JPS57139952A - Resin sealing type semiconductor device - Google Patents

Resin sealing type semiconductor device

Info

Publication number
JPS57139952A
JPS57139952A JP56026367A JP2636781A JPS57139952A JP S57139952 A JPS57139952 A JP S57139952A JP 56026367 A JP56026367 A JP 56026367A JP 2636781 A JP2636781 A JP 2636781A JP S57139952 A JPS57139952 A JP S57139952A
Authority
JP
Japan
Prior art keywords
resin
corrosion resistance
metallic layer
lead frame
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56026367A
Other languages
Japanese (ja)
Inventor
Kuniaki Tsurushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56026367A priority Critical patent/JPS57139952A/en
Publication of JPS57139952A publication Critical patent/JPS57139952A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the generation of resin burr, and to conduct resin sealing having excellent corrosion resistance by previously forming a metallic layer having low tensile strength property, corrosion resistance and solder fitting property onto the surface of a lead frame and molding the lead frame with resin. CONSTITUTION:Sections except a bonding section (within a B line) on the lead frame 11 are coated with the metallic layer of a metal having low tensile strength property, corrosion resistance and solder fitting property such as tin or solder. It is preferable the thickness of the metallic layer 22 previously coated onto a lead 21 is 10-20mum. The inside of the B line is molded 25 with resin through bonding. Accordingly, the resin burr by a molding die 23 is difficult to be generated, corrosion resistance is improved, and the deformation of the lead is reduced.
JP56026367A 1981-02-25 1981-02-25 Resin sealing type semiconductor device Pending JPS57139952A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56026367A JPS57139952A (en) 1981-02-25 1981-02-25 Resin sealing type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56026367A JPS57139952A (en) 1981-02-25 1981-02-25 Resin sealing type semiconductor device

Publications (1)

Publication Number Publication Date
JPS57139952A true JPS57139952A (en) 1982-08-30

Family

ID=12191523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56026367A Pending JPS57139952A (en) 1981-02-25 1981-02-25 Resin sealing type semiconductor device

Country Status (1)

Country Link
JP (1) JPS57139952A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59108335A (en) * 1982-12-14 1984-06-22 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS6396947A (en) * 1986-10-13 1988-04-27 Mitsubishi Electric Corp Lead frame semiconductor device
JPS63197364A (en) * 1987-02-12 1988-08-16 Goto Seisakusho:Kk Manufacture of semiconductor device
JPS63197363A (en) * 1987-02-12 1988-08-16 Goto Seisakusho:Kk Manufacture of semiconductor device
JPH034554A (en) * 1989-06-01 1991-01-10 Shinko Electric Ind Co Ltd Lead frame
JP2014029995A (en) * 2012-06-27 2014-02-13 Dainippon Printing Co Ltd Lead frame and manufacturing method of the same, lead frame with resin and manufacturing method of the same, and led package and manufacturing method of the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56122156A (en) * 1980-03-03 1981-09-25 Shinko Electric Ind Co Ltd Lead frame for semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56122156A (en) * 1980-03-03 1981-09-25 Shinko Electric Ind Co Ltd Lead frame for semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59108335A (en) * 1982-12-14 1984-06-22 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS6396947A (en) * 1986-10-13 1988-04-27 Mitsubishi Electric Corp Lead frame semiconductor device
JPS63197364A (en) * 1987-02-12 1988-08-16 Goto Seisakusho:Kk Manufacture of semiconductor device
JPS63197363A (en) * 1987-02-12 1988-08-16 Goto Seisakusho:Kk Manufacture of semiconductor device
JPH034554A (en) * 1989-06-01 1991-01-10 Shinko Electric Ind Co Ltd Lead frame
JP2014029995A (en) * 2012-06-27 2014-02-13 Dainippon Printing Co Ltd Lead frame and manufacturing method of the same, lead frame with resin and manufacturing method of the same, and led package and manufacturing method of the same

Similar Documents

Publication Publication Date Title
JPS57139952A (en) Resin sealing type semiconductor device
JPS5676542A (en) Resin-sealed semiconductor device
JPS56122156A (en) Lead frame for semiconductor device
GB2103420B (en) Gold-plated package for semiconductor devices
JPS57173948A (en) Manufacture of semiconductor device
JPS57128947A (en) Semiconductor device
JPS5792854A (en) Plastic molded type semiconductor device
JPS5432160A (en) Manufacture of precious metal covered wire
JPS57154863A (en) Manufacture of resin sealing type electronic parts
JPS5629355A (en) Manufacture of resin-sealed semiconductor device
JPS57118658A (en) Lead frame
JPS56158462A (en) Lead frame for single inline semiconductor device
JPS57155752A (en) Resin sealed semiconductor device
JPS5287429A (en) Method of bonding lead to plastics
JPS57122558A (en) Manufacture of lead for electrode
JPS5788753A (en) Lead frame and semiconductor device prepared by using the same
JPS58119660A (en) Semiconductor device
JPS647547A (en) Resin-sealed semiconductor device
JPS5571044A (en) Electronic part and its manufacturing process
JPS57164549A (en) Resin sealed semiconductor device
JPS5752155A (en) Manufacture of resin sealed semiconductor device
JPS57202766A (en) Lead frame for semiconductor device
JPS5736846A (en) Metallic package for semiconductor element
JPS641262A (en) Electronic device and manufacture thereof
FR2368125A1 (en) COMPOSITE LEAD FRAME STRIP - having ferritic stainless steel core and nickel, copper and tin or nickel plated coatings