JPS5923423Y2 - Detection and exclusion device for IC with bent leads - Google Patents

Description

[Detailed description of the invention] This invention is an IC inspection device that has a chute (runway) that transports a large number of aligned ICs (elements) at high speed while maintaining alignment in the IC (semiconductor integrated circuit) manufacturing process. Alternatively, the present invention relates to a device that detects and eliminates an IC with a bent lead (output terminal fitting) in a device that handles IC elements (hereinafter referred to as IC) such as a printing machine.

Equipment that handles DIP (dual in-line package) ICs handles ICs with bent leads due to, for example, chutes for transporting ICs on rails, measurement terminals for measuring the electrical characteristics of ICs, and IC storage magazines. If this occurs, not only will the machine be unable to operate normally, but it will also take a lot of time and effort to repair the leads of the ICs that are stuck one by one or to remove the ICs that cannot be repaired.

For parts such as ICs that require mass production, this waste of manpower and time is a huge loss.

SUMMARY OF THE INVENTION An object of the present invention is to provide a device that detects an IC whose leads are bent in a range inappropriate for the device at the beginning of the chute and automatically discharges the IC from the chute.

Conventionally, there was no device like the present invention that automatically eliminates ICs with bent leads.

Therefore, the IC contained in the magazine that stores the IC
C is all sent into the chute and the lead bends I
If the IC gets caught in the sinito or other mechanical parts, the operator or other supervisor uses appropriate tools such as tweezers or needles to pull out the IC and insert it into the defective IC installed in the middle of the chute. It was necessary to move the material to a certain point and then discharge it out of the chute, which inevitably lowered the operating rate of the manufacturing equipment.

The present invention will be explained below using an apparatus implementing the present invention.

FIG. 1 is a perspective view of an example of a DIP type IC inspection device.

An example of IC testing equipment is generally shown in Figure 2. IP type IC devices are generally supplied one by one to the measuring section (3 in Figure 1), and the measuring section 3 automatically tests the operation of the IC elements. It has the function of determining the quality of IC elements and sorting them into non-defective products and defective products.

Therefore, an overview of this IC testing device will be explained.

In FIG. 1, numeral 1 indicates a magazine stock section and a loader section.

The magazine stock section stores and stacks a large number of magazines containing ICs to be inspected, and the loader section takes out one magazine from the magazine stock section and supplies the ICs in the magazine to the transport chute. It consists of a connecting mechanism section.

In addition, 2 is an individualization mechanism unit which individualizes the ICs continuously sent from 1 through a chute one by one and sends them to the measurement unit 3. 4 is a sorting unit, and 5 and 6 are storage units. In the IC inspection device shown in FIG. 1, the ICs in the magazine are supplied one by one to the measuring section, and in the measuring section, the ICs are inserted into the IC sockets, put into an operating state, and subjected to an operation test. Based on the results, the ICs are sent to the sorting section 4. The sorted items are stored in either storage magazines 5 or 6 installed at the bottom.

Here, the loader section 19, the individualizing section 2, the measuring section 35, the sorting section 4, and the storage magazine 5 or 6 are connected to each other by a chute, and in particular, the sorting section 4 is connected to a large number of chutes connected to the storage magazine. IC sent from 3
It is a switching chute to distribute the.

Further, a chute having a curved portion is used between the sorting section 4 and the storage magazine due to the positional relationship, so that the ICs are fed through the chute while straddling chute rails as shown in FIG.

It is inevitable that some of the ICs to be inspected will have bent leads due to accidents during the manufacturing process, as shown in an example in FIG.

In FIG. 4, a is an example of the lead bending inward, and b is an example of the lead bending outward.

Such lead-bent ICs often do not insert properly into the IC socket or get caught in the switching section or curved section of the chute.

The present invention provides a device for detecting and eliminating these ICs with bent leads, and will be described in detail below.

FIG. 5 is a perspective view showing the principle of construction of a detection/exclusion device embodying the present invention.

In this figure, 7 indicates a connection chute with the individualization mechanism section 2 of FIG. 1, and 8 indicates a connection chute with the measurement section 3.

Reference numeral 9 denotes a slider stand or a substrate which can be slid by a cylinder 10 in both directions perpendicular to the chute using a guide 11 as a guide.

Reference numerals 12 to 16 are mounted on the slider stand 9 to form a slider section, and 12 and 13 are chute rail pieces on which the IC slides on the upper surface as shown in FIG.

Parts a and b surrounded by broken lines are called gates, and have (chevron-shaped) protrusions on both sides of a part of the chute rail piece, and blocks 14, 15.1 mounted on the slider base opposite to these protrusions.
The width between the opposing protrusions of blocks 14, 15, and 16 is W, and the width between the protrusions on the upper surface of each chute rail piece is V.

Now let W be the allowable dimension of the outer gap of the IC leads,
Also, if ■ is taken as the allowable dimension for the inner gap of the leads, if the individualized IC leads sent from chute 7 are bent beyond this allowable dimension, the IC will stop at the gate a part of the chute rail piece. However, at the position where this IC stops, an optical system detector is provided, for example, which can optically detect whether or not an object remains for a certain period of time or longer.

Such a detector can be easily realized by attaching a sensor 17 using a phototransistor or the like to a cover 18 or the like provided directly above the chute rail piece, as is well known, so a detailed explanation will be omitted.

Sensor 17 stops the IC for a certain period of time or more (gets stuck)
When this is detected, the operation of the individualization unit 2 is stopped by the control output of the control unit which inputs the output of a sensor (not shown in the figure), and the cylinder 10 attached to the slider stand 9 is operated. In the example, the chute rail piece 12 that connected between chutes 7 and 8 is slid forward in the figure, and the slider base 9 is moved so that the chute rail piece 13 moves to the position in front of the chute rail piece 12, and then stopped. let

When the operation of the cylinder 10 is completed, the individualization mechanism section 2 resumes its operation and starts supplying new IC elements to the measurement section.

On the other hand, for the lead bending IC that is stopped at part (a) of the chute rail piece 12, the moment the slider holder 9 stops moving, the cylinder 19 installed corresponding to the stop position of the chute rail piece 12 operates. The IC is pushed upward from the bottom using a lever and the lead is bent.The IC is then transferred to the IC storage box 20 and stored therein.

Also, when the chute rail piece is switched like this, if the lead bending IC stops at part b, sensor 1
Upon detection of 7, the cylinder 10 starts operating again, slides the slider 9 toward the front in the figure until the chute rail piece 12 connects to the chutes 7 and 8, and then stops.

The IC with bent leads is removed by operating a cylinder 21 similar to the cylinder 19 and transferring it to the IC storage box 22 with bent leads.

In this manner, lead bent ICs can be detected and eliminated without substantially stopping the flow within the apparatus shown in FIG.

Note that the driving cylinders 19 and 21 in FIG. 5 only show an outline of their shapes and do not show their actual mounting positions or driving directions.

As is clear from the above explanation, it is possible to automatically eliminate the hooking of lead bent ICs (devices) in the measurement section and chute, which are the most likely to cause accidents, in the IC inspection device as shown in Fig. 1 in which the present invention is implemented. This eliminates the waste of time and effort required to stop operation and take out the IC or correct lead bends one by one due to the lead bending IC getting caught, and greatly improves the operating time of the device. Can be done.

Furthermore, the device of the present invention, which has the function of eliminating ICs with bent leads, is not only used in the measurement section, but can also be used as a device to prevent ICs with bent leads from entering any process of IC manufacturing equipment. .

[Brief explanation of drawings]

FIG. 1 is a structural perspective view of an example of an IC inspection device implementing the present invention, FIG. 2 is an external perspective view of an example of an IC (element),
FIG. 3 is a sectional view showing an IC in the chute, FIG. 4 is a perspective external view showing an example of a lead bending IC, and FIG. 5 is a side view of the basic configuration of the device of the present invention. 1...Magazine stock and loader, 2...
...Individuation mechanism section, 3...Measurement section, 4...
... Sorting section, 5, 6... Storage section, 7.8...
...Shoot, 9...Slider (stand), 10
,19゜21...Cylinder, 11...
Guide, 12, 13... Chute rail piece, a
, l) ・---Gate (projection) part, 14,1
5゜16...Slider block, 17...
...Photoelectric conversion sensor, 18...Cover, 20,
22...Lead bending IC storage box.

Claims (1)

[Scope of utility model registration request] DIP type IC transported over a chute rail
(Integrated circuit) As a device to detect and eliminate lead bends of devices that are outside of a certain standard, a chute rail is inserted by cutting a part of the chute, this rail is placed on it, and the chute is moved a certain distance in both directions perpendicular to this rail. a possible slider stand and another one placed on this stand and parallel to and spaced apart from the chute rail by a sliding distance in one direction of the slider holder;
The chute rail piece of the book and the chute rail piece are made up of three blocks arranged in parallel with the chute rail piece at a constant distance between these two chute rail pieces and outside the chute rail piece, and each chute rail piece and At one opposing location of the block, there is a slider section with a gate consisting of a protrusion set to the allowable values of the outer and inner distances of the IC leads, and the presence of a lead-curved IC element at the gate. A detection control circuit that generates a control output when the IC element is detected; and a detection control circuit that uses the control output to move the slide table on which the IC element is located toward the outside of the chute to align the parallel chute piece with the chute rail, and to 1. A detection and removal device for ICs with bent leads, characterized by comprising a drive system that repeatedly removes a certain IC element and discharges it out of a slider section.