JPS57159032A - Forming method for package of electronic timepiece - Google Patents

Forming method for package of electronic timepiece

Info

Publication number
JPS57159032A
JPS57159032A JP56043997A JP4399781A JPS57159032A JP S57159032 A JPS57159032 A JP S57159032A JP 56043997 A JP56043997 A JP 56043997A JP 4399781 A JP4399781 A JP 4399781A JP S57159032 A JPS57159032 A JP S57159032A
Authority
JP
Japan
Prior art keywords
polyphenylene sulfide
resin
injection
sulfide resin
electronic timepiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56043997A
Other languages
Japanese (ja)
Inventor
Naotake Ebinuma
Aizo Kaneda
Ataru Yokono
Masao Goto
Makoto Iida
Takahiko Anchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56043997A priority Critical patent/JPS57159032A/en
Publication of JPS57159032A publication Critical patent/JPS57159032A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Clocks (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the yield of an electronic timepiece by sealing an IC chip bonded to a lead frame with polyphenylene sulfide resin, thereby reducing molding cycle time and prescribed facility equipments. CONSTITUTION:Polyphenylene sulfide resin composition 7 of thermoplastic resin is injection molded by an injection molding method into a space formed by upper and lower cavities 4', 6' to form an IC chip 1. Then, polybutylene terephthalate resin is used as a lower melting point resin at the outer periphery, and an external electronic part burying block 12 is formed by an injection molding method. This polyphenylene sulfide resin facilitate the injection with low viscosity, and does not deform a connecting gold wire. Further, electric characteristics (such as electric insulation, dielectric constant) of sealing material are preferable.
JP56043997A 1981-03-27 1981-03-27 Forming method for package of electronic timepiece Pending JPS57159032A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56043997A JPS57159032A (en) 1981-03-27 1981-03-27 Forming method for package of electronic timepiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56043997A JPS57159032A (en) 1981-03-27 1981-03-27 Forming method for package of electronic timepiece

Publications (1)

Publication Number Publication Date
JPS57159032A true JPS57159032A (en) 1982-10-01

Family

ID=12679347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56043997A Pending JPS57159032A (en) 1981-03-27 1981-03-27 Forming method for package of electronic timepiece

Country Status (1)

Country Link
JP (1) JPS57159032A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4788583A (en) * 1986-07-25 1988-11-29 Fujitsu Limited Semiconductor device and method of producing semiconductor device
JPS6436031A (en) * 1987-07-31 1989-02-07 Toshiba Corp Semiconductor device and manufacture thereof
JPH05226396A (en) * 1992-02-10 1993-09-03 Nec Corp Manufacture of resin-molded semiconductor device
US6790792B2 (en) 1999-01-08 2004-09-14 Dow Global Technologies Inc. Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4788583A (en) * 1986-07-25 1988-11-29 Fujitsu Limited Semiconductor device and method of producing semiconductor device
JPS6436031A (en) * 1987-07-31 1989-02-07 Toshiba Corp Semiconductor device and manufacture thereof
JPH05226396A (en) * 1992-02-10 1993-09-03 Nec Corp Manufacture of resin-molded semiconductor device
US6790792B2 (en) 1999-01-08 2004-09-14 Dow Global Technologies Inc. Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers

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