JPS5418675A - Sealing method for semiconductor element - Google Patents

Sealing method for semiconductor element

Info

Publication number
JPS5418675A
JPS5418675A JP8298077A JP8298077A JPS5418675A JP S5418675 A JPS5418675 A JP S5418675A JP 8298077 A JP8298077 A JP 8298077A JP 8298077 A JP8298077 A JP 8298077A JP S5418675 A JPS5418675 A JP S5418675A
Authority
JP
Japan
Prior art keywords
semiconductor element
sealing method
hardening
film
catalyzer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8298077A
Other languages
Japanese (ja)
Inventor
Takashi Yokoyama
Hiroshi Suzuki
Hideo Inayoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8298077A priority Critical patent/JPS5418675A/en
Publication of JPS5418675A publication Critical patent/JPS5418675A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To enhance the mass productivity for the semiconductor element, by fitting the semiconductor element containing the projection electrode into the opening part provided to the insulating flexible film to secure an electric and mechanical combination with the conductor formed on the film and then hardening them by dropping the liquid epoxy resin containing the hardening agent and catalyzer.
COPYRIGHT: (C)1979,JPO&Japio
JP8298077A 1977-07-13 1977-07-13 Sealing method for semiconductor element Pending JPS5418675A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8298077A JPS5418675A (en) 1977-07-13 1977-07-13 Sealing method for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8298077A JPS5418675A (en) 1977-07-13 1977-07-13 Sealing method for semiconductor element

Publications (1)

Publication Number Publication Date
JPS5418675A true JPS5418675A (en) 1979-02-10

Family

ID=13789353

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8298077A Pending JPS5418675A (en) 1977-07-13 1977-07-13 Sealing method for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5418675A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002293883A (en) * 2001-03-30 2002-10-09 Sunstar Eng Inc One-pack heat-setting epoxy resin composition and underfill material for packaging semiconductor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002293883A (en) * 2001-03-30 2002-10-09 Sunstar Eng Inc One-pack heat-setting epoxy resin composition and underfill material for packaging semiconductor

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