JPH0453389B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention provides a large number of methods for aging inspection of ICs.
The present invention relates to a transport mechanism for an IC insertion device used to insert an IC board.

[Conventional technology]

Today, the demand for ICs is increasing dramatically, and to meet this demand, manufacturers are automating their production lines to mass-produce ICs. On the other hand, mass-produced
As some ICs may be defective, each
ICs are subjected to heat, humidity, and strength tests.

However, it is inefficient to carry out these tests over a long period of time, so in reality the tests are carried out in a short period of time by accelerating adverse conditions. Accelerated tests related to heat and temperature are usually called aging, and involve inserting a large number of ICs into a board with many sockets.
After heating this in an oven at 125° C. for 72 hours, certain property tests are carried out.

Although the automation of IC inspection processes has progressed considerably,
The process of inserting and removing ICs from the board still relies on the manual labor of each worker. A plurality of ICs are stored in a designated magazine, and the worker takes out the ICs one by one from the magazine and inserts them into each socket on the board.When removing the ICs, they use a designated jig and tool to successively insert the ICs in each row. It's ready to be removed. These tasks will become faster once you get used to them, but it is still desirable to automate them.

The biggest factors making automation difficult are the wide variety of IC sizes and the existence of boards with different numbers of sockets and socket spacing.

[Purpose of the invention]

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a transport mechanism for an IC insertion device that can quickly cope with changing to a board with a different socket spacing.

[Summary of the invention]

In order to achieve the above object, in the present invention, part of the IC transport rails is made movable, and blocks for adjusting and fixing each rail at a predetermined interval can be attached with a single touch.

[Embodiments of the invention]

FIG. 1 shows the most common DIP (Dual Inline Package) type IC 10. This IC 10 is formed by connecting a lead frame to a silicon chip and molding the periphery. A large number of terminals 12 are provided in a centipede shape on both sides of the IC 10, and the terminals 12 are formed by cutting out the frame portion of the lead frame and then bending it downward.

FIG. 2 shows a board 14 used for thermally accelerated testing, ie, caging. board 14
is rectangular in shape, and has many sockets 16 on its top surface.
is provided. On both sides of each socket 16,
A large number of small holes 17 are bored (only some of which are shown), into which terminals 12 on both sides of the IC 10 can be inserted, as shown by arrows. Board 14 has a large number of
After receiving the IC 10, it is placed in a predetermined furnace (not shown) and heated.

Further, predetermined wiring is incorporated inside the board 14, so that the characteristics of each IC on the board 14 taken out from the furnace can be inspected at once.

FIG. 3 shows an IC insertion device 18 according to this embodiment.
A simplified side view of the whole is shown. In this IC insertion device 18, a box-shaped rack 20 is arranged on the left side in the figure, and a large number of empty boards 14 for aging are stacked inside the rack 20.

The lowermost end of the board 14 is supported by a support stand 22, and an air cylinder 24 is connected to the center of the lower surface of the support stand 22. Therefore, the boards 14 in the rack 20 are pushed up one stage at a time by the air cylinder 24, and the boards 14 in the uppermost position are sent out one by one. In addition, a guide rod 26 is installed inside the rack 20 so that the board 14 can be raised smoothly.
It is desirable to provide

On the exit side of the top board 14 (right side in the figure),
A belt 28 for conveying the board is arranged, and the board 1
4 to the IC insertion position.
The belt 28 has an endless shape and has six pulleys 30.
It is wound around and operated clockwise by a motor (not shown). As can be seen from FIG. 8, a pair of belts 28 are provided, and the belts 28 convey the board 14 while supporting both sides thereof. Belt 28 of board 14
The feeding is performed by a predetermined arm (not shown).

An IC transport mechanism 32 is arranged above the belt 28. In this IC transport mechanism 32, the board 3
4 is arranged in an inclined state, and six rails 36 are laid on the board 34, as can be seen from FIG.

Each rail 36 extends in the same direction as the moving direction of the belt 28, and the interval between each rail 36 is set between the boards 1 and 2.
This corresponds to the spacing of the sockets 16 on 4. Furthermore, a joint 38 is provided in a portion of each rail 36 at two locations, as can be seen from FIGS. 4 and 5. Therefore, even when inserting an IC into a board where the sockets 16 have different spacings, the spacing between the rails 36 can be changed.

In order to easily adjust the spacing and fix the rails 36, a special block 40 is employed in this embodiment. This block 40 has recesses 42 corresponding to the number of rails 36, as shown in FIG.

On the other hand, a guide rail 46 is installed along the longitudinal direction on the frame 44 (FIG. 5).
Therefore, when the block 40 is placed on the guide rail 46 and slid in the direction of the arrow, the tip end of each rail 36 fits into each recess 42 of the block 40. As a result, each rail 36 can be adjusted and fixed at the same time.

Therefore, if the block 40 having the unevenness dimension corresponding to the spacing between the sockets 16 is manufactured in advance, it is only necessary to replace the block 40 even if the board has a different socket spacing. Since this operation is a one-touch operation, there is no need to finely adjust the rails 36 one by one.

In this embodiment, the uppermost rail 36 (Fig. 4) is always fixed, and each rail 3 is fixed based on this.
I am trying to adjust the interval of 6.

A stopper pin 48 is provided at the tip of each rail 36, as shown in FIGS. 4 and 5, so that the IC 10 that has slid down on the rail 36 can be stopped at this position. In addition, a detent step 50 is formed on the rail 36 so that the IC 10 does not bounce back when it collides with the stopper pin 48.

On the inclined rail 36, as shown in FIG. 5, there is an intermittent feeding mechanism 5 for feeding the ICs 10 one by one.
2 is installed. This intermittent feeding mechanism 52 is
It is composed of two air cylinders 54 and 56 and a bracket 58 that supports them.

Two air cylinders 54 and 56 are provided along the longitudinal direction of the rail 36, and are operated alternately by solenoid valves and sequence control.

The ICs 10 conveyed on the rails 36 are housed in advance in a curtain rail-shaped magazine 60, as shown in FIG. 7, and both ends of the magazine 60 are closed with padding 62. Therefore, if one side of the magazine 60 is unfilled and the opening of the magazine 60 is aligned with the starting end of the rail 36, each IC inside will slide on the rail 36.

As can be seen from FIG. 3, a box 64 is installed below the rail 36 and the base plate 34, and can accommodate the empty magazine 60.

Next, the operating order of the IC transport mechanism 32 will be explained. First, one end of the magazine 60 is opened and aligned with the starting end of each rail 36. The top of each rail 36 is now filled with IC10, and the top IC
10 comes into contact with the air cylinder 56 and stops at this position, as shown in FIG.

Subsequently, when the air cylinder 54 is lowered and the air cylinder 56 is raised, only the IC 10 at the tip is lowered on the rail 36, and then the IC 10 is pressed and stopped by the air cylinder 54. IC1 slipped down
0 collides with the stopper 48 and stops. At this time, even if the IC 10 bounces back, it is prevented from returning by the stepped portion 50, so the stopping position of the IC 10 will not be significantly deviated. This IC 10 is fed into each socket 16 of the board 14 by an IC gripping device which will be described later.

Next, when the air cylinder 54 rises and the air cylinder 56 falls, the IC 10 slides down until it collides with the air cylinder 56 again, returning to the state shown in FIG.

On the other hand, as shown in FIGS. 3 and 8, a table 66 is disposed between the pair of belts 28 in front of and below the above-mentioned IC stop position. This table 66 has a flat plate shape that is slightly smaller than the board 14.
A sensor 68 is attached to its tip. This sensor 68 functions to detect the leading end of the board 14 conveyed by the belt 28 and to stop the board 14 at the table position. At the bottom of the table 66 is a rod 69 of an air cylinder 67.
are connected to each other, and the air cylinder 67 functions to lift the board 14 together with the table 66 from the belt 28 when the sensor 68 detects the board.

On one side of the table 66 (upper part of FIG. 8),
Two stoppers 70, 72 are arranged, and two air cylinders 74, 76 are provided on the other side. Stoppers 70, 72, air cylinders 74, 7
6 is arranged at a right angle to the belt 28, and a right angle notch 72a is provided at the tip of the stopper 72.
is formed.

Furthermore, a table 66 is provided between the belts 28 and 28.
Three air cylinders 78, 80, 8 are located at the rear of the
2 is installed. The air cylinder 78 is the third
As can be seen from the figure, it is located vertically, and two air cylinders 80 and 82 are attached in parallel to its tip via a bracket 84.

Stoppers 70, 72 and air cylinders 74, 7
Although not shown, 6 and 78 are fixed to a part of the frame. Each of these members is connected to the board 14
The positioning mechanism 65 of FIG.

First, as shown in FIGS. 9 and 11, when the board 14 conveyed by the belts 28 and 28 reaches the table 66, the sensor 68 detects the tip of the board 14 and the air cylinder 67 is activated. The board 14 is then lifted from the table-by-table belt 28. At this time, the air cylinders 78, 80,
As can be seen from FIG. 3, the belt 82 is located at a lower position than the belt 28, so there is no problem in conveying the board 14. Further, there is a slight gap between the sockets 16 (only two shown) on the board 14 and the stoppers 70, 72.

Next, as shown in FIG.
4 and 76 are activated, and the socket 16 is the stopper 7.
Start the board 14 until it touches 0,72.

Subsequently, as shown in FIG. 11, the air cylinder 78 is activated to raise the two air cylinders 80 and 82 to the position of the board 14. Finally, the two air cylinders 80 and 82 are activated to press the rear end of the board 14 as shown in FIG. ends. In this fixed state, the IC 10 is inserted into each socket 16 of the board 14.

FIG. 12 shows an enlarged view of the IC gripping device 84. This IC gripping device 84 includes a pair of claws 86 and 88, and a rod 90 passes through both claws 86 and 88. An air cylinder 92 is connected to one end of the rod 90, and the air cylinder 92 is attached to a bracket 94. Further, a stopper 96 projects downward from the middle portion of the bracket 94, and this stopper 96 serves to stop the pawl 88 at a certain position when it is activated.

Therefore, when the air cylinder 92 operates, the claw 8
6 and 88 approach along the rod 90, but the claw 8
8 always stops at a fixed position, and the stopping position of the claw 86 changes depending on the size of the IC 10. Therefore, even if the size of the IC 10 or the socket position of the board 14 changes, if the program is set based on the stop position of the claw 88, the IC gripping device 84 can be accurately moved onto the socket 16 of the board 14. Can be done.

Further, each claw 86, 88 of the IC gripping device 84 is
As can be seen from Fig. 15, a plurality of ICs are provided in parallel in the horizontal direction, so one horizontal row of ICs in the socket 16 can be used.
10 can be sent at once.

Further, the IC gripping device 84 is provided with an air cylinder 96 (FIG. 12) that moves up and down, and a pressure plate 10 extending laterally is provided at the tip of the cylinder rod 98.
0 is concatenated. This pressing plate 100 has claws 8
When 6 and 88 grip the IC 10, they come into contact with the top surface of the IC 10 to prevent it from floating up, and ultimately act to insert the IC 10 into the socket 16 as shown in FIG. 14 by operating the air cylinder 96. do.

Note that the IC gripping device 84 itself is movable in the up-down direction and the front-back direction, as shown in FIG. This movable structure can be achieved by known techniques such as a rack and pinion, an air cylinder, etc., and therefore a description thereof will be omitted.

The IC gripping device 84 configured as described above is
It works as follows.

First, as shown in FIG. 3, the IC gripping device 84 moves rearward (to the left in the drawing) and grips each IC 10 aligned on the rail 36 with the claws 86 and 88. In this state, the IC gripping device 84 moves to above the socket 16 in the first row in front of the board 14, which is positioned on the table 66. This is the first
This is the state shown in FIGS. 2 and 15.

Next, as shown in FIG.
is opened and each IC 10 is dropped into the socket 16. The tip of the terminal 12 of the IC 10 is thinner (see Figure 1), and each hole 17 in the socket 16 (see Figure 2) is large.
The terminal 12 of No. 10 slightly enters into the hole 17. Finally, the air cylinder 96 is actuated and the pusher plate 100 pushes the IC 10 completely into the socket 16, as shown in FIG. At this time, the table 66 supports the pressing force from below.

At this point, the next IC 10 is waiting on the rail 36. The IC gripping device 84 grips these ICs 10 again in the same manner as described above, and pushes each IC 10 into the socket 16 in the second row. Since the board 14 is fixed at a predetermined position, the amount of movement of the IC gripping device 84 gradually becomes smaller as the first example, second example, and so on proceed. Each amount of movement may be programmed in advance and controlled by a microcomputer.

After the board 14 with the ICs 10 inserted into all the sockets 16, the table 66 is lowered by the air cylinder 67, and the belt 2 is moved again as shown in FIG.
At 8, it is transported to the rack 102. board 14
After releasing the air cylinders 80, 82 are lowered by the air cylinder 78. Although not shown, an arm for feeding the board 14 into the rack 102 is provided near the end of the belt 28.

Inside the rack 102, like the rack 20, a support stand 104 and an air cylinder 106 for moving the support stand up and down are installed. Therefore, each time one board 14 is fed into the rack 102, the air cylinder 106 is actuated to lower the support base 104, and each board 14 is stacked on the support base 104. Further, a guide rod 108 extending vertically is provided in the rack 102 so that the boards 14 can be accumulated smoothly.

In this way, the racks 20 and 102 have the same structure, but the air cylinder 24 moves up one step at a time, and the air cylinder 106 moves down one step at a time. These boards 14 are transported to a furnace and subjected to an aging test.

〔Effect of the invention〕

As mentioned above, in the present invention, a part of the IC transport rail is made movable and a block is used to adjust and fix these at predetermined intervals, so it is possible to easily deal with boards having different socket intervals.

[Brief explanation of the drawing]

Figure 1 is a perspective view of a DIP type IC, Figure 2 is a perspective view of a board with a socket, Figure 3 is a simplified side view of the IC insertion device, Figure 4 is a plan view of the IC transport mechanism, Figure 5
The figure is a side view, Figure 6 is a perspective view of the adjustment block, Figure 7 is a perspective view of the IC magazine, Figure 8 is a plan view of the board positioning mechanism, and Figures 9 and 10 are the operation of the board positioning mechanism. A plan view showing the condition,
Figure 11 is a side view showing the rising operation of the air cylinder, Figure 12 is an enlarged side view of the IC gripping device, and Figure 12 is an enlarged side view of the IC gripping device.
3 and 14 are enlarged side views showing the operating state of the IC gripping device, and FIG. 15 is a simplified front view of the IC gripping device. 10...DIP type IC, 12...terminal, 14...board, 16...socket, 18...IC insertion device,
32...IC transport mechanism, 36...rail, 38...
... joint, 40 ... block, 42 ... recess, 46 ... guide rail, 48 ... stopper pin, 52 ... intermittent feed mechanism, 60 ... IC magazine, 65 ... board positioning mechanism, 84 ... IC
gripping device.

Claims (1)

[Claims] 1. A transport mechanism for an IC insertion device that automatically inserts a large number of ICs into each socket of a board for aging inspection of ICs, which is arranged so as to transport and guide ICs from a magazine. A joint that allows a part of each rail to move laterally, a block that adjusts and fixes each rail at a predetermined interval, an intermittent feed mechanism that feeds a predetermined number of ICs on the rail, and an IC that has fallen off. A transport mechanism for an IC insertion device consisting of a stopper that stops the IC insertion device in a predetermined position. 2. The transport mechanism for an IC insertion device according to claim 1, wherein the joint is a hinge provided at two locations in the longitudinal direction of the rail. 3. The transport mechanism for an IC insertion device according to claim 1, wherein recesses corresponding to the rails are formed in the block, and these recesses fit with the respective rails. 4. The intermittent mechanism according to claim 1, wherein the intermittent mechanism is two air cylinders that alternately expand and contract.
Conveyance mechanism for IC insertion device. 5. The transport mechanism for an IC insertion device according to claim 1, wherein a stepped portion for preventing the IC from returning is formed near the end of the rail.