JPS6258178A - Method for inserting ic in ageing board socket - Google Patents

Abstract

PURPOSE:To make it possible to certainly adapt IC to a socket, by pressing IC after IC was once fallen in a socket. CONSTITUTION:The boards 14 in a lefthand rack 20 are pushed up by an air cylinder 24 and successively fed out from the uppermost board 14 and fed to an IC inserting position by a feeder 28 and a table 66 is lifted by a lifter 67 to be located. An IC feed mechanism 32 is arranged above a belt 28 and six rails 36 are laid on a base plate 34 so as to extend to the same direction as the moving direction of the belt 28 and each interval between the rails 36 is allowed to correspond to the interval of the sockets on the board 14. ICs 10 intermittently fed one at a time on the inclined rails by a feeder 52 are successively located by a locating device 48 and each of them is successively inserted in each socket on the board 14 by an IC grasping device 84. The board 14 wherein ICs 10 were inserted in all of the sockets is fallen along with the table 66 by an air cylinder 67 and again fed to a righthand rack 102 by the belt 28.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a method for inserting an IC into an aging board socket used in aging inspection of an IC.

[Prior art]

Today, ICs are mass-produced by various manufacturers, but some of the mass-produced ICs are defective. For this reason, each IC is subjected to heat, humidity, strength, etc. tests, and then its electrical characteristics are inspected and defective products are removed.

However, it is inefficient to perform these tests over a long period of time, so in reality, a large number of ICs are tested in a short period of time by accelerating the adverse conditions. Among accelerated tests, those related to heat and temperature are usually called aging, in which a large number of ICs are inserted into a boat 9 with sockets arranged in a plurality of rows, and after heating this in a furnace at 125 ° C. for 72 hours, Predetermined characteristic tests are performed.

Although some parts of the IC inspection process are automated, boat 9
At present, the process of inserting and extracting ICs still relies on the manual labor of field workers.

A plurality of ICs are stored in a designated magazine in advance, and the worker takes out the ICs one by one from the magazine and inserts them into each socket on the board, and when removing them, uses a designated jig and tool so that they can be pulled out one row at a time. It has become. These tasks will become faster once you get used to them, but it is desirable to automate them.

However, it is extremely difficult to automatically insert all the many terminals of an IC into the small holes in the socket.

This is because when an IC is mechanically gripped and carried into a socket, and a pressing force is applied to it, any terminal that has even slightly dislodged from the small hole will be bent by the pressing force, and the rc will become a defective product.

Furthermore, if a large number of ICs are inserted into each socket at the same time, even a slight deviation in the position of the board or the spacing between the sockets will result in the IC terminals not being able to fit into the small holes.

[Purpose of the invention]

The present invention has been made in view of the above circumstances, and its purpose is to provide a method for inserting an IC into an aging boat socket in which all ICs are reliably fitted into the small holes of the socket.

[Summary of the invention]

In order to achieve the above object, the present invention divides the automatic IC insertion process into two parts, in which the IC is lightly dropped into the socket in the first process, and then the IC is pressed into the socket in the second process. did.

In other words, the tip of the rc terminal is thin, and each small hole in the socket is made slightly thicker, so if the IC is dropped lightly in the first step, each terminal of the IC will absorb the weight of the IC and the simulated It penetrates into each small hole to some extent. After this, I.C.
By pressing the terminal, each terminal will be inserted into the small hole without damage.

[Embodiments of the invention]

FIG. 1 shows the most common IP (dual inline package) type rclo. This IC 10 is formed by connecting a lead frame to a silicon chip and molding the periphery. A large number of terminals 12 are provided in a centipede shape on both sides of the IC 10, and the terminals 12 are formed by cutting out the frame portion of the lead frame and then bending it downward.

FIG. 2 shows a board 14 used for thermally accelerated testing, or aging. The board 14 is rectangular and has a number of sockets 16 on its top surface. A large number of small holes 17 are bored in the IC1 (only some of them are shown), as shown by arrows.
The terminals 12 on both sides of 0 can be inserted. After receiving a number of ICs 10, the boat 914 is placed in a predetermined furnace (not shown) and heated.

In addition, a predetermined wiring is incorporated inside the board #14,
The characteristics of each IC on the board 14 taken out from the furnace can be inspected at once.

FIG. 3 shows a simplified side view of the entire RC insertion device 18 according to this embodiment. In this IC insertion device 18,
A box-shaped rack 20 is installed on the left side of the figure, and a large number of empty aging boats "14" are stacked inside the rack 20.

The lowermost end of the boat 914 is supported by the support stand 22, and the air cylinder 24 is connected to the center of the lower surface of the support stand 22. Therefore, the boards 14 in the rack 20 are pushed up one stage at a time by the air cylinder 24, and are sequentially sent out from the boat 014 at the top position. In addition, in order to smoothly raise the board 14, a board transporting bolt 28 is placed in the rack 20 on the exit side (right side in the figure) of the uppermost guide rod 14. IC
It is designed to be transported to the insertion position. The x-route 4 has a two-torque 9less shape and is wound around six pulleys 30, and is operated clockwise by a motor (not shown). cheat) 28
As can be seen from Figure 8, there are a pair of
14 while supporting both sides. The boat 014 is fed to the boat 014 by a predetermined arm (not shown).
It is carried out by

An IC transport mechanism 32 is installed above the belt 28. In this IC transport mechanism 32, a board 34 is installed in an inclined state, and six rails 36 are laid on the board 34, as can be seen from FIG.

Each rail 36 extends in the same direction as the moving direction of the rail 28, and the spacing between the rails 36 corresponds to the spacing between the sockets 16 on the board 14. Moreover, a joint 38 is provided in a portion of each rail 36 at two locations, as can be seen from FIGS. 4 and 5.

Therefore, the spacing between the rails 36 can be changed even when inserting an IC into a board where the spacing between the sockets 16 is different.

In order to easily adjust and fix the distance between the rails 36, a special Zlock 40 is used in this embodiment.

This block 40 has recesses 42 corresponding to the number of Nirails 36, as shown in FIG.

On the other hand, a guy V-rail 46 is installed along the longitudinal direction on the frame 44 (FIG. 5). Therefore, if the block 40 is placed on the guide rail 46 and slid in the direction of the arrow, the tip of each rail 36 will be aligned with the block 40.
It fits into each recess 42 of 0. This allows each rail 36
The spacing adjustment and fixing are performed in the same way.

Therefore, if the block 40 having the uneven dimensions corresponding to the spacing between the sockets 16 is manufactured in advance, it is sufficient to simply replace the block 40 even if the board has a different socket spacing. Since this operation is a one-touch operation, there is no need to finely adjust the rails 36 one by one.

In this embodiment, the uppermost rail 36 (FIG. 4) is always fixed, and the intervals between the rails 36 are adjusted based on this.

A stopper pin 48 is provided at the tip of each rail 36, as shown in FIGS. 4 and 5, so that the IC 10 that has slid down on the rail 36 can be stopped at this position. Furthermore, a step 50 for preventing detent is formed on the rail 36 so that the ICIQ does not bounce back when it collides with the stopper pin 48.

On the inclined rail 36, as shown in FIG.
An intermittent feeding mechanism 52 for feeding the 10 pieces one by one is installed. This intermittent feeding mechanism 52 is composed of two air cylinders 56 and a bracket shell that supports them.

Two air cylinders 54 and 56 are provided along the longitudinal direction of the rail 36, and are operated alternately by solenoid valves and sequence control.

The ICIQ transported on the rail 36 is stored in advance in a curtain rail-shaped magazine mark, as shown in FIG.
Both ends of the magazine mark are closed by padding 62.

Therefore, if the opening of the magazine (a) is aligned with the starting end of the rail 36 with one of the magazine marks removed, each IC 10 inside will slide down on the rail 36.

As can be seen from FIG. 3, a box diagram is installed below the rail 36 and the board 34, and an empty magazine (A) is installed below.
can be accommodated.

Next, the operation sequence of the rc transport mechanism 32 will be explained. First, open one end of the magazine mark and open each rail 36.
Align with the starting edge of. Now I C1 on each rail 36
0, the IC 10 at the tip comes into contact with the air cylinder 56 and stops at this position, as shown in FIG.

Subsequently, when the air cylinder is lowered and the air cylinder is raised, only the tip IC 10 is lowered on the rail 36, and the next IC 10 is pressed and stopped by the air cylinder 54. The IC 10 that has slid down collides with the stopper 48 and stops. At this time, even if the IC 10 bounces back, it is prevented from returning by the stepped portion 50, so the stopping position of the IC 10 will not be significantly deviated. This device C10 is inserted into each socket 16 of the boat 914 by an IC gripping device which will be described later.

Next, when the air cylinder 54 is raised and the air cylinder 56 is lowered, the workpiece C10 slides down until it collides with the air cylinder 56 again, returning to the state shown in FIG.

On the other hand, as shown in FIGS. 3 and 8, a pair of
In between, a table is arranged below and in front of the above-mentioned IC stop position. This table area has a flat plate shape that is slightly smaller than the blur 14, and a sensor plate is attached to its tip. This sensor unit detects the tip of the boat "14" carried by the boat "14" (R) 28, and
The function is to stop the table at the table position. table 66
Lot 969 of the air cylinder Taro 7 is connected to the lower surface of the air cylinder 67, and the air cylinder 67 connects the table 66 and the ball) 2 by detecting the boat angle of the sensor field.
It has the effect of lifting from 8.

Two stoppers 70 and 72 are arranged on one side of the table 66 (upper side in FIG. 8), and two air cylinders 74 and 76 are arranged on the other side. Stopper 70
, 72, the air cylinders 74, 76 are arranged at right angles to the bolt 28, and a right-angled notch 72a is formed at the tip of the stopper 72.

Furthermore, three air cylinders 78 , 80 , 82 are installed between the tables 28 and 28 at rear positions of the table 66 . As can be seen from FIG. 3, the air cylinder 78 is located vertically and has a bracket 84 at its tip.
Two air cylinders (equipment) 82 are installed in parallel via the air cylinders.

Stoppers 70, 72 and air cylinders 74, 76
, 78 are fixed to a part of the frame, although not shown. Each of these members constitutes a positioning mechanism 65 for the board 14, and the order of their operation will be explained in detail next.

First, as shown in FIGS. 9 and 11, the belt is opened.

When the board 14 transported by the edict reaches the top of the table 66, a sensor detects the tip of the board 14, the air cylinder 67 is activated, and the board 14 is lifted from the belt 28 with the table. At this time, air 71
8, 80, and 82 are located at a lower position than the belt A as seen in FIG. 3, so there is no problem in conveying the board 14. Further, there is a slight gap between the sockets 16 (only two shown) on the boat 914 and the stoppers 70 and 72.

Next, as shown in FIG.
is activated, and the socket 16 is connected to the stoppers 70 and 72.
Move 14.

Next, as shown in FIG. 11, the air cylinder 78 is actuated to raise the two air cylinders 80 and 82 to the position of the board 14. Finally two air cylinders (equipment)
, 82 are activated to press the rear end of the boat 914 as shown in FIG. 8, and the front socket 16 fits into the notch 72a of the stopper 72, completing the positioning of the boat 914. In this fixed state, the IC 10 is inserted into each socket 16 of the board 14.

FIG. 12 shows an enlarged view of the IC gripping device 84. This IC gripping device path is provided with a pair of claws 86 and 88, both of which have rods (a) passing through them. An air cylinder 92 is connected to one end of the Loch hood, and the air cylinder 92 is attached to a bracket 94. Moreover, in the middle part of the bracket 94, there is a ``Stotsuno!''! !
% protrudes downward, and this stopper 96 plays the role of stopping the pawl at a certain position when it is activated.

Therefore, when the air cylinder 92 is activated, the claws 86 and 88
approaches along the rod, but the pawls always stop at a fixed position, and the pawl 86's stopping position changes depending on the size of IC10. Therefore, even if the size of the IC 10 or the socket position of the boat 914 changes, if the program is set based on the stop position between the claws, the IC gripping device path can be accurately moved onto the socket 16 of the boat 14. can do.

Furthermore, since a plurality of claws 862 of the rc gripping device 84 are provided in parallel in the lateral direction, as can be seen from FIG.
ICs 10 outside the rows of sockets 16 can be inserted at once.

Further, the IC gripping device 84 is provided with an air cylinder 96 (FIG. 12) that moves up and down, and a suppression plate 100 that extends in the lateral direction is connected to the tip of the cylinder rod 98.

This suppression plate 100 comes into contact with the upper surface of the IC 10 to prevent it from floating when the claws 86 and 88 grip the IC 10, and finally, by the operation of the air cylinder 96, as shown in FIG. It serves to insert the IC 10 into the socket 16.

Note that the IC gripping device 84 itself is movable in the vertical direction and the front-back direction, as shown in FIG. This movable structure is
Since this can be achieved using known techniques such as rack and pinion, air cylinder, etc., the explanation will be omitted.

The IC gripping device path configured as described above operates as follows.

First, as shown in FIG. 3, the IC gripping device path moves backward (to the left in the drawing) and
C10 is gripped by claws 86 and 88. In this state I
The C gripping device moves to above the socket 16 in the front row of the boat 014, which is positioned on the table 66. This is the state shown in FIGS. 12 and 15.

Then, as shown in FIG. 13, the claws 86 and 88 are opened to allow each r c 10 to fall into the socket 16. r
The tip of the terminal 12 of the CLO is thinner (see Figure 1), and each hole 17 in the socket 16 (see Figure 2) is thicker. Push it in a little. Finally, the air cylinder % is actuated and the push plate 100 pushes the IC 10 completely into the socket 16 as shown in FIG. At this time, the table 66 supports the pressing force from below.

At this point, the next IC 10 is waiting on the rail 36. The IC gripping device 84 holds these ICs in the same manner as described above.
Grip C10 again and insert each IC into the socket 16 in the second row.
Push in 10. Since #14 is fixed at a predetermined position, the amount of movement of the IC gripping device is - row, row 2, etc.
It gradually becomes smaller as you go. Each amount of movement may be programmed in advance and controlled by a micro combinator.

Board 1 with IC10 inserted in all sockets 16
4, the table mark is lowered by the air cylinder 67,
As shown in FIG. 3, it is again conveyed to the rack 102 by R. 28. After releasing the board 14, the air cylinder holder 82 is lowered by the air cylinder 78. Although not shown, an arm for feeding the boat 914 into the rack 102 is provided near the end of the bolt 28.

Inside the rack 102, like the rack 20, there is a support stand 104.
and an air cylinder 106 for moving it up and down. Therefore, one board 14 is connected to the rack 10.
Each time the boards 14 are fed into the board 2, the air cylinder 106 is operated to lower the support stand 104, and each board 14 is stacked on the support stand 104. In addition, a guide 90'' 108 extending vertically is provided in the rack 102 so as to smoothly accumulate the balls 14.

In this way, the rack 20 and the rack 102 have the same structure, but the air cylinder 24 moves up one step at a time, and the air cylinder 106 moves down one step at a time.

These boards 14 are transported to a furnace and subjected to an aging test.

〔Effect of the invention〕

As stated in the paper, according to the IC insertion method of the present invention, the IC is first dropped into the socket and then pushed into the socket.
Even if each terminal of the IC and each small hole of the socket are not precisely aligned, the two can be reliably matched.

[Brief Description of the Drawings] Figure 1 is a perspective view of a DIP type IC, Figure 2 is a perspective view of a board with a socket, Figure 3 is a simplified side view of an IC insertion device,
Fig. 4 is a plan view of the RC transport mechanism, Fig. 5 is a side view thereof,
Fig. 6 is a perspective view of the adjustment block, Fig. 7 is a perspective view of the IC magazine, Fig. 8 is a plan view of the board positioning mechanism, and Fig. 9 is a perspective view of the adjustment block.
10 is a plan view showing the operating state of the board positioning mechanism, FIG. 11 is a side view showing the raising operation of the air cylinder, FIG. 12 is an enlarged side view of the IC gripping device, and FIGS. 13 and 14. 15 is an enlarged side view showing the operating state of the IC gripping device, and FIG. 15 is a simplified front view of the RC gripping device. 10-.IMP type IC12...Terminal 14...Boat 916...Socket 17--Small hole 18C insertion device 32...IC transport mechanism 65...Board positioning mechanism 84...IC gripping device 86.88・Claw 92,
96...Air cylinder 100...Suppression plate Patent applicant Dai Co., Ltd.) - Figure 9 bb

Claims (1)

[Claims] A method for automatically inserting a large number of ICs into each socket of a board for aging inspection of ICs, the method includes the steps of dropping the ICs into the sockets of the board, and inserting the ICs in the sockets.
A method for inserting an IC into an aging board socket, which comprises the step of completely inserting the IC terminal into the small hole in the socket by pressing C from above.