JPS5720437A - Resin sealing metal mold for semiconductor device - Google Patents

Resin sealing metal mold for semiconductor device

Info

Publication number
JPS5720437A
JPS5720437A JP9534180A JP9534180A JPS5720437A JP S5720437 A JPS5720437 A JP S5720437A JP 9534180 A JP9534180 A JP 9534180A JP 9534180 A JP9534180 A JP 9534180A JP S5720437 A JPS5720437 A JP S5720437A
Authority
JP
Japan
Prior art keywords
lead
resin
lower molds
burrs
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9534180A
Other languages
Japanese (ja)
Inventor
Yukio Higuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9534180A priority Critical patent/JPS5720437A/en
Publication of JPS5720437A publication Critical patent/JPS5720437A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Abstract

PURPOSE:To readily remove burrs of resin adhered to the lead of a sealed part by forming an oblique part of the shape externally expanding at the goove for lead of upper and lower molds and shortening the burrs of the lead. CONSTITUTION:An element is contained in cavities 6, 2 formed by upper and lower molds 23 and 21, leads 10 are interposed with grooves 24, 22, resin is filled, and a resin-sealed device 8 is formed. Oblique parts 24a, 22a of the shape expanding externally toward the groove are formed at the grooves 6, 2 for the lead of the upper and lower molds. Burrs 25 are formed at the lead 10 of the resin-sealer 9 thus molded and cured, but since the obliqud parts 24a, 22a are provided, the burs are shortened in a lump, can be mechanically readily removed, and the workability can be improved.
JP9534180A 1980-07-10 1980-07-10 Resin sealing metal mold for semiconductor device Pending JPS5720437A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9534180A JPS5720437A (en) 1980-07-10 1980-07-10 Resin sealing metal mold for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9534180A JPS5720437A (en) 1980-07-10 1980-07-10 Resin sealing metal mold for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5720437A true JPS5720437A (en) 1982-02-02

Family

ID=14134985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9534180A Pending JPS5720437A (en) 1980-07-10 1980-07-10 Resin sealing metal mold for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5720437A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58210628A (en) * 1982-05-31 1983-12-07 Toshiba Corp Molding for sealing semiconductor resin
JPH0479936U (en) * 1990-11-24 1992-07-13
US6410883B1 (en) * 1999-05-26 2002-06-25 Nec Corporation Cleaning device and method for cleaning resin sealing metal mold

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58210628A (en) * 1982-05-31 1983-12-07 Toshiba Corp Molding for sealing semiconductor resin
JPH0479936U (en) * 1990-11-24 1992-07-13
US6410883B1 (en) * 1999-05-26 2002-06-25 Nec Corporation Cleaning device and method for cleaning resin sealing metal mold

Similar Documents

Publication Publication Date Title
JPS57147260A (en) Manufacture of resin-sealed semiconductor device and lead frame used therefor
SE7411786L (en) METHOD FOR ENCLOSING ELECTRICAL COMPONENTS, AND FOR THE METHOD USE MOLDING
JPS5720437A (en) Resin sealing metal mold for semiconductor device
JPS55128835A (en) Molding method and mold used therefor
JPS5664458A (en) Metallic body
JPS53124075A (en) Manufacture of resin sealing type semiconductor device and metal mold used for said manufacture
JPS56107559A (en) Manufacture of resin-sealed semiconductor device
GB1194452A (en) Improvements in or relating to methods of Encapsulating Electrical Components in Hardenable Synthetic Material
JPS5664445A (en) Manufacture of semiconductor device
JPS5629338A (en) Resin sealing of semiconductor element
JPS57128931A (en) Resin sealing for semiconductor device
JPS5381076A (en) Lroduction of resin seal semiconductor device
JPS562642A (en) Device for forming resin-sealed semiconductor device
JPS57159032A (en) Forming method for package of electronic timepiece
JPS55163867A (en) Lead frame for semiconductor device
JPS5410674A (en) Resin sealing method of semiconductor device
JPS645022A (en) Resin sealing method for optical semiconductor device
JPS57139931A (en) Resin-sealing mold for semiconductor device
JPS5738125A (en) Transfer molding process
JPS56103482A (en) Manufacture of semiconductor device for photoelectric conversion
JPS55157235A (en) Manufacture of semiconductor integrated circuit
JPS6430237A (en) Manufacture of resin-sealed semiconductor device
JPS5434762A (en) Resin-sealing metal mold
JPS57202745A (en) Manufacture of semiconductor device
JPS62125635A (en) Resin-sealed method for resin-sealed semiconductor device