JPS5481073A - Sealing method for semiconductor element - Google Patents
Sealing method for semiconductor elementInfo
- Publication number
- JPS5481073A JPS5481073A JP14948277A JP14948277A JPS5481073A JP S5481073 A JPS5481073 A JP S5481073A JP 14948277 A JP14948277 A JP 14948277A JP 14948277 A JP14948277 A JP 14948277A JP S5481073 A JPS5481073 A JP S5481073A
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- substrate
- resin
- semiconductor element
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To prevent the exfoliation between the sealing resin and the insulator substrate due to the external force by means of the metal mold which forms the T- shape through the aperture part.
CONSTITUTION: Semiconductor element 3 is put on and welded to insulator substrate 1 containing circuit pattern 2 plus more than one unit of aperture part 8, and the electrode of element 3 is connected to pattern 2 via metal thin wire 4. And then the sealing is given using the thermosetting resin as the sealing material for the environmental protection of element 3 as well as the mechanical protection of wire 4. Sealing resin 7 forms T-shape 9 on the back of substrate 1 via part 8, thus preventing the exfoliation of the upper surface of substrate 1 containing pattern 2 and touching resin 7 due to the external force.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14948277A JPS5481073A (en) | 1977-12-12 | 1977-12-12 | Sealing method for semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14948277A JPS5481073A (en) | 1977-12-12 | 1977-12-12 | Sealing method for semiconductor element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5481073A true JPS5481073A (en) | 1979-06-28 |
JPS57655B2 JPS57655B2 (en) | 1982-01-07 |
Family
ID=15476105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14948277A Granted JPS5481073A (en) | 1977-12-12 | 1977-12-12 | Sealing method for semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5481073A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5754356A (en) * | 1980-08-05 | 1982-03-31 | Gao Ges Automation Org | |
JPH03116856A (en) * | 1989-09-29 | 1991-05-17 | Hitachi Ltd | Semiconductor device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10649000B2 (en) | 2015-12-17 | 2020-05-12 | Panasonic Intellectual Property Management Co., Ltd. | Connection assembly |
TWI800066B (en) * | 2021-11-01 | 2023-04-21 | 行政院原子能委員會核能研究所 | Composite gel polymer electrolyte lithium battery structure and method of fabricating the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4979686A (en) * | 1972-12-07 | 1974-08-01 | ||
JPS49114359A (en) * | 1973-02-28 | 1974-10-31 | ||
JPS5078170U (en) * | 1973-11-19 | 1975-07-07 |
-
1977
- 1977-12-12 JP JP14948277A patent/JPS5481073A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4979686A (en) * | 1972-12-07 | 1974-08-01 | ||
JPS49114359A (en) * | 1973-02-28 | 1974-10-31 | ||
JPS5078170U (en) * | 1973-11-19 | 1975-07-07 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5754356A (en) * | 1980-08-05 | 1982-03-31 | Gao Ges Automation Org | |
JPH0158657B2 (en) * | 1980-08-05 | 1989-12-13 | Gee Aa Oo G Fuyuuru Automatsuioon Unto Oruganizatsuioon Mbh | |
JPH05270183A (en) * | 1980-08-05 | 1993-10-19 | Gao Ges Autom Org Mbh | Carrier element for ic module |
JPH03116856A (en) * | 1989-09-29 | 1991-05-17 | Hitachi Ltd | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS57655B2 (en) | 1982-01-07 |
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