JPS5469063A - Manufacture of electronic device - Google Patents

Manufacture of electronic device

Info

Publication number
JPS5469063A
JPS5469063A JP13595377A JP13595377A JPS5469063A JP S5469063 A JPS5469063 A JP S5469063A JP 13595377 A JP13595377 A JP 13595377A JP 13595377 A JP13595377 A JP 13595377A JP S5469063 A JPS5469063 A JP S5469063A
Authority
JP
Japan
Prior art keywords
concavity
substrate
projection
resin
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13595377A
Other languages
Japanese (ja)
Other versions
JPS5549422B2 (en
Inventor
Hiroyuki Nishi
Masabumi Tsunetsugu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP13595377A priority Critical patent/JPS5469063A/en
Publication of JPS5469063A publication Critical patent/JPS5469063A/en
Publication of JPS5549422B2 publication Critical patent/JPS5549422B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: To secure an easy formation of the display window simultaneously with the resin sealing of the substrate by providing the projection touching the LED set onto the wiring substrate at the concavity of the molding tool.
CONSTITUTION: The wiring substrate is inserted to metal mold concavity 6 with electronic parts 2 put downward, and substrate projection bar 7 is hooked to each hooking step part 8. In this case, the substrate is held horizontally within the concavity, and LED3 touches top surface 9a of projection 9. Then fused resin 10 is filled into concavity 6 through pouring. Substrate 1 is drawn out of concavity 6 after solidification of resin 10, thus window edge W remaining as a through-hole.
COPYRIGHT: (C)1979,JPO&Japio
JP13595377A 1977-11-11 1977-11-11 Manufacture of electronic device Granted JPS5469063A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13595377A JPS5469063A (en) 1977-11-11 1977-11-11 Manufacture of electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13595377A JPS5469063A (en) 1977-11-11 1977-11-11 Manufacture of electronic device

Publications (2)

Publication Number Publication Date
JPS5469063A true JPS5469063A (en) 1979-06-02
JPS5549422B2 JPS5549422B2 (en) 1980-12-11

Family

ID=15163692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13595377A Granted JPS5469063A (en) 1977-11-11 1977-11-11 Manufacture of electronic device

Country Status (1)

Country Link
JP (1) JPS5469063A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5791572A (en) * 1980-11-28 1982-06-07 Toshiba Corp Light module and manufacture therefor
JPS58223336A (en) * 1982-06-22 1983-12-24 Nec Corp Manufacture of casting mold
US4486364A (en) * 1981-12-04 1984-12-04 Stanley Electric Company, Ltd. Method and apparatus for molding a synthetic resin lens for a light emitting diode
WO2014118856A1 (en) * 2013-01-31 2014-08-07 パナソニック株式会社 Electronic circuit device and method for manufacturing electronic circuit device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02136970U (en) * 1989-04-17 1990-11-15

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5791572A (en) * 1980-11-28 1982-06-07 Toshiba Corp Light module and manufacture therefor
JPS6244831B2 (en) * 1980-11-28 1987-09-22 Tokyo Shibaura Electric Co
US4486364A (en) * 1981-12-04 1984-12-04 Stanley Electric Company, Ltd. Method and apparatus for molding a synthetic resin lens for a light emitting diode
JPS58223336A (en) * 1982-06-22 1983-12-24 Nec Corp Manufacture of casting mold
JPS6255297B2 (en) * 1982-06-22 1987-11-19 Nippon Electric Co
WO2014118856A1 (en) * 2013-01-31 2014-08-07 パナソニック株式会社 Electronic circuit device and method for manufacturing electronic circuit device
JPWO2014118856A1 (en) * 2013-01-31 2017-01-26 パナソニックＩｐマネジメント株式会社 Electronic circuit device and method for manufacturing electronic circuit device
US9568169B2 (en) 2013-01-31 2017-02-14 Panasonic Intellectual Property Management Co., Ltd. Electronic circuit device and method for manufacturing electronic circuit device

Also Published As

Publication number Publication date
JPS5549422B2 (en) 1980-12-11

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