JPS533166A - Resin molding method - Google Patents

Resin molding method

Info

Publication number
JPS533166A
JPS533166A JP7759776A JP7759776A JPS533166A JP S533166 A JPS533166 A JP S533166A JP 7759776 A JP7759776 A JP 7759776A JP 7759776 A JP7759776 A JP 7759776A JP S533166 A JPS533166 A JP S533166A
Authority
JP
Japan
Prior art keywords
molding method
resin molding
insulation plate
plate formed
electrode patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7759776A
Other languages
Japanese (ja)
Inventor
Koji Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP7759776A priority Critical patent/JPS533166A/en
Publication of JPS533166A publication Critical patent/JPS533166A/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To eliminate the production of mold flash and shorten soldering time by mounting an IC on an insulation plate formed with electrode patterns, applying an IC on an insulation plate formed with electrode patterns, applying reinforcing coating on the IC then placing in sandwich form resin moldings on the top and bottom thereof and resin-molding the outside circumference of the assembly.
COPYRIGHT: (C)1978,JPO&Japio
JP7759776A 1976-06-30 1976-06-30 Resin molding method Pending JPS533166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7759776A JPS533166A (en) 1976-06-30 1976-06-30 Resin molding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7759776A JPS533166A (en) 1976-06-30 1976-06-30 Resin molding method

Publications (1)

Publication Number Publication Date
JPS533166A true JPS533166A (en) 1978-01-12

Family

ID=13638350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7759776A Pending JPS533166A (en) 1976-06-30 1976-06-30 Resin molding method

Country Status (1)

Country Link
JP (1) JPS533166A (en)

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