in one direction (a direction orthogonal to the paper surface); and a conveyor unit 3 provided on the side of the conveyor unit 3. Component supply unit 4 and electronic components (hereinafter, referred to as component supply unit 4).
A main component is a component mounting unit 5 for receiving the component and mounting the component at a predetermined position on the printed circuit board Z on the conveyor unit 3.

The conveyor section 3 is provided with rails 6 extending in the horizontal direction and parallel to each other on the base 2.
Both ends of the printed circuit board Z are held by the rails 6 and 6, and the printed circuit board Z is transported in the transport direction M (see FIG. 2, in FIG. 1, a direction perpendicular to the paper).

The component supply unit 4 includes a component supply station 7 disposed on the side of the conveyor unit 3 and a stock unit that is orthogonal to the conveyor unit 3 in a plan view and inclined forward toward the conveyor unit 3 in a side view. 8 and a shooter unit 9 for sending parts from the stock unit 8 to the component supply station 7 one by one. The component supply station 7 includes a base member 7a that is movable between a position below the shooter unit 9 and a predetermined position on the side of the conveyor unit 3.
The base member 7 a receives the component sent from the shooter unit 9 and moves the component to a predetermined position on the side of the conveyor unit 3. Stock unit 8
It is a so-called stick feeder type, in which a plurality of stick-shaped cases 10 in which a large number of components are stored are stocked, and the components stored in the case 10 are sent from the shooter unit 9 to the component supply station 7 one by one. Has become. The mounting apparatus 1 is provided with a plurality of, for example, two sets of component supply units 4 having the same configuration in order to mount different types of components on the printed board Z.

The component mounting unit 5 has the following configuration. On the base 2, the conveying direction M of the conveyor unit 3
A ball screw 1 provided with guide rails 11 and 11 and a drive motor 12a (see FIG. 1) along (see FIG. 2).
2 are provided. On these guide rails 11, a U-shaped slide base 13 is provided movably, and the slide base 13 is provided with a drive motor 12a.
When the ball screw 12 is rotationally driven (see FIG. 1), the ball screw 12 moves along the transport direction M. As shown in FIG. 1, guide rails 14, 14 extending in a horizontal direction orthogonal to the transport direction M are provided on an upper portion of the slide base 13.
A ball screw 15 is provided. A chuck mechanism 16 for gripping a component, which includes a cylinder 16a that can expand and contract in the vertical direction, is movably provided along the guide rails 14, 14, and the ball screw 15. On the other hand, guide rails 17 and 17 and a ball screw 18 are similarly provided below the slide base 13. A clinch mechanism 19 for clinching (bending) the lead of the component is provided movably along the guide rails 17, 17 and the ball screw 18. The ball screw 15 is provided with a drive motor 20, and the ball screw 18 is attached to the ball screw 15 by a timing belt 21.
The ball screws 15 and 18 rotate in synchronization. Thereby, when the ball screws 15 and 18 are rotationally driven by the drive motor 20,
The chuck mechanism 16 and the clinch mechanism 19 are configured to move in a direction orthogonal to the transport direction M while being vertically opposed.

As shown in FIG. 3, the chuck mechanism 16 is provided with a pair of chuck claws (gripping means) 23 which can be moved up and down by an air cylinder 22. , 23 are opened and closed by a drive mechanism (not shown). Further, a pusher 24 that moves up and down by an air cylinder or the like (not shown) is provided between the chuck claws 23. With such a configuration, the chuck claws 23 of the component mounting section 5,
Reference numeral 23 denotes a configuration that is movable on the base 2 in two directions perpendicular to each other in a horizontal plane and in a vertical direction, and that the component P can be gripped between the chuck claws 23.

As shown in FIG. 1, the mounting apparatus 1 having the above-described configuration has a forming block 30 for correcting (leading) its leads prior to mounting the components on the printed circuit board Z. Is provided.
As shown in FIG. 3, the forming block 30 has the same number of recesses (lead aligning means) 32 as the number of leads L of the component P formed on the upper surface of a plate-like base plate 30 a.
A first block (first jig) 33 and a second block (second jig) 34 are provided on both sides of the recess 32 so as to face each other. The forming block 30 is movable in a horizontal plane and in a vertical direction by a drive mechanism (not shown).

As shown in FIG. 4, each recess 32 has a bottomed shape and a tapered shape with an open top. The diameter of the opening at the upper end is determined when the component P is gripped by the chuck claws 23, 23. The dimension is set to be larger than the variation (for example, ± 1 mm) of the tip position of the lead L. Also, the recesses 32, 3
The bottom surfaces of 2 are set at the same height.

As shown in FIG. 3, the first block 33
Consists of block bodies 33a and 33b, and a tapered guide groove (first guide groove) that is V-shaped in plan view and expands upward in side view is provided on one end side of each of the block bodies 33a and 33b. 35 are formed. The interval A between the guide grooves 35 of the block bodies 33a and 33b is equal to the regular lead pitch of the component P (for example, 27.5).
mm) that is smaller than a certain dimension (for example, 26.5 m).
m). Similarly to the first block 33, the second block 34 is made up of block bodies 34a and 34b, and the ends of the block bodies 34a and 34b facing the first block 33 are V A tapered guide groove (second guide groove) 36 that is shaped like a letter and that extends upward in a side view is formed. Block 3
Interval B between guide grooves 36, 36 of 4a, 34b, respectively
Are set at substantially the same interval (for example, 27.7 mm) as the regular lead pitch of the component P. Note that the set interval B of the second block 34 is such that after correcting the leads L, L of the component P, these leads L are connected to the guide grooves 36, 36.
As described above, the size of the component P is slightly larger than the regular lead pitch in consideration of the size of the lead L itself returning to its original shape when separated from the lead P. The size of the maximum width portion at the upper end of the guide grooves 35, 36 is set to a size larger than the variation (for example, ± 1 mm) of the tip position of the lead L when the component P is gripped by the chuck claws 23, 23. ing.

Next, the operation when the component P is mounted on the printed circuit board Z using the mounting apparatus 1 having the above configuration will be described. The operations of the mounting apparatus 1 described below are all sequence-controlled by a control device (not shown).

In order to mount the component P as shown in FIG. 5 on the printed circuit board Z by the mounting apparatus 1 shown in FIGS. 1 and 2, first, the component P (see FIG. From the section 8 via the shooter section 9, it is transferred onto the base member 7 a of the component supply station 7. And the part P
(See FIG. 5).
Move to the side. On the other hand, the chuck mechanism 1 of the component mounting unit 5
6 are moved vertically above the base member 7a, and are lowered to make the chuck claws 23, 23
Is opened and closed to grip the main body of the component P (see FIG. 5) on the base member 7a. At this time, as shown in FIG. 5, the component (electronic component) P has not yet been formed, and its leads L, L not only connect the lead pitch and length, but also connect the regular positions of the leads L, L. It is also shifted laterally with respect to the elliptical line, that is, the center line between the chuck claws 23 in FIG.

<First Step> Next, as shown in FIG. 4, the chuck claws 23 holding the component P are moved vertically above the forming block 30. Then, the forming block 30 is raised by a driving mechanism (not shown), and the lead L of the component P is positioned immediately above each recess 32. Then, the chuck pawls 23, 23 are opened only by a minute dimension, and the pusher 24 is lowered to push the component P downward. Then, each lead L of the component P is respectively inserted into the concave portion 3.
2, and the leading end thereof contacts the bottom surface of the concave portion 32. At this time, when opening the chuck claws 23, 23, it is sufficient that the gripped component P is pushed down by the pusher 24 as described above.
After each lead L of the component P is brought into contact with the bottom surface of the concave portion 23 in this manner, the chuck claws 23 are closed again to grip the component P again. Thereby, the chuck claws 23,
This means that the top ends of the leads L, L of the component P in the up-down direction are aligned horizontally with respect to 23.

<< Second Step >> Next, the forming block 30 is moved by a driving mechanism (not shown) to the chuck claws 23,
The leading ends of the leads L, L of the component P gripped by 23 are lowered to a position at which the height is substantially the same as the center position of the first block 33 in the height direction. Then, as shown in FIG. 6A, the forming block 30 is replaced with the leads L, L of the component P held by the first block 33 with the chuck claws 23, 23.
In the direction approaching (the direction (a) in the figure).
At this time, the forming block 30 moves the upper end corner 35a of the guide grooves 35, 35 of the first block 33 to a position where the central axis between the chuck claws 23, 23 passes a certain dimension. Then, the leads L, L of the component P are guided into the guide grooves 35, 35 and deformed, and the lead pitch is corrected to the interval A between the guide grooves 35, 35 (see FIG. 3). Further, since the forming block 30 is moved until the upper end corners 35a of the guide grooves 35, 35 reach a position passing a central axis between the chuck claws 23, 23 by a predetermined dimension, the leads L, L are moved toward the second block 34. Becomes inclined. Since the guide grooves 35 have a V-shape in plan view, the leads L can be reliably guided to the guide grooves 35 even if the positions of the leads L vary. Here, the lead pitch of the leads L, L of the component P is originally
When the distance A between the guide grooves 35, 35 is substantially equal, even if the first block 33 is pressed, the leads L do not undergo plastic deformation, but are simply elastically deformed. Will return to. However, in this case, there is no problem since the lead pitch of the leads L, L is originally substantially equal to the interval A as described above. Further, when one or both of the leads L and L are bent toward the second block 34, the bent lead L is connected to the first block 3.
3 does not come into contact with the guide groove 35, but also in this case, the lead L is originally in the state shown in FIG. In this way, in the second step, the lead pitch of the leads L, L of the component P is set to
As shown in FIG. 6A, the tip is inclined toward the second block 34.

<< Third Step >> Next, as shown in FIG. 6B, the forming block 30 is
In (a), the direction (reference (b) direction) opposite to the reference (a) direction, that is, the second block 34 approaches the leads L, L of the component P gripped by the chuck claws 23, 23. Move in the direction. At this time, the forming block 30 is moved to a position where the distal end surface 34c of the second block 34 substantially coincides with the central axis between the chuck claws 23. Then, the leads L, whose lead pitch has been corrected to the interval A in the second step, are guided into the guide grooves 36, 36 and plastically deform, and the lead pitch is changed to the guide grooves 36, 36.
The gap is corrected to 36 intervals B (see FIG. 3). As shown in FIG. 6B, the leads L, L that have been inclined toward the second block 34 in the second step have their tips positioned vertically below the central axes of the chucks 23, 23. To be corrected. Also, the lead L originally inclined toward the second block 34 is corrected in the same manner. In this case as well, since the guide grooves 36, 36 have a V-shape in plan view, the leads L, L can be reliably guided into the guide grooves 36, 36. In addition, since the center position in the height direction of the second block 34 matches the tip height of the leads L, L, the tips of the leads L, L are located at the center portions 36a, 36a of the guide grooves 36, 36 in the height direction. It is surely guided. As a result, the lead pitch of the leads L, L can be accurately corrected to the interval B between the guide grooves 36, 36, and the positions of the tips of the leads L, L can be made regular. Next, the forming block 30 is moved in a direction away from the leads L, L of the component P (direction (a) in the drawing), and returned to the original position. Then, the guide grooves 36, 3
The leads L, L away from 6 are slightly elastically displaced in the direction in which the lead pitch is narrowed by the elasticity of the leads L, and have a regular lead pitch.

As described above, the chuck claws 23, 23
The leads L, L of the component P gripped by are corrected to a regular lead pitch, and the tips of the leads L, L
23 so as to be located vertically below the central axis.
Thereby, the tip position of each lead L with respect to the chuck claws 23 can be corrected to a high positional accuracy of, for example, ± 0.05 mm.

Thereafter, the chuck mechanism 16 shown in FIG. 1 is moved to a predetermined position on the printed circuit board Z conveyed to a predetermined position on the rails 6 and 6 of the conveyor section 3, that is, a vertical position of the mounting position. The gripped component P (see FIG. 5) is positioned above. Then, the chuck mechanism 16 is lowered to insert the leads L, L into predetermined through holes (not shown) of the printed circuit board Z. At the same time, the inserted leads L, L are clinched (bent) below the printed circuit board Z by the clinch mechanism 19 interlocking with the chuck mechanism 16, whereby the mounting of the component P is completed.
Thereafter, the chuck mechanism 16 returns to the component supply station 7 to receive the next component, and thereafter repeats the above procedure to mount a predetermined number of components on the printed circuit board Z.

As described above, in the forming method of the leads L, L of the component P, first, the forming block 30
After aligning the tip positions of the leads L, L of the component P with respect to the chuck claws 23, 23 in the recesses 32, 32, these leads L, L are pressed against the first block 33, and the lead pitch is temporarily set in the guide groove. The spacing A of 35, 35 is corrected to a dimension smaller than the regular lead pitch, then the leads L, L are pressed against the second block 34 to be plastically deformed, and the lead pitch is changed to the second guide grooves 36, 36.
Is corrected to the regular lead pitch. Accordingly, when the lead pitch of the component P originally deviates significantly from the regular lead pitch, it is needless to say that the component P can be corrected to the regular lead pitch. If the lead pitch of the component P is originally slightly deviated from the regular lead pitch, if the lead pitch of the component P is to be corrected only once, for example, by pressing only the second block 34, The leads L, L are elastically deformed without being plastically deformed, are separated from the second block 34, and return to their original dimensions at the same time, and cannot be corrected to a regular lead pitch. On the other hand, in the above-described forming method, the leads L, L of the component P are first corrected in the first block 33 to the interval A smaller than the regular lead pitch, and then the second block 34 corrects the regular leads. Since the pitch is corrected, the lead pitch can be reliably corrected to the regular lead pitch. Further, when correcting the lead pitch of the component P as described above, the first block 33 and the second block 34 are arranged to face each other, and after the leads L, L of the component P are first pressed against the first block 33, The correction is performed by pressing against the second block 34 on the opposite side. Thereby, even if each lead L is shifted to any side from a line connecting the regular positions of the leads L, L of the component P, the lead L is at least one of the first block 33 and the second block 34. To be corrected on the line. Therefore, not only the lead pitch,
The tip position of each lead L with respect to the chuck claws 23, 23 can also be reliably corrected to a proper position. In this way, the chuck claws 23, 2
Since the lead pitches and positions of the leads L, L with respect to No. 3 are corrected to regular lead pitches and positions, when mounting this component P on the printed circuit board Z, it is ensured that a predetermined through hole (not shown) is formed. Can be inserted,
As a result, it is possible to improve the equipment operation rate by reducing the number of times and time of equipment stoppage due to a mistake in inserting the part P, and to reduce the number of defective products, thereby greatly reducing defective cost.

In the above embodiment, it is needless to say that the operations of the respective parts are performed in parallel in order to shorten the cycle time of the mounting apparatus 1. The forming block 30 is used as a lead alignment means.
However, the shape and the like are not limited to those in the above-described embodiment, and if the tips of the leads L, L of the component P can be aligned, for example, they are simply aligned on the upper surface of the base plate 30a. Alternatively, for example, the ends of the leads L, L may be cut to align the positions of the ends. Further, when forming the leads L, L of the component P, the chucking claws 23, 23 are fixed, and the forming block 30 is moved.
0 may be set to a fixed state, and the chuck claws 23 may be moved.
0 and the chuck claws 23 may be moved. At this time, if only the chuck claws 23 are moved, the driving mechanism of the forming block 30 can be omitted.
Since the drive mechanism 23 is originally provided with the drive mechanism, each of the above-described effects can be achieved without increasing the equipment cost. Further, the guide grooves 35 of the first block 33, 35
Is set to a dimension that is smaller than the regular lead pitch by a certain dimension, but is set to a dimension that is larger by a certain dimension than the regular lead pitch. May be corrected. Needless to say, the first block 33, the second block
The specific dimensions of the intervals A and B of R> 34 are not limited to the dimensions shown in the above embodiment, but are finally corrected to a regular lead pitch in consideration of the elastic modulus of the leads L and L. It should be set so that. Also, the shape of the guide grooves 35 and 36 may be any shape as long as the leads L and L can be corrected. Furthermore, when there are a plurality of types of components P to be mounted, a forming block 30 may be provided corresponding to each of the components, and the forming may be performed in the same manner. Even if the set interval of the second block 34 is adjusted, the same effect as described above can be obtained. In addition, in the above embodiment, the example in which the number of the leads L of the component P to be formed is two is used. However, even when the number of the leads is two or more, the concave portion 32 of the forming block 30 may be used. If the guide groove 35 of the first block 33 and the guide groove 36 of the second block 34 are provided corresponding to the positions of the leads of the components to be formed, forming can be performed in the same manner. Similar effects can be obtained.

[0024]

As described above, according to the method for forming leads of an electronic component according to the present invention, first, the lead alignment position of the electronic component with respect to the component holding means is aligned by the lead alignment means, and then the first jig is used. Correct the lead pitch of the part to a dimension different from the regular lead pitch by a certain dimension, and then
The lead pitch was corrected to the set interval of the second guide groove by the second jig, and the lead pitch of the component was corrected to the regular lead pitch. In this way, when the component is gripped by the gripping means of the mounting apparatus, the lead pitch / position of the lead with respect to the gripping means can be corrected to a regular lead pitch / position. In particular, when the lead pitch of the part to be corrected originally deviates only slightly from the regular lead pitch, for example, when the lead is corrected to the regular lead pitch only once with the second jig, the lead becomes plastic. A problem arises in that the lead pitch is elastically deformed without being deformed and returns to the original lead pitch, and the lead pitch cannot be corrected to a regular lead pitch. On the other hand, according to the method of the present invention, as described above, once the first jig corrects the lead pitch to a dimension different from the regular lead pitch by a certain dimension, and then corrects it to the regular lead pitch with the second jig. I tried to correct it,
It is possible to reliably correct the pitch to a regular lead pitch. As a result, when mounting this component on the board,
Leads can be reliably inserted into predetermined through-holes. As a result, the number of equipment stoppages and time due to component insertion errors can be reduced, the equipment operation rate can be improved, and the number of defective products can be reduced. It is possible to significantly reduce the cost of defective products by reducing the cost.

[Brief description of the drawings]

FIG. 1 is a side view showing an example of an electronic component mounting apparatus for mounting a component by applying a lead forming method of an electronic component according to the present invention.

FIG. 2 is a plan view of the mounting apparatus.

FIG. 3 is a perspective view showing a part of gripping means, a lead alignment means, a first jig and a second jig provided in the mounting apparatus.

FIG. 4 is a front sectional view showing the lead alignment means.

FIG. 5 is a side view and a front view showing a state in which the component is gripped by the gripping means.

FIG. 6 is a side sectional view showing a state in which a lead of a component is formed by the first jig and the second jig.

[Explanation of symbols]

 Reference Signs List 1 mounting device (electronic component mounting device) 23 chuck claw (gripping means) 32 concave portion (lead alignment means) 33 first block (first jig) 34 second block (second jig) 35 guide groove (first One guide groove) 36 guide groove (second guide groove) L lead P component (electronic component) Z printed board (circuit board)

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-62-127137 (JP, A) JP-A-61-285790 (JP, A) JP-A-5-299894 (JP, A) 56399 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 13/04

Claims (1)

(57) [Claims] 1. A lead forming method for correcting leads of an electronic component prior to mounting the electronic component having a plurality of leads on a circuit board using an electronic component mounting apparatus. A first jig having the same number of first guide grooves as the leads formed on the mounting apparatus at intervals different from the regular lead pitch of the electronic component by a certain dimension, and substantially equal to the regular lead pitch. A second jig having the same number of second guide grooves as the leads formed at the same interval is provided so as to face each other, and after the main body of the electronic component is gripped by component gripping means, the leads are aligned. Means for aligning the position of the lead end of the electronic component with respect to the component gripping means; and moving one or both of the component gripping means and the first jig to the electronic component. A second step of correcting the lead pitch of the electronic component to the set interval of the first guide groove by pressing the tip end of the lead into the first guide groove; and the component holding means or the second jig. By moving one or both of the above and pressing the tip of the lead of the electronic component against the second guide groove, the third step of correcting the lead pitch of the electronic component to the set interval of the second guide groove Forming a lead of an electronic component.