JPS54149582A - Manufacture of resin-sealed semiconductor device - Google Patents
Manufacture of resin-sealed semiconductor deviceInfo
- Publication number
- JPS54149582A JPS54149582A JP5764878A JP5764878A JPS54149582A JP S54149582 A JPS54149582 A JP S54149582A JP 5764878 A JP5764878 A JP 5764878A JP 5764878 A JP5764878 A JP 5764878A JP S54149582 A JPS54149582 A JP S54149582A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- bonded
- manufacture
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 238000007789 sealing Methods 0.000 abstract 2
- 239000003566 sealing material Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive Effects 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000012212 insulator Substances 0.000 abstract 1
- 239000008188 pellet Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Abstract
PURPOSE: To carry out highly-efficient sealing without using an expensive mold by making the surface of the mold insulated and by using it for one part of a sealing material after resin sealing.
CONSTITUTION: Mold 1, made of epoxy resin or a conductive substance with the surface coated with an insulator, consists of lower mold 11 as the base and upper mold 12 as the cap. Tab 21 is bonded to plane part 11a while lead 22 is bonded to 11b and on the tab, semiconductor pellet 3 is bonded and then connected 4 to the lead. Both upper and lower molds are fixed together by adhesive 5 and resin 6 is injected from hole 11d and hardened; and then, molds are utilized for one part of a sealing material.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5764878A JPS54149582A (en) | 1978-05-17 | 1978-05-17 | Manufacture of resin-sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5764878A JPS54149582A (en) | 1978-05-17 | 1978-05-17 | Manufacture of resin-sealed semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54149582A true JPS54149582A (en) | 1979-11-22 |
Family
ID=13061710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5764878A Pending JPS54149582A (en) | 1978-05-17 | 1978-05-17 | Manufacture of resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54149582A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6185827A (en) * | 1984-10-04 | 1986-05-01 | Toshiba Corp | Resin sealing metallic mold |
| JP2014082233A (en) * | 2012-10-12 | 2014-05-08 | Sumitomo Electric Ind Ltd | Semiconductor device and method of manufacturing the same |
-
1978
- 1978-05-17 JP JP5764878A patent/JPS54149582A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6185827A (en) * | 1984-10-04 | 1986-05-01 | Toshiba Corp | Resin sealing metallic mold |
| JPH0325017B2 (en) * | 1984-10-04 | 1991-04-04 | Tokyo Shibaura Electric Co | |
| JP2014082233A (en) * | 2012-10-12 | 2014-05-08 | Sumitomo Electric Ind Ltd | Semiconductor device and method of manufacturing the same |
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