JPS60932U - electronic circuit equipment - Google Patents
electronic circuit equipmentInfo
- Publication number
- JPS60932U JPS60932U JP9380983U JP9380983U JPS60932U JP S60932 U JPS60932 U JP S60932U JP 9380983 U JP9380983 U JP 9380983U JP 9380983 U JP9380983 U JP 9380983U JP S60932 U JPS60932 U JP S60932U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- thick film
- circuit device
- board
- circuit equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の電子回路装置を示す縦断面図、第２図は
この考案の電子回路装置の一実施例の構成を示す縦断面
図、第３図はこの考案の電子回路装置の他の実施例の構
成を示す縦断面図である。
１・・・・・・ケース、２・・・・・・母基板、３・・
・・・・厚膜基板、３ａ、 ３ｂ・・・・・・リード
線群、４・・・・・・注型剤。なお、図中同一符号は同
一または相当部分を示す。FIG. 1 is a vertical cross-sectional view showing a conventional electronic circuit device, FIG. 2 is a vertical cross-sectional view showing the configuration of an embodiment of the electronic circuit device of this invention, and FIG. 3 is a vertical cross-sectional view of another electronic circuit device of this invention. FIG. 2 is a longitudinal cross-sectional view showing the configuration of an example. 1... Case, 2... Mother board, 3...
... Thick film substrate, 3a, 3b... Lead wire group, 4... Casting agent. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
母基板、上記厚膜基板および母基板を収納するケース、
このケース内に粘度Ｎの樹脂等の注型剤を注入した電子
回路装置において、上記厚膜基板の上記注型剤による注
型時に、上記厚膜基板が水平面に対し傾斜角（θ）ｊａ
ｎ ”７．９５ｘｌＱ’ｘＮ）なる傾きを有するよう
に配設されていることを特徴とする電子回路装置。A thick film board with electronic components attached, a mother board to which this thick film board is connected, a case that houses the thick film board and mother board,
In an electronic circuit device in which a casting agent such as a resin having a viscosity of N is injected into the case, when the thick film substrate is cast with the casting agent, the thick film substrate has an inclination angle (θ) ja with respect to a horizontal plane.
1. An electronic circuit device characterized in that the electronic circuit device is arranged so as to have an inclination of n''7.95xlQ'xN).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9380983U JPS60932U (en) | 1983-06-16 | 1983-06-16 | electronic circuit equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9380983U JPS60932U (en) | 1983-06-16 | 1983-06-16 | electronic circuit equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60932U true JPS60932U (en) | 1985-01-07 |
Family
ID=30224892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9380983U Pending JPS60932U (en) | 1983-06-16 | 1983-06-16 | electronic circuit equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60932U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56167336A (en) * | 1980-05-26 | 1981-12-23 | Toshiba Corp | Manufacture of resin-sealed type module |
-
1983
- 1983-06-16 JP JP9380983U patent/JPS60932U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56167336A (en) * | 1980-05-26 | 1981-12-23 | Toshiba Corp | Manufacture of resin-sealed type module |
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