JPS5664458A - Metallic body - Google Patents

Metallic body

Info

Publication number
JPS5664458A
JPS5664458A JP9510180A JP9510180A JPS5664458A JP S5664458 A JPS5664458 A JP S5664458A JP 9510180 A JP9510180 A JP 9510180A JP 9510180 A JP9510180 A JP 9510180A JP S5664458 A JPS5664458 A JP S5664458A
Authority
JP
Japan
Prior art keywords
frame
dies
projection
nipping
pressing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9510180A
Other languages
Japanese (ja)
Other versions
JPS5735586B2 (en
Inventor
Tetsuo Hajime
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9510180A priority Critical patent/JPS5664458A/en
Publication of JPS5664458A publication Critical patent/JPS5664458A/en
Publication of JPS5735586B2 publication Critical patent/JPS5735586B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0038—Moulds or cores; Details thereof or accessories therefor with sealing means or the like
    • B29C33/0044—Moulds or cores; Details thereof or accessories therefor with sealing means or the like for sealing off parts of inserts projecting into the mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B29C45/14418—Sealing means between mould and article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486—Details, accessories and auxiliary operations
    • B29C2045/14934—Preventing penetration of injected material between insert and adjacent mould wall
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To simply prevent the oozing of resin by nipping a lead frame between upper and lower dies, forming a projection at the frame when charging molding resin into the cavity formed in the dies and pressing the projection with the dies thereby eliminating the gap therebetween. CONSTITUTION:A projection 6 becoming a weir at a dam part 5 formed at the lead frame 4 is formed by deforming the frame 4 itself or using metal having softer property than the mold. A projection 9 is formed correspondingly to the projection 6 on the contacting surface of the dies 8 when nipping the frame 4 using the upper and lower dies 8 beforehand, thereby pressing the projection 6 of the frame 4 so as to thus seal the gap between the dies 8 and the frame 4. Thereafter, predetermined molding resin 10 is charged into the cavity formed in the dies 8. Thus, the frame 4 can be prevented from generating burrs.
JP9510180A 1980-07-14 1980-07-14 Metallic body Granted JPS5664458A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9510180A JPS5664458A (en) 1980-07-14 1980-07-14 Metallic body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9510180A JPS5664458A (en) 1980-07-14 1980-07-14 Metallic body

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP1509071A Division JPS5549966B1 (en) 1971-03-19 1971-03-19

Publications (2)

Publication Number Publication Date
JPS5664458A true JPS5664458A (en) 1981-06-01
JPS5735586B2 JPS5735586B2 (en) 1982-07-29

Family

ID=14128479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9510180A Granted JPS5664458A (en) 1980-07-14 1980-07-14 Metallic body

Country Status (1)

Country Link
JP (1) JPS5664458A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0271984A2 (en) * 1986-12-15 1988-06-22 Hercules Products, Inc. Two-part gasket
JP2007262821A (en) * 2006-03-29 2007-10-11 Kubota Corp Manhole lid
WO2009081081A2 (en) * 2007-12-26 2009-07-02 Compagnie Plastic Omnium Mould and cross member assembly, cross member and motor vehicle technical front end
FR2925871A1 (en) * 2007-12-26 2009-07-03 Plastic Omnium Cie Cross member for forming e.g. floor pan of motor vehicle, has projections located partially outside part to be overmolded, where cross member is configured such that projections do not form structure part of vehicle
EP2147768A1 (en) * 2008-07-24 2010-01-27 Compagnie Plastic Omnium Method of manufacturing a component for a vehicle, in particular a technical front-end
USRE43443E1 (en) * 1992-03-27 2012-06-05 Renesas Electronics Corporation Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0271984A2 (en) * 1986-12-15 1988-06-22 Hercules Products, Inc. Two-part gasket
USRE43443E1 (en) * 1992-03-27 2012-06-05 Renesas Electronics Corporation Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two
JP2007262821A (en) * 2006-03-29 2007-10-11 Kubota Corp Manhole lid
WO2009081081A2 (en) * 2007-12-26 2009-07-02 Compagnie Plastic Omnium Mould and cross member assembly, cross member and motor vehicle technical front end
FR2925871A1 (en) * 2007-12-26 2009-07-03 Plastic Omnium Cie Cross member for forming e.g. floor pan of motor vehicle, has projections located partially outside part to be overmolded, where cross member is configured such that projections do not form structure part of vehicle
FR2925862A1 (en) * 2007-12-26 2009-07-03 Plastic Omnium Cie ASSEMBLY OF A MOLD AND A TRAVERSE AND FRONT PANEL TECHNIQUE OF A MOTOR VEHICLE
WO2009081081A3 (en) * 2007-12-26 2009-08-20 Plastic Omnium Cie Mould and cross member assembly, cross member and motor vehicle technical front end
EP2225081A2 (en) * 2007-12-26 2010-09-08 Compagnie Plastic Omnium Mould and cross member assembly, cross member and motor vehicle technical front end
US8424959B2 (en) 2007-12-26 2013-04-23 Compagnie Plastic Omnium Mould and cross member assembly, cross member and motor vehicle technical front panel
EP2147768A1 (en) * 2008-07-24 2010-01-27 Compagnie Plastic Omnium Method of manufacturing a component for a vehicle, in particular a technical front-end
FR2934194A1 (en) * 2008-07-24 2010-01-29 Plastic Omnium Cie METHOD FOR MANUFACTURING A VEHICLE ELEMENT, IN PARTICULAR A TECHNICAL FRONT PANEL

Also Published As

Publication number Publication date
JPS5735586B2 (en) 1982-07-29

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