JPS54149582A - Manufacture of resin-sealed semiconductor device - Google Patents

Manufacture of resin-sealed semiconductor device

Info

Publication number
JPS54149582A
JPS54149582A JP5764878A JP5764878A JPS54149582A JP S54149582 A JPS54149582 A JP S54149582A JP 5764878 A JP5764878 A JP 5764878A JP 5764878 A JP5764878 A JP 5764878A JP S54149582 A JPS54149582 A JP S54149582A
Authority
JP
Japan
Prior art keywords
mold
resin
bonded
manufacture
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5764878A
Other languages
Japanese (ja)
Inventor
Takehisa Hamano
Masaru Tsunetomo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5764878A priority Critical patent/JPS54149582A/en
Publication of JPS54149582A publication Critical patent/JPS54149582A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To carry out highly-efficient sealing without using an expensive mold by making the surface of the mold insulated and by using it for one part of a sealing material after resin sealing.
CONSTITUTION: Mold 1, made of epoxy resin or a conductive substance with the surface coated with an insulator, consists of lower mold 11 as the base and upper mold 12 as the cap. Tab 21 is bonded to plane part 11a while lead 22 is bonded to 11b and on the tab, semiconductor pellet 3 is bonded and then connected 4 to the lead. Both upper and lower molds are fixed together by adhesive 5 and resin 6 is injected from hole 11d and hardened; and then, molds are utilized for one part of a sealing material.
COPYRIGHT: (C)1979,JPO&Japio
JP5764878A 1978-05-17 1978-05-17 Manufacture of resin-sealed semiconductor device Pending JPS54149582A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5764878A JPS54149582A (en) 1978-05-17 1978-05-17 Manufacture of resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5764878A JPS54149582A (en) 1978-05-17 1978-05-17 Manufacture of resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS54149582A true JPS54149582A (en) 1979-11-22

Family

ID=13061710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5764878A Pending JPS54149582A (en) 1978-05-17 1978-05-17 Manufacture of resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS54149582A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185827A (en) * 1984-10-04 1986-05-01 Toshiba Corp Resin sealing metallic mold
JP2014082233A (en) * 2012-10-12 2014-05-08 Sumitomo Electric Ind Ltd Semiconductor device and method of manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185827A (en) * 1984-10-04 1986-05-01 Toshiba Corp Resin sealing metallic mold
JPH0325017B2 (en) * 1984-10-04 1991-04-04 Tokyo Shibaura Electric Co
JP2014082233A (en) * 2012-10-12 2014-05-08 Sumitomo Electric Ind Ltd Semiconductor device and method of manufacturing the same

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