JPS6484694A - Manufacture of insulating substrate provided with conductive layer - Google Patents
Manufacture of insulating substrate provided with conductive layerInfo
- Publication number
- JPS6484694A JPS6484694A JP62241942A JP24194287A JPS6484694A JP S6484694 A JPS6484694 A JP S6484694A JP 62241942 A JP62241942 A JP 62241942A JP 24194287 A JP24194287 A JP 24194287A JP S6484694 A JPS6484694 A JP S6484694A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conductive layer
- resist layer
- manufacture
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
PURPOSE:To form readily a conductive layer on a three-dimensional surface by forming an insulating material on a mold surface whereon irregularities process is conducted and a conductive layer is formed. CONSTITUTION:After a resist layer 2 is formed on a conductive plate material (a temporary substrate) 1, irregular shape 1a is formed by press working. A cable way 3 is formed onto the temporary substrate 1 by electroplating. The temporary substrate 1 is arranged within a metal mold 4 and insulating molding material (resin) is injected to form an insulating substrate 6 which has a solid surface. The cable way 3 and a resist layer 2 are transcribed to the substrate 6. After the substrate 6 is removed from the metal mold 4, the resist layer 2 is eliminated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62241942A JPS6484694A (en) | 1987-09-26 | 1987-09-26 | Manufacture of insulating substrate provided with conductive layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62241942A JPS6484694A (en) | 1987-09-26 | 1987-09-26 | Manufacture of insulating substrate provided with conductive layer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6484694A true JPS6484694A (en) | 1989-03-29 |
Family
ID=17081859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62241942A Pending JPS6484694A (en) | 1987-09-26 | 1987-09-26 | Manufacture of insulating substrate provided with conductive layer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6484694A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03151259A (en) * | 1989-11-09 | 1991-06-27 | Sekisui Chem Co Ltd | Laminated sheet |
US6945707B2 (en) | 2000-04-21 | 2005-09-20 | Seiko Epson Corporation | Three-dimensional mounted assembly and optical transmission device |
JP2007129273A (en) * | 2007-02-23 | 2007-05-24 | Matsushita Electric Works Ltd | Method for manufacturing led display apparatus |
-
1987
- 1987-09-26 JP JP62241942A patent/JPS6484694A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03151259A (en) * | 1989-11-09 | 1991-06-27 | Sekisui Chem Co Ltd | Laminated sheet |
US6945707B2 (en) | 2000-04-21 | 2005-09-20 | Seiko Epson Corporation | Three-dimensional mounted assembly and optical transmission device |
US7040817B2 (en) | 2000-04-21 | 2006-05-09 | Seiko Epson Corporation | Three-dimensional mounted assembly and optical transmission device |
JP2007129273A (en) * | 2007-02-23 | 2007-05-24 | Matsushita Electric Works Ltd | Method for manufacturing led display apparatus |
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