JPH065259B2 - Inserting IC into aging board socket - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a method for inserting an IC into an aging board socket used for aging inspection of an IC.

[Prior art]

Today, ICs are mass-produced by each manufacturer, but there are some defective products in the mass-produced ICs.
Therefore, each IC is tested for heat, humidity, strength, etc., and then its electrical characteristics are inspected to remove defective products.

However, it is inefficient to perform these inspections over a long period of time, and therefore, in reality, the adverse conditions are accelerated to inspect a large number of ICs in a short period of time. The one related to heat and temperature in the accelerated test is usually called aging. After inserting a large number of ICs into a board with sockets arranged in multiple lines and heating them at 125 ° C for 72 hours in a furnace, The characteristic test is performed.

Although the IC inspection process is partially automated, the process of inserting the IC into the board and the process of removing the IC are currently dependent on the manual work of field workers. A plurality of ICs are stored in a predetermined magazine in advance, and a worker can insert one IC from the magazine.
Each piece is taken out and fitted into each socket of the board, and when it is taken out, it can be taken out continuously in a row with a predetermined jig and tool. The more you get used to these tasks, the faster they become, but automation is still desired.

However, it is extremely difficult to automatically insert all the many terminals of the IC into the small holes in the socket. Mechanically IC
When the terminal is gripped and carried into the socket and a pressing force is applied to it, the terminal that is even slightly detached from the small hole bends due to the pressing force I
This is because C is a defective product.

Furthermore, if a large number of ICs are inserted into each socket at a time, the terminals of the ICs cannot fit into the small holes even if the positions of the boards and the intervals between the sockets are slightly changed.

[Object of the Invention]

The present invention has been made in view of such circumstances, and an object thereof is to provide a method for inserting an IC into an aging board socket so that all the ICs surely fit into the small holes of the socket.

[Outline of Invention]

In order to achieve the above object, the present invention divides the automatic IC insertion step into two steps, in the first step the IC is lightly dropped into the socket, and then in the second step, the IC is pushed into the socket. did.

That is, since the terminal of the IC has a thin tip and each small hole of the socket is formed in a slightly large size, when the IC is lightly dropped in the first step, each terminal of the IC is separated by the weight of the IC and the wedge action. It goes into the small holes to some extent. After this, I
When C is pressed, each terminal is surely inserted into the small hole without damage.

Example of Invention

FIG. 1 shows the most basic DOP (dual in-line package) type IC10. This IC
10 is formed by connecting a lead frame to a silicon chip and molding the periphery. A large number of terminals 12 are provided on both sides of the IC 10, and the terminals 12 are formed by cutting the frame portion of the lead frame and bending it downward.

FIG. 2 shows a board 14 used for a thermal acceleration test, that is, aging. The board 14 has a rectangular shape, and a large number of sockets 16 are provided on the upper surface thereof. A large number of small holes 17 are formed on both sides of each socket 16 (only a part is shown) so that both side terminals 12 of the IC 10 can be inserted as indicated by arrows. After receiving the large number of ICs 10, the board 14 is placed in a predetermined furnace (not shown) and heated.

In addition, a predetermined wiring is incorporated in the board 14, so that each IC characteristic on the board 14 taken out of the furnace can be inspected at once.

FIG. 3 shows a simplified side view of the entire IC insertion device 18 according to this embodiment. In this IC insertion device 18, a box-shaped rack 20 is installed on the left side in the drawing, and a large number of empty boards 14 for aging are stacked in the rack 20.

The lowermost end of the board 14 is supported by a support base 22, and an air cylinder 24 is connected to the center of the lower surface of the support base 22.
Therefore, the boards 14 in the rack 20 are pushed up step by step by the air cylinder 24 and are sequentially sent out from the board 14 at the uppermost position. Further, it is desirable to provide a guide rod 26 in the rack 20 so that the board 14 can be raised smoothly.

On the exit side (the right side in the figure) of the uppermost board 14, a board carrying belt 28 is arranged to carry the board 14 to the IC insertion position. The belt 28 has an endless shape and is wound around six pulleys 30 and is operated clockwise by a motor (not shown). As can be seen from FIG. 8, a pair of belts 28 are provided, and the belts 28 are conveyed while supporting both sides of the board 14. The board 14 is sent to the belt 28 by a predetermined arm (not shown).

An IC transfer mechanism 32 is installed above the belt 28. In this IC transfer mechanism 32, a board 34 is arranged in an inclined state, and six rails 36 are provided on the board 34 as can be seen from FIG.
Has been laid.

The rails 36 extend in the same direction as the moving direction of the belt 28, and the distance between the rails 36 corresponds to the distance between the sockets 16 on the board 14. In addition, a part of each rail 36 has a fourth
As can be seen from Fig. 5 and Fig. 5, joints are made at two points.
38 are provided. Therefore, the spacing of the rails 36 can be changed even when the ICs are inserted into boards having different spacings of the sockets 16.

In this embodiment, a special block 40 is adopted in order to easily adjust the spacing of the rails 36 and fix them. This block
As shown in FIG. 6, reference numeral 40 denotes a concave portion 42 corresponding to the number of rails 36.
have.

On the other hand, a guide rail 46 is installed on the frame 44 (FIG. 5) along the longitudinal direction. Because of this, the block
When 40 is placed on the guide rail 46 and slid in the direction of the arrow, the tip end of each rail 36 is moved into each recess 42 of the block 40.
To fit. As a result, the rails 36 are simultaneously adjusted and fixed.

Therefore, if the blocks 40 having irregularities corresponding to the intervals of the sockets 16 are produced in advance, it is only necessary to replace the blocks 40 even for boards having different socket intervals.
Since this operation is a one-touch operation, it is not necessary to finely adjust the rails 36 one by one.

In this embodiment, the uppermost rail 36 (Fig. 4) is always fixed, and the spacing between the rails 36 is adjusted with reference to this.

A stopper pin 48 is provided at the tip of each rail 36 as shown in FIGS. 4 and 5, so that the IC 10 sliding down on the rail 36 can be stopped at this position. Further, a step portion 50 for detent is formed on the rail 36 so that the IC 10 does not bounce backward when the IC 10 collides with the stopper pin 48.

As shown in FIG. 5, an intermittent feeding mechanism 52 for feeding the ICs 10 one by one is installed on the inclined rail 36.
The intermittent feed mechanism 52 is composed of two air cylinders 54 and 56 and a bracket 58 that supports them.

The air cylinders 54 and 56 are arranged along the longitudinal direction of the rail 36.
Individually provided, they are operated alternately by a solenoid valve and sequence control.

The IC 10 transported on the rail 36 is previously stored in a curtain rail-shaped magazine 60 as shown in FIG. 7, and both ends of the magazine 60 are closed by the padding 62. Therefore,
With one side of magazine 60 removed, magazine 60
If you align the opening of the
C10 will slide down on rail 36.

A box 64 is installed below the rail 36 and the base plate 34, as shown in FIG. 3, and can accommodate an empty magazine 60.

Next, the operation sequence of the IC transport mechanism 32 will be described. First, one end of the magazine 60 is opened and aligned with the starting end of each rail 36. As a result, each rail 36 is filled with the IC 10, and the IC 10 at the leading end is stopped at this position by hitting the air cylinder 56 as shown in FIG.

Subsequently, when the air cylinder 54 descends and the air cylinder 56 rises, only the IC 10 at the tip descends on the rail 36, and the next IC 10 is pressed and stopped by the air cylinder 54. The IC 10 that has slipped off collides with the stopper 48 and stops. At this time, even if the IC 10 rebounds, the stepped portion 50 prevents the IC 10 from returning, so that the stop position of the IC 10 is not greatly changed.
This IC 10 is mounted on the board 14 by an IC gripping device described later.
Is inserted into each socket 16.

Next, when the air cylinder 54 rises and the air cylinder 56 descends, the IC 10 slides down until it collides with the air cylinder 56 again, and returns to the state of FIG.

On the other hand, as shown in FIGS. 3 and 8, between the pair of belts 28, a table 66 is arranged below the front side of the IC stop position. The table 66 has a flat plate shape slightly smaller than the board 14, and a sensor 68 is attached to the tip thereof. The sensor 68 detects the tip of the board 14 conveyed by the belt 28 and stops the board 14 at the table position. The rod 69 of the air cylinder 67 is connected to the lower surface of the table 66.
67 detects the board detected by the sensor 68 and lifts the board 14 together with the table 66 from the belt 28.

Two stoppers 70 and 72 are arranged on one side (upper side in FIG. 8) of the table 66, and two air cylinders are arranged on the other side.
74 and 76 are provided. The stoppers 70, 72 and the air cylinders 74, 76 are arranged at right angles to the belt 28, and
A right-angled notch 72a is formed at the tip of the stopper 72.

Further, between the belts 28, 28, there is a position 3 behind the table 66.
Individual air cylinders 78, 80, 82 are installed. As can be seen from FIG. 3, the air cylinder 78 is located in the vertical direction, and two air cylinders 80 and 82 are mounted in parallel at the tip thereof via a bracket 84.

Although not shown, the stoppers 70, 72 and the air cylinders 74, 76, 78 are fixed to a part of the frame. Each of these members constitutes the positioning mechanism 65 for the board 14, and the operation sequence thereof will be described next.

First, as shown in FIGS. 9 and 11, when the board 14 conveyed by the belts 28, 28 reaches the table 66, the sensor 68 detects the tip of the board 14 to detect the air cylinder.
Working from 67, the board 14 is lifted from the belt 28 per table. At this time, the air cylinders 78, 80, 82 are
As you can see from the figure, it is lower than the belt 28,
There is no problem in transporting the board 14. In addition, between the socket 16 (only two are shown) on the board 14 and the stoppers 70, 72,
There is a slight gap.

Next, as shown in FIG. 10, the air cylinders 74 and 76 are operated, and the board is pushed until the socket 16 comes into contact with the stoppers 70 and 72.
Move 14

Subsequently, as shown in FIG. 11, the air cylinder 78 is operated to raise the two air cylinders 80 and 82 to the position of the board 14. Finally, the two air cylinders 80 and 82 are operated to press the rear end of the board 14 as shown in FIG. 8, and the front socket 16 is fitted into the notch 72a of the stopper 72 to position the board 14. Ends. In this fixed state, board 14
The IC 10 is inserted into each socket 16 of the.

FIG. 12 shows an enlarged view of the IC gripping device 84.
This IC gripping device 84 includes a pair of claws 86 and 88,
Rod 90 penetrates 86 and 88. An air cylinder 92 is connected to one end of the rod 90, and the air cylinder 92 is attached to a bracket 94. Further, a stopper pin 96 projects downward in the middle portion of the bracket 94, and the stopper pin 96 plays a role of stopping at a fixed position when the claw 88 operates.

Therefore, when the air cylinder 92 operates, the claws 86 and 88 move to the rod.
Although approaching along 90, the claw 88 always stops at a fixed position,
The stop position of the claw 86 changes according to the size of the IC 10. Therefore, even if the size of the IC 10 or the socket position of the board 14 changes, the IC gripping device 84 can be accurately moved onto the socket 16 of the board 14 by setting the program with reference to the stop position of the claw 88. You can

Further, as can be seen from FIG. 15, the plurality of claws 86, 88 of the IC gripping device 84 are provided in parallel in the lateral direction, so that the IC 10 for one row of the socket 16 can be inserted at a time.

Further, the IC gripping device 84 includes an air cylinder 96 that moves up and down.
(FIG. 12) is provided, and a pressing plate 100 extending in the lateral direction is connected to the tip of the cylinder rod 98. This pressure plate 1
When the claws 86, 88 grip the IC 10, the 00 abuts against the upper surface of the IC 10 to prevent it from rising, and finally the air cylinder 96 operates to move the IC 10 to the socket 16 as shown in FIG. It works by inserting.

The IC gripping device 84 itself is movable in the vertical direction and the front-back direction as shown in FIG. Since this movable structure can be constructed by a known technique such as a rack and pinion, an air cylinder, etc., its explanation is omitted.

The IC gripping device 84 configured as described above operates as follows.

First, as shown in FIG. 3, the IC gripping device 84 moves backward (to the left in the drawing), and the ICs 10 arranged on the rail 36 are aligned.
Is gripped by the claws 86 and 88. In this state, IC gripping device 84
Moves to above the socket 16 in the front first row of the board 14 positioned on the table 66. This is the state shown in FIGS. 12 and 15.

Then, as shown in FIG. 13, the claws 86 and 88 are opened to release each I.
Drop C10 into socket 16. The terminal 12 of the IC 10 has a narrower tip (see FIG. 1), and each hole (see FIG. 2) in the socket 16 is provided with a larger size.
The terminal 12 of is slightly inserted into the hole 17. Finally an air cylinder
96 operates, and as shown in FIG.
Is completely pushed into socket 16. At this time, Table 66 is
The pressing force is supported from below.

At this point, the next IC 10 is waiting on the rail 36. The IC gripping device 84 grips these ICs 10 again in the same manner as described above, and pushes each IC 10 into the socket 16 in the second row. Since the board 14 is fixed in place, the IC gripping device
The movement amount of 84 gradually decreases as going in one row, two rows, and so on. Each movement amount may be controlled by a microcomputer by forming a program in advance.

The board 14 in which the ICs 10 are inserted into all the sockets 16 is moved down by the air cylinder 67 to the table 66, and is conveyed again to the rack 102 by the belt 28 as shown in FIG.
After releasing the board 14, the air cylinders 80, 82 are lowered by the air cylinder 78. Although not shown, an arm for feeding the board 14 into the rack 102 is provided near the end of the belt 28.

Like the rack 20, a support base 104 and an air cylinder 106 for vertically moving the support base 104 are installed in the rack 102. Therefore, every time one board 14 is sent to the rack 102, the air cylinder 106 operates to lower the support base 104, and the boards 14 are stacked on the support base 104. Also,
A vertically extending guide rod 108 is erected in the rack 102 so that the boards 14 can be accumulated smoothly.

In this way, the rack 20 and the rack 102 have the same structure, but the air cylinder 24 is raised step by step, and the air cylinder 106
Will be lowered step by step. These boards 14
Selected to the furnace and used for the aging test.

〔The invention's effect〕

As described above, according to the IC insertion method of the present invention, the IC is once dropped into the socket and then pushed in.
Even if the terminals of the IC and the small holes of the socket do not have to be aligned accurately, they can be surely matched.

[Brief description of drawings]

1 is a perspective view of a DIP type IC, FIG. 2 is a perspective view of a board with a socket, and FIG. 3 is a simplified side view of an IC insertion device.
4 is a plan view of the IC transport mechanism, FIG. 5 is a side view thereof,
6 is a perspective view of the adjusting block, FIG. 7 is a perspective view of the IC magazine, FIG. 8 is a plan view of the board positioning mechanism, and FIG.
Figures and 10 are plan views showing the operating state of the board positioning mechanism, FIG. 11 is a side view showing the upward movement of the air cylinder,
FIG. 12 is an enlarged side view of the IC holding device, FIGS. 13 and 14 are enlarged side views showing the operating state of the IC holding device, and FIG. 15 is a simplified front view of the IC holding device. 10 ... DIP type IC, 12 ... Terminal, 14 ... Board, 16 ... Socket, 17 ... Small hole, 18 ... IC insertion device, 32 ... IC transport mechanism,
65 ... Board positioning mechanism, 84 ... IC gripping device, 86, 88 ...
Claws, 92, 96 ... Air cylinders, 100 ... Press plates

Claims (1)

[Claims] 1. A method for automatically inserting a large number of ICs into each socket of a board for IC aging inspection,
The IC 10 is gripped by a predetermined gripping mechanism 84, 86, 88,
A step of dropping this IC into the socket 16 from directly above,
A method of inserting an IC into an aging board socket, which comprises a step of pressing the IC in the socket from above by the pressing mechanism 96, 98, 100 to completely insert the IC terminal 12 into the small hole 17 of the socket.