JPS5480079A - Method of forming semiconductor seal - Google Patents

Method of forming semiconductor seal

Info

Publication number
JPS5480079A
JPS5480079A JP9641678A JP9641678A JPS5480079A JP S5480079 A JPS5480079 A JP S5480079A JP 9641678 A JP9641678 A JP 9641678A JP 9641678 A JP9641678 A JP 9641678A JP S5480079 A JPS5480079 A JP S5480079A
Authority
JP
Japan
Prior art keywords
forming semiconductor
semiconductor seal
seal
forming
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9641678A
Other languages
Japanese (ja)
Other versions
JPS5622372B2 (en
Inventor
Kazuo Bandou
Keiji Maeda
Kenji Yasuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
I Pex Inc
Original Assignee
Dai Ichi Seiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Ichi Seiko Co Ltd filed Critical Dai Ichi Seiko Co Ltd
Priority to JP9641678A priority Critical patent/JPS5480079A/en
Priority to DE19792900114 priority patent/DE2900114A1/en
Priority to IT19830/79A priority patent/IT1110092B/en
Priority to NL7903254A priority patent/NL7903254A/en
Publication of JPS5480079A publication Critical patent/JPS5480079A/en
Publication of JPS5622372B2 publication Critical patent/JPS5622372B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP9641678A 1978-08-07 1978-08-07 Method of forming semiconductor seal Granted JPS5480079A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP9641678A JPS5480079A (en) 1978-08-07 1978-08-07 Method of forming semiconductor seal
DE19792900114 DE2900114A1 (en) 1978-08-07 1979-01-03 Encapsulating semiconductor devices with plastic - where device has heat sealing plate in a recess which is either sealed or has grooves to allow easy removal of hardened plastic (NL 11.2.80)
IT19830/79A IT1110092B (en) 1978-08-07 1979-02-01 MOLD AND PROCEDURE FOR TRANSFER ENCAPSULATION OF ELECTRONIC SEMICONDUCTOR DEVICES
NL7903254A NL7903254A (en) 1978-08-07 1979-04-25 METHOD AND DIE FOR ENCAPSULATION OF ELECTRONIC SEMICONDUCTOR ELEMENTS BY TRANSFER PRESSING.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9641678A JPS5480079A (en) 1978-08-07 1978-08-07 Method of forming semiconductor seal

Publications (2)

Publication Number Publication Date
JPS5480079A true JPS5480079A (en) 1979-06-26
JPS5622372B2 JPS5622372B2 (en) 1981-05-25

Family

ID=14164360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9641678A Granted JPS5480079A (en) 1978-08-07 1978-08-07 Method of forming semiconductor seal

Country Status (4)

Country Link
JP (1) JPS5480079A (en)
DE (1) DE2900114A1 (en)
IT (1) IT1110092B (en)
NL (1) NL7903254A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55128835A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Molding method and mold used therefor

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0070320A4 (en) * 1981-01-26 1985-03-06 Dai Ichi Seiko Co Ltd Sealing and molding machine.
GB2096825A (en) * 1981-04-09 1982-10-20 Sibbald Alastair Chemical sensitive semiconductor field effect transducer
DE3138555A1 (en) * 1981-09-28 1983-04-07 Siemens AG, 1000 Berlin und 8000 München Process for producing plastic housings
NL8203255A (en) * 1982-08-19 1984-03-16 Arbo Handel Ontwikkeling DIE FOR COVERING PARTS OF ELEMENTS WITH PLASTIC.
US4504435A (en) * 1982-10-04 1985-03-12 Texas Instruments Incorporated Method for semiconductor device packaging
FR2545653B1 (en) * 1983-05-04 1986-06-06 Pichot Michel METHOD AND DEVICE FOR ENCAPSULATING INTEGRATED CIRCUITS
DE3439145A1 (en) * 1983-10-26 1985-05-09 Reliability Inc., 77218 Houston, Tex. UNLOADING / SORTING MACHINE FOR IC COMPONENTS ON A BURN-IN BOARD
IT1252575B (en) * 1991-12-20 1995-06-19 Sgs Thomson Microelectronics MOLD AND PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR PLASTIC DEVICES, WITH VISIBLE METALLIC DISSIPATOR FOR WELDING CONTROL
US5480296A (en) * 1992-02-15 1996-01-02 Goldstar Electron Co., Ltd. Transfer molding apparatus for encapsulating an electrical element in resin
US5441684A (en) * 1993-09-24 1995-08-15 Vlsi Technology, Inc. Method of forming molded plastic packages with integrated heat sinks
DE4333415C2 (en) * 1993-09-30 1999-03-04 Siemens Ag Device for enveloping a semiconductor component and an associated heat sink with plastics
EP0703612B1 (en) * 1994-09-20 1998-11-25 STMicroelectronics S.r.l. Method for electrically insulating heat sinks in electronic power devices
JP4118353B2 (en) * 1996-10-11 2008-07-16 株式会社デンソー Manufacturing method of resin-encapsulated semiconductor device and mold die

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5460565A (en) * 1977-10-21 1979-05-16 Nec Home Electronics Ltd Parts molding method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5460565A (en) * 1977-10-21 1979-05-16 Nec Home Electronics Ltd Parts molding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55128835A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Molding method and mold used therefor

Also Published As

Publication number Publication date
DE2900114A1 (en) 1980-02-14
JPS5622372B2 (en) 1981-05-25
IT1110092B (en) 1985-12-23
NL7903254A (en) 1980-02-11
IT7919830A0 (en) 1979-02-01

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