JPS5460565A - Parts molding method - Google Patents

Parts molding method

Info

Publication number
JPS5460565A
JPS5460565A JP12700577A JP12700577A JPS5460565A JP S5460565 A JPS5460565 A JP S5460565A JP 12700577 A JP12700577 A JP 12700577A JP 12700577 A JP12700577 A JP 12700577A JP S5460565 A JPS5460565 A JP S5460565A
Authority
JP
Japan
Prior art keywords
resin
metal
molding method
concavity
flash
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12700577A
Other languages
Japanese (ja)
Other versions
JPS5751256B2 (en
Inventor
Shingo Kawashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP12700577A priority Critical patent/JPS5460565A/en
Publication of JPS5460565A publication Critical patent/JPS5460565A/en
Publication of JPS5751256B2 publication Critical patent/JPS5751256B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To ensure removal of the flash after sealing by using the circumference side of the metal substrate as the taper surface and loading the resin through touch of the edge of the concavity in the metal mold.
CONSTITUTION: Pellet 13 and lead 14 are connected and fixed to metal substrate 10. The exposed concave surface side of substrate 10 turns to convexity 15, and the circumference side of 15 is formed to taper surface 16. Then the resin 11 is loaded through touch of edge 18 of concavity 17 in metal molds cope 12a. In such way, the resin does not flow into 17, thus omitting the removal of the flash after sealing
COPYRIGHT: (C)1979,JPO&Japio
JP12700577A 1977-10-21 1977-10-21 Parts molding method Granted JPS5460565A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12700577A JPS5460565A (en) 1977-10-21 1977-10-21 Parts molding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12700577A JPS5460565A (en) 1977-10-21 1977-10-21 Parts molding method

Publications (2)

Publication Number Publication Date
JPS5460565A true JPS5460565A (en) 1979-05-16
JPS5751256B2 JPS5751256B2 (en) 1982-11-01

Family

ID=14949316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12700577A Granted JPS5460565A (en) 1977-10-21 1977-10-21 Parts molding method

Country Status (1)

Country Link
JP (1) JPS5460565A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5480079A (en) * 1978-08-07 1979-06-26 Dai Ichi Seiko Co Ltd Method of forming semiconductor seal
JPH0390481U (en) * 1989-12-28 1991-09-13
EP1419866A1 (en) * 2001-08-22 2004-05-19 Sony Corporation Method and device for forming module electronic component and module electronic component
JP2014143240A (en) * 2013-01-22 2014-08-07 Shindengen Electric Mfg Co Ltd Mold, method of manufacturing resin sealed type semiconductor device using the same, and resin sealed type semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61198859U (en) * 1985-06-04 1986-12-12

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53149765A (en) * 1977-06-01 1978-12-27 Toshiba Corp Metal mold for semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53149765A (en) * 1977-06-01 1978-12-27 Toshiba Corp Metal mold for semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5480079A (en) * 1978-08-07 1979-06-26 Dai Ichi Seiko Co Ltd Method of forming semiconductor seal
JPS5622372B2 (en) * 1978-08-07 1981-05-25
JPH0390481U (en) * 1989-12-28 1991-09-13
EP1419866A1 (en) * 2001-08-22 2004-05-19 Sony Corporation Method and device for forming module electronic component and module electronic component
EP1419866A4 (en) * 2001-08-22 2009-07-01 Sony Corp Method and device for forming module electronic component and module electronic component
JP2014143240A (en) * 2013-01-22 2014-08-07 Shindengen Electric Mfg Co Ltd Mold, method of manufacturing resin sealed type semiconductor device using the same, and resin sealed type semiconductor device

Also Published As

Publication number Publication date
JPS5751256B2 (en) 1982-11-01

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