JPS5460565A - Parts molding method - Google Patents
Parts molding methodInfo
- Publication number
- JPS5460565A JPS5460565A JP12700577A JP12700577A JPS5460565A JP S5460565 A JPS5460565 A JP S5460565A JP 12700577 A JP12700577 A JP 12700577A JP 12700577 A JP12700577 A JP 12700577A JP S5460565 A JPS5460565 A JP S5460565A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- metal
- molding method
- concavity
- flash
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To ensure removal of the flash after sealing by using the circumference side of the metal substrate as the taper surface and loading the resin through touch of the edge of the concavity in the metal mold.
CONSTITUTION: Pellet 13 and lead 14 are connected and fixed to metal substrate 10. The exposed concave surface side of substrate 10 turns to convexity 15, and the circumference side of 15 is formed to taper surface 16. Then the resin 11 is loaded through touch of edge 18 of concavity 17 in metal molds cope 12a. In such way, the resin does not flow into 17, thus omitting the removal of the flash after sealing
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12700577A JPS5460565A (en) | 1977-10-21 | 1977-10-21 | Parts molding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12700577A JPS5460565A (en) | 1977-10-21 | 1977-10-21 | Parts molding method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5460565A true JPS5460565A (en) | 1979-05-16 |
JPS5751256B2 JPS5751256B2 (en) | 1982-11-01 |
Family
ID=14949316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12700577A Granted JPS5460565A (en) | 1977-10-21 | 1977-10-21 | Parts molding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5460565A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5480079A (en) * | 1978-08-07 | 1979-06-26 | Dai Ichi Seiko Co Ltd | Method of forming semiconductor seal |
JPH0390481U (en) * | 1989-12-28 | 1991-09-13 | ||
EP1419866A1 (en) * | 2001-08-22 | 2004-05-19 | Sony Corporation | Method and device for forming module electronic component and module electronic component |
JP2014143240A (en) * | 2013-01-22 | 2014-08-07 | Shindengen Electric Mfg Co Ltd | Mold, method of manufacturing resin sealed type semiconductor device using the same, and resin sealed type semiconductor device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61198859U (en) * | 1985-06-04 | 1986-12-12 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53149765A (en) * | 1977-06-01 | 1978-12-27 | Toshiba Corp | Metal mold for semiconductor device |
-
1977
- 1977-10-21 JP JP12700577A patent/JPS5460565A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53149765A (en) * | 1977-06-01 | 1978-12-27 | Toshiba Corp | Metal mold for semiconductor device |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5480079A (en) * | 1978-08-07 | 1979-06-26 | Dai Ichi Seiko Co Ltd | Method of forming semiconductor seal |
JPS5622372B2 (en) * | 1978-08-07 | 1981-05-25 | ||
JPH0390481U (en) * | 1989-12-28 | 1991-09-13 | ||
EP1419866A1 (en) * | 2001-08-22 | 2004-05-19 | Sony Corporation | Method and device for forming module electronic component and module electronic component |
EP1419866A4 (en) * | 2001-08-22 | 2009-07-01 | Sony Corp | Method and device for forming module electronic component and module electronic component |
JP2014143240A (en) * | 2013-01-22 | 2014-08-07 | Shindengen Electric Mfg Co Ltd | Mold, method of manufacturing resin sealed type semiconductor device using the same, and resin sealed type semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS5751256B2 (en) | 1982-11-01 |
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