JPS55138845A - Method of fabricating semiconductor device - Google Patents

Method of fabricating semiconductor device

Info

Publication number
JPS55138845A
JPS55138845A JP4607279A JP4607279A JPS55138845A JP S55138845 A JPS55138845 A JP S55138845A JP 4607279 A JP4607279 A JP 4607279A JP 4607279 A JP4607279 A JP 4607279A JP S55138845 A JPS55138845 A JP S55138845A
Authority
JP
Japan
Prior art keywords
chip
semiconductor device
mold
thermoplastic resin
lower surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4607279A
Other languages
Japanese (ja)
Inventor
Makoto Koshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP4607279A priority Critical patent/JPS55138845A/en
Publication of JPS55138845A publication Critical patent/JPS55138845A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To eliminate the breakage of an IC chip and the disconnection of the finger portions thereof and to improve the yield of a semiconductor device in fabrication by retaining the IC chip from both upper and lower surfaces thereof by a plurality of retainer pins provided thereat in a mold and injection molding it with thermoplastic resin. CONSTITUTION:A printed board 1 is connected to an IC chip 2 by finger portions 12a. The chip 2 is retained from both upper and lower surfaces thereof by retainer pins 32, 33 provided in an injection mold 3. A rubber 34 is so employed as to eliminate damage of the chip as required at this time. Thereafter, thermoplastic resin 31 is injection molded by the mold.
JP4607279A 1979-04-17 1979-04-17 Method of fabricating semiconductor device Pending JPS55138845A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4607279A JPS55138845A (en) 1979-04-17 1979-04-17 Method of fabricating semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4607279A JPS55138845A (en) 1979-04-17 1979-04-17 Method of fabricating semiconductor device

Publications (1)

Publication Number Publication Date
JPS55138845A true JPS55138845A (en) 1980-10-30

Family

ID=12736782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4607279A Pending JPS55138845A (en) 1979-04-17 1979-04-17 Method of fabricating semiconductor device

Country Status (1)

Country Link
JP (1) JPS55138845A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4888307A (en) * 1986-08-27 1989-12-19 Sgs Microelettronica S.P.A. Method for manufacturing plastic encapsulated semiconductor devices
JPH04352435A (en) * 1991-05-30 1992-12-07 Mitsubishi Electric Corp Mold for manufacturing hollow semiconductor pressure sensor sealed with resin
NL1003315C2 (en) * 1996-06-11 1997-12-17 Europ Semiconductor Assembly E Method for encapsulating an integrated semiconductor circuit.

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4888307A (en) * 1986-08-27 1989-12-19 Sgs Microelettronica S.P.A. Method for manufacturing plastic encapsulated semiconductor devices
JPH04352435A (en) * 1991-05-30 1992-12-07 Mitsubishi Electric Corp Mold for manufacturing hollow semiconductor pressure sensor sealed with resin
NL1003315C2 (en) * 1996-06-11 1997-12-17 Europ Semiconductor Assembly E Method for encapsulating an integrated semiconductor circuit.
EP0813236A1 (en) * 1996-06-11 1997-12-17 European Semiconductor Assembly (Eurasem) B.V. Method for encapsulating an integrated semi-conductor circuit
US5897338A (en) * 1996-06-11 1999-04-27 European Semiconductor Assembly (Eurasem) B.V. Method for encapsulating an integrated semi-conductor circuit

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