JPH0515612B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a extraction blade structure for an IC extraction device that automatically extracts ICs fitted into respective sockets of an aging board for aging inspection of ICs.

[Prior art]

Today, the demand for ICs is increasing dramatically, and to meet this demand, manufacturers are automating their production lines to mass-produce ICs. On the other hand, mass-produced ICs
Since there may be some defective products, each IC
are subjected to heat, humidity, strength, etc. tests.

However, it is inefficient to conduct these tests over a long period of time, so in reality, adverse conditions are accelerated and processed in a short period of time, which is called an accelerated test. Among these, those related to heat and temperature are called accelerated thermal testing or aging, in which a large number of ICs are inserted into a board with multiple sockets, heated at 125°C for 72 hours in a furnace, and then a specified characteristic test is performed. It is done.

Although the aging inspection process for ICs has been automated to some extent, the process of inserting each IC into the board's socket and removing the IC still relies on the manual labor of each worker. A plurality of ICs are stored in a designated magazine, and the worker takes out the ICs one by one from the magazine and inserts them into the sockets.When extracting them, a blade-shaped jig is used to continuously extract the ICs one row at a time. It's summery. These tasks will become faster once you get used to them, but it is still desirable to automate them from a labor-saving perspective.

In order to automatically extract ICs, it seems possible to install multiple extraction jigs and tools in parallel, which are currently done manually, and move them in the extraction direction.

However, the gap between the socket and the IC is only 3
m/m, and the gap position also varies by about 3 m/m vertically depending on each IC. Therefore, there is no problem in manually inserting the IC extraction jig into this gap, but it is a major problem when automated.

[Purpose of the invention]

The present invention has been made in view of the above circumstances, and its purpose is to provide an IC from which the IC can be reliably removed even if the height of the IC inside the socket varies.
An object of the present invention is to provide a extraction blade structure for a extraction device.

[Summary of the invention]

In order to achieve the above object, in the present invention, a roller is mounted above the extractor blade at a distance slightly larger than the thickness of the IC, and the roller is placed in contact with the top surface of the IC just before the extractor blade enters the socket. It is composed of

Therefore, even if the height of the IC in the socket is different,
Once the roller is on the IC, the extraction blade will enter the bottom of the IC based on this contact position.
It is possible to prevent the blade edge from colliding with the IC and causing mistakes.

[Embodiments of the invention]

Figure 1 shows the most common DIP type (dual type).
An IC10 (in-line package) is shown. This IC 10 is formed by connecting a lead frame to a predetermined silicon chip and molding the periphery. Further, a large number of terminals 12 protrude in a centipede shape from both sides of the IC 10, and these terminals 12 are formed by cutting out the frame portion of the lead frame and then bending it downward.

FIG. 2 shows a board 14 used for thermally accelerated testing, or aging. This board 14 is a rectangular flat plate, and a large number of sockets 16 are provided on its upper surface. A large number of small holes 17 (only some of which are shown) are provided on the inner surfaces of both sides of each socket 16.
are drilled, and the terminals 12 on both sides of the IC 10 can be inserted into these small holes 17 as shown by the arrows. After receiving a large number of ICs 10, the board 14 is placed in a predetermined furnace (not shown) and heated.

Further, predetermined wiring is incorporated inside the board 14, so that the characteristics of each IC on the board 14 taken out from the furnace can be inspected at once. In this state,
The IC 10 is still fitted into the socket 16 of the board 14, and it is necessary to remove the IC 10 from the socket 16.

FIG. 3 shows an IC extraction device 18 employing the extraction blade structure of the present invention. In this IC extraction device 18, a box-shaped rack 20 is installed on the left side in the figure, and inside the rack 20, an IC 10 is placed.
A large number of boards 14 are stacked up.

The lowermost end of the board 14 is supported by a support stand 22, and an air cylinder 24 is connected to the center of the lower surface of the support stand 22. Therefore, the boards 14 in the rack 20 are pushed up one stage at a time by the air cylinder 24, and the boards 14 in the uppermost position are sequentially sent out to the outside. To facilitate smooth lifting of the board 14, a guide rod 26 is provided in the rack 200 in this embodiment, extending upwardly.
Furthermore, a plurality of wheels 28 are attached to the lower surface of the rack 20 so that it can move on the floor 30.

On the exit side of the top board 14 (right side in the figure),
A belt 32 for conveying the board is arranged, and the board 1 is
4 to the IC extraction position. The belt 32 has an endless shape and is wound around six pulleys 34, and is moved in the direction of the arrow by a motor (not shown). Further, as can be seen from FIG. 4, a pair of belts 32 are provided, and convey the board 14 while supporting both sides thereof. The board 14 is fed onto the belt 32 by a predetermined arm (not shown).

The conveying system using the belt 32 is actually covered with a predetermined cover (omitted), and the cover is adapted to be attached to the frame 36. A plurality of support legs 38 and wheels 40 for movement are attached to the lower surface of the frame 36.

As shown in FIGS. 3 and 4, the positioning mechanism 4 of the board 14 is located at the IC extraction position of the belt 32.
2 is installed. In this positioning mechanism 42, a table 44 is arranged between the belts 32, and a sensor 46 for detecting the board 14 is attached to the center of the front end of the table 44. Also,
An air cylinder 48 is connected to the lower surface of the table 44, and the table 44 is raised by a signal from a sensor 46.

On one side of the table 44 (upper part of FIG. 4),
Two stoppers 50, 52 are arranged, and two air cylinders 54, 56 are provided on the other side. These stoppers 50, 52 and air cylinders 54, 56 are for holding the board 14 on the table 44 from both sides.
is adapted to abut against the side surface of the socket 16 rather than the side surface of the board 14. This is because the IC extraction position will be more accurate if the socket 16 is used as a reference rather than the side surface of the board 14.

Further, three air cylinders 58, 60, and 62 are provided behind the table 44 (on the left side in FIG. 4) at positions slightly lower than the belt 32. As can be seen from FIG. 3, the air cylinder 58 is located in the vertical direction, and two air cylinders 60 and 62 are attached in parallel to its tip via a bracket 64. Therefore, when the air cylinder 58 is actuated, each air cylinder 60, 62 projects above the belt 32 and corresponds to the rear end of the board 14.

The air cylinders 60 and 62 protrude from the board 1.
4, and plays the role of supporting the force applied to the board 14 when IC is extracted. If it is desired to completely fix the board 14, a predetermined stopper may also be provided at the front end of the board 14.

A extraction blade 64 for IC extraction is arranged at a slight inclination at the upper front side of the table 44. The extraction blade 64 is similar to a conventional extraction jig in that the tip 64a penetrates the lower surface of the IC 10 and extracts it from the socket 16, but as shown in FIG. 5, a roller 66 is attached to the tip. It has an elongated groove 68 in the longitudinal direction for receiving a plurality of ICs 10.

The gap between the roller 66 and the tip 64a of the extraction blade is formed to be slightly larger than the thickness t of the IC 10.
Further, the roller 66 is configured to come into contact with the upper surface of the IC 10 before the tip 64a enters the lower surface of the IC 10.

Therefore, even if there is variation in the height of the IC 10, that is, the gap size S, the tip 64a will enter the gap after the roller 66 contacts the top surface of the IC 10, and therefore the tip 64a will not collide with the front end of the IC 10. do not have.

Further, a rod 70 is provided in the vertical direction of the extraction blade 64.
is inserted, and a roller 72 is also attached to the tip of the rod 70. The roller 72 is constantly urged downward by the spring 74 and enters the groove 68.
Prevents IC10 from being pulled out due to its own weight. I C
When extracting, the IC is removed by moving the extractor blade 64.
10 pushes up the roller 72 and enters the groove 68. Although not shown, the rod 70 can be moved up and down by an air cylinder.

A plurality of extraction blades 64 are arranged in a horizontal direction, and since these blades move over the entire length of the board 14, all ICs 10 can be extracted from the socket 16 at one time.

The rear end of each extraction blade 64 is connected to a bracket 76 as shown in FIG. 3, and the bracket 76 is pivotally attached to a support plate 78 by a pin 80. An air cylinder 82 and a tension coil spring 84 are also provided between the bracket 76 and the support plate 78.
is interposed.

The tension coil spring 84 is attached to the tip 6 of the extraction blade 64.
4a and roller 66 downward at all times,
The IC 10 is extracted in this state. The air cylinder 82 extends when the IC extraction is completed, rotates the extraction blade 64 upward, and maintains it horizontally.

The upper end of the support plate 78 is slidably attached to a rail 79, and the rail 79 is attached to a gate-shaped frame 86.
It fits into a rail 88 which is fixed laterally to the inner surface of the rail 88. For this reason, the extraction blade 34 is suspended and supported by the gate-shaped frame 86 via two types of rails 79 and 88.

Therefore, the extracting blade 64 can slide along the rail 79 and remove all the ICs 10 from the socket 16, and then move laterally along the rail 88.

Near the end of the rail 88 (upper part of Figure 4),
A guide rail 90 for transporting ICs is installed at an angle, and a box 92 for accumulating ICs is arranged at the end of the guide rail 90. Therefore, each IC 10 released from the extraction blade 64 slides down each guide rail 90 and falls into the box 92.

On the other hand, a rack 94 is also arranged on the downstream side of the belt 32 (on the right side in FIG. 3), and empty boards 14 are stacked thereon. The lowermost end of the board 14 is supported by a support stand 96, and an air cylinder 98 is connected to the lower surface of the support stand 96. Further, a guide rod 100 inside the rack and wheels 102 on the underside of the rack are provided in exactly the same manner as the rack 20. However, the difference is that while the boards 14 in rack 20 rise one step at a time, the boards 14 in rack 94 descend one step at a time.

The IC extraction device 18 of this embodiment configured as described above operates in the following order.

First, in FIG. 3, the uppermost board 14 is transferred from the rack 20 on the upstream side onto the belt 32 by a predetermined arm. With the IC 10 fitted into each socket 16 of the board 14, the board 14 is transported in the direction of the arrow. At this time, the table 44 and the air cylinders 60 and 62 are connected to the belt 32.
Since it is located at a slightly lower position, there is no problem in transporting the board 14.

Next, when the board 14 reaches the top of the table 44, the sensor 46 detects the front end of the board 14, and the air cylinder 48 is immediately activated to lift the board 14 together with the table 44 from the belt 32.

Next, as shown in FIG. 4, the air cylinder 5
4,56 operates to stop the board 14 from the stopper 50,
52 and clamp both sides of the board 14.
Since the stoppers 50, 52 abut against the socket 16 rather than the side surface of the board 14, each socket position is accurately positioned with respect to the stopper contact point.

Next, air cylinder 58 (FIG. 3) is actuated to raise a pair of air cylinders 60, 62 (FIG. 4), which extend and abut against the rear end of board 14. Since the extraction blade 64 moves sufficiently to the left in the figure, the position of the board 14 in the longitudinal direction does not need to be very accurate.

As shown in FIG. 5, when the extraction blade 64 moves in the direction of the arrow, the roller 66 first moves to the IC10.
The tip 64a rides on the top surface of the IC10.
Go into the bottom of the. When the tip 64a moves further, the IC 10 separates from the socket 16, pushes up the roller 72, enters the groove 68, and is prevented from returning by the roller 72.

Since the extraction blade 64 is constantly urged downward by the action of the tension coil spring 84, the tip 64
a is never higher than the gap between IC10. Further, even if the extraction blade 64 is lower than the predetermined position, when the roller 66 rides on the IC 10, the tip 64a also rises at the same time, so that there will be no mistake in extraction of the IC 10.

Of the pressing force applied during extraction, the table 44 supports the downward component, and the lateral component is supported by the air cylinders 60, 62 (FIG. 4).

The lateral positioning of the socket 16 (direction across the belt 32) is performed using the stoppers 50, 52 as described above.
Since this is done more accurately, the extraction blade 64 will not shift laterally with respect to the socket 16.

When all the ICs 10 in each socket 16 are extracted, the air cylinder 82 is extended and the extraction blade 64 is removed.
turns upward and becomes horizontal. The extraction blade 64 then moves laterally along the rail 88, as shown in FIG. 4, and stops near the entrance of the guide rail 90. Here, the air cylinder 82 (Fig. 3)
is shortened, causing the extraction blade 64 to tilt significantly, and at the same time, the rod 70 and roller 72 (FIG. 5) rise.

Therefore, a large number of ICs 10 in the groove 68 slide out and fall along the guide rail 90, and reach the box 92.
It will accumulate in.

On the other hand, after the empty board 14 is released from the air cylinders 54, 56, 60, 62, the table 44 is lowered, placed on the belt 32 again, and conveyed to the rack 94 side. In addition, the air cylinder 58 (Fig. 3) is also shortened so that the air cylinder 6
0,62 goes down.

Empty boards 14 are stacked onto racks 94 near the exit of belt 32 by a predetermined arm (not shown). When the boards 14 are stacked, the air cylinder 98 is actuated to lower the entire board one step.

After sending out each IC 10, the extraction blade 64 moves slightly backward along the rail 79, and then returns to the IC extraction position again along the rail 88.
At this time, the next board 14 has already been positioned on the table 14, and the above-described operations are then repeated. All these operations are performed under microcomputer control.

〔Effect of the invention〕

As mentioned above, in the extractor blade structure of the present invention, the roller is provided above the tip of the extractor blade, and the groove for receiving the IC is formed between the roller and the tip of the extractor blade, so the height of the IC in the socket and the Even if there are variations in the gap, all ICs can be reliably extracted.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a DIP type IC, FIG. 2 is a perspective view of an aging board, and FIG. 3 is a simplified side view of an IC extraction device to which the extraction blade of the present invention is applied.
4 is a plan view of FIG. 3, and FIG. 5 is an enlarged sectional view of the extraction blade. 10...IC, 12...terminal, 14...aging board, 16...socket, 18...IC extraction device,
32... Belt, 42... Board positioning mechanism, 44
...Table, 64...Extracting blade, 64a...Extracting blade tip, 66...Roller, 68...Groove, 72...Roller,
79...Rail, 80...Pin, 82...Air cylinder, 84...Tension coil spring, 86...Gate frame, 88...Rail, S...IC gap dimension, t...IC
thickness.

Claims (1)

[Claims] 1 A sampling blade structure for an IC extraction device that automatically extracts ICs fitted into each socket of an aging board for aging inspection of ICs, and is provided at a slight inclination in correspondence with each socket of the board. It wedges into the bottom surface of the IC in the socket and the IC
IC is placed above the tip of the extraction blade.
An IC comprising rollers that are attached at intervals slightly larger than the thickness of the IC and that contact the top surface of the IC immediately before the extraction blade enters the socket, and an IC receiving groove formed between the tip of the extraction blade and the roller. Extraction blade structure for extraction device.