JPS647547A - Resin-sealed semiconductor device - Google Patents
Resin-sealed semiconductor deviceInfo
- Publication number
- JPS647547A JPS647547A JP16374487A JP16374487A JPS647547A JP S647547 A JPS647547 A JP S647547A JP 16374487 A JP16374487 A JP 16374487A JP 16374487 A JP16374487 A JP 16374487A JP S647547 A JPS647547 A JP S647547A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- lead
- lead alloy
- semiconductor device
- alloy coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To lower the cost and shorten the manufacturing time by a method wherein a semiconductor device is provided with a mount to carry a semiconductor element through the intermediary of a tin-lead alloy coating and with an outer lead that is also a tin-lead alloy coating with its melting temperature point higher than that used for the mount. CONSTITUTION:A resin-sealed semiconductor device of this design includes a semiconductor element 4, a mount 2 to carry the semiconductor element 4 through the intermediary of a coating of a tin-lead alloy, and outer leads 1 constituting a higher-melting tin-lead alloy coating together with regions other than wire-bonding regions. Such a combination of coatings may be obtained by using a lead frame with its components plated prior to assembly. The difference in melting temperature between the two tin-lead alloys contributes to the elimination of difficulties in the assembling process. The design dispenses with a step for providing the outer leads 1 with a tin or tin-lead alloy coating, after encapsulation in a sealing resin 7.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16374487A JPS647547A (en) | 1987-06-29 | 1987-06-29 | Resin-sealed semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16374487A JPS647547A (en) | 1987-06-29 | 1987-06-29 | Resin-sealed semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS647547A true JPS647547A (en) | 1989-01-11 |
Family
ID=15779856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16374487A Pending JPS647547A (en) | 1987-06-29 | 1987-06-29 | Resin-sealed semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS647547A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04134851A (en) * | 1990-09-27 | 1992-05-08 | Nec Corp | Lead frame |
KR19990016048A (en) * | 1997-08-12 | 1999-03-05 | 윤종용 | Solder plated lead frame and manufacturing method of semiconductor chip package using the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62156845A (en) * | 1985-12-28 | 1987-07-11 | Toshiba Corp | Lead frame |
-
1987
- 1987-06-29 JP JP16374487A patent/JPS647547A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62156845A (en) * | 1985-12-28 | 1987-07-11 | Toshiba Corp | Lead frame |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04134851A (en) * | 1990-09-27 | 1992-05-08 | Nec Corp | Lead frame |
KR19990016048A (en) * | 1997-08-12 | 1999-03-05 | 윤종용 | Solder plated lead frame and manufacturing method of semiconductor chip package using the same |
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