JPH0767026B2 - Semiconductor device clamping device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention is suitable for clamping a semiconductor device such as a SIP type IC having a plurality of lead pins extending from one side of a package body. The present invention relates to a clamp device for a semiconductor device.

[Prior Art] A semiconductor device clamping device is for clamping a semiconductor device in an accurately positioned state, and is used as a mechanism for inserting / removing the device into / from a socket part of a tester in an IC handler. Widely used. Here, the IC handler has a loader section to which a device storing jig such as a magazine is mounted, takes out the device from the loader section, and sends it out to a conveying path including a chute or the like. A test is carried out by mounting it in the socket part of the tester installed in the position, and after that, the devices after the test are completed are transported to the unloader part, and classified based on the test result and classified as a jig for unloader magazines. It is designed to be stored in.

Here, as a clamp device used as a function for inserting / removing the device in the above-mentioned IC handler into the test head, in order to enable the device to be smoothly and surely attached to the socket portion of the tester, Must be able to be clamped with the correct positioning. Moreover, when inserting / removing the socket of the test head of the semiconductor device,
Sufficient clamping force must be provided to prevent the device from falling out or misaligning.

Based on the above-mentioned request, the package main body of the device is clamped by holding it from both front and rear sides or right and left sides, which has been conventionally used. By clamping the body of the device in this way, it becomes possible to position it accurately and to exert a sufficient clamping force for inserting and removing it from the socket of the tester. .

[Problems to be Solved by the Invention] By the way, in the above-described semiconductor device clamping apparatus according to the related art, as a device that can be handled, it is preferable that the package main body has good size and shape accuracy. Limited However, in recent years, the lead pins are extended from one side of the package body.
In a so-called SIP type IC, such as a hybrid IC, which is packaged by resin-encapsulating the entire substrate with electronic components such as a plurality of resistors and capacitors mounted on the substrate by means of dipping or the like. Devices have been developed.However, in such devices, the size and shape of the package body greatly vary from product to product due to the resin encapsulation. Clamping the body has the disadvantage that it cannot be accurately positioned.

The present invention has been made in view of the above points, and it is an object of the present invention to enable it to be clamped in an accurately positioned state even if there are variations in the size and shape of the package body. Another object of the present invention is to provide a clamp device for a semiconductor device.

[Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention provides a semiconductor device having a plurality of lead pins extending from one side of a package body, in which the package body is positioned in a guide member. , With the lead pin protruding from the guide member,
A pair of left and right clamp plates, which can be displaced in a direction orthogonal to the traveling direction of the semiconductor device, is provided by a clamp operating member at an intermediate position during sliding by its own weight, and the package body is pushed in the extending direction of the lead pin. A pressing member is provided, and the clamp plate is held by a clamp operating member at an interval between the thickness of the package body and the thickness of the lead pin, and the lead pin is inserted between the clamp release state and the lead pin from both sides. It is arranged so as to be displaced between the clamped state of being held and the pushing member contacts the clamp plate with the portion of the semiconductor device connected to the lead pin of the package body before the clamped state. The feature is that the positioning is performed so as to be in contact with each other.

[Operation] The semiconductor device conveyed along the traveling route is stopped at a predetermined position and positioned by an appropriate means. Therefore, when the clamp actuating member is actuated, the lead pin of the device is held between the clamp plates. Along with this, the portion of the package body of the device with the best dimensional accuracy is the root portion where the lead pin is extended, that is, the parting position of the sealing resin. Position by pressing on the clamp plate. For this,
A pressure member is provided, which allows the device to be clamped in a correctly positioned state. When the device clamped in this way is attached to, for example, the socket part of the tester, the device is held in a stable state by the clamp plate, so that the pushing force into the socket part of the tester can be exerted. become,
Also when pulling out the device from the socket,
A sufficient pulling force can be applied.

Embodiments Embodiments of the present invention will be described in detail below with reference to the drawings.

Thus, in the present embodiment, the one configured to be used for inserting / removing into / from the socket portion of the tester in the IC handler is shown. However, the clamp device of the present invention further handles various semiconductor devices. It goes without saying that it can be used as a mechanism.

Therefore, FIG. 7 shows a schematic configuration of the IC handler. In the figure, reference numeral 1 denotes a loader section, 2 denotes an unloader section, and the loader section 1 is equipped with a magazine 4 containing a large number of semiconductor devices 3. The semiconductor device 3 is adapted to run along the chute 5, and first, the loader unit 1 to the inclined runway.
It slid down along 5a, was turned around at orienta part 5b, and was lowered down along vertical runway 5c. A device insertion / removal section 10 is provided at an intermediate position on the vertical runway 5c, and the device 3 is clamped by the device insertion / removal section 10 so as to face the device insertion / removal section 10. It can be attached to the part 6. After performing the test by mounting the socket portion 6 in this manner, the direction is changed again by the orienter portion 5d and the vehicle is slid down along the inclined runway 5e, and the classification portion 7 in the unloader portion 2 described above. It is arranged to be classified based on the test result and stored in a plurality of magazines 8 having the same configuration as the magazine 4 in the loader unit 1.

Here, as is clear from FIG. 8, the semiconductor device 3 handled by the above-mentioned IC handler is a so-called SIP type IC in which a plurality of lead pins 3b are straightly extended from one side of the package body 3a, Moreover, this package body 3a
Is an electronic component such as a resistor or a capacitor mounted on a substrate, and the substrate is resin-sealed by a depping means or the like. Therefore, the surface of the package body 3a has a large number of irregularities, the dimensions and shapes of which vary considerably, and the back surface of the body 3a has a slight dimensional error. On the other hand, the alignment and dimensional accuracy of the lead pins 3b are good, and further, the accuracy of the position of the root part of the lead pins 3b, that is, the parting off the sealing resin in the main body 3a is also relatively good.

When the semiconductor device 3 having such a structure is conveyed along the vertical runway 5c of the chute 5, as shown in FIG.
Further, the lead pin 3b is projected toward the installation side of the socket portion 6 and can be lowered.

As shown in FIGS. 1 to 3, the device inserting / removing portion 10 is provided below the vertical runway 5c and is movable so as to be continuous with the vertical runway 5c. It has a guide 11. As is apparent from FIG. 4, the movable guide 11 has a frame body 11 having a U-shaped cross section for accommodating the main body 3a of the device 3.
In the front opening of the frame 11a, locking plates 12, 12 are fixedly provided on the left and right, except for the position directly facing the socket 6. Therefore, the device 3 moves from the vertical runway 5c to the movable guide 11 with the lead pin 3b protruding from the gap between the locking plate bodies 12, 12.

A pair of left and right clamp plates 13a and 13b for clamping the lead pins 3b of the device 3 are provided at positions below the disposition portion of the locking plate body 12 in the movable guide 11. The clamp plates 13a, 13b are fixed to the tips of the arms 14a, 14b by means of screws or the like, and the arms 14a, 14b are connected to the mounting members 15a, 15b. Mounting members 15a, 15b
Is inserted into the upper and lower positions of the guide shafts 16a and 16b,
It can be displaced along the guide shafts 16a and 16b in the direction of approaching and separating from each other. And these guide shafts 16a,
16b is inserted through the bosses 17a, 17b, and the bosses 17a, 17b
A pair of connecting arms 18a, 18a and 18b, 18b are attached respectively, and these connecting arms are connected to a slide base 19.

Next, in order to open and close the clamp plates 13a, 13b, springs 20, 20 are stretched between the mounting members 15a, 15b, and the springs 20 cause the clamp plates 13a, 13b to approach each other, that is, The lead pin 3b of the device 3 is biased so as to be in a clamped state in which it is held. Also, brackets 21a, 21b are fixed to the mounting members 15a, 15b,
Rollers 22a and 22b are mounted on the brackets 21a and 21b, respectively. The rollers 22a and 22b form a cam follower, and a cam plate 23 having a tapered cam surface is abutted on the rollers 22a and 22b. The cam plate 23
Is reciprocated by a cylinder 24 fixed to the slide base 19. When the cam plate 23 is moved by the cylinder 24 in the direction of arrow A in FIG.
The mounting members 15a and 15b are displaced along the guide shafts 16a and 16b in a direction in which they are separated from each other, so that they can be displaced to the unclamped state. Here, in the unclamped state, the distance between the clamp plates 13a and 13b is an intermediate width between the thickness of the main body 3a and the thickness of the lead pin 3b in the device 3. This allows the device 3 to move the movable guide 11
The device 3 is held so that it does not deviate from it when it is fed into.

With the device 3 clamped as described above, the movable guide 11 is moved toward the socket portion 6 side as shown by the arrow B in FIG. 1 to move the lead pin 3b of the device 3 to the socket. The slide table 19 can be inserted into the portion 6, and for this purpose, the slide base 19 is engaged with the guide 25a provided on the base 25, and
It is connected to the cylinder 26, and by operating the cylinder 26, reciprocation is performed along the guide 25a.

By the way, in order to smoothly and surely insert the lead pin 3b of the device 3 into the socket portion 6, when the device 3 is clamped, the device 3 must be positioned.

Therefore, a stopper pin 27 and a positioning pin 28 are provided to perform positioning in the vertical direction, that is, the traveling direction. The stopper pin 27, as shown in FIG.
Through the pin hole 29 formed in the rear wall portion of the frame 11a of the movable guide 11, the device 3 can be retracted into and out of the traveling path of the device 3 in the movable guide 11. In order to displace the stopper pin 27 between the operating position where it can be engaged with the main body 3a of the device 3 and the retracted position retracted from the device traveling passage, The stopper pin 27 is connected to the cylinder 31 via the spring 30.
Is engaged with. Further, the positioning pin 28 is used for the device 3
The movable guide 11 is interfered with the operating position which is provided at a position slightly lower than the position where the stopper pin 27 is arranged in the traveling path of the device, and which engages with the lead pin 3b of the device 3 which is guided by the movable guide 11 and descends. It is possible to reciprocate between it and the retracted position.

On the other hand, a pair of upper and lower push pins are used as push members for positioning the device 3 in the direction orthogonal to the traveling direction.
32,33 are used. These push pins 32 and 33 are inserted into pin holes 34 and 35 formed at a constant interval above the above-mentioned pin hole 29, and the pin 3 of the device 3 in the movable guide 11 is inserted from the pin holes 34 and 35. It is possible to appear on the driving route. The push pins 32 and 33 are mounted on the operation block 36, and the operation block 36 is a cylinder.
It is connected to the rod 38 of 37 and is in a state of protruding inside the traveling route by the action of the spring 39 at all times, and by operating the cylinder 37, it is possible to retract from this device traveling route. Has become. Here, the one push pin 32 is fixed to the actuation block 36, while the other push pin 33 is, as shown in FIG.
It is slidable in the axial direction and is urged by a spring 40 in a protruding direction.

Thus, when the device 3 reaches the position to be clamped and the clamp plates 13a, 13b are held in the unclamped state, the push pins 32, 33 are projected to move the device 3 Push the back side of the main body 3a and clamp the end of the lead pin 3b on the side that is connected to the clamp plates 13a, 13b.
The device 3 can be positioned in a direction orthogonal to the traveling direction by abutting the corners of the device 3. Then, at this time, the push pin 33 is made movable relative to the push pin 32, so that one of the push pins comes into partial contact with the device 3 and the posture of the device 3 collapses. Can be prevented. In addition, the push pins 32 and 33 are provided on the socket 6
It also has a function of pushing in at the time of insertion into.

The present embodiment is configured as described above, and its operation will be described next.

First, the clamp plates 13a and 13b are released from the clamp state,
In addition, the stopper pin 27 and the positioning pin 28 are held in the operating position, and the cylinder 37 is further operated to retract the push pins 32 and 33 from the device traveling path. In this state, the device 3 is guided from the loader section 1 into the movable guide 11 through the inclined runway 5a, the orienter section 5b and the vertical runway 5c of the chute 5.

Then, the tip end of the package body 3a of the device 3 comes into contact with the stopper pin 27 provided so as to project into the movable guide 11, and the lowering thereof is stopped. After that, when the cylinder 31 is operated to displace the stopper pin 27 to the retracted position, the device 3 is slightly lowered, and the lead pin 3b at the tip end thereof is brought into contact with the positioning pin 28, whereby the device 3 3 is positioned in the vertical direction. Here, since the device 3 falls by its own weight, if the lead pin 3b is directly brought into contact with the positioning pin 28, the lead pin 3b may be bent by an impact, so that the device 3 is once received by the stopper pin 27. This lead pin by
3b protection is achieved.

In this state, when the pulling force applied to the operation block 36 by the cylinder 37 is released, the push pins 32 and 33 project and come into contact with the back surface of the main body 3a of the device 3, and as shown in FIG. It is pressed against the clamp plates 13a, 13b. Here, since the distance between the clamp plates 13a and 13b is smaller than the thickness of the main body 3a of the device 3,
The tip side of the main body 3a is pressed against the back surface of the clamp plates 13a, 13b, and the device 3 is held by the clamp plates 13a, 13b and the push pins 32, 33. Positioning in the direction orthogonal to the traveling direction of 3 will also be performed. At this time, since the push pin 33 is relatively movable with respect to the push pin 32, both push pins 32 and 33 surely come into contact with the back surface of the device 3, so that one-sided contact is possible. This can prevent the device 3 from tilting.

After positioning the device 3 in this way,
When the cylinder 24 is operated to displace the cam plate 23 and move the clamp plates 13a and 13b in the direction of approaching each other, the lead pin 3b of the device 3 is clamped by the clamp plates 13a and 13b. Here, the device 3 is positioned with reference to the lead pin 3b, and the root portion of the lead pin 3b, that is, the portion in contact with the portion of the package body 3a where the resin is cut off, is clamped. Even if there are variations in the dimensional accuracy of parts and the like, it is possible to perform clamping with extremely accurate positioning, and it is possible to fully exert the clamping force by the clamp plates 13a, 13b. After this, the positioning pin 28 is displaced to the retracted position.

Next, when the clamping of the device 3 is completed, the cylinder 26
Is operated to move the slide base 19 in the direction of the arrow B in FIG. 1 to connect the device 3 clamped between the clamp plates 13a and 13b to the socket portion 6. As described above, the device 3 is clamped in a correctly positioned state even if there are variations in the size and shape of the body 3a, so that the connection to the socket portion 6 can be performed extremely smoothly and reliably. become able to. Further, when the device 3 is connected to the socket portion 6, a resistance is generated.
Since it is securely held by 13b and its back surface is in contact with the push pins 32, 33, there is no problem in pushing the device 3 into the socket portion 6.

After the device 3 is tested as described above, if the cylinder 26 is moved in the direction of arrow C in FIG. 1, the device 3 is separated from the socket portion 6. Then, by displacing the clamp plates 13a, 13b to the unclamped state, the device 3 descends from the movable guide 11 and is fed from the orienter part 5d to the unloader part 2 via the inclined runway 5e. Classification part 7 in part 2
Then, it is stored in the magazine 8 in a state of being classified based on the test result.

By repeating the above-described operation, the devices 3 can be sequentially tested and classified based on the test result.

[Effects of the Invention] As described in detail above, according to the clamp device of the present invention,
When positioning and clamping a semiconductor device, the root of the lead pin, which is the part of the sealing resin of the package body, is pressed against the clamp plate, and the base of the lead pin is clamped by a pair of clamp plates. As a result, even devices that have variations in size and shape in the package body can be positioned accurately, and a mechanism for inserting and removing the tester socket from the IC handler, etc. As a result, the following effects can be obtained.

[Brief description of drawings]

FIG. 1 is a structural explanatory view of an insertion / removal mechanism for a socket portion in a tester of a semiconductor device using the clamp device of the present invention, FIG. 2 is a side view of FIG. 1, and FIG. 3 is III- of FIG. I
Partially omitted external view seen from direction II, Fig. 4 is IV- in Fig. 2.
IV sectional view, FIG. 5 is a sectional view taken along line VV of FIG. 3, FIG. 6 is an explanatory view of operation, FIG. 7 is a schematic configuration diagram of an IC handler, FIG. 8 is an external view of a semiconductor device, and FIG. FIG. 4 is a sectional view of a chute. 1: loader section, 2: unloader section, 3: semiconductor device, 3a:
Package body, 3b: Lead pin, 4: Magazine, 5: Chute, 6: Socket part, 10: Device insertion / removal part, 11: Movable guide, 13a, 13b: Clamp plate, 15a, 15b: Mounting member, 16a, 16
b: Guide shaft, 19: Slide base, 20: Spring, 22a, 22b: Roller, 23: Cam plate, 24: Cylinder, 27: Stopper pin, 28: Positioning pin, 31: Cylinder, 32, 33: Push pin , 36: working block, 37: cylinder.

Claims (1)

[Claims] 1. A semiconductor device having a plurality of lead pins extending from one side of a package body, wherein the package body is positioned in a guide member, and the lead pins are allowed to protrude from the guide member while sliding by gravity. A pair of left and right clamp plates that can be displaced in a direction orthogonal to the traveling direction of the semiconductor device by a clamp operating member is provided at an intermediate position, and a pressing member that pushes the package body in the extending direction of the lead pin is provided. The clamp plate is held by a clamp actuating member at an intermediate distance between the thickness of the package body and the thickness of the lead pin, and the lead pin is inserted between the clamp release state and the clamp state in which the lead pin is clamped from both sides. And the pushing member is set in the clamped state before being brought into the clamped state. Conductor device, the clamping device of the semiconductor device, wherein a joint portion that is configured to be positioned so as to abut against the clamping plate to the lead pin of the package body.