JPS6269174A - Ic inserting device for aging board - Google Patents

Abstract

PURPOSE:To simultaneously and exactly insert ICs to each socket by sliding down the ICs from plural inclined rails, and aligning the ICs at prescribed positions by a stopper. CONSTITUTION:An IC 20 in a magazine drops down along an inclined rail 36, the head IC 10 collides with an air cylinder 44 and stops, and subsequently, when a cylinder 42 descends and 44 ascends, only the head IC slides down, collides with a stopper pin 48 and stops. The next IC 10 stopped by the cylinder 42 stops temporarily at the position of the cylinder 44, when the cylinder 42 ascends and 44 descends, and subsequently, when the cylinder 42 descends, 44 ascends, and the pin 48 ascends, the next IC 10 collides with the pin 48 and stops. Thereafter, the same action is repeated, and each IC is aligned at the prescribed position. Subsequently, when a worker inserts a board 14 along a guide 58, the socket 16 of the board 14 corresponds to each IC 10. In this state, a holding plate 70 is shifted horizontally by turning on a prescribed switch, the socket 16 and the IC 10 are fitted lightly by operating air cylinders 62, 64, and thereafter, when air cylinders 50 are operated all together, the IC 10 is pushed entirely into the socket 16.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to an IC insertion device into an aging board, which is used for inserting a large number of ICs into a board for aging boards.

[Prior art]

Today, the demand for ICs has increased dramatically, and for this reason, manufacturers are mass producing ICs by automating their production lines. On the other hand, since some defective products occur among mass-produced ICs, each IC is subjected to heat, humidity, and strength tests.

However, it is inefficient to conduct these inspections over a long period of time, so in reality, adverse conditions are accelerated and processed in a short period of time. Among the accelerated tests, those related to heat and temperature are usually called aging, in which a large number of ICs are inserted into a boat 9 with multiple sockets, heated at 125°C for 72 hours in a furnace, and then a specified characteristic test is conducted. It will be done.

Although the IC inspection process is partially automated, the process of inserting and extracting the IC from each socket on the board is
The current situation is that we still rely on the manual labor of field workers. A plurality of ICFi ICs are stored in advance in a designated magazine, and the worker takes out the ICs one by one from the open end of the magazine and inserts them into each socket on the board, and when removing them, they use a designated jig to pull them out one row at a time. It is now possible to remove the IC. These tasks will become faster once you get used to them, but it is desirable to automate them as much as possible.

The biggest factor that makes automation difficult is that it is necessary to accurately position the IC terminals and the small holes of the socket. If the correspondence between the terminal and the small hole is even slightly out of alignment, the terminal will collide with the socket and bend when the two are fitted together. Furthermore, there are ICs of different sizes and boards with different socket spacing, so this must be taken into consideration when automating the device.

[Object of the Invention] The present invention has been made in view of the above circumstances, and its object is to achieve a number of 1. An object of the present invention is to provide an IC inserting device into an aging board that can reliably insert C into each socket at once.

[Summary of the invention]

In order to achieve the above object, in the present invention, ICs are slid down a plurality of inclined rails, each IC is aligned in a predetermined position by a stopper, and the board installed on the top surface is moved to the IC side to connect the socket and the IC. After a light fit and fit, the restraining means provided on each rail is configured to force all ICs completely into the socket.

[Embodiments of the invention]

FIG. 1 shows the most common IP type (dual inline package type) IC10. As is well known, this IC 10 is formed by connecting a silicon chip 1v and a lead frame and then molding around the periphery. In addition, there are many terminals 1 on both sides of the IC10.
2 are provided in a centipede shape, and these terminals 12 are formed by cutting out the frame portion of the lead frame and then bending it downward.

FIG. 2 shows a board 14 used for thermally accelerated testing, or aging. The board 14 has a flat plate shape and has a large number of sockets 16 arranged in a row on its upper surface. A large number of small holes 17 are provided on both sides of the inner surface of each socket 16.
(only some of which are shown) are drilled, and each terminal 12 of the IC 10 can be inserted into these small holes 17 as shown by arrows.

The board 14 is heated in a predetermined furnace (not shown) while receiving a large amount of ICl,Q.

In addition, predetermined wiring is incorporated inside the board 14, and the characteristics of each IC on the board 14 taken out from the furnace can be inspected at once. A simplified side view of is shown. In this IC insertion device 18, a frame 20 having a skeleton structure has a box shape, and legs 22 and wheels 24 are attached to the lower surface of the frame 20 at four locations. The legs 22 support the entire IC insertion device 18 on a floor 26;
The wheels 24 are for moving the IC insertion device 18.

A board 30 is attached to one end of the frame 20 via a pin 28, and the mouths of a pair of air cylinders 32 are connected to the bottom surface of the board 30 through a pin.

The base end of the air cylinder 32 is pin-coupled within the frame 20. Therefore, the base 30 can be pivoted about the pin as a fulcrum by the operation of the air cylinder 32, and can be folded onto the frame 20 as shown by the imaginary line when the IC insertion device 18 is not in use.

A plurality of groove-shaped rails 36 are laid in parallel on the upper surface of the board 30, as shown in FIGS. 4 and 5, and the IC 10 slides down within these rails 36 by its own weight with the terminals 12 facing upward. It looks like this.

In the middle part of the rail 36, as shown in FIG.
An intermittent feeding mechanism is provided for feeding the sockets one by one to the socket insertion position. This intermittent feeding mechanism 38 is comprised of a bracket 40 arranged in a direction across the entire rail 36, and two air cylinders 42 and 44 supported by this bracket 40. Air cylinders 42, 4
4 are provided in parallel along the longitudinal direction of the rail 36,
In FIG. 5, the air cylinder 44 is connected to the IC1 inside the rail 36.
0 is stopped at this position.

Therefore, the air cylinder 42 is lowered, and the air cylinder 1
If 4 rises, only one IC10 is sent out. At this time, the air cylinder 42 presses the ventral surface of the IC 10.

In addition, on the upper surface of the rail 36 on the upstream side of the intermittent feed mechanism 38,
A holding plate 46 is provided for each rail. This holding plate 46 is for preventing the IC 10 from floating upward due to impact when it continuously falls to the air cylinder I.

Near the end of the rail 36, a plurality of stopper pins 48 and air cylinders 50 are alternately arranged along the longitudinal direction. The stopper pin 48 and the air cylinder 50 are attached to one block 52 and can penetrate the rail 36 and protrude to the upper surface of the rail.

Further, the block 52 is screwed to the lower surface of the rail 36, and by loosening the screw (not shown), the block 52 can be attached to the rail 36.
It is adjustable in the longitudinal direction.

The stopper pins 48 are designed to sequentially protrude from below in order to stop the IC 10 fed from the intermittent feeding mechanism at this position. In addition, the air cylinder 50
acts to push the ICs 10 aligned on each stopper bin 48 upward and into each socket 16 of the bow Y 14.

As can be seen from FIG. 3, the IC insertion position is covered with a cover 8, and the insertion opening 5 of the board 14 is located on the side of the cover.
6 is formed. Further, guys V58 are provided on both sides of the inner surface of the insertion section 14 to guide and support both sides of the board 14.

As shown in FIGS. 3 and 4, support plate markings 1-'14 are arranged on the inner surface of the cover space, and both ends of the support plate ω are connected to the respective rods rs and 6s of the air cylinders 62 and 64. has been done. A band-shaped holding plate 70 along the rail 36 is provided inside the support plate mark, and this holding plate 70, like the above-mentioned holding plate 46,
Prevents 0 from floating up due to inertia. Further, although not shown, the holding plate 70 momentarily moves laterally just before the support plate mark or the air cylinder 50 is activated, so that it does not interfere with the insertion of the IC 10 into the socket.

Note that the IC insertion device 1 is
If the falling speed of the IC 10 is properly set by adjusting the inclination angle of the IC 10, the impact between the IC 10 and the stopper pin 48 can be reduced. Therefore, the holding plate 70 that prevents the IC 10 from floating is not necessarily required.

ICl0 used in the IC insertion device 18 of this embodiment is:
As shown in FIG. 6, it is housed in a curtain rail-shaped magazine 72, both ends of which are closed with padding 74.

The IC insertion device 18 configured as described above operates according to the following sequence.

First, the filler 74 is removed from one end of the magazine 72 shown in FIG. 6, and the magazine 72 is connected to the starting end of each rail 36. Now, the IC10 in the magazine 72 is connected to the rail 36.
As shown in Figure 5, the leading IC10
collides with the air cylinder material and stops. At this time, if the magazine 72 is set to have a larger inclination than the rail 36,
The fall of IC10 is ensured.

Therefore, each rail 36 is full of rcio.

At this time, each stop below the rail 36 /! : Pin 48 has not yet protruded.

Next, when the air cylinder 42 is lowered and the air cylinder 44 is raised, only the ICIQ at the tip slides down.

At the same time, the stopper pin 48 at the lowest position
As it protrudes upward, the IC 10 collides with the stopper bin and stops.

On the other hand, when the air cylinder 42 holding the next I C10 rises and the air cylinder material descends, the intermittent feed mechanism 3
8 is again in the state shown in FIG.

Here, at the same time as the air cylinder 42 is lowered and the air cylinder I is raised, the second stopper pin from the bottom is raised. Therefore, the next IC10 is stock/-? pin 4
It collides with 8 and stops, and the above operation is repeated from then on.
C10 is aligned at a predetermined position.

Next, when the worker inserts the empty board 14 upside down from the insertion opening opening along the guy Yw (Fig. 3), the board r1
Each of the four sockets 16 corresponds to an IC 10 on the stopper pin 48 as shown in FIG.

Here, when the worker turns on a predetermined switch, the presser plate 7
0 is momentarily shifted laterally and the air cylinder 62
, 64 are actuated, the bow)-14 moves in the approaching direction together with the support plate ω as shown in FIG.
10 will fit lightly. The terminal 12 of the IC10 is the first
As can be seen from the figure, the tip is tapered, and the small hole 17 (FIG. 2) of the socket 16 is formed to be thicker than the diameter of the terminal 12. Therefore, when the socket 16 and the IC 10 are lightly fitted together as shown in FIG.
2 is slightly inserted into the small hole 17 by the wedge action.

Finally, the air cylinders 50 on the rail 36 side operate all at once, and as shown in FIG.
completely pushed into. All that is left to do is for the worker to take out the boat 9 from the insertion slot. The boat 914 into which the IC 10 has been inserted is transported to a predetermined furnace and subjected to an aging test.

Intermittent feed mechanism 38, stock/ξ bin 48, presser plate 70,
The air cylinders 62, 64 and the air cylinder 50 are operated continuously and in a short period of time under microcomputer control.

In the process of inserting ICl0, the terminals 12 are guided to each small hole 17 by movement between the support plates in the first stage, so even if the corresponding positions of the two are slightly deviated, it is corrected at this stage.

Therefore, unlike when the IC 10 is pushed into the socket 16 from the beginning, a mistake such as a part of the terminal 12 failing to enter the small hole 17 and being bent does not occur.

When inserting ICs of different sizes into the board, the cover holder of the IC insertion device 18 may be opened and the position of each block 52 under the rail 36 may be adjusted. Although not shown, since a long hole is formed in the rail 36, by loosening the screw that fixes the block 52, the block position can be changed together with the stopper pin 48 and the air cylinder 50.

In the above embodiment, an air cylinder is used as a driving means for each part, but it is also possible to use a solenoid V1 motor or the like.

〔Effect of the invention〕

As described in the paper, according to the IC insertion device of the present invention, it is possible to reliably insert a large number of ICs into each socket of the aging board 9.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing a DIP type IC, Fig. 2 is a perspective view of the aging boat 9, Fig. 3 is a simplified side view of the IC insertion device, Fig. 4 is a plan view of the RC insertion part, Fig. 5 The diagram is an IC
An enlarged side view of the inside of the insertion device, Fig. 6 is a perspective view of the magazine in which ICs are stored, and Figs. 7 and 8 are illustrations of ICs being inserted into the board.
It is an enlarged side view showing the insertion process. 10...IC12...Terminal 14...Aging boat 916...Socket 17...Small hole 18...
・IC insertion device 30...board 36...rail 3
8...Intermittent feed mechanism 42.44...Air cylinder 48
...Stopper pin 50...Air cylinder ω・-
Support plates 62, 64, air cylinder 72...Magazine patent applicant Guito-ka Co., Ltd., Gokawa

Claims (5)

[Claims] (1) A board installed at an angle, a plurality of parallel rails laid on this board and on which each IC from the magazine slides down with the terminals facing upward, and a predetermined number of ICs in the rails arranged on the rails. an intermittent feeding mechanism that feeds the ICs from the intermittent feeding mechanism to a position corresponding to the socket of the rail, a stopper that is provided at the socket corresponding position of the rail and sequentially stops the ICs from the intermittent feeding mechanism at a predetermined position, and a board supporting means installed on the opposing surface of the rail. A device for inserting an IC into an aging board, comprising: a board moving means for slightly fitting each socket of the board into each IC; and a pressing means provided at a position corresponding to the socket on each rail for inserting the IC into the socket. (2) The device for inserting an IC into an aging board according to claim 1, wherein the board is foldable to a horizontal position. (3) The device for inserting an IC into an aging board according to claim (1), wherein the intermittent feeding mechanism is two air cylinders that expand and contract alternately. (4) The device for inserting an IC into an aging board according to claim (1), wherein the stopper is a pin that can protrude from the front end of the IC. (5) Claim No. 1, wherein the pressing means is an air cylinder that penetrates the rail and moves the IC upward.
The device for inserting an IC into an aging board as described in 2.