JPH03108677A - Contact mechanism for ic device - Google Patents

Abstract

PURPOSE:To enable non-contact running of a lead with a lead holder by clamping an IC device between a clamp member and a base member while the IC device runs, by a member guiding the opposite-side corners of a package and by the clamp member which can be brought into contact with and separated from the lead and the back side of the package. CONSTITUTION:The title mechanism is constructed of a base guide 30 having a running passage 31 of an IC device D on the surface and of a roof guide 40 comprising a package guide member 41 and a clamp member 42. When the device D runs between the guide 30 and the roof 40, they are held so that a guide face 41a of the member 41 is spaced by a gap l1 from the back side of the device D. Therefore, it runs downward smoothly under its own weight between the guide face 41a and the running passage 31. A lead holder 43 and a package holder 44 of the member 42 are spaced from the device D by a larger gap l2 than the gap l1, and therefore a lead L does not come into sliding contact with the lead holding member 43 while it runs. By this constitution, exfoliation of a plating layer of the lead L by friction and sticking thereof to the member 43 can be prevented.

Description

Detailed Description of the Invention [Industrial Application Field 1] The present invention relates to a so-called SO2 type IC in which a plurality of leads extend laterally on both the left and right sides of a package part.
The present invention relates to a contact mechanism for an IC device that brings the device into and out of contact with a contact portion of an IC tester in order to test and measure its electrical characteristics. [Prior art] In order to test and measure the electrical characteristics of IC devices,
A C tester is used, and the IC handler
This is a mechanism for supplying IC devices to a tester, and storing the IC devices after testing and measurement are classified and classified based on the measurement results. Here, this I
As the C handler, for example, one having the configuration shown in FIG. 5 is used. In the figure, H is an IC handler, and T is an IC tester. It is composed of. Further, the IC handler H includes a loader section 10, a measurement section 11, and an unloader section 12. Here, the IC device to be tested and measured in this apparatus has a plurality of leads L extending laterally on both left and right sides of the package part P, as shown in FIG. , the so-called S
This is an O2 type IC device D. As is well known, the loader section 10 is equipped with a magazine 13 that stores a large number of IC devices D, and by tilting the magazine 13 from a horizontal position, the IC devices D can be transferred from the magazine 13 to a chute on the loader side. Sent to 14. This loader side chute 14 is provided in an inclined state, so that the IC device D can be slid down by its own weight. In addition, here, IC device D'? When testing and measuring at room temperature, the IC device D is run along the loader chute 14, and when testing and measuring the IC device D in a heated state, the loader chute 14 is This is the preheat section. Next, an orienter 15 is provided at the exit of the rotor-side chute 14, and the orienter 15 separates and takes out the IC devices D supplied from the loader-side chute 14 one by one, and transfers them to the measuring section 11. I'm trying to send it in. The measuring section 11 is configured to transport the IC device D in the vertical direction, and this IC device D is transported to the contact section 3.
When the IC device D is lowered to a position facing the contact portion 3, the IC device D is positioned, connected to the contact portion 3, and tested and measured. When this test/measurement is completed, the IC device D is separated from the contact portion 3 and further lowered. An orienter 16 is provided at the exit portion of the measuring section 11, and the IC device D that has been tested and measured is transferred to the unloader section 12 via the orienter 16. The unloader section 12 includes a sorting mechanism 17 and a plurality of columns of magazines 18.
The IC devices D sent to the storage device are sorted by a sorting mechanism 17 based on the test results, and then stored in the respective magazines 18. Next, FIG. 7 shows a cross section of the measuring section 11. As is clear from the figure, the measuring section 11 includes a loop guide 20 and a base guide 21 in order to form a traveling path R for causing the IC device D to travel under its own weight. The base guide 21 is formed with a sliding surface 21a that makes sliding contact with the bottom surface of the package portion P of the IC device D. On the other hand, the loop guide 20 has a package guide section 22 formed of a groove elongated in the running direction of the IC device D in order to guide the left and right shoulders and the back surface of the package section P. When connecting the IC device D to the contact portion 3, the IC device D is held between the loop guide 20 and the base guide 21, and
The lead L is moved toward the contact portion 3 to connect the lead L to the contact portion 3. Further, in order to prevent poor contact of the lead L when connecting to the contact portion 3, the loop guide 20 is provided with a lead holding portion 23 made of artificial sapphire or the like. Further, in order to bring the IC device D into contact with and away from the contact portion 3, the loop guide 20 and the base guide 21
It can be displaced in a direction perpendicular to the direction in which the device D travels under its own weight, and the loop guide 20 is connected to a driving means (not shown). Therefore, when running the IC device D, as shown in FIG.
Package guide part 22 and lead presser part 2 at O
3 is in a state where it is separated from the package part P and lead L of the IC device D by a predetermined distance, and the I
When connecting the C device D to the contact portion 3, as shown in FIG. It has become. [Problem to be solved by the invention 1] By the way, when running the IC device D,
Within the traveling path R between the loop guide 20 and the base guide 21, the IC device D is in a state where it can move by an amount corresponding to the above-mentioned interval. Therefore, while the IC device D is running, only its leads may come into sliding contact with the lead holding portion 23. Here, since a solder layer is formed on the surface of the lead L, when the lead L slides into contact with the surface of the lead holding part 23, this solder layer is peeled off due to friction between the two, and the lead holding part 23 is peeled off.
It will adhere to. As a result, when the lead L is connected to the contact part 3, the solder layer adhering to the lead holding part 23 short-circuits the adjacent sorts, making it impossible to perform tests and measurements. For this reason, the lead holding portion 23 must be cleaned frequently, resulting in a problem of poor maintainability. The present invention has been made in view of the above points, and an object of the present invention is to provide a contact mechanism for an IC device that allows the IC device to run without the lead coming into contact with the lead holding part. Our goal is to provide the following. Means for Solving the Problems 1 In order to achieve the above-mentioned object, the present invention includes a loop guide means that includes a package guide member that guides both corner portions of the package portion of the IC device while the IC device is traveling, and a lead and a loop guide member. The device is characterized in that it includes a lamp member that can be brought into and out of contact with the back surface of the package part, and that the IC device is clamped between the clamp member and the base guide. [Operation] By adopting such a configuration, when the IC device is run, the IC device is guided along the running path formed between the package guide member and the base guide means in the loop guide means. . Here, since the package guide member guides the corner portion of the package portion of the IC device from the shoulder portion to the back portion, there is no risk that the IC device will deviate from the running path. Therefore, at this time,
By retracting the clamp member to a position where it does not come into contact with the IC device, there is no possibility that the plating layer of the lead will adhere to the lead contacting surface of the clamp member. When the IC device reaches a predetermined position, the clamp member comes into contact with the back surface and the leads of the package portion of the IC device, and as a result, the IC device has its package portion contacting the clamp member and the base. When the lead is clamped by the guide and connected to the contact part, the clamp member presses the lead against the contact part, so that the electrical characteristics of the IC device can be tested and measured smoothly and reliably. can be set. Embodiment E Hereinafter, embodiments of the present invention will be described in detail based on FIGS. 1 to 4. Here, although the basic configuration of the IC Pandora itself is not essentially different from that shown in FIG. 5, the measurement section 11 has a configuration as described below. First, in FIGS. 1 and 2, 30 indicates a base guide, 40 indicates a loop guide, and the base guide 3
A traveling path 31 for the IC device D to travel on is formed on the surface of the IC device D. On both sides of this running path 31, cutouts 32.
32 is formed. Here, this notch 32.32
are provided at two locations at the top and bottom of the running path 31 in the running direction, so that two IC devices D can be tested and measured at the same time, but only one IC device D can be tested and measured at the same time. Alternatively, three or more IC devices may be tested and measured simultaneously. Further, the base guide 30 is supported by a pair of upper and lower shafts 3:1, 33, and is configured to be able to be reciprocated in a direction perpendicular to the running direction of the IC device D. On the other hand, the loop guide 40 includes a package guide member 41
and a clamp member 42. The package guide member 41 includes a guide surface 41a that extends from the back surface of the package portion P of the IC device D to the side wall portions on both sides continuous thereto, that is, the corner portions including part of the shoulders, and the left and right side portions thereof are Base guide 3
It is fixed at 0. A through hole 41b is formed in the portion of the package guide member 41 facing the contact portion 3, and notches 41c are formed in both side portions.
41c is provided. Therefore, in the position of the contact part 3 mentioned above, the guide surface 41a of the package guide member 41 guides the corner part of the package part P of the IC device D, and in other positions, the guide surface 41a of the package guide member 41 guides the corner part of the package part P and It is configured to guide the back. Further, the clamp member 42 has a main body portion 42a, and the main body portion 42a is positioned outside the package guide member 41. The main body portion 42a is provided with a pair of lead pressers 43, 43 and a package presser 44 made of artificial sapphire or the like. The lead presser 43 is disposed at a position facing the leads of the IC device D through notches 41c formed on both left and right sides of the package guide member 41, and the package presser 44 faces the through hole 41b. A pair of drive shafts 46, 46 are attached to the main body 42a of the clamp member 42. Each of these drive shafts 46
is connected to a connecting plate 47, and the connecting plate 47 is connected to a driving means 48 such as a cylinder. Further, the other end of the shaft 33 connected to the base guide 30 is also connected by a connecting plate 49, and the connecting plate 47 and the connecting plate 49 are separated from each other by a distance. FIG. 3 shows a state in which the IC device D can run between the base guide 30 and the loop guide 40, and the fourth
The figure shows a state in which the IC device D is clamped between the base guide 30 and the loop guide 40 and connected to the contact portion 3. As is clear from these drawings,
When running the IC device D, the lead presser 43 and the package presser 4 that constitute the clamp member 42 are used.
4 are both leads of the IC device D, and are maintained at a distance of 1 from the package portion P. However, the guide surface 4]a of the package guide member 41 is spaced apart from the package portion P by the distance 2. Here, the interval or 2 is set to be narrower than the interval sentence 1. In addition, in FIG. 1, 50.50 indicates a positioning rod, and the positioning rod 50 is used when the IC device D travels between the base guide 30 and the loop guide 40 and reaches a predetermined position. This is for positioning the IC device D, and it is placed in a position close to the travel path 31 of the base guide 30 through the insertion hole 51 bored in the main body 42 of the clamp member 42 and the through hole 41b of the package guide member 43. It is possible to derive up to This embodiment is constructed as described above, and when the C device D is supplied from the loader section 10 to the measurement section 11 via the orienter 15, the base guide 30 and loop guide 4
The vehicle is forced to run between 0 and 0. At this time, the base guide 30 and the loop guide 40 are connected to the package guide member 4 of the loop guide 40, as shown in FIG.
The distance between the guide surface 41a of 1 and the back surface of the IC device D is 1.
They are held apart from each other. Therefore, the IC
The device D is smoothly moved downward by its own weight between the guide surface 41a and the travel path 31 of the base guide 30. However, since the lead presser 43 and the package presser 44 in the clamp member 42 are spaced apart from the IC device D by a distance 1 which is larger than the above-mentioned distance 12, only the leads are connected while the IC device D is running. There is no sliding contact with the lead holding member 44. Therefore, there is no problem in that the plating layer over the lead is peeled off due to friction and adhered to the lead pressing member 44. Here, first, among the two positioning rods 50 arranged vertically, only the lower positioning rod 50 is made to protrude in a state facing the running path 31 of the IC device D. is stopped in a predetermined position. In this way the first I
After the C device D is positioned, the upper positioning rod 50 is projected to face the running path 31, thereby allowing the next IC device D to be moved to be positioned. When the two IC devices D are positioned and stopped as described above, the driving means 48 is actuated to move the driving shaft 46 together with the connecting plate 47 to the IC devices D.
2, i.e., in the direction of the arrow in FIG. As a result, first, the lead presser 43 of the clamp member 42 in the loop guide 40 contacts the lead L, and the package presser 44 contacts the package portion P. As a result, the IC device D is held between the loop guide 40 and the base guide 30. Then, when the loop guide 40 is further pushed by the driving means 48, the connecting plate 47 comes into contact with the connecting plate 49, and the base guide 30 is pushed together with the loop guide 40, as shown in FIG. , only the leads of the IC device D come into contact with the contact portion 3. At this time, the package portion P of the IC device D is held between the base guide 30 and the package holder 44 of the loop guide 40, and the lead holder is pressed against the contact portion 3 by the lead holder 43. , the IC device D is reliably connected to the IC tester T, and its electrical characteristics are tested and measured. When the IC device D is tested and measured in this way, the pressing force by the driving means 48 is released. As a result, the drive shaft 46 and the shaft 3 are removed by a return means (not shown).
3, the package guide member 41 is displaced in the opposite direction to the above-mentioned direction, and the package guide member 41 is moved toward the guide body 41 by the action of the spring 50.
3, and returns to the state shown in FIG. Then, by releasing the restriction of the IC device D by the positioning lot 50, the IC device D after the test and measurement is sent from the orienter 16 to the sorting mechanism 17 in the unloader section 12, and is classified by the sorting mechanism 17. It is stored in the magazine 18 in this state. By repeating the above-described operations, it is possible to sequentially test and measure the electrical characteristics of the IC device. [Advantageous Effects of the Invention 1] As explained above, the present invention provides a loop guide means provided in a measuring section that includes a package guide member that guides both corner portions of the package section while the IC device is running, and a lead and package section. and a ramp member that can be brought into and out of contact with the back surface of the IC device, and the IC device is clamped between the clamp member and the base guide, and the IC device is moved between the base guide and the loop guide. By setting the distance between the clamp member and the lead to be larger than the distance between the package part and the package guide member, it is now possible to keep the leads of the IC device out of contact with the lead holding member. There is no possibility that the plating layer formed on the surface of the lead will adhere to the lead pressing member.

[Brief explanation of drawings]

1 to 4 show one embodiment of the present invention, in which FIG. 1 is an exploded perspective view of a main part of a contact mechanism of an IC device, FIG. 2 is a cross-sectional view of the contact mechanism of an IC device, and FIG. 4 and 4 are cross-sectional views taken along line mm in FIG. 2 showing different operating states, and FIG. 5 is an explanatory diagram of the configuration of the IC handler.
FIG. 6 is an external view of the IC device, and FIGS. 7 and 8 are sectional views of essential parts showing the contact mechanism of the conventional IC device in different operating states. 30: Base guide, 31: Running path, 4 discharge loop guide, 42: Clamp member, 43: Lead holder, 44: Package holder.

Claims (1)

[Claims] It has a loop guide means and a base guide means, and guides the running of an IC device having a plurality of leads extending laterally on both left and right sides of a package part, and
In a mechanism in which a device is clamped in a predetermined position and brought into contact with and separated from a contact portion of an IC tester, the loop guide means guides both corner portions of the package portion while the IC device is traveling. A contact for an IC device, comprising a guide member and a ramp member that can be brought into and out of contact with the back surface of a lead and a package part, and the IC device is clamped between the clamp member and the base guide. mechanism.