JPS533166A - Resin molding method - Google Patents
Resin molding methodInfo
- Publication number
- JPS533166A JPS533166A JP7759776A JP7759776A JPS533166A JP S533166 A JPS533166 A JP S533166A JP 7759776 A JP7759776 A JP 7759776A JP 7759776 A JP7759776 A JP 7759776A JP S533166 A JPS533166 A JP S533166A
- Authority
- JP
- Japan
- Prior art keywords
- molding method
- resin molding
- insulation plate
- plate formed
- electrode patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To eliminate the production of mold flash and shorten soldering time by mounting an IC on an insulation plate formed with electrode patterns, applying an IC on an insulation plate formed with electrode patterns, applying reinforcing coating on the IC then placing in sandwich form resin moldings on the top and bottom thereof and resin-molding the outside circumference of the assembly.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7759776A JPS533166A (en) | 1976-06-30 | 1976-06-30 | Resin molding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7759776A JPS533166A (en) | 1976-06-30 | 1976-06-30 | Resin molding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS533166A true JPS533166A (en) | 1978-01-12 |
Family
ID=13638350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7759776A Pending JPS533166A (en) | 1976-06-30 | 1976-06-30 | Resin molding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS533166A (en) |
-
1976
- 1976-06-30 JP JP7759776A patent/JPS533166A/en active Pending
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