JPS55118640A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS55118640A
JPS55118640A JP2586879A JP2586879A JPS55118640A JP S55118640 A JPS55118640 A JP S55118640A JP 2586879 A JP2586879 A JP 2586879A JP 2586879 A JP2586879 A JP 2586879A JP S55118640 A JPS55118640 A JP S55118640A
Authority
JP
Japan
Prior art keywords
cavity
board
resin
silicone rubber
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2586879A
Other languages
Japanese (ja)
Inventor
Katsutoshi Soejima
Satoshi Watakari
Hideo Sakamoto
Akiyoshi Mineo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2586879A priority Critical patent/JPS55118640A/en
Publication of JPS55118640A publication Critical patent/JPS55118640A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B29C45/14418—Sealing means between mould and article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

PURPOSE:To rationally obtain a desired quality of a semiconductor device by molding a number of printed boards carrying electronic parts by using a transfer molding die burying silicone rubber in the portion for retaining the substrates. CONSTITUTION:A conductor pattern is formed on a printed board 1, and a semiconductor element 2 is carried thereon. The board 1 is set in molds 13, 14. The mold has a cavity 18, and a silicone rubber 10 for preventing flow of resin for retaining the board 1. The resin is flowed from a gate 16 into the cavity 18 to seal the semiconductor element 1 and wires 17 in the cavity 18. At this time the resin flowed from the cavity 18 can be completely retained by the silicone rubber 10. Thus, the transfer molding system is applied to the printed board having ruggedness on the surface to provide a desired quality of product.
JP2586879A 1979-03-06 1979-03-06 Manufacture of semiconductor device Pending JPS55118640A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2586879A JPS55118640A (en) 1979-03-06 1979-03-06 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2586879A JPS55118640A (en) 1979-03-06 1979-03-06 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS55118640A true JPS55118640A (en) 1980-09-11

Family

ID=12177763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2586879A Pending JPS55118640A (en) 1979-03-06 1979-03-06 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS55118640A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59135137A (en) * 1983-01-25 1984-08-03 Hitachi Metals Ltd Resin coating mold
JPS59135136A (en) * 1983-01-25 1984-08-03 Hitachi Metals Ltd Resin coating mold
JPH05211187A (en) * 1991-12-26 1993-08-20 Nippon Steel Corp Molding die for ic package
US5336272A (en) * 1988-10-13 1994-08-09 Mitsubishi Denki Kabushiki Kaisha Method for molding a semiconductor package on a continuous leadframe
US5728600A (en) * 1994-11-15 1998-03-17 Vlt Corporation Circuit encapsulation process
US5898216A (en) * 1995-11-14 1999-04-27 Sgs-Thomson Microelectronics S.A. Micromodule with protection barriers and a method for manufacturing the same
US5945130A (en) * 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation
US6302673B1 (en) * 1956-12-17 2001-10-16 Texas Instruments Incorporated Integrated circuit chip mold seal
US6302672B1 (en) * 1996-12-17 2001-10-16 Texas Instruments Incorporated Integrated circuit chip mold seal
WO2001084618A2 (en) * 2000-05-02 2001-11-08 Siemens Production And Logistics Systems Ag Method and mould for encapsulating electronic circuit carriers by injection moulding
KR20120021195A (en) * 2010-08-30 2012-03-08 토와 가부시기가이샤 Manufacturing method for resin sealed molded product and manufacturing apparatus for resin sealed molded product
JP2013251414A (en) * 2012-05-31 2013-12-12 Mikuni Corp Engine control unit

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302673B1 (en) * 1956-12-17 2001-10-16 Texas Instruments Incorporated Integrated circuit chip mold seal
JPS59135136A (en) * 1983-01-25 1984-08-03 Hitachi Metals Ltd Resin coating mold
JPS6241846B2 (en) * 1983-01-25 1987-09-04 Hitachi Metals Ltd
JPS59135137A (en) * 1983-01-25 1984-08-03 Hitachi Metals Ltd Resin coating mold
US5336272A (en) * 1988-10-13 1994-08-09 Mitsubishi Denki Kabushiki Kaisha Method for molding a semiconductor package on a continuous leadframe
JPH05211187A (en) * 1991-12-26 1993-08-20 Nippon Steel Corp Molding die for ic package
US6403009B1 (en) 1994-11-15 2002-06-11 Vlt Corporation Circuit encapsulation
US5728600A (en) * 1994-11-15 1998-03-17 Vlt Corporation Circuit encapsulation process
US6710257B2 (en) 1994-11-15 2004-03-23 Vlt Corporation Circuit encapsulation
US5945130A (en) * 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation
US6071758A (en) * 1995-11-14 2000-06-06 Sgs-Thomson Microelectronics S.A. Process for manufacturing a chip card micromodule with protection barriers
US5898216A (en) * 1995-11-14 1999-04-27 Sgs-Thomson Microelectronics S.A. Micromodule with protection barriers and a method for manufacturing the same
US6302672B1 (en) * 1996-12-17 2001-10-16 Texas Instruments Incorporated Integrated circuit chip mold seal
WO2001084618A2 (en) * 2000-05-02 2001-11-08 Siemens Production And Logistics Systems Ag Method and mould for encapsulating electronic circuit carriers by injection moulding
WO2001084618A3 (en) * 2000-05-02 2002-02-07 Siemens Production & Logistics Method and mould for encapsulating electronic circuit carriers by injection moulding
KR20120021195A (en) * 2010-08-30 2012-03-08 토와 가부시기가이샤 Manufacturing method for resin sealed molded product and manufacturing apparatus for resin sealed molded product
JP2012049414A (en) * 2010-08-30 2012-03-08 Towa Corp Method and apparatus for manufacturing resin encapsulation molded article having substrate exposure face
JP2013251414A (en) * 2012-05-31 2013-12-12 Mikuni Corp Engine control unit

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