JPH0228571A - Device clamping device for ic handler - Google Patents

Abstract

PURPOSE:To clamp and then insert and extract lead pins of a semiconductor device into and from the socket part of a tester smoothly and securely by forming a clamp plate of a thin plate which has superior electric insulation and low moisture absorptivity. CONSTITUTION:The semiconductor device 3 has the lead pins 3b projected from one side of a package main body 3a in a parallel state and a couple of clamps 13a and 13b to be clamped at right angles to the parallel direction of the lead pins 3b are formed of thin plates which have superior electric insulation and low moisture absorptivity. Consequently, even when the lead pins 3b are held while unclamped, none of the lead pins 3b short-circuits mutually. Further, the clamp plates 13a and 13b are formed of the thin plate materials, so the lead pins 3b can be projected to sufficient length and the lead pins 3b of the semiconductor device 3 are clamped and then inserted into and extracted from the socket part 6 of the tester smoothly and securely.

Description

Detailed Description of the Invention [Industrial Application Field 1] The present invention relates to a device clamping device for inserting and removing a semiconductor device into a tester in an IC handler, and particularly relates to a device clamping device for inserting and removing a semiconductor device into a tester in an IC handler. The present invention relates to a device clamping device suitable for clamping a semiconductor device having a plurality of lead pins extending from one side of the IC handler and inserting and removing it into an IC handler.

[Prior Art] In an IC handler, a device clamp device used as a mechanism for inserting and removing a semiconductor device into a socket portion of a tester is used to clamp the semiconductor device in a precisely positioned state.

Therefore, FIG. 7 shows a schematic configuration of the IC handler. In the figure, ■ indicates a rotor section, and 2 indicates an unloader section, and the loader section 1 is loaded with a magazine 4 containing a large number of semiconductor devices 3. This semi-conductor device 3 runs along a chute 5, slides diagonally down from the loader section 1 along the inclined runway 5a, changes direction at the orienter section 5b, and slides vertically. Descend along road 5C. The device 3 is clamped at an intermediate position of the vertical path 5c and inserted into and removed from the socket portion 6a of the desta 6. Further, after the test is performed by attaching the device 3 to the socket part 6a, the device 3 is attached to the orienter part 5.
d, the direction is changed again and the magazine slides diagonally down along the inclined runway 5e, and is classified by the sorting section 7 in the unloader section 2 based on the above-mentioned test results. It is designed to be stored in magazine 8.

However, the device clamp device for the IC handler described above clamps the device in an accurately positioned state and also clamps the device in the device tester so that the device can be smoothly and reliably inserted into and removed from the socket of the tester. It must be held with enough force to prevent it from falling off or shifting when it is inserted into and removed from the socket. For this purpose, conventional clamping devices use a pair of clamp members that are close to and separated from each other, and the clamp members are used to clamp the device package body from both the front and back sides or from both the left and right sides. I was trying to do a clamp.

[Problem to be solved by the invention] By the way, the device clamp device according to the prior art described above can only handle devices whose package body has good precision in size and shape. It will be done. However, in recent years, for example,
As shown in the figure, it is a so-called SIP type IC in which a plurality of lead bins 3b extend straight from one side of a package body 3a. There are also hybrid ICs in which components are mounted on a board and the board is sealed with resin using a depping means or the like. This type of device 3 has many uneven parts on the surface of the package body 3a, and their dimensions and shapes vary considerably. Therefore, when clamping the package body 3a, it is difficult to accurately It becomes impossible to perform positioning.

Furthermore, even with devices other than those described above, there are some devices in which the package body cannot be clamped or is not preferable due to the shape, material, etc. of the package body.

On the other hand, even if there is a SIP type hybrid IC mentioned above, the alignment and dimensional accuracy of the lead pins are strictly controlled, so it is possible to clamp the lead pins using the lead pins as a reference, but it is also possible to clamp the lead pins directly. This is because there are various requirements for the clamp member, such as the clamp member not getting in the way when the lead pin is inserted into the socket, and the lead bins having to be held so that they are not electrically conductive. At present, a clamping device for direct clamping has not yet been developed.

The present invention has been made in view of the above, and its purpose is to clamp the lead pins of a semiconductor device so that they can be smoothly and reliably inserted into and removed from the socket of a tester. An object of the present invention is to provide a device clamping device equipped with a clamp plate having the above-mentioned characteristics.

[Means for solving problems] In order to achieve the above-mentioned object, the present invention provides.

A pair of clamp plates are provided for clamping the lead pin portion of a semiconductor device in which a plurality of lead pins protrude in parallel from one side of the package body from a direction perpendicular to the parallel direction of the lead pins, and the clamp plate is electrically insulated. It is characterized by being made of a thin plate made of a material with excellent moisture absorption and low hygroscopicity.

[Function 1] As described above, by forming the clamp plate from a material with excellent electrical insulation, even if the lead pins are held in a clamped state, the lead pins will not be short-circuited. Moreover, since this clamp plate is made of a thin plate material, the lead pin can be left protruding for a sufficient length, so that the lead pin does not become an obstacle when inserting the lead pin into the socket. That's not it.

Here, IC handlers are designed to be tested under various conditions such as exposing semiconductor devices to high temperatures, room temperature, and low temperatures, and depending on the ambient conditions, the clamp plate may become damp. Sometimes. However, even if the clamp plate is brought into direct contact with the lead pins of the device in a state where the clamp plate has absorbed moisture, there is a risk that electrical continuity will occur between the lead pins. However, by using a low hygroscopic material as the clamp plate as in the present invention, it becomes possible to minimize the adhesion of moisture to the clamp plate, thereby reliably preventing the occurrence of errors during testing. You will be able to play one tot.

[Embodiment 1] Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

As shown in FIGS. 1 to 3, the device clamp device 10 is provided so as to be continuous with the vertical runway 5C of the chute 5 in the IC Pandora, and extends in the direction approaching and away from the socket portion 6a. Displaceable movable guide 11
It is designed to be installed on the As shown in FIG. 4, the movable guide 11 has a frame 11a having a U-shaped cross section for housing the main body 3a of the device 3, and a socket portion 6a is provided at the front opening of the frame 11a. Regulating plate bodies 12.12 are fixedly provided on the left and right sides except for the positions where they directly face each other.

Therefore, the device 3 is configured to move from the vertical runway 5C to the movable guide 11 with the lead pin 3b protruding from the gap between each of the regulating plates 12, 12.

The device clamp device 10 includes a pair of clamp plates 13a.
, 13b, and the clamp plates 13a and 13b are provided in the movable guide 11 at a position where the regulating plate body 12 is not attached, so that the lead pin 3b of the device 3 can be clamped. Clamp plate 13
a, I:lb are made of thin plate members having the full length in the parallel direction of the lead pins 3b or a length slightly shorter than that, and screws 15 are attached to the tips of the arms 14a and 14b, respectively.
is removably secured by. Each of these arms 14a, 14b has guide shafts 16a, 16.
Slide block 17a slidably inserted into b.
, 17b.

In order to open and close the aforementioned clamp plates 13a and 13b, the slide blocks 17a and 17b are arranged in a direction in which the clamp plates 1:la and 13b approach each other, that is, in a clamped state in which the lead pin 3b of the device 3 is clamped. A spring 18.18 is tensioned so as to bias it. Furthermore, the slide blocks 17a and 17b are provided with brackets 20a and rollers 19a and 19b attached to their tips, respectively.
20b is fixed to this roller 19a.

A cam plate 21 having a tapered cam surface is in contact with 19b, and by advancing the cam plate 21 from the illustrated position, the clamp plate 1:Ia, 13b can be moved between the clamped state and the unclamped state. It is now possible to displace it. Here, in order to prevent the device 3 from deviating from the movable guide 11 in this unclamped state, the interval between the clamp plates 13a and 13b is set to a width between the thickness of the main body 3a and the thickness of the lead pin 3b in the device 3. It becomes.

Next, 22 indicates a stopper pin, and 23 indicates a positioning pin, and the stopper pin 22 is inserted into the movable guide 11 through a pin hole 24 formed in the rear wall portion of the frame 11a, as shown in FIG. The movable guide 11 is movable into and out of the travel path of the device chair 3, and the stopper pin 22 is in an operating position facing into the device travel path.
It is possible to move between the retracted position and the retracted position from the device travel path.

Further, the positioning pin 23 is provided at a position slightly below the disposed position of the stopper pin 22 on the travel path of the device 3, and is operated to engage with the lead pin 3b of the device 3 that is guided by the movable guide 11 and descends. It is possible to reciprocate between this position and a retracted position where it does not interfere with the movable guide 11. As a result, the device 3 traveling within the movable guide ll can be moved to the clamp plate 1:la, llb
is positioned in the clamp position.

Moreover, in the clamp position, the clamp plate 13a.

+3b is brought into contact with the root portion of the lead pin 3b, that is, the position of the connecting portion to the main body 3a. For this purpose, a pair of upper and lower push pins 25 and 26 are used,
Each of these push pins 25 and 26 is inserted into bottle holes 27a and 27b that are bored at a constant interval above the above-mentioned bottle hole 24 in the movable guide 11, and the device 3 is inserted through the bottle holes 27a and 27b. It is possible to appear on the driving route. And these push pins 25
．． 26 is attached to an operating block 28, and the operating block 28 is movable back and forth.
Due to the action of the spring 29, the device is brought into a state of protruding into the inside of the travel path, and the device can be retreated from the travel path against the spring 29. here,
One push pin 25 is fixed to the actuating block 28, while the other push pin 26 is, as shown in FIG.
It is slidable in the axial direction and is biased in the projecting direction by a spring 30.

Thus, when the device 3 reaches the clamp position and the clamp plates 13a, 13b are held in the unclamped state, the device 3 is moved from its main body 3a by protruding the push pins 25, 26. Push the back side and clamp the base of the lead pin 3b on the clamp plate 1:la, 13.
It is designed to be pressed against the corner part of b. At this time, since the push pin 26 is movable relative to the push pin 25, it is possible to prevent the device 3 from collapsing due to one of the push pins hitting the device 3. It is now possible to prevent this.

Here, once the above-mentioned clamp plate 1:la, 13b clamps the lead pin 3b of the device 3, it is inserted into the socket part 6a of the desta 6 to perform a test, and then the lead pin 3b is held until it is removed from the socket part 6a. 3b is held in a clamped state. For this reason, in order to ensure a sufficient insertion depth of the lead pin 3b into the socket portion 6a, the clamp plates 13a, 13b are made of thin plate members and are adapted to abut the root portion of the lead pin 3b.

Furthermore, in order to prevent the lead pins 3b from becoming electrically conductive to each other during the test, the lead pins 3b are made of a material with excellent electrical insulation properties. moreover,
Since it is used to insert and remove the device 3 into the socket part 6a, it has a certain degree of hardness and strength, and will not be deformed or damaged when it is inserted into or removed from the socket part 6a. and device 3
The clamp plates 13a and 13b are designed to have heat resistance because the test is performed at high temperatures rather than at room temperature.

For this reason, the material of the clamp plates 13a and 13b should be made of ceramic or heat-resistant resin material having sufficient strength even if they are made of a thin plate material.
, 13b absorb moisture, the clamp plates 13a, 1
When the lead pin 3b of the device 3 is clamped due to the moisture adsorbed on the lead pin 3b, the lead pin 'lb:
There may be conduction between lb and lb. Therefore, the clamp plates 13a and 13b are made of a low hygroscopic material, for example, a non-porous ceramic rough or a resin material such as silicon glass.

This embodiment is constructed as described above, and its operation will be explained next.

First, the clamp plates 13a and 141b are brought into the unclamped state, the stopper pin 22 and the positioning pin 23 are held in the operating position, and the push pins 25 and 26 are roughly retracted from the device travel path. In this state, the device 3 is transferred from the loader section 1 to the inclined runway 5a in the chute 5.
, guided into the movable guide 11 via the orienter section 5b and the vertical runway 5C.

Then, the package body 3a of the device 3 is attached to the stopper pin 22 provided so as to protrude into the movable guide 11.
The tip of the F is brought into contact with the F, causing it to descend or stop. After that, when the stopper pin 22 is moved to the retracted position, the device 3 is slightly lowered and comes into contact with the lead pin 3b at its tip or the positioning pin 23, thereby causing the device 3 to move in its vertical direction. Positioning is performed. In this way, by positioning the device 3 with the positioning pin 23 after receiving the device 3 with the -degree stopper pin 22, the leet pin 3b is protected.

In this state, the push pins 25 and 26 are projected and brought into contact with the back surface of the main body 3a of the device 3, and the device 3 is pressed against the clamp plates 13a and 13b. Here, the clamp plate 13a is in the unclamped state.

Since the distance between +3b and 3b is smaller than the thickness of the main body 3a of the device 3, the tip side of the main body 3a is pressed against the back surfaces of the clamp plates 13a and 13b, and is pressed against the clamp plates 13a and 13b. Moving pin 25, 2
6, the device 3 is positioned in a pinched state.

After positioning the device 3 in this way,
When the cylinder 24 is actuated to displace the cam plate 21 and move the clamp plates 1:la, 13b in a direction toward each other, the lead pin 3b of the device 3 is clamped by the clamp plates 13a, 13b. . Here, the device 3 is positioned with respect to the lead pin 3b, and the root portion of the lead pin 3b, that is, the portion in contact with the part of the resin in the package body 3a, is clamped, so that the surface of the body 3a is clamped. Even if there are variations in the dimensional accuracy of parts, etc., it is possible to clamp with extremely accurate positioning, and moreover, the clamp plate 1: la, 13 b
This allows the clamping force to be fully exerted. Furthermore, since the clamp plates 13a and 13b are formed of thin plate material, when the lead pin 3b is clamped, the lead pin 3b is clamped to the clamp plate 1:la,
A sufficient length of protrusion is ensured from the surface of +3b for insertion into the socket portion 6a.

Next, when the clamping of the device 3 is completed, the positioning pin 23 is moved to the retracted position, and the sill 26 is activated to connect the device 3 clamped between the clamp plates 13a and +3b to the socket portion 6a. Since the clamps 113a and 13b are made of electrically insulating material, the clamp plates 13a and 13b
Even if the lead pins 3b of the device 3 are held in a clamped state, the lead pins 3b will not be electrically connected to each other. In addition, device 3 is in a high temperature state, a normal temperature state,
Tests are conducted under various conditions such as low temperature conditions, or when tests are conducted in a humid environment, if moisture adheres to the clamp plates 1:1a, 13b, measurement errors may occur. becomes. however,
Since the clamp plates 13a, 1:lb are made of a material with low hygroscopicity, adhesion of such moisture can be suppressed to a minimum, and measurement errors will not occur.

After testing the device 3 as described above, the device 3 is separated from the socket portion 6a, or at this time a force in the bending direction is applied to the clamp plates 13a, 13b. However, the clamp plate 13a
, 13b have sufficient strength against such bending force, so that the device 3 can be smoothly removed from the socket portion 6a. Then, by displacing the clamp plates 13a and 13b to the unclamped state, the device 3 descends from the movable guide 11 and is sent from the orienter section 5d to the unloader section 2 via the inclined runway 5e. The classification unit 7 in the unit 2 sorts the items based on the test results and stores them in the magazine 8.

By repeating the above-described operations, the devices 3 can be sequentially tested and classified based on the test results.

[Advantageous Effects of the Invention 1] As detailed above, according to the device clamp device of the present invention, the clamp plate is made of a thin plate member that has excellent electrical insulation properties and has low moisture absorption. , the lead pins of a semiconductor device can be clamped to smoothly and reliably insert/remove them into the socket portion of the tester, and when the lead pins are attached to the dandruff 91~, the lead pins are electrically connected to each other and can be measured. This makes it possible to reliably prevent errors from occurring.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram showing the overall configuration of the device clamp device of the present invention, Fig. 2 is a side view of Fig. 1, Fig. 3 is an exploded perspective view of the device clamp device, and Fig. 4 is an IT diagram of Fig. 1. -I
V sectional view, Figure 5 is the V-V sectional view of Figure 1, Figure 6 is the V-V sectional view of Figure 1.
A'S +6 ward q91. 7 is a schematic diagram of the IC handler, and FIG. 8 is an external view of the semiconductor device. l: loader section, 2: unloader section, 3: semiconductor device, 3a: package body, 3b = lead pin, 4: magazine, 5: chute, 6: socket section, 10: device insertion/removal section, 11: movable guide, 1 :]a, ]3b:
Clamp plate, 16a, 16b Ni guide shaft, 17a
, 17b Nislide block, 18: Spring, 19
a, 19b: Laura. 2 discharge cam plate, 22: stopper pin, 23: positioning pin, 25, 26: push pin, 27: actuation block.

Claims (1)

[Claims] A pair of clamp plates are provided for clamping the lead pin portion of a semiconductor device in which a plurality of lead pins protrude in parallel from one side of the package body from a direction perpendicular to the parallel direction of the lead pins, and the clamp plate is electrically insulated. A device clamp device for an IC handler, characterized in that it is formed of a thin plate made of a material with excellent moisture absorption and low moisture absorption.