JPS56167336A - Manufacture of resin-sealed type module - Google Patents
Manufacture of resin-sealed type moduleInfo
- Publication number
- JPS56167336A JPS56167336A JP6994080A JP6994080A JPS56167336A JP S56167336 A JPS56167336 A JP S56167336A JP 6994080 A JP6994080 A JP 6994080A JP 6994080 A JP6994080 A JP 6994080A JP S56167336 A JPS56167336 A JP S56167336A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- resin
- case
- sand
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
PURPOSE:To prevent production of foams and improve reliability, by putting an electronic-circuit-loaded substrate into a case in such a position as to be inclined toward the bottom, filling it with sand silica, etc., and then, sealing it by pouring resin on the side where distance between the substrate and the bottom is shorter. CONSTITUTION:In a mold processing for sand casting of an electronic equipment to be used under an unfavorable environmental condition, an electronic-circuit-loaded substrate 2 to be housed in a case 1 is fixed in such a position as to be inclined toward the bottom of the case. After this case 1 is filled with a filler 3, such as silica and sand, etc., in such a manner as to embed the substrate 2 completely, such a material as epoxy resin 4 is poured on the side where distance between the substrate 2 and the bottom is shorter, and the resin 4 is hardened by being spread all over the surface. It is possible, by doing so, to release the air surrounded on the bottom of the substrate 2 slant-upwardly and to improve reliability of a module.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6994080A JPS56167336A (en) | 1980-05-26 | 1980-05-26 | Manufacture of resin-sealed type module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6994080A JPS56167336A (en) | 1980-05-26 | 1980-05-26 | Manufacture of resin-sealed type module |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56167336A true JPS56167336A (en) | 1981-12-23 |
Family
ID=13417155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6994080A Pending JPS56167336A (en) | 1980-05-26 | 1980-05-26 | Manufacture of resin-sealed type module |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56167336A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60932U (en) * | 1983-06-16 | 1985-01-07 | 三菱電機株式会社 | electronic circuit equipment |
JPS60167340U (en) * | 1984-04-16 | 1985-11-06 | 日本電気株式会社 | Hybrid integrated circuit device |
US6753578B2 (en) | 2001-09-05 | 2004-06-22 | Mitsubishi Denki Kabushiki Kaisha | Resin-sealed semiconductor device |
JP2020188042A (en) * | 2019-05-10 | 2020-11-19 | 三菱電機株式会社 | Semiconductor device, power conversion device, and method of manufacturing semiconductor device |
-
1980
- 1980-05-26 JP JP6994080A patent/JPS56167336A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60932U (en) * | 1983-06-16 | 1985-01-07 | 三菱電機株式会社 | electronic circuit equipment |
JPS60167340U (en) * | 1984-04-16 | 1985-11-06 | 日本電気株式会社 | Hybrid integrated circuit device |
US6753578B2 (en) | 2001-09-05 | 2004-06-22 | Mitsubishi Denki Kabushiki Kaisha | Resin-sealed semiconductor device |
JP2020188042A (en) * | 2019-05-10 | 2020-11-19 | 三菱電機株式会社 | Semiconductor device, power conversion device, and method of manufacturing semiconductor device |
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