JPS60121745A - Method and device for removing ic package from socket - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] (Industrial Application Field) This invention relates to an automated device for handling electronic circuit components,
In particular, it relates to automated equipment for the burn-in of electronic circuit components before they are placed on sale and use.

More specifically, the present invention provides an electronic integrated circuit package (
The present invention relates to a technique for automatically unloading an IC package (IC package) from a socket of a printed circuit board (PC board) and simultaneously classifying the IC package according to a predetermined performance grade.

(Prior Art) Currently, in the industry, IC packages are not only produced in agriculture, but also I! ′? They are integrated into electrical circuits used in complex and expensive equipment. Just as many crystals from Nagisa are damaged, breakdowns are inevitable for IC packages as well. In most cases, failure occurs within the first 101,000 hours of use. Since the equipment to which such an IC package is mounted is complex, failures after the IC package is mounted must be avoided as much as possible. For example, if a failure is not discovered, i! If a malfunction is discovered during the final inspection of the equipment, testing and repair require extensive testing and repair, resulting in increased production costs. Furthermore, if the equipment fails while installed in the field, it will require a reliable repair by a service technician, incurring additional costs and having a significant impact on profits. As a result, electrical equipment manufacturers are demanding high reliability and quality from commercially available IC packages.

If you remove IC packages that may break down within a few hours of use before installing them into electrical equipment, you can save time.
The quality J5 and reliability of C parts are improved. One of the most effective methods for detecting defective IC packages is burn-in. During burn-in testing, this I
The physical and chemical stress on the C package is its tolerance v! Added within. This Death Nyoζ,
I installed it in the device and it is expected that it will malfunction soon.
C package is discovered.

The burn-in procedure is as follows. First, one or more PC boards (burn-in boards) [,
'Array cover C package. Second, this burn-in board with the IC packages arranged in it is placed in a chamber with controlled atmospheric conditions (especially temperature). 'Jru. Third, apply DC bias or rated pulses to each IC package on each burn-in board. In this case, forward and reverse DC bias is possible. added and also
The DC bias, pulse signal and load are applied almost simultaneously. Fourth, the IC package is placed under certain atmospheric conditions and after the DC bias, pulse signal and load are applied for a certain period of time. Then, take out the burn-in board from the dilemma bar.Finally, remove the IC package from the taken-out burn-in board.

Burn-in d3 Konatsu IC add ICC back product T
Another way to ensure control is to ensure that the IC package performs to its minimum rated specifications. Typically, each IC package is tested over a wide range of parameters. IC packages are then classified according to predetermined performance grades.

However, although burn-in testing reduces equipment failure and thus saves repair costs, it does not eliminate the cost of burn-in. The main costs required for burn-in are the burn-in chamber,
Costs for purchasing and installing burn-in boards and dest equipment. - It is necessary to train operators to operate the equipment and monitor each rod, which is time consuming.

In either case, the main focus is on performing the burn-in perfectly. The operational profitability of performing burn-in dest depends on the cost required for burn-in,
If an IC package is installed in a device without burn-in, and the IC package fails, the cost required to replace it is determined by:

One means to reduce burn-in investment costs is to reduce human f1 costs. Accordingly, various efforts have been made to enable or automate the aforementioned steps. Currently, several companies are manufacturing machines that load IC packages into socket 1 of burn-in boards.31For example, 1
A machine of this type is disclosed in U.S. Pat. Machines are also being manufactured that can unload IC packages from burn-in board sockets.

The assignee of this application uses the same name in advertising pamphlets, etc., but the burn-in board equipment Anne L21-
We are manufacturing the Da 1217 model. The burn-in board to be unloaded will have -i-
The patient is positioned on a ramp in a horizontal position, aligned with a flat-shaped lift rod. Each lift rod consists of a ramp-shaped middle part whose height gradually decreases and an upper tube. This socket 71~ [1 is pushed into the vertical groove formed in the socket 1~ and approaches the back side of each IC packagel)
J, the sea urchin is turning. As the lift rod moves along the longitudinal groove (and touches the back side of the column of IC packages), the IC packages are lifted one by one from the socket and transported by gravity along the rear tube to the plastic receiving tube. 1, by 1,000 IJJ, the entire burn-in board is moved along the column of the IC package to several riffs 1 at the same time. loaded.

To the applicant's knowledge, IDEA, Inc. (IDEA, In
C,) manufactures an automatic burn-in board unloader, and according to this ID E All, a hook device is inserted between the socket L- and the IC back 2, and the same hook is installed on the surface. Remove the IC packages one row at a time from the socket by moving them at right angles from the burn-in board and pulling the IC packages out of the socket.
There is. Next, the IC package is hooked by heavy horns.
Transferred from AE to Plus Deck's storage tube.

After the burn-in process has been completed (assuming, of course, that a burn-in process has been performed), a platform scale apparatus is available to perform the above-described testing and sorting on the IC packages. U.S. Patent Publications Nos. 3,587,852, 3,664,499, 3,727,757 and 3,896
No. 935 discloses an IC package automatic test/sorter device. Generally speaking, IC packages are sequentially transferred from a plastic housing to a conveyor system, and one after another to a test device. When the test is completed, the IC packages are stored in containers according to the test results.

(Problems to be Solved by the Invention) As mentioned above, automated equipment is used to load IC packages onto burn-in boards, burn-in IC packages, load burn-in boards, and In order to improve the efficiency of the aforementioned quality control program, I
Equipment has been developed to simultaneously test IC packages as they burn in, eliminating the need for separate test equipment. However, when IC packages must be further sorted by grade, Since IC packages are manually sorted according to a predetermined grade, even if burn-in and test processes are combined to improve efficiency, the efficiency will be lost.

It will therefore be appreciated that in a quality control program, maximum efficiency can be achieved by using automated equipment that can unload and sort burn-in boards according to predetermined performance grades.

(Means for Solving the Problems) According to the automated unloader/sorter device according to the present invention, [C-package] can be unloaded quickly and efficiently. At the same time, IC
Package sorting is also accomplished by unloading IC packages of the same performance grade one after another in each column.

The burn-in board of the unloader/sorter equipment is provided with two passageways for each socket 1~ extending through the burn-in board and the tracks.
It is possible to get close to the back side of the IC package inside.

In addition, the unloader/sorter device is equipped with a table that supports the burn-in board, an extrusion mechanism for extruding IC packages from the sockets 1 to 1, and a beam mechanism for hanging the ejected IC packages from the sockets 1 to 1. It is being

Since the table supporting and covering the burn-in board has an inclined structure, the IC package is easily transferred from the burn-in board to the beam mechanism by gravity. Further, the table is provided with a mechanism for locking the burn-in board and a plurality of grooves along the inclined surface of the table. The burn-in board is attached to the daple upside down with each column to the socket 1 aligned with the groove in the daple.

The extrusion m 84 consists of a plurality of fluid-driven cylinders connected to each burn-in board and an extension mechanism that is inserted through the passageway of the socket. Each cylinder is called an unloader channel and is arranged in a plurality of columns, each of which corresponds to a performance grade of the IC package. Each unloader channel is positioned so that the burn-in board can pass directly beneath it, so that each socket is aligned with the unloader channel on a column-by-column basis.

Additionally, the unloader/sorter device provides a mechanism for moving the burn-inboard table relative to the unloading gate 11. Therefore, each column of sockets 1 to 1 of the burn-in board passes under each unrouted groove 11 one after another.

Each unlogged channel selectively pushes out from each socket underneath it an IC package with the performance grade assigned to the individual unlogged channel. unloaded from the socket.

When the IC package is removed from the socket 1~, it falls into the corresponding groove in the table and slides into the collection mechanism. The collection mechanism consists of plastic IC packages and storage tubes arranged in a plurality of storage racks, and is detachably installed within the storage frame. The accommodation rack accommodates the accommodation duplexes aligned in a column shape. The storage rack can be removed from the storage frame in the comparison fishing section 11 and replaced. Each enclosure has one f receiving frame aligned under the 1-double flannel. The IC package is transferred from the burn-in board deple to a receiving duplex waiting at the end of the deple. When the storage cube becomes full, the corresponding storage frame moves forward and empty storage cube:L
-Place the bulb in position.

In addition, the unloader/sorter device has a mechanism for verifying whether the unloader/two culms are operating correctly. Slipping down the ditch 13
A mechanism is provided for counting the number of IC packages that have been unloaded and comparing the number of IC packages that have been unloaded with the number of IC packages that have been attempted to be unloaded.

Further, a mechanism is provided in each unloader channel to check whether or not there is an IC package in the socket. This ensures that the integrity of the unloading and sorting process is always accurate.

Other features and advantages of the invention will be readily apparent to those skilled in the art upon reading the following description.

(Example) Next, one embodiment of the present invention will be described with reference to the drawings.

With the demand for reliable quality control in the manufacture of integrated circuit (IC) packages, burn-in boards are
Load the C package, unload the same burn-in board, inspect the IC package, and check the IC package according to its performance.
Various automated devices for sorting into the above grades have been developed. Multiple ICs mounted on the burn-in board to improve efficiency throughout the quality control process
An apparatus has been developed that burns in C packages and simultaneously inspects IC packages. As IC packages are inspected, they are graded according to their performance, and the data generated is stored for later use in sorting process packages according to grade.

The present invention provides a method and apparatus for unloading burn-in boards and simultaneously sorting IC packages into grades at a relatively high speed. Therefore, when the present invention is used in conjunction with a single burn-in/destination device as described above, there is no need for separate testers and sorters, which are typically very complicated and expensive. Apart from saving on equipment and maintenance costs, the elimination of the need for separate tester/sorter equipment greatly improves the quality control process.
Will be uploaded.

Overview of the system 1 In Figure 1, the unloader/sorter S4 position 2 shown
0 is the welded metal frame 22 and the L of the frame 22.
A control unit 24 at a corner of the frame 22, a burn-inboard daple 26 slidably supported on each pair of lines within the frame 22, and a plurality of burn-inboard daples 26 arranged below to receive the burn-inboard daple 26. unloader channel 28 and lower frame 2 of this unloader channel 28
A plurality of storage frames 3 are slidably provided at the bottom of 2.
0.

A burn-in board 32 having a plurality of sockets pulled thereon for receiving IC packages is secured in an inverted position to the burn-in board table 26. Each burn-in board 32 is attached to an unloader/sorter device 20, and for each socket, a pair extending from the underside of the burn-in board 32 through the burn-in board 32 and the socket to the underside of the IC package mounted within the socket. With the bar-in-board 32 in the suspended state, the bar-in-board table 26 slides under the unloader channel 28 such that the first column of holes on the bar-in-board 32 and the first unloader channel 2
It is consistent with 8. Each unloader channel 28 has an extending EIS that is interposed in the path of the bar-in-board 32 and the socket to push the IC package out of the socket of the bar-in-board 32 . Furthermore, each unloader channel is associated with a particular performance grade of the IC package. That is, each ICC variable performance grade on the Palin board 32 has IIl? The data is collected and stored during the burn-in operation and the ast f1 operation, and then the control unit 1
-24. As a result, the IC package becomes
The reburn-in board is selectively pushed out into the appropriate unloader channel 28.

Each column on bar-inboard 32 is gradually moved down each unloader channel 28. As the IC package is pushed out of the socket, it falls into a groove in the bar-inboard table 26, and then slides down the table 26 and is transferred to a plastic storage tube in the storage frame 3o. Each accommodation frame 3o also has an unloader channel 2
8, it is associated with a specific performance grade of the IC package, allowing each grade to be housed in separate storage tubes, making the sorting process quick and efficient. A mechanism is also provided to verify that only the correct IC packages are unloaded from the socket by each unloader channel 28 prior to the loading process.

The body of the typical IC package illustrated in this example is generally a parallelepiped. Four to sixty-four leads extend outward and downward from both sides of the main body. The cross section of this lead is generally dog-shaped. Total width of IC package G; L O, 3°0.4. 0.6 inch (
7, 6, 10, 2, 15, 2g++), etc. The burn-in board 32 socket has socket contacts. This socket contact is formed into a slot shape,
The leads of the IC package are inserted into this slot. Some IC packages do not have leads, which are called chips. This chip is square or rectangular and relatively thin, and its physical appearance is wafer-like. Typically, the edges or substantially the entire surface of the chip are selectively coated with conductive coatings. Therefore, when mounting this chip on a circuit board, it is necessary to set its orientation correctly.

An Overview of the Unloader/Soter Apparatus As shown in FIG. 1, the unloader/sorter apparatus 2° is supported within a welded metal frame 22. Sheet metal or other suitable material (not shown) may be used to enclose the frame 22 and protect the equipment therein. The overall box-shaped frame 22 has four wooden upright members 34. a~3
4 d, upper horizontal part U36 connected between these members
There are horizontal parts a to 36d, and horizontal parts 38a to 38d.

The control unit 24 includes a microprocessor and a frame 2.
It is built in a housing located at the upper/r' end of 2.
c. A device 20 having electronic equipment 20 and indicated by arrow 40
It's in front of me. The control unit 24 will be explained in detail in the section on the control unit 'to be described later.

A pair of carriage supports U30a, 50b form an angle of approximately 45° with respect to the horizontal plane, and each rear upright member 3
4d, 34c and extend downwardly toward the lower portions of the front uprights 34a, 34b. Also, in the IC, the pair of cylindrical carriage bars 528, 52b are the carriage support portion U30a,
It extends in the width direction between the bar housings 50b and is attached thereto by the bar housing 54. Further, a positioning screw 56 is rotatably supported by a screw housing 58 between the support parts 4t50a and 50b. Carriage bar 52a, 5
2b provides a guide and support trajectory for the burn-inboard double 26. The positioning screw 56 is attached to the pulley 4
2 and bell 1-44 to an electric motor 46. When the motor 46 is started, the positioning screw 56 rotates, and the bar-inboard table 26 is moved to the carriage bar 5.
28, 52b.

Burn-in Board Table Referring to FIGS. 1-8, the burn-in board table 26 comprises a generally rectangular slab, preferably of non-conductive material such as wood or plastic molding. Carriage bars 52a and 52b are slidably engaged with the lower surface of the burn-in board table 26, and support the bar-in board teal 26 within an inclined surface that slopes downward toward the front portion 50 of the device 20. A plurality of table support machines 1I458 are fixedly shielded. Further, a table fil R1 determining mechanism 60 is provided on the lower surface of the bar-inboard table 26 and is screwed into the positioning screw 56. This positioning mechanism 60 converts the rotational movement of the positioning screw 56 into a linear movement of the bar-inboard table 26 along the carriage bars 52a, 52b.

The bar-inboard table 26 has a plurality of grooves 62, a pair of hinge racks 68a, 68b, grooves 72 provided in each groove 62, and a programming bar 76.
Ru. The groove 62 extends linearly within the top surface of the bar-in-board table 26 from the rear edge to the front edge. The widthwise usage of 62 is determined according to the column spacing of the sockets of the burn-in board 32 and the width of the 10 package cages within those sockets 1-. Each 1f462 has 32 burn-in boards
Above 1. It corresponds to a single column of C package/soku 1-. Furthermore, )h62 forms a passage through which the IC package pushed out from the burn-in board 32 is transferred to the accommodation tube 6/l within the accommodation frame 30 by gravity. A plurality of through holes 142 (one for each socket 130) extend from the base of the 'I 462 to the underside of the burn-in board deple 26. As can be seen in particular in FIG. 8, a plurality of curved base portions 66 define a connecting passageway between groove 62 and receiving tube 64. As shown in FIG.

Optical sensor racks 68a and 68b are burn-in board 3
2, which extends in the width direction of the groove of the burn-in board table 26 and serves as a mechanism for counting the IC packages unloaded from the socket as the IC packages move downward in the groove 62 toward the storage tube 64. It is. The lower sensor rack 68b has a plurality of light sources, e.g.
Upper sensor rack 68a has a plurality of corresponding photoelectric sensors. A plurality of small-diameter through holes 70 formed through the burn-in board table 26 form and cover optical passages between the light source and the photoelectric sensor. In this way, the bulk 62 within the table 32
The IC package passes along the Renri Rack 6.
'i! of the optical path between 8a and 68b! 4 Marked by cutting and opening.

Referring to Figure 1--Figure 8, burn-in board-j
- the tip of the groove 62 in the pull 26 rightwards the gate 72, which groove 1-72 is the cylinder of the pneumatic cylinder 7/I which extends upwardly from the underside of the burn-inboard groove 26;
Consists of shifts. Cylinder 1? The foot extends vertically so that the IC package inserted into the groove 62 does not enter the accommodation dup 64 until the verification process is completed, as will be described in detail in the section on the unloader channel path below.

Once the proper functioning of the loading process has been verified, the gate 72 is retracted and the IC package is placed in the receiving tube 64.
If an error is discovered during the verification process,
One of the next two operations is performed. 1. In other words, the operation of the underloader/sorter device will be stopped until the trouble is resolved, or the IC packages unloaded during the erroneous process will be damaged or damaged for repair. After being transferred to the non-defective storage tube, the verification process continues. In either case, once the error is discovered, that particular IC package will not be transferred to the corresponding storage tube 64.

FIG. 2 is a front view of the unloader/sorter apparatus 20 with the rear (top) burn-in board deple cut away to show the programming par 76. As explained in more detail in the section entitled "Unloader Channel" below, the programming bar 76 has at least one programming bar 76 for accurately positioning the burn-inboard programming bar 26 relative to the unloader channel. Used in conjunction with a light source and photoelectric detector. As shown in FIG.
Attached to the Ei D>'f+ edge, the burn-in board desol 26 can be placed under the unloader channel 28 and moved while the bar 76 is moved between the light source and the detector.

Returning to Figures 1 to 8, burn-in board Desol 2
On the lower surface of the trapezoid 62, there is a step 11j (a light source for a tubular fluorescent lamp fixture 78 and a lamp 80W). It is used in conjunction with equipment within the unloading channel 28 as described.

Also, while the cable 82 connects the control unit 24 to the burn-in board 32 on the burn-in board table 26 through the slot 1 connector 84, the control-1 unit 24 is connected to the burn-in board 32 to be unloaded. can be identified. Additionally, electrical control wiring for the Couple 82tJ cylinder fixture 80, sensor racks 68a, 68b, and pneumatic gate cylinder 74 can be included as needed.

The unloader channel 28 is slidably mounted between the carrier bars 9Qa, b of the carrier bar 9Qa, b as shown in FIG. 1. The carrier bars 90a, b are The burn-in board daple 26 is parallel to and above the plane formed by the burn-in board.
The unloader channel 11 slides under the unloader channel 28 and stays relatively far away from the unloader channel 28.
includes a fixing screw 92, which allows the anchorage 1
The position of the 1 channel 28 and the spacing between these channels are adjusted by sliding along the transport bars 90a, b (4ti).
This is necessary in order to make the sorter assembly 20 compatible with a variety of IC packages on different balloon-inboards 32.

In FIG. 8, a side view of unloader channel 28 is shown. Each of the unloader channels 28.

A basic structure 94 including a removable protective cover is provided.

The burn-in board 32 mounted on the burn-in board table 26 slides into the
It comes right below 8.

FIG. 6 is an enlarged view of a portion of unloader channel 28, with protective cover 96 removed to clearly show the included equipment. Figure 7 shows the direction J of arrow 7 in Figure 6.
This is a perspective view. As shown in FIGS. 6 and 7, the basic structure 94 is made of C-shaped iron material as a whole. This basic structure 94 supports a plurality of knits 100.

One unloader 100 is provided for each socket in the column of the burn-in board 32.

The unit support member 102. It includes a pneumatic cylinder 10/1 and a photoelectric detector 106. The unit support member 102 is C
This part $4102 has a short passage in the shape of d3,
1. By means of a navy blue bolt and its slot 110, the foundation jA
Adjustably fixed to the structure 94.

The pneumatic cylinder 104 is connected to the unit support member 102
is screwed together with the upper extension part 112 extending in the horizontal direction,
Extending generally perpendicularly from the extension. Extension part 112
When the cylinder shaft 11/I is passed through the opening, the cylinder shaft 11/I is straightened, and the lower end of the cylinder shaft 11/I is screwed into the extrusion extension block 116. , the diameter is, for example, 0 from the threaded part at the lower end of the knock 116.
．． Two extruded extensions 118a, b of 15 cm extend downwardly. The lower ends of these extruded extensions 118a, b are the lower extension ffl+ 12 of the unit support member 102.
4 through corresponding through holes 122a, b.

The power of the pneumatic cylinder 104 is
given by fluid entering and exiting at a, b. When the upper port 120a of the cylinder is supplied with, for example, compressed air, the shaft 114 and the extrusion extensions 118a,b are forced downwardly.

The extensions 118a,b extend downwardly to the burn-inboard 32 and have a diameter of 0.17 cm that pulls into the burn-inboard 32 when the burn-inboard driver pull 26 is in the correct position. The IC package 13 passes through the communication holes 126a, b and extends into coaxial through holes 128a, b with a diameter of 0.2 cm in the socket 130.
Reach the bottom of 2 and cover. The further extended portions of the extruded extensions 118a and 118b hold the IC package 132 into the socket 1.
30 and extruded IC package 132.

Corresponding J groove 62 in burn-in board table 26
When the cylinder 104 is supplied with compressed air from the lower inlet/outlet 111120b, the cylinder 104 is supplied with compressed air.

The extrusion extensions 118a,b as well as the syringe 111'l are retracted. .

J leek;・Lower horizontal extension part 1 that goes down to the support part 102
2/I is equipped with a photoelectric detector 106 on each end face. This detector 106 has a photosensitive element h on its lower surface.
140, which is attached below the deple 32 [
The light from the illuminated fluorescent lamp 80 is sensed. A plurality of through holes 14, one corresponding to each socket 130
2 starts from the bottom of the groove 62 and extends to the lower surface of the daple 26.

It is substantially coaxial with through holes 126b and 128b in burn-in board 32 and socket 130, respectively. When the table 26 is properly positioned below the unloader channel 28, the fluorescent lamp 80 is
6. Light passes through corresponding through holes 142, 128b and 126b in empty socket 130 and burn-in board 32, respectively. Therefore, photoelectric detector 106
will give an indication as to whether the IC package is in the corresponding socket 13 or not. Depending on whether light is sensed by photoelectric detector 106.

1 detector 1 where the presence or absence of IC package 132 is taught
06 acts as an electrical switch and sends a signal to the control unit via conductor 1/1/4.

Referring now to FIG. 8, some of the unloader channels 28 have sensors 148 that connect the burn-in board 26 to the unloader channel 2.
8, it is easy to correctly position the position. As mentioned above, table 26 has a programming par 76 along its lower rear edge. As shown in FIG. 2, the programming par 76 has a plurality of teeth 150. What is the spacing between the teeth 150?

When the burn-in board 32 is placed on the table 260, for example, the leading edge 152 is determined so that the socket columns on the burn-in board 32 are aligned in a straight line.

Next, referring to FIG. 2 and FIG.
The programmer 76 is arranged to pass between the two sensors in the sensor 148.

And, this Sen v148 is a programming par 76
The presence of a leading edge 152 on the tooth 150 of d3 is detected. When sensor 148 detects leading edge 152, it sends a signal to control unit 24 indicating that burn-in board table 26 is correctly positioned below channel 28. This sensor 1/18G is taken on the + side of the selected unloader channel 28. There is no need for the unloader channel 28 of the rib C to be provided with a stub 148.

Described here is a double position monitoring system.

As long as l'@150 of programming bar 76 is within the vicinity of one sensor 148, it will operate correctly. However, since the total width of the unloader channel portion of a single device 20 may exceed the width of the burn-in board 32, it may be necessary to use multiple sensors 148.

Therefore, between the two selected unloader channels 28, R
A small number of sensors 142 are arranged at intervals C, and II!
! 115 must always be in the vicinity of at least one pin 1)-148.

As shown in FIG. 10, a pin 148 is secured to the lower rear end of the substructure 9/I of the unloader channel 28. The sensor 148 includes a U-shaped, front extension 154jl,b. Of these, the first extension 154a includes a light emitting diode at position 156 in FIG.

A light beam is projected toward the photosensitive transistor provided at position 15B in the figure in the second extension 154b. 1st
As shown in FIG. 0, the diode transistors are in photoelectric communication and the sensors 148 are aligned with respect to the space between the sets of teeth 150. tooth 15
When the leading edge of 0 is advanced by 152 to break the photoelectric communication between the transistor and the diode, sensor 148 sends an electrical signal to a control unit (designated 24 in FIG. 1) to This tells us that the reference numeral 26 in Figure 1 has come to the correct position below An[1~Daditonel 28, i.e., depending on whether the C ray is present at position 158 in Figure 2.

By being activated or deactivated, this photosensitive transistor is used as an electrical switch to communicate the position of the burn-in board table 26 to the control unit.

The unloader channel part of this J: Uni 9 device is I
It is provided with means for removing the C package from the sockets 1- on the burn-in board, and means for checking the presence or absence of the IC package in the sockets 1-. Additionally, selected ones of the unloader channels 28 activate the sensor 148, which cooperates with the programmer 76 to teach the control unit the position of the burn-inboard table. 1° Receiving Frame The receiving frame of the unloader/sorter device facilitates automatic loading of sorted IC packages into the plastic receiving tube. One housing frame is installed for each unloading channel 11 of the unloader/sorter device. , shown in Figures 8 and 9.
As shown, each housing frame 30 has three members: a movable frame 170 and a movable tube rack 172.
and a housing tube 64. Individual housing tubes 64 are removably mounted within dual rack 172 . The tube rack 172 is connected to the frame 1.
It is installed within 70. Because the tube rack 172 is easily removable within the frame 170, it will delay operation of the unloader/sorter M20 if the tube rack 172 becomes full of IC packages. The tube rack 172 can be replaced easily. The frame 170 is configured to continuously step forward as the storage dups 64 become full, so that each storage dup 64 is filled in turn.

In particular, each tube rack 172 has a support device for supporting a plurality of (for example, 20) storage dups 64 spaced apart from each other in an inclined manner in the longitudinal direction of the tube rack 172. The tube rack 172 has, for example, an individual holding section (not shown) that engages with the storage duplex 64.
For each frame 170, at least a black 172 is provided, and then an empty storage tube 64 is installed. It is difficult to exchange inside.

Frame 170 is −(
It is a skeletal frame that is movable. This frame 170 controls the position of the frame 170 by a drive and control device for moving the frame 170 along a frame track 174:
Turn the pointing device (more on this later) to the right. A frame made of a skeletal spool allows the base of the
? A channel 176 is formed. In addition, this 1F channel 17
6 is set to the width of the dual black 172 to accommodate the dual black 172. At the upper end of frame 170, a wooden rib member 178 extends horizontally along one side thereof. Since there is no rib member along one side of the upper end of the frame 170, the tube rack 172 can be easily attached and detached. The frame 170 further includes a cross report 18
At least one 0 is attached. The cross report 180 engages the tube rack 172 to hold it against the rib member 178.

A tube rack 172 is seated within the front end of frame 170. Further, the rear end of the frame 170 is connected to the frame 1
70. This drive member includes a frame track 174, a frame track 17
a plurality of carriages 18 for slidably engaging each other;
2, air cylinder 184, and air cylinder 18/I
two rack and pinion devices 186 for transmitting the motion f1 of the motor to the frame 170.

The frame track 174 consists of an inverted T-shaped bar inserted between the front lower horizontal member 3'8a of the lower horizontal members of the frame 22 and the lower horizontal part 44F8b of the rear punctuation.

At least two carriages 182 are mounted on the frame 170.
It is adjacent to the r-flank 176 and engages the frame 1-rack 174. One of the carriages 182 is the frame 1.
The neck is thrown at the rear end of 70. Each (l multiple unit 182 consists of a reciprocating housing, two j1 brim [1-ra 188a, b and one lower [1-ra 190 J:]. This reciprocating housing surrounds the frame 1-rack 17/I, These rollers 188a, b, 190 are supported.
The frame track 174 is placed on the opposite cylinders 192a and 192b of the frame track 174, and is set to be able to support the storage frame 30.

On the other hand, it is rotatably supported on a shaft located directly below the frame track 17/I, so that it can engage with the room 1 rack 174 with low friction. Set.

The air cylinder 184 is attached to a cylinder support 194. The cylinder support 194 is mounted between a cross report beam 196 (see FIG. 1) and a first extension lug 198 extending downwardly from the right lower horizontal member 38b (see FIG. 1). Note that the cross rib 1-beam 196 is attached between the front and rear [ζ horizontal members 38a, c, and both horizontal members 38a,
It is somewhat displaced downward from c. Furthermore, the air cylinder 184 has a pair of boats 200a and 200b, and the cylinder shaft 202 is expanded and contracted by pressurized fluid supply DI from the boats.

The outer ends of the cylinder cylinders 11) 1 to 202 are connected to the first gear rack 20, which forms part of the rack and vinyl arrangement 186.
4. This rack nord pin2 A device 18
6 further includes one pinion gear 206
- Includes Yarak 208. The first gear rack 204 includes a pinion gear 206 rotatably supported on a gear rod 210.
engage with. The hair extension 2.10 includes a cross report beam 196 (see FIG. 1) and a second extension 21 extending downward from the lower horizontal member 38b on the right side (see FIG. 1).
It is installed between 2. Further, the first gear 7 rack 204 and the binion gear 206 are continuously engaged by a small C:I rubber pulley 214 supported by the gear A7 rod 210. The second gear rack 208 is
82 is connected to the bottom surface of the carriage 182J.
It extends forward and engages pinion gear A72o6.

In this manner, when the cylinder barrels 1 to 202 are extended to the maximum extent, the receiving frame 3o moves to the rearmost end (see FIG. 8), and the first receiving duplex 64 receives the IC package from the burn-in board table 26. It is set in a position where it can be used. Then, when the cylinder shaft 202 contracts, the accommodation frame 30 gradually moves forward, and the second accommodation tube 64 is set at a position where it can accommodate the IC package.

A position indicating device mounted on the frame 170 is comprised of a center 216 (identical to 1/18) and indicates the position of the burn-inboard table 26.

A center identical to the center 148 is mounted on the light emitting diode 218J5J: and the phototube 220.

This sensor allows light emitting diode A-218 and photocell 2 to
20 is detected.

The frame 170 and the due blank 172 have a through hole 222a facing between each housing tube 64.

b is formed. These through holes 222a and 222b form the above-mentioned optical path, and their center line is indicated by 224 in the figure.

Each through hole 222 is arranged to correspond to one receiving tube 64 within the duplex 172 . For details,
This is the same as J3 described in the section [Unloader/Sorter] based on FIG. 10.

Figure 11 shows the control system 23 of the unloader/sorter device.
0 is a block diagram of 0. The illustrated control unit 24 contains the hardware that is the heart of the control system 230. The control units 1 to 24 are mostic (host
CPU-I Z-80 microb [1 set, including PROM (programmable read-only memory), RAM (random access memory), and input/output board. These are essential members to perform the control function.

Additionally, control unit 24 includes a host of storage media, such as a flexible disk drive or a serial interface to a shared data source. For example, the control unit 24 is connected directly to a serial interface to a burn-in dest device, and a fully loaded burn-in board is connected directly to the burn-in dest device.
- Guided by Da/Sota. The unloader/sorter and burn-in test equipment are also connected to the central processing control system. In the last two examples, information regarding the burn-in board to be unloaded is communicated to the control unit 24 via a serial interface. The most important of this information relates to the performance of each IC package.The external control 11 functions given to the control unit l-2/1 are divided into four categories. namely, table positioning subsystem 232, burn-inboard unloader subsystem 234, sort verification subsystem 236, and storage tube subsystem 23.
There are 4 of 8. Table positioning subsystem 232
The control panel (indicated by 240 in FIG. 1) includes a 5TART button, a limit switch to limit the range of movement of the burn-in board table, and a table position center (point 240) to set the burn-in board to the unloader channel. 10 (indicated at 148 in FIG. 10). The input signal is processed within the controller 24 to operate the positioning screw (indicated by 58 in FIG. 1) and to operate the burn-in board table.
The output signal to be transmitted to the cth motor (indicated by 46 in FIG. 1) is determined.

The burn-in board unloader system 7 23/1 signals that the burn-in board table is set in the proper position below the ant 1-dub t-tall, and each unloading t-tall is to be unloaded. Contains internal input data that identifies the IC package. The unloader system 234 communicates a plurality of output signals that cause the identified IC package to be unloaded. For example, when a solenoid valve is energized by this output signal, pressurized gas is forced into the air cylinder by the action of the solenoid valve, and the IC package is moved to each socket.
− is pushed out.

The sort verification 1 nub system 236 supports two independent verification systems. In the first verification system, when a newly released IC package reaches ff+ in the burn-in board 7-bull, the IC package in the Hinley rack (indicated by 68a and b in FIG. 8) Hikari Jt
? At the end of the process, the number of IC packages that have passed is counted. Then, the number of IC packages that were clicked is
If you count the number of C packages, the power is 1 to 24.
2 is satisfied.

In the second verification system, after the designated IC package is pushed out of the column of socket 1, the column is placed below the photodetector (indicated by 106 in FIG. 2) in the same unloader channel. will be moved to Socket 1 instructed to unload IC package
- If there is no IC package in - then empty socket 1 - verification 244 is satisfied. Once both verifications 242 and 244 are satisfied, the sort verification system 236
72 in the figure) to output an output signal 2) for loading the IC package into the receiving tube 1. When -C1, for example, a solenoid valve is energized by this output signal, pressurized air is fed to the air cylinder,
The states of Goo 1~ are controlled.

Finally, the primary function of the storage system 238 is to maintain sufficient storage capacity in position to accommodate IC packages from the burn-in board table. This requires keeping track of the total number of IC packages to be introduced into a given storage tube, knowing in advance the capacity of the storage tube and the dimensions of the IC packages to be unloaded, and 1. This can be achieved by moving the storage frame as necessary to set up an empty storage duplex for storing the C package. Input data regarding the position of the containment frame is obtained from a plurality of lenses (indicated at 216 in FIG. 9) that monitor the position of the containment frame. The output signal from the containment tube loading rib system is
(indicated by 174 in FIG. 8) controls the operation of the housing frame. For example, when a solenoid is excited by these outputs No. 5, the air cylinder (18 in Fig. 8) is excited.
Pressurized air is pumped into the area (indicated by 4).

The positioning rib system cooperates to simultaneously control the operation of the unloader/sorter device.

The control system 230, particularly the microledge within the control unit 24, performs various other detailed operations, but the above description has been limited to the main control operations.

Referring to FIG. 1 and FIG.
Unloader/sorter device 20 immediately after being picked up
It is shown. Prior to operation, the operator verifies that the containment frames 30 each have a Chiko black with an empty containment tube. To start driving, the driver presses the star mill button on the control panel 240. Once covered, the burn-in board table 26 moves to the right toward the unloader/sorter device 20, as indicated by arrow 40 in the figure, and operation begins.

Burn-in board Daple 26 continues to move to the right,
As shown in FIG. 3, the leftmost socket row of the burn-in board 32 is lined up directly below the unloader unit 100 in the rightmost unloading groove 1/nel 28.
It slides near the channel 28.

FIG. 3 shows ten unloader channels. Anroguchi 1! Each channel is associated with a particular performance grade of IC package. For example, if we consider an IC package with a performance grade named "Grade 5", this grade 51G package can be produced by extruding an IC package of the grade in which only the fifth unlogged groove 11 channel 28 corresponds. IC pack "-" sorting from.

be done. Anne on the far right side of 2L
The inner knits 100 are selectively driven, and only the specific performance grade 1 (n package) specified for the C-th an[J-da 1-t-nel 28] is extruded.

IC detached by first channel 28
The package falls into the burn-in board table groove 62 and slides past the hinge racks 68a,b (see FIG. 8). The sensor racks 68a and 68b count the IC packages and load the number of ICs intended to be unloaded.
Check if the package was actually unloaded! l
iE Tsuru. At the same time, burn-in board table 26
slaps approximately one socket column width to the left on the burn-in board, with the leftmost socket column aligned with the column of photodetector 106 in the rightmost unload channel, as shown in FIG. becomes.

Each unloader channel 28 covers the width of two socket columns of the burn-in board, one of which is located near the unloader unit 100.
The other is located near the photoelectric detector 106.

Now, referring to Figure 4, each unloading goose/flannel 2
Empty socket 1 verification wrestling can be performed for the leftmost socket column of the photoelectric detector 106 included in 8. If both the count and the empty socket 1~verification are satisfactory, the corresponding goo]-72 is released and
The C package can be dropped into the accommodation tube in the rightmost accommodation frame 30.

The empty socket verification process is performed for the first (leftmost) socket column, and at the same time the second (from the left) socket column aligned near the unloader unit +-i o o of the rightmost unloader channel 28. The IC package is unloaded from [1-]. Once that is completed, the burn-in board is 32.
Step 1 to the left by the width of the ram and the process continues. Each time, the burn-in board triple 26 steps in the direction of one column socket 1 to GJk, and the next socket column is aligned with the unloader unit 100. For example, burn-in board 32 has 7
There is a column socket and unloader/sorter device F2
Assuming that there are 10 unloading channels 28 in 0, and assuming that the burn-in board dople 26 must move to all J locations of the burn-in board 32 near the unloader channels 28, at some point the 1st, 3rd, 5th and 7th sokutu 1-column is unloaded! Unloader unit 1oo close to channel 28
2nd, 4th and 6th sockets located nearby and at the same time]-
The column is located near the photodetector 106 near the unloader unit 28.

7 > t: + -IJ: y I" 100 C Push out the IC packages specified from the 1st, 3rd, 5th and 7th columns 1 to 7 at the same time. However, if - ) It is desirable to carry out unloading operations simultaneously and continuously to limit the load on the pressurized air flow supply mechanism.
An empty socut verification process is performed for the and sixth column. The burn-in board table 26 is then stepped to the left, the width of one socket column;
The fourth and sixth columns are arranged with unloader units 1 to 100, and the first, third, fifth and seventh columns are arranged with photoelectric detectors 10.
Line up with 6.

Now, referring to Figure 5, the figure shows the unlow f-ing/
Sorting Bu [1t? The unloader/sorter apparatus 2o is shown near completion of the process. Unload the device 2 degrees! All IC packages have been removed from the burn-in board 32 portion on the left side of the channel portion. As the burn-in board 26 continues to move to the left,
The device 2o sequentially unloads all the IC packages from the burn-in board 32. The unloaded and sorted IC packages are collected by grade into storage tubes within the storage frame. The accommodation frame 3° can be moved forward as necessary to collect the IC package into an unfilled tube.

11t like this? Burn-in board table 2
This continues until the entire 6 is operated by the all-C unloader channels. The last unloader is Anne 1 first.
It is possible to set up all unloaded IC packages to be removed. Burn-in board is the first one for all Anroguchi! After passing near Nell 28,
It is replaced with another burn-in board 32 that requires unloading back to the position shown in FIGS. 1 and 2.

The unloader/sorter device described above is a powerful and efficient means of unloading IC packages from burn-in board sockets and simultaneously sorting them into any number of predetermined performance grades. be.

By using the ``An1''-da/sorter device for versiin/testing, there is no need to use a separate tester/sorter, which is complicated and expensive. Omitting the desta/sorter device from the 1-rus also speeds up the entire process, thus further increasing the effectiveness of the 1-rus.

While embodiments of the invention have been shown and described, modifications may be made thereto by those skilled in the art without departing from the spirit of the invention.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an automated burn-inboard unloader and IC package sorter arranged in accordance with the principles of the present invention, with ornaments omitted to disclose the functional apparatus; ing. FIG. 2 is a front view of the apparatus of FIG. 1 with the burn-in board table in the loading position l. FIG. 3 is a front view of the apparatus of FIG. 2 with the burn-inboard double in position to begin the unloading and sorting steps. FIG. 4 is a cutaway front view of the device of FIG.
The first column of the C socket is aligned with the channel of the optical hinge J: Showing the burn-in board table repositioned. FIG. 5 shows the apparatus of FIG. 4 with the burn-inboard dople repositioned near the end of the unloading and sorting steps. Fig. 6 is a side view of the unloader boutonnel, Fig. 7 is a sectional view taken along line 7-7 of the unloader boutonnel shown in Fig. 6, and Fig. 8 is a sectional view of the unloader boutonnel shown in Fig. 6.
The sectional view taken along the line 8-8 in Figure 3 and 9
Figure G! A sectional view taken along line 9-9 of a part of the device shown in FIG.
FIG. 10 is a detailed front view of the programming bar and hinge mechanism of FIG. 8, and FIG. 11 is a block diagram of the control system for the unloader/sorter device. 20... Unloader/sorter device 24... Control unit 26... Burn-in board table 28... Unloader boutonnel 30... Accommodation frame 32... Burn-in board 58... Daple support mechanism 62... -Groove 64...Accommodating tubes 68a, 68b...Sensor rack 74, 104.184...Pneumatic cylinder 100...
・Unloader units 1 to 102...Unit T-support part U 106...Photoelectric detector 112...Extension parts 118a, 118b-...Extrusion extension part 130...Sout 132...IC package 148 ...Sensor 172...Tuberack Applicant Reliable Intuitive Agent Patent Attorney Oka 2. Name of the invention: Method and device for removing an IC package from a socket 1-3; Relationship with the case of the person making the amendment Patent applicant's address: Texas, 77218, United States of America. Houston, P.O. Box 218370 Name Reliability Inc. Holley Derad 4, Agent address No. 6, 10M19, Sakae 2-chome, Naka-ku, Nagoya, Subject of amendment (1) Patent applicant's column in the application (2) Drawings ( 3) Document proving authority of representation

Claims (1)

[Claims] (1) 1 for removing the ICC bag from the socket
In the J method, the socket is provided with l (prepare a printed circuit board, the extension Ia4i1 is prepared, and this extension 111 mechanism is attached to the printed circuit board and the socket 1-, and from the socket 1) IC package II!II D12
The removal method is characterized by 4R from the stage of collecting the IC package. (2) the step of pushing in the extension mechanism (removal I according to claim 1111, characterized in that ξ is optionally performed in order to remove only a predetermined IC package); is 1. . (3) The step of recovering the IC package includes the step of transferring the removed IC package to the storage tube. 3. The removal method according to claim 2, wherein the removal method is T-shaped. (4) A device for removing an electronic component from a socket 1-, which extends through the socket, engages the electronic component, and removes the electronic component from the socket.
2. A covering device characterized by having a stirring mechanism on the right side. (5) A device for removing an IC package from a socket 1- on a printed circuit JJ board, the device being an extending machine for inserting the IC package into a passage extending through the printed circuit board and the socket. (4) and a structure Ia for moving the extension mechanism in and out of the passageway to remove and remove the IC package in the socket. The device according to claim 5, characterized in that the m-shape for moving in and out is configured to be able to operate arbitrarily to detach the IC package from the socket. 6. The device according to claim 6, wherein said extension Ili laterally comprises a substantially straight rod aligned to fit into said passageway.
. (8) The device according to claim 7, wherein the mechanism Mi for moving the extension mechanism in and out comprises a fluid-driven cylinder. (9) There is a device for unloading the IC package from the burn-in board, a support mechanism for supporting the burn-in board, and a device for unloading the IC package from the burn-in board. An IC is provided in a passage extending through the burn-in board and the socket.
A pushing device comprising: a pushing mechanism for pushing a package out of the socket; and a collecting mechanism for collecting the Ml-removed IC package from the socket. (10) A mechanism for arbitrarily operating the extrusion mechanism is provided so that IC packages of a certain grade can be sorted out from other 1G packages on the burn-in board. The device according to item 9. (11) The apparatus according to claim 10, wherein the extrusion mechanism and the recovery mechanism are arranged in the form of a plurality of rams, each column corresponding to a specific grade of IC package. (12) A mechanism is provided for moving the burn-in board in relation to the extrusion mechanism, and the columns of the sockets 1 to 1 on the burn-in board are arranged in series with the columns of the extrusion and recovery mechanism. 12. The device according to claim 11, characterized in that: (13) The extrusion mechanism comprises a plurality of fluid-driven cylinders and an extension mechanism connected to each of these cylinders and inserted into the passageway passing through the burn-in board and the socket. The device according to item 12. (14) The support v1 structure includes a tilting table, a mechanism provided on this table for locking the burn-in board in an upside-down state, and a recovery mechanism for removing the IC package from the socket of the burn-in board. 13. The apparatus according to claim 12, further comprising a transfer mechanism for transferring the sample to the apparatus. (15) What is the above-mentioned Transfer III structure? It consists of multiple grooves provided on the burn-in board, and these fM
15. Apparatus according to claim 14, characterized in that G; L are arranged in alignment with the columns of the sockets 1 to 1 of the burn-in board, respectively. (16) The collection Ia structure is installed corresponding to a plurality of IC package storage units and each column of the extrusion m structure, and is arranged in correspondence with each column of the extrusion m structure. The IC package is provided with a plurality of accommodation frames including a part of a plurality of accommodation dups and a mechanism for moving each of the accommodation frames, and an IC package is rowed into the accommodation duplex included in the accommodation frame. Special 17FI characterized by being configured as follows;
1. Apparatus according to paragraph 12. (11) The collection mechanism roughly includes a plurality of storage racks including a mechanism for engaging the storage duplex, and these storage racks are removably mounted in each of the storage frames. 17. The device according to claim 16, characterized in that: (18) The device further includes a verification mechanism for verifying proper operation of the extrusion mechanism, and this verification mechanism includes a verification mechanism for counting IC packages detached from the ejector of the burn-in board. 13. The apparatus according to claim 12, further comprising a detection mechanism for detecting the presence or absence of an IC package in the socket 1 of the burn-in board. (19) a printed circuit board, a plurality of sockets disposed on the printed circuit board, and extending through the circuit board, at least one socket for each of the circuit boards; The IC has multiple passages through which the IC can be inserted and inserted.
A burn-in board (20) characterized in that the package is configured to be detachable from the aforementioned socket. The IC package socket 1 is provided with a passage extending from the bottom surface to the top surface of the socket, and a tool inserted through the passage is received. (2) Sockets 1 to 1 characterized in that they are configured such that a C package can be removed from the socket.